CN210381721U - Be applied to heat dissipation sheet of mobile phone motherboard - Google Patents
Be applied to heat dissipation sheet of mobile phone motherboard Download PDFInfo
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- CN210381721U CN210381721U CN201920923186.6U CN201920923186U CN210381721U CN 210381721 U CN210381721 U CN 210381721U CN 201920923186 U CN201920923186 U CN 201920923186U CN 210381721 U CN210381721 U CN 210381721U
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- mobile phone
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Abstract
A heat dissipation sheet applied to a mobile phone mainboard comprises a silica gel protection film, a graphite heat dissipation assembly, a PET (polyethylene terephthalate) original film, a transparent protection film, a first release film and a second release film, wherein the silica gel protection film is provided with a middle setting area and two side end setting areas; the graphite heat dissipation assembly is arranged in the middle arrangement area, and the central line of the graphite heat dissipation assembly is superposed with the central line of the silica gel protective film; two PET original films are arranged and are respectively arranged in two side end arrangement areas; the transparent protective film is covered on the graphite heat dissipation assembly and covers the PET original film; the first release film is arranged at the bottom end of the silica gel protective film; the second is located the first bottom from type membrane. The radiating sheet is simple in structure and convenient to install, and can be installed as long as the second release film is removed; meanwhile, through the arrangement of the graphite radiating assembly, heat generated on a mobile phone mainboard can be quickly dissipated, and the overall radiating effect of the mobile phone is ensured.
Description
Technical Field
The utility model relates to a heat radiation structure's of electronic product technical field especially relates to a be applied to mobile phone motherboard's heat dissipation sheet.
Background
At present, the processor function of electronic products is stronger and stronger, the power consumption is larger and larger, and the heat productivity is increased. Therefore, the heat dissipation performance of the electronic product is very important. Especially, precise and portable electronic products, such as smart phones and the like, have high power consumption and large heat productivity, but have too small volume, and heat dissipation is a problem to be solved urgently. For example, a smart phone generally adopts a composite material heat dissipation film adhered to an inner surface of a mobile phone case to adhere heat generating components such as a mobile phone battery and the like to the case, so as to quickly conduct and dissipate heat. However, the current heat dissipation film has the following problems:
1) the structure is simple, but the heat dissipation effect is poor;
2) the heat dissipation effect is good, but the structure is complicated, the manufacturing cost is high, and the processing is loaded down with trivial details.
Therefore, it is necessary to provide a technical means to solve the above-mentioned drawbacks.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's defect, provide a be applied to mobile phone motherboard's heat dissipation sheet to there is the radiating effect poor, the structure is complicated, cost is with high costs and the loaded down with trivial details problem of processing in the heat dissipation membrane of solving among the prior art.
The utility model discloses a realize like this, a be applied to mobile phone motherboard's heat dissipation sheet, include:
the silica gel protective film is provided with a middle setting area and two side end setting areas positioned at two sides of the middle setting area;
the graphite heat dissipation assembly is arranged in the middle arrangement area of the silica gel protective film, and the central line of the graphite heat dissipation assembly is superposed with the central line of the silica gel protective film;
two PET original films are arranged and are respectively arranged in two side end arrangement areas on the silica gel protective film;
the transparent protective film is covered on the graphite heat dissipation assembly and covers the PET original film;
the first release film is arranged at the bottom end of the silica gel protective film;
the second is from the type membrane, the second is located from the type membrane the first bottom from the type membrane, just the second is greater than from the length and width size of type membrane the first length and width size from the type membrane.
Specifically, graphite radiator unit includes first graphite flake, second graphite flake and graphite viscose layer, graphite viscose layer is located first graphite flake with between the second graphite flake.
Further, the length and width dimensions of the first graphite sheet are the same as the length and width dimensions of the second graphite sheet.
Preferably, the first and second graphite sheets each have a thickness of 0.01 to 0.015 mm.
Preferably, the thickness of the graphite adhesive layer is 0.055-0.065 mm.
