CN110278694A - A kind of ultrathin type electronic equipment dissipating heat patch - Google Patents
A kind of ultrathin type electronic equipment dissipating heat patch Download PDFInfo
- Publication number
- CN110278694A CN110278694A CN201910621323.5A CN201910621323A CN110278694A CN 110278694 A CN110278694 A CN 110278694A CN 201910621323 A CN201910621323 A CN 201910621323A CN 110278694 A CN110278694 A CN 110278694A
- Authority
- CN
- China
- Prior art keywords
- heat
- electronic equipment
- graphite flake
- conducting substrate
- bond plies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 43
- 239000010439 graphite Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 239000002390 adhesive tape Substances 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 description 4
- 230000000191 radiation effect Effects 0.000 description 3
- 210000004556 brain Anatomy 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of ultrathin electronic equipment dissipating heat patch comprising: for fixing the heat-conducting substrate being bonded with electronic equipment；Graphite flake, middle part are equipped with window, and graphite flake fits in heat-conducting substrate lower end surface, and is fixed by glue or the first sticking double faced adhesive tape, and heat-conducting substrate outer rim protrudes from except the graphite flake outer rim；First bond plies, moulding are adapted with the moulding of window, and the fixation of the first bond plies fits in heat-conducting substrate lower end surface, are placed in window, the first bond plies lower end surface is flushed with graphite flake lower end surface.It can be adsorbed by heat-conducting substrate when electronic equipment operation generates a large amount of heat, and conduct cause graphite flake, distributed by graphite flake, reach high-efficiency heat conduction heat dissipation effect；The present invention is sheet products, thinner thickness, so that being applicable to relatively thin electronic equipment；Wireless charger carries out wireless charging to electronic equipment through the window of graphite flake, and graphite flake will not have an impact wireless charging, guarantees that wireless charging is normally carried out.
Description
Technical field:
The present invention relates to electronic equipment dissipating heat technical fields, refer in particular to a kind of ultrathin electronic equipment dissipating heat patch.
Background technique:
In order to keep life more convenient, modern microelectronic technology high speed development does not turn off and issues various electronic equipments, such as electricity
Brain, mobile phone, tablet computer etc..Wherein, due to that can generate a large amount of thermal energy when electronic device operates, and thermal energy will affect electronics dress
The speed of service is set, or causes electronic device that overheat occurs and crashes.
For this purpose, electronic equipment will increase radiator cooperation fan to radiate to it, but it will cause the increase of thickness,
So that relatively thin electronic equipment is not suitable for, such as mobile phone, tablet computer.
So there is an urgent need to a kind of high-efficiency heat conduction, light and thinner thickness materials to transfer heat away from rapidly, ensure
Electronic equipment operates normally.
In view of this, the present inventor proposes following technical scheme.
Summary of the invention:
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of ultrathin electronic equipment dissipating heat patches.
In order to solve the above-mentioned technical problem, present invention employs following technical proposals: ultrathin type electronic equipment dissipating heat patch
Piece includes: for fixing the heat-conducting substrate to fit together with electronic equipment；Graphite flake, graphite flake middle part are provided with window,
And the graphite flake fits in the heat-conducting substrate lower end surface, and is fixed by glue or the first sticking double faced adhesive tape, outside the heat-conducting substrate
Edge protrudes from except the graphite flake outer rim；First bond plies, moulding are adapted with the moulding of the window, this first is led
Hot double-sided adhesive fixation fits in the heat-conducting substrate lower end surface, is placed in the window, the first bond plies lower end surface and stone
Ink sheet lower end surface flushes.
Furthermore, in above-mentioned technical proposal, the heat-conducting substrate is heat-conducting silica gel sheet.
Furthermore, in above-mentioned technical proposal, the heat-conducting substrate is thermal conductive metal plate.
Furthermore, in above-mentioned technical proposal, the heat-conducting substrate is thermal plastic cement piece.
Furthermore, in above-mentioned technical proposal, the heat-conducting substrate is bond plies.
Furthermore, in above-mentioned technical proposal, the graphite flake both ends are respectively formed with the first notch and the second notch,
Fixation is fitted with the second bond plies and third bond plies respectively at heat-conducting substrate lower end surface both ends, this is second thermally conductive
Double-sided adhesive and third bond plies fill first notch and the second notch respectively, and second bond plies and third are thermally conductive
The thickness of double-sided adhesive is identical as the thickness of graphite flake.
Furthermore, in above-mentioned technical proposal, the window is in cross, which is in cross；
Either, the window is in rectangle, which is in rectangle；Either, the window is rounded, this is first thermally conductive
Double-sided adhesive is rounded.
