CN210103830U - Copper foil patch for mobile phone display screen - Google Patents
Copper foil patch for mobile phone display screen Download PDFInfo
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- CN210103830U CN210103830U CN201920817064.9U CN201920817064U CN210103830U CN 210103830 U CN210103830 U CN 210103830U CN 201920817064 U CN201920817064 U CN 201920817064U CN 210103830 U CN210103830 U CN 210103830U
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- copper foil
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- adhesive tape
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Abstract
The utility model discloses a copper foil paster for cell-phone display screen, including the copper foil paster, the copper foil paster includes from down and the last release paper that sets gradually, copper foil sticky tape, first graphite fin, insulating film and protection film, the insulating film passes through the double faced adhesive tape and pastes first graphite fin on copper foil sticky tape, the copper foil sticky tape is including connecting the first copper foil sticky tape from the release paper and setting up the second copper foil sticky tape at first copper foil sticky tape and insulating film connection, second copper foil sticky tape is provided with the filling hole of connecting first graphite fin and first copper foil sticky tape, the filling hole intussuseption is filled with second graphite fin. The utility model discloses a copper foil paster can be effectively with the heat conduction that the chip sent among the cell-phone electronic components to the copper foil on, again by the copper foil with heat conduction on the graphite cooling fin, has built a heat dissipation channel, reaches quick heat conduction radiating purpose to be favorable to promoting the experience effect of screen.
Description
Technical Field
The utility model relates to a copper foil field especially relates to a copper foil paster for cell-phone display screen.
Background
At present, partial products in the market conduct heat conduction and heat dissipation through metal materials, particularly copper and aluminum, although the heat conductivity coefficient of copper is 398W/mK, the application of the copper is limited due to the fact that the copper is heavy and easy to oxidize, and the like, and the heat conductivity coefficient of aluminum is 237W/mK, and the requirements of the existing products on heat conduction and heat dissipation are difficult to meet. The heat dissipation film made of natural graphite materials and artificially synthesized graphite materials used at present improves the heat dissipation of electronic products to a certain extent, but the graphite heat dissipation film is mainly made by a method of directly rolling treated graphite and methods of macromolecular carbonization, graphitization and the like, and the heat dissipation material with the surface made of graphite has low tensile strength, is fragile, has more particles and dust and is inconvenient to install and use.
With the rapid development of modern technologies, the miniaturization of electronic devices, the increasing of the dominant frequency of chips, the increasing of functions, and the gradual increase of the power consumption of a single chip all result in the rapid increase of heat flux density. Studies have shown that over 55% of electronic devices fail due to excessive temperatures, and thus the heat dissipation problem of electronic devices plays a significant role in the development of electronic devices.
The copper foil tape is a metal tape and is mainly applied to electromagnetic shielding, electric signal shielding and magnetic signal shielding, the electric signal shielding mainly depends on the excellent conductivity of copper, and the magnetic shielding needs a glue surface conductive substance 'nickel' of the copper foil tape to achieve the effect of magnetic shielding, so that the copper foil tape is widely applied to mobile phones, notebook computers and other digital products.
With the miniaturization and high integration of integrated circuits, the packing density of electronic components continues to increase, providing powerful usage functions, while also leading to a dramatic increase in the operating power consumption and heat generation thereof. The first technical officer, Pat-Gaersin, responsible for chip design, by the former Intel corporation, pointed out: "if the chip power consumption and heat dissipation problems cannot be solved, the chip surface will be as hot as the surface of the sun by 2015". High temperatures can have detrimental effects on the stability, reliability and lifetime of electronic components, such as excessive temperatures that can compromise semiconductor junctions, damage the circuit connection interfaces, increase the resistance of the conductors and cause mechanical stress damage. There is data indicating that CPU failures due to overheating account for 55% of the total number of CPU failures. Even for a single communication device or electronic component, the reliability is reduced by 50% for every 10 ℃ increase in operating temperature. Therefore, in order to ensure high reliability while the device exhibits optimum performance, it is necessary to ensure that the heat generated by the heat-generating electronic component can be discharged in time.
At present, heat dissipation materials for large-scale integrated circuits at home and abroad are mainly heat-conducting silica gel and graphite flakes. The common heat-conducting silica gel is an organic silicon material, has low heat conductivity coefficient and can only meet the use requirements of common integrated circuits.