Preferably, the width of the PET raw film is 15-20 mm.
Preferably, the thickness of the transparent protective film is 0.05 mm.
Preferably, the thickness of the first release film and the second release film is 0.08 mm.
As another preferred embodiment of the present scheme, a center line of the first release film coincides with a center line of the silica gel protective film; the first type membrane of releasing is thrown the projection of silica gel protection film is located the silica gel protection film within range, just first type membrane's side with form the blank area between the side of silica gel protection film.
Preferably, the distance between the side end of the first release film and the side end of the silicone protective film is 0.8-1.1 mm.
Compared with the prior art, the beneficial effects of the utility model are that:
the heat dissipation sheet applied to the mobile phone mainboard mainly comprises a silica gel protection film, a graphite heat dissipation assembly, a PET original film, a transparent protection film, a first release film and a second release film, is simple in structure and convenient to install, only the second release film needs to be removed, the second release film is attached to the mobile phone mainboard through a robot hand, and the product step distance and the discharging direction are set according to the specified requirements, so that the heat dissipation sheet can be installed; meanwhile, through the arrangement of the graphite radiating assembly, heat generated on a mobile phone mainboard can be quickly dissipated, and the overall radiating effect of the mobile phone is ensured.
Drawings
Fig. 1 is a schematic view of a heat dissipation sheet applied to a mobile phone motherboard according to an embodiment of the present invention when being rolled up;
fig. 2 is a schematic view of a heat dissipation sheet applied to a mobile phone motherboard according to an embodiment of the present invention when the heat dissipation sheet is laid flat;
fig. 3 is a schematic view of a part of a heat dissipation sheet applied to a mobile phone motherboard, the part being lifted;
fig. 4 is a schematic structural diagram of a heat dissipation sheet applied to a mobile phone motherboard according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a graphite heat dissipation assembly applied to a heat dissipation sheet of a mobile phone motherboard according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1 to 4, in order to provide a preferred embodiment of the present invention, the present embodiment relates to a heat dissipation sheet 1 applied to a mobile phone motherboard, which includes a silica gel protective film 10, a graphite heat dissipation assembly 20, a PET original film 30, a transparent protective film 40, a first release film 50 and a second release film 60, wherein the silica gel protective film 10, the graphite heat dissipation assembly 20, the PET original film 30, the transparent protective film 40, the first release film 50 and the second release film 60 are interconnected through silica gel or pressure sensitive adhesive, and the following description is further made on each component of the heat dissipation sheet 1 applied to the mobile phone motherboard;
the silica gel protective film 10 is provided with a middle setting area 11 and two side end setting areas 12 positioned at two sides of the middle setting area 11;
the graphite heat dissipation assembly 20 is arranged in the middle arrangement area 11 of the silica gel protective film 10, and the central line of the graphite heat dissipation assembly 20 is superposed with the central line of the silica gel protective film 10 so as to ensure positioning and installation;
two PET original films 30 are arranged, and the two PET original films 30 are respectively arranged in two side end arrangement areas 12 on the silica gel protective film 10;
the transparent protective film 40 is covered on the graphite heat dissipation assembly 20 and covered on the PET original film 30 to protect the graphite heat dissipation assembly 20;
the first release film 50 is arranged at the bottom end of the silica gel protective film 10;
the second is located the first bottom from type membrane 50 from type membrane 60, and the second is greater than the first length and width size from type membrane 50 from the length and width size of type membrane 60 to be used for will be applied to on the attached cell-phone of radiating sheet 1 of mobile phone motherboard.
The heat dissipation sheet 1 applied to the mobile phone motherboard of the embodiment mainly comprises a silica gel protective film 10, a graphite heat dissipation assembly 20, a PET original film 30, a transparent protective film 40, a first release film 50 and a second release film 60, and is simple in structure and convenient to install, and the heat dissipation sheet can be installed as long as the second release film 60 is removed, a robot is used for attaching the heat dissipation sheet to the mobile phone motherboard, and the product step distance and the discharging direction are set according to the specified requirements; meanwhile, through the arrangement of the graphite heat dissipation assembly 20, heat generated on a mobile phone mainboard can be quickly dissipated, and the overall heat dissipation effect of the mobile phone is ensured.