Furthermore, in above-mentioned technical proposal, the thickness of first bond plies is identical as the thickness of graphite flake.
Furthermore, in above-mentioned technical proposal, the heat-conducting substrate upper surface is provided with the second double-sided adhesive, and this second pair
The first release paper is posted in face glue upper surface, after tearing the first release paper, by the second double faced adhesive tape together on electronic equipment.
Furthermore, in above-mentioned technical proposal, the ultrathin type electronic equipment dissipating heat patch with a thickness of 0.5-3mm.
After adopting the above technical scheme, compared with prior art, the present invention has the following advantages: the present invention uses
The fixation of heat-conducting substrate and electronic equipment be bonded, and when the electronic equipment operation a large amount of heat of generation, which can will be a large amount of
Heat absorption, and cause graphite flake is conducted, to be distributed by the graphite flake to heat, to achieve the effect that heat dissipation, and the stone
Ink sheet has extremely strong heat conduction and heat radiation effect, and the present invention is enabled to have fabulous heat dissipation effect, furthermore, the present invention is sheet products,
Its thinner thickness so that being applicable to relatively thin electronic equipment (such as mobile phone, tablet computer), and can carry out thin electronic equipment high
Thermally conductive, guarantee electronic equipment normal operation is imitated, order is of the invention with the extremely strong market competitiveness.In addition, the present invention is in graphite flake
Middle part is provided with window, and when carrying out wireless charging to electronic equipment (such as mobile phone) using wireless charger, wireless charger is saturating
It crosses the window and wireless charging directly is carried out to electronic equipment (such as mobile phone), which will not have an impact wireless charging, protect
Card wireless charging is normally carried out, very convenient to use, and the first bond plies are filled in the window, this first is led
Hot double-sided adhesive also can further improve heat radiation function.
Detailed description of the invention:
Fig. 1 is perspective view of the invention；
Fig. 2 is cross-sectional view of the invention；
Fig. 3 is stereogram exploded view of the invention；
Fig. 4 is main view of the invention；
Fig. 5 is rearview of the invention.
Specific embodiment:
The present invention is further described with attached drawing combined with specific embodiments below.
It include: for being fitted in electronic equipment fixation for a kind of ultrathin electronic equipment dissipating heat patch as shown in Fig. 1-5
Heat-conducting substrate 1 together；Graphite flake 2 is provided with window 21 in the middle part of the graphite flake 2, and the graphite flake 2 fits in the heat-conducting substrate
1 lower end surface, and being fixed by glue or the first sticking double faced adhesive tape, 1 outer rim of heat-conducting substrate protrude from 2 outer rim of graphite flake it
Outside；First bond plies 3, moulding are adapted with the moulding of the window 21, and first bond plies 3 fixation fits in
1 lower end surface of heat-conducting substrate, is placed in the window 21, and 3 lower end surface of the first bond plies and 2 lower end surface of graphite flake are neat
It is flat.The present invention is bonded using heat-conducting substrate 1 with electronic equipment fixation, and when electronic equipment, which is run, generates a large amount of heat, this is led
Hot substrate 1 can adsorb a large amount of heat, and conduct cause graphite flake, to be distributed by the graphite flake to heat, to reach scattered
The effect of heat, and the graphite flake has extremely strong heat conduction and heat radiation effect, and the present invention is enabled to have fabulous heat dissipation effect, furthermore, this
Invention is sheet products, thinner thickness, so that being applicable to relatively thin electronic equipment (such as mobile phone, tablet computer), and can be right
Thin electronic equipment carries out high-efficiency heat conduction, ensures that electronic equipment operates normally, the present invention is enabled to have the extremely strong market competitiveness.Separately
Outside, the present invention is provided with window 21 in the middle part of graphite flake 2, wireless when being carried out using wireless charger to electronic equipment (such as mobile phone)
When charging, wireless charger directly carries out wireless charging to electronic equipment (such as mobile phone) through the window 21, which will not
Wireless charging is had an impact, guarantees being normally carried out for wireless charging, it is very convenient to use, and be filled in the window 21
First bond plies 3, first bond plies 3 also can further improve heat radiation function.
The heat-conducting substrate 1 is heat-conducting silica gel sheet.Either, the heat-conducting substrate 1 is thermal conductive metal plate.Either, institute
Stating heat-conducting substrate 1 is thermal plastic cement piece.Either, the heat-conducting substrate 1 is bond plies.Preferably, heat-conducting substrate 1 uses
Heat-conducting silica gel sheet, soft, not only good heat conduction effect, and it is also preferable to be bonded effect.