With the development of smart phones, the screen of a mobile phone is made larger, so that the heat dissipation and electromagnetic shielding of the mobile phone are more and more emphasized by mobile phone manufacturers, especially for high-end smart phones, in order to increase the experience of users on the operation of the screen of the mobile phone, a plurality of manufacturers add copper foils for heat conduction, heat dissipation and electromagnetic shielding in a screen assembly.
Patent number CN201520208083.3 discloses a graphene composite heat dissipation film, which comprises a PET release film layer, a first heat conductive adhesive layer, a carbon nanotube layer, a copper foil layer, a graphene layer, a second heat conductive adhesive layer, a PET substrate layer and an antistatic coating from top to bottom. Carbon nanotube, copper foil, graphite alkene direct joint in the compound radiating film of graphite alkene are in the same place, can effectively improve the heat conduction effect, and this utility model's compound radiating film of graphite alkene possesses the effect of preventing static simultaneously, is convenient for install and use, can wide application in products such as high electron device, liquid crystal display that calorific capacity.
Patent No. CN201520924324.4 discloses a single-sided conductive copper foil, which comprises a heat conductive coating, a copper foil, and a conductive adhesive coating; the heat-conducting coating, the copper foil and the conductive adhesive coating are sequentially laminated. The utility model discloses an utilize heat conduction coating or conducting resin picture layer to fix on electronic product, have the fixed convenient advantage of installation.
In summary, the application of the copper foil in the mobile phone is relatively simple, and the electric conduction performance, the heat conduction performance and the heat dissipation performance of the copper foil are general, and for this reason, a copper foil adhesive tape used for electronic components of a screen assembly is designed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the above problem that prior art exists, provide a copper foil paster for mobile phone display screen, the utility model discloses a copper foil paster can be effectively with the heat conduction that the chip sent among the mobile phone electronic components to the copper foil, again by the copper foil with heat conduction on the graphite cooling fin, built a heat dissipation channel, reach quick radiating purpose of heat conduction to be favorable to promoting the experience effect of screen.
For realizing above-mentioned technical purpose, reach above-mentioned technological effect, the utility model discloses a following technical scheme realizes:
a copper foil patch for a mobile phone display screen comprises a copper foil patch, wherein the copper foil patch comprises release paper, a copper foil adhesive tape, a first graphite radiating fin, an insulating film and a protective film which are sequentially arranged from bottom to top, process holes are formed in two sides of the protective film, the insulating film is used for adhering the first graphite radiating fin to the copper foil adhesive tape through a double-sided adhesive tape, the copper foil adhesive tape comprises a first copper foil adhesive tape connected with the release paper and a second copper foil adhesive tape arranged on the first copper foil adhesive tape and connected with the insulating film, the second copper foil adhesive tape is provided with filling holes connected with the first graphite radiating fin and the first copper foil adhesive tape, and the filling holes are filled with second graphite radiating fins; the second copper foil tape has a width set at 1/2 times the width of the first copper foil tape for dividing the first copper foil tape into an upper conductive area and a lower conductive area.
Preferably, the thickness of the first graphite radiating fin is set to be 0.01-0.015; the thickness of the second graphite radiating fin is consistent with that of the second copper foil tape.
Preferably, the thickness of the release paper and the protective film is set to be 0.1-0.15mm, cutting lines are arranged on the release paper, the cutting lines are positioned on the left side and the right side of the copper foil tape, and the release paper is divided into three parts.
Preferably, the first graphite heat sink can be replaced with a silicone heat sink.
Preferably, the thickness of the adhesive surface of the first copper foil tape is set to be 0.025-0.04mm, and the thickness of the adhesive surface of the second copper foil tape is set to be 0.015-0.025 mm.
Preferably, the thickness of the insulating film is set to 0.01 to 0.05 mm.
The utility model has the advantages that:
1. the copper foil patch of the utility model can effectively conduct the heat emitted by the chip in the electronic component of the mobile phone to the copper foil, and then conduct the heat to the graphite heat sink through the copper foil, so that a heat dissipation channel is built, and the purpose of rapid heat conduction and heat dissipation is achieved, thereby being beneficial to improving the experience effect of the screen;
2. the copper foil adhesive tape of the utility model is mainly used for the electric conduction and heat dissipation and electromagnetic shielding of the electronic components of the mobile phone; the cutting lines arranged on the release paper are beneficial to the peeling of the release paper and the sticking of the copper foil adhesive tape;
3. the utility model discloses simple structure, convenient to use, and frivolous, can satisfy the light of current market to electronic product, thin requirement and design, have good toughness concurrently, be difficult for appearing wrinkling during the bonding operation, warp, fracture or tear etc..