Referring to fig. 3 to 5, the graphite material of the graphite heat dissipation assembly 20 of the present embodiment is made of graphene, wherein the ratio of graphene (graphene): the carbon material is a two-dimensional carbon material and is a general name of single-layer graphene, double-layer graphene and multi-layer graphene;
single layer Graphene (Graphene): refers to a two-dimensional carbon material composed of a layer of carbon atoms which are periodically and closely packed in a benzene ring structure (i.e. a hexagonal honeycomb structure);
bilayer graphene (Bilayer or double-layer graphene): the two-dimensional carbon material is formed by stacking two layers of carbon atoms which are periodically and closely stacked in a benzene ring structure (namely a hexagonal honeycomb structure) in different stacking modes (including AB stacking, AA stacking and the like);
few-layer graphene (Few-layer): the carbon material is a two-dimensional carbon material formed by stacking 3-10 layers of carbon atoms which are periodically and closely stacked in a benzene ring structure (namely a hexagonal honeycomb structure) in different stacking modes (including ABC stacking, ABA stacking and the like);
multilayer or thick-layer graphene (multi-layer graphene): the carbon material is a two-dimensional carbon material formed by stacking carbon atoms with periodic close-packed benzene ring structures (namely hexagonal honeycomb structures) with the thickness of more than 10 layers and less than 10nm in different stacking modes (including ABC stacking, ABA stacking and the like);
graphene is the thinnest, hardest nanomaterial known to the world, and it is almost completely transparent, absorbing only 2.3% of light; the heat conductivity coefficient is as high as 5300W/m.K, higher than that of carbon nano tube and diamond, and its electron mobility is over 15000cm at normal temp2V.s, higher than carbon nanotubes or silicon crystal, and higher resistivityOnly about 10-6Omega cm, lower than copper or silver, is the material with the smallest resistivity in the world. Because of its extremely low resistivity and high electron transfer rate, it is expected to be used for developing a new generation of thinner and faster conductive electronic devices or transistors; since graphene is essentially a transparent and good conductor, it is also suitable for manufacturing transparent touch screens, optical panels, and even solar cells.
The graphite heat dissipation assembly 20 of the present embodiment preferably includes a first graphite sheet 21, a second graphite sheet 22, and a graphite adhesive layer 23, wherein the graphite adhesive layer 23 is disposed between the first graphite sheet 21 and the second graphite sheet 22. Preferably, the graphite adhesive layer 23 is a double-sided adhesive tape, so as to facilitate the drawing of materials and the bonding of the first graphite sheet 21 and the second graphite sheet 22.
For convenience of processing and material selection, the length and width dimensions of the first graphite sheet 21 are the same as those of the second graphite sheet 21.
Meanwhile, because the graphite sheet is also a conductor and is easy to generate dust, if the dust falls on the circuit board, the circuit board is likely to be short-circuited, the design mostly adopts a full-sealed design to consider the heat dissipation problem, and therefore, the materials for wrapping the edges at the two sides are thin as much as possible; similarly, too thick graphite adhesive layer 13 will also affect heat conduction. Therefore, the thicknesses of the first graphite sheet 21 and the second graphite sheet 22 are both 0.01-0.015mm, and the thickness of the graphite adhesive layer 23 is 0.055-0.065mm, so as to ensure that the graphite heat dissipation assembly 20 formed in the range can achieve a good heat dissipation effect, and simultaneously ensure that the whole thickness of the heat dissipation sheet 1 applied to the mobile phone mainboard can be applied to different types of mobile phones; preferably, the thickness of each of the first graphite sheet 21 and the second graphite sheet 22 is 0.01mm, and the thickness of the graphite adhesive layer 23 is 0.06mm, so that the overall thickness of the formed graphite heat dissipation assembly 20 is 0.08 mm.