Graphite flake is a kind of completely new heat conduction and heat radiation material, has unique crystal grain orientation, in both directions uniform heat conduction,
It is laminar structured to be well adapted for any surface, shielding heat source and the performance that consumer electronics product is improved while component.
This completely new natural graphite solution, radiating efficiency is high, occupies little space, is light-weight, and uniform heat conduction, disappears in both directions
Except " hot spot " region, the performance of consumer electronics product is improved while shielding heat source and component.
2 both ends of graphite flake are respectively formed with the first notch and the second notch, the 1 lower end surface both ends of heat-conducting substrate point
The second bond plies 4 and third bond plies 5 Gu Ding be fitted with, second bond plies 4 and third heat-conducting double-sided
Glue 5 fills first notch and the second notch respectively, the thickness of second bond plies 4 and third bond plies 5 with
The thickness of graphite flake 2 is identical.
The window 21 is in cross, which is in cross；Either, the window 21 is in rectangle,
First bond plies 3 are in rectangle；Either, the window 21 is rounded, and first bond plies 3 are rounded.Yu Ben
In embodiment, the window 21 is in cross, which is in cross.
The thickness of first bond plies 3 is identical as the thickness of graphite flake 2.The ultrathin type electronic equipment dissipating heat patch
With a thickness of 0.5-3mm.
1 upper surface of heat-conducting substrate is provided with the second double-sided adhesive, which posts the first release paper,
After tearing the first release paper, by the second double faced adhesive tape together on electronic equipment.
In conclusion the present invention is bonded using heat-conducting substrate 1 with electronic equipment fixation, when electronic equipment operation generates largely
Heat when, which can adsorb a large amount of heat, and conduct cause graphite flake, with by the graphite flake to heat carry out
It distributes, to achieve the effect that heat dissipation, and the graphite flake has extremely strong heat conduction and heat radiation effect, and the present invention is enabled to have fabulous heat dissipation
Effect, furthermore, the present invention is sheet products, thinner thickness, so that being applicable to relatively thin electronic equipment (such as mobile phone, plate electricity
Brain), and high-efficiency heat conduction can be carried out to thin electronic equipment, it ensures that electronic equipment operates normally, enables the present invention that there is extremely strong city
Field competitiveness.In addition, the present invention is provided with window 21 in the middle part of graphite flake 2, when use wireless charger is to electronic equipment (such as hand
Machine) carry out wireless charging when, wireless charger through the window 21 directly to electronic equipment (such as mobile phone) carry out wireless charging, should
Graphite flake 3 will not have an impact wireless charging, guarantee being normally carried out for wireless charging, very convenient to use, and the window
The first bond plies 3 are filled in mouth 21, which also can further improve heat radiation function.
Certainly, the above is only a specific embodiment of the present invention, be not to limit the scope of the present invention, it is all according to
The equivalent change or modification that structure, feature and principle described in scope of the present invention patent is done should be included in Shen of the present invention
It please be in the scope of the patents.
Claims (10)
1. a kind of ultrathin type electronic equipment dissipating heat patch, it is characterised in that: comprising:
For fixing the heat-conducting substrate (1) to fit together with electronic equipment；
Graphite flake (2), the graphite flake (2) middle part is provided with window (21), and the graphite flake (2) fits in the heat-conducting substrate (1)
Lower end surface, and fixed by glue or the first sticking double faced adhesive tape, which protrudes from graphite flake (2) outer rim
Except；
First bond plies (3), moulding are adapted with the moulding of the window (21), and first bond plies (3) are solid
Surely heat-conducting substrate (1) lower end surface is fitted in, is placed in the window (21), the first bond plies (3) lower end surface and stone
Ink sheet (2) lower end surface flushes.
2. a kind of ultrathin electronic equipment dissipating heat patch according to claim 1, it is characterised in that: the heat-conducting substrate
It (1) is heat-conducting silica gel sheet.
3. a kind of ultrathin electronic equipment dissipating heat patch according to claim 1, it is characterised in that: the heat-conducting substrate
It (1) is thermal conductive metal plate.
4. a kind of ultrathin electronic equipment dissipating heat patch according to claim 1, it is characterised in that: the heat-conducting substrate
It (1) is thermal plastic cement piece.
5. a kind of ultrathin electronic equipment dissipating heat patch according to claim 1, it is characterised in that: the heat-conducting substrate
It (1) is bond plies.
6. a kind of ultrathin type electronic equipment dissipating heat patch described in -5 any one according to claim 1, it is characterised in that: described
Graphite flake (2) both ends are respectively formed with the first notch and the second notch, and heat-conducting substrate (1) the lower end surface both ends are fixed respectively to paste
Conjunction has the second bond plies (4) and third bond plies (5), second bond plies (4) and third bond plies
(5) first notch and the second notch are filled respectively, the thickness of second bond plies (4) and third bond plies (5)
It is identical as the thickness of graphite flake (2).