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to be implemented according to the content of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a schematic view relating to the present invention;
fig. 2 is a schematic structural diagram according to the present invention.
The reference numbers in the figures illustrate: the structure comprises a copper foil patch 1, release paper 2, a copper foil tape 3, a first graphite radiating fin 4, an insulating film 5, a protective film 6, a fabrication hole 7, a double-sided adhesive tape 8, a second graphite radiating fin 9, an upper conductive region 10, a lower conductive region 11, a first copper foil tape 301, a second copper foil tape 302 and a cutting line 12.
Detailed Description
The invention is further described with reference to the accompanying drawings:
referring to fig. 1 to 2, a copper foil patch for a mobile phone display screen includes a copper foil patch 1, where the copper foil patch 1 includes a release paper 2, a copper foil tape 3, a first graphite heat sink 4, an insulating film 5 and a protective film 6, which are sequentially arranged from bottom to top, process holes 7 are formed on two sides of the protective film 6, the insulating film 5 pastes the first graphite heat sink 4 on the copper foil tape 3 through a double-sided adhesive tape 8, the copper foil tape 3 includes a first copper foil tape 301 connected to the release paper 2 and a second copper foil tape 302 arranged on the first copper foil tape 301 and connected to the insulating film 5, the second copper foil tape 302 is provided with filling holes connecting the first graphite heat sink 4 and the first copper foil tape 301, and the filling holes are filled with second graphite heat sinks 9; the second copper foil tape 302 has a width set at 1/2 times the width of the first copper foil tape 301 for dividing the first copper foil tape 301 into the upper conductive area 10 and the lower conductive area 11. By adopting the technical scheme, the heat conduction and the heat dissipation of the copper foil adhesive tape 3 are facilitated, the heat is guided, and the heat dissipation performance of the copper foil adhesive tape 3 is improved.
Preferably, the thickness of the first copper foil tape 301 is set to be 0.05-0.15 mm; the thickness of the second copper foil tape 302 is set to 0.01-0.05 mm. By adopting the technical scheme, the copper foil tape is light and thin, and the overall thickness of the copper foil tape 3 is reduced.
Preferably, the thickness of the first graphite fin 4 is set to 0.01 to 0.015; the thickness of the second graphite heat sink 9 is equal to the thickness of the second copper foil tape 302. By adopting the technical scheme, the quick heat conduction and heat dissipation of the copper foil adhesive tape 3 are facilitated.
Preferably, the thickness of the release paper 2 and the protective film 6 is set to be 0.1-0.15mm, the release paper 2 is provided with cutting lines 12, the cutting lines 12 are positioned at the left side and the right side of the copper foil tape 3, and the release paper 2 is divided into three. By adopting the technical scheme, the thicknesses of the release paper 2 and the protective film 6 are increased, and the deformation of the copper foil adhesive tape 3 is favorably reduced; the cutting line 12 is provided to facilitate peeling off the release paper 2 on one side of the copper foil tape 3 for adhesion, and then the release paper 2 is peeled off from the copper foil tape 3 in sequence, thereby facilitating the user or mechanical operation. The position of the release paper 2 on the copper foil tape 3 on the two sides is the same, so that the release paper 2 on one side can be peeled off nearby when the copper foil tape is used.
Preferably, the first graphite fins 4 can be replaced with silicone fins. By adopting the technical scheme, the use requirements of different occasions are met.
Preferably, the thickness of the adhesive surface of the first copper foil tape 301 is set to 0.025-0.04mm, and the thickness of the adhesive surface of the second copper foil tape 302 is set to 0.015-0.025 mm. By adopting the technical scheme, the thickness of the copper foil tape 3 is reduced.
Preferably, the thickness of the insulating film 5 is set to 0.01 to 0.05 mm. By adopting the technical scheme, the shielding device is used for shielding the conductive surface on the surface of the copper foil tape 3.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
Example one
When the copper foil tape laminating machine is in actual use, a user peels off release paper on two sides of a copper foil tape, process holes in a copper foil tape protective film are connected and positioned with positioning columns on two sides of a jig, then one side of the copper foil tape is pressed, one side of the copper foil tape is firstly pasted on an electronic component on the jig, then the release paper in the middle of the copper foil tape is peeled, the copper foil tape is completely pasted on the electronic component, and therefore the copper foil tape is laminated.
Example two
When the tool is used in practice, a user peels off release paper on one side of a copper foil patch firstly, a process hole on a protective film on one side of the release paper is peeled off and is installed on a positioning column on one side of the tool, then the process hole on the other side of the protective film is aligned to the positioning column on the other side of the tool, a copper foil adhesive tape on one side to be peeled off is pasted to one side of an electronic component on the tool firstly, then the release film is peeled off in sequence, and the peeled copper foil adhesive tape is pasted to the electronic component in sequence, so that the pasting of the copper foil adhesive tape is completed.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. The utility model provides a copper foil paster for cell-phone display screen which characterized in that: the copper foil patch comprises a copper foil patch (1), wherein the copper foil patch (1) comprises release paper (2), a copper foil adhesive tape (3), a first graphite radiating fin (4), an insulating film (5) and a protective film (6) which are sequentially arranged from bottom to top, process holes (7) are formed in two sides of the protective film (6), the insulating film (5) is used for pasting the first graphite radiating fin (4) on the copper foil adhesive tape (3) through a double-sided adhesive tape (8), the copper foil adhesive tape (3) comprises a first copper foil adhesive tape (301) connected with the release paper (2) and a second copper foil adhesive tape (302) arranged on the first copper foil adhesive tape (301) and connected with the insulating film (5), the second copper foil adhesive tape (302) is provided with filling holes for connecting the first graphite radiating fin (4) and the first copper foil adhesive tape (301), and second graphite radiating fins (9) are filled in the filling holes; the width of the second copper foil tape (302) is set at 1/2 of the width of the first copper foil tape (301) for dividing the first copper foil tape (301) into an upper conductive area (10) and a lower conductive area (11).
2. The copper foil patch for the display screen of the mobile phone according to claim 1, wherein: the thickness of the first graphite radiating fin (4) is set to be 0.01-0.015; the thickness of the second graphite radiating fin (9) is consistent with that of the second copper foil tape (302).
3. The copper foil patch for the display screen of the mobile phone according to claim 1, wherein: the thickness setting of leaving type paper (2) and protection film (6) is at 0.1-0.15mm, and it is provided with on leaving type paper (2) and cuts line (12), it is located the left and right sides of copper foil sticky tape (3) to cut line (12), divide into three from type paper (2).
4. The copper foil patch for the display screen of the mobile phone according to claim 1, wherein: the first graphite radiating fins (4) can be replaced by silica gel radiating fins.
5. The copper foil patch for the display screen of the mobile phone according to claim 1, wherein: the adhesive surface thickness of the first copper foil tape (301) is set to be 0.025-0.04mm, and the adhesive surface thickness of the second copper foil tape (302) is set to be 0.015-0.025 mm.
6. The copper foil patch for the display screen of the mobile phone according to claim 1, wherein: the thickness of the insulating film (5) is set to 0.01-0.05 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817064.9U CN210103830U (en) | 2019-06-02 | 2019-06-02 | Copper foil patch for mobile phone display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817064.9U CN210103830U (en) | 2019-06-02 | 2019-06-02 | Copper foil patch for mobile phone display screen |
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| Publication Number | Publication Date |
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| CN210103830U true CN210103830U (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920817064.9U Active CN210103830U (en) | 2019-06-02 | 2019-06-02 | Copper foil patch for mobile phone display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113999623A (en) * | 2021-11-18 | 2022-02-01 | 太仓展新胶粘材料股份有限公司 | Integrated composite heat dissipation buffer part and preparation method thereof |
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2019
- 2019-06-02 CN CN201920817064.9U patent/CN210103830U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113999623A (en) * | 2021-11-18 | 2022-02-01 | 太仓展新胶粘材料股份有限公司 | Integrated composite heat dissipation buffer part and preparation method thereof |
| CN113999623B (en) * | 2021-11-18 | 2023-08-08 | 太仓展新胶粘材料股份有限公司 | Integrated composite heat dissipation buffer piece and preparation method thereof |
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