7. a kind of ultrathin electronic equipment dissipating heat patch according to claim 6, it is characterised in that: the window (21) is in
Cross, first bond plies (3) are in cross；Either, the window (21) is in rectangle, first bond plies
It (3) is in rectangle；Either, the window (21) is rounded, and first bond plies (3) are rounded.
8. a kind of ultrathin electronic equipment dissipating heat patch according to claim 6, it is characterised in that: described first is thermally conductive double
The thickness of face glue (3) is identical as the thickness of graphite flake (2).
9. a kind of ultrathin electronic equipment dissipating heat patch according to claim 7, it is characterised in that: the heat-conducting substrate
(1) upper surface is provided with the second double-sided adhesive, which posts the first release paper, after tearing the first release paper,
By the second double faced adhesive tape together on electronic equipment.
10. a kind of ultrathin electronic equipment dissipating heat patch according to claim 7, it is characterised in that: the ultrathin type electronics
Equipment cooling patch with a thickness of 0.5-3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910621323.5A CN110278694A (en) | 2019-07-10 | 2019-07-10 | A kind of ultrathin type electronic equipment dissipating heat patch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910621323.5A CN110278694A (en) | 2019-07-10 | 2019-07-10 | A kind of ultrathin type electronic equipment dissipating heat patch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110278694A true CN110278694A (en) | 2019-09-24 |
Family
ID=67962978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910621323.5A Pending CN110278694A (en) | 2019-07-10 | 2019-07-10 | A kind of ultrathin type electronic equipment dissipating heat patch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110278694A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007184392A (en) * | 2006-01-06 | 2007-07-19 | Taika:Kk | Thermoconductive structural body, and heat dissipating memeber and electronic device using the same |
| CN202941077U (en) * | 2012-11-01 | 2013-05-15 | 斯迪克新型材料（江苏）有限公司 | Graphite heat radiation structure for electronic product |
| CN104669702A (en) * | 2013-12-03 | 2015-06-03 | 凯尔凯德新材料科技泰州有限公司 | Graphite heat conduction film compound block and manufacturing method thereof |
| CN104836871A (en) * | 2015-05-08 | 2015-08-12 | 广东欧珀移动通信有限公司 | Mobile phone main board radiating graphite sheet and mobile phone |
| CN205142769U (en) * | 2015-12-01 | 2016-04-06 | 深圳市添正弘业科技有限公司 | Graphite heat radiation structure for smart phone and tablet computer |
| CN207531246U (en) * | 2017-11-16 | 2018-06-22 | 黄伟军 | A kind of graphene heat dissipation film |
| CN108770296A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN210274985U (en) * | 2019-07-10 | 2020-04-07 | 东莞市源冠塑胶模具有限公司 | Ultra-thin type electronic equipment heat dissipation paster |
-
2019
- 2019-07-10 CN CN201910621323.5A patent/CN110278694A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007184392A (en) * | 2006-01-06 | 2007-07-19 | Taika:Kk | Thermoconductive structural body, and heat dissipating memeber and electronic device using the same |
| CN202941077U (en) * | 2012-11-01 | 2013-05-15 | 斯迪克新型材料（江苏）有限公司 | Graphite heat radiation structure for electronic product |
| CN104669702A (en) * | 2013-12-03 | 2015-06-03 | 凯尔凯德新材料科技泰州有限公司 | Graphite heat conduction film compound block and manufacturing method thereof |
| CN104836871A (en) * | 2015-05-08 | 2015-08-12 | 广东欧珀移动通信有限公司 | Mobile phone main board radiating graphite sheet and mobile phone |
| CN205142769U (en) * | 2015-12-01 | 2016-04-06 | 深圳市添正弘业科技有限公司 | Graphite heat radiation structure for smart phone and tablet computer |
| CN207531246U (en) * | 2017-11-16 | 2018-06-22 | 黄伟军 | A kind of graphene heat dissipation film |
| CN108770296A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN210274985U (en) * | 2019-07-10 | 2020-04-07 | 东莞市源冠塑胶模具有限公司 | Ultra-thin type electronic equipment heat dissipation paster |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No.1, Wusha Haibin Road, Chang'an Town, Dongguan City, Guangdong Province 523000 Applicant after: Dongguan Yuanguan Technology Co., Ltd Address before: 523000 Guangdong Province, Dongguan city Changan Town Industrial Zone sixth usha Beach Road No. 3 1 Applicant before: DONGGUAN YUANGUAN PLASTIC MOULD Co.,Ltd. |
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