In addition, the width of the PET original film 30 of the embodiment is 15-20mm, and the PET original film 30 is a PET film without a release force, so as to ensure the positioning of the graphite heat dissipation assembly 20. The thickness of transparent protection film is 0.05mm to when guaranteeing to reach the protection graphite radiator unit 20, save material, optimize the production design.
Further, the thickness of the first release film 50 and the second release film 60 of the present embodiment is 0.08mm, wherein the first release film 50 is a milky white PET release film of 3g, and the second release film 60 is a transparent or textured release film. And the thickness setting of first type membrane 50 and second type membrane 60 not only reaches required product requirement, still can save material, optimizes production design.
Referring to fig. 4, the center line of the first release film 50 of the present embodiment is overlapped with the center line of the silicone protective film 10 for easy installation; meanwhile, the projection of the first release film 50 on the silicone protective film 10 is located within the range of the silicone protective film 10, and a blank area is formed between the side end of the first release film 50 and the side end of the silicone protective film 10, so as to facilitate subsequent processing and manufacturing.
Moreover, preferably, the distance between the side end of the first release film 50 and the side end of the silicone protective film 10 is 0.8-1.1mm, and preferably, the distance between the side end of the first release film and the side end of the silicone protective film is 1.0mm, so as to ensure that the required product requirements are met, facilitate installation and setting, and optimize production design.
The above description is only for the preferred embodiment of the present invention, and the structure is not limited to the above-mentioned shape, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a be applied to heat dissipation sheet of mobile phone motherboard which characterized in that includes:
the silica gel protective film is provided with a middle setting area and two side end setting areas positioned at two sides of the middle setting area;
the graphite heat dissipation assembly is arranged in the middle arrangement area of the silica gel protective film, and the central line of the graphite heat dissipation assembly is superposed with the central line of the silica gel protective film;
two PET original films are arranged and are respectively arranged in two side end arrangement areas on the silica gel protective film;
the transparent protective film is covered on the graphite heat dissipation assembly and covers the PET original film;
the first release film is arranged at the bottom end of the silica gel protective film;
the second is from the type membrane, the second is located from the type membrane the first bottom from the type membrane, just the second is greater than from the length and width size of type membrane the first length and width size from the type membrane.
2. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 1, wherein: graphite radiator unit includes first graphite flake, second graphite flake and graphite viscose layer, graphite viscose layer is located first graphite flake with between the second graphite flake.
3. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 2, wherein: the length and width dimensions of the first graphite sheet are the same as the length and width dimensions of the second graphite sheet.
4. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 3, wherein: the thickness of the first graphite sheet and the second graphite sheet is 0.01-0.015 mm.
5. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 2, wherein: the thickness of the graphite adhesive layer is 0.055-0.065 mm.
6. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 1, wherein: the width of the PET original film is 15-20 mm.
7. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 1, wherein: the thickness of the transparent protective film is 0.05 mm.
8. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 1, wherein: the thickness of the first release film and the second release film is 0.08 mm.
9. The heat dissipating sheet applied to a main board of a cellular phone as set forth in any one of claims 1 to 8, wherein: the center line of the first release film is superposed with the center line of the silica gel protective film; the first type membrane of releasing is thrown the projection of silica gel protection film is located the silica gel protection film within range, just first type membrane's side with form the blank area between the side of silica gel protection film.
10. The heat dissipating sheet applied to a main board of a mobile phone as claimed in claim 9, wherein: the distance between the side end of the first release film and the side end of the silica gel protective film is 0.8-1.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920923186.6U CN210381721U (en) | 2019-06-18 | 2019-06-18 | Be applied to heat dissipation sheet of mobile phone motherboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920923186.6U CN210381721U (en) | 2019-06-18 | 2019-06-18 | Be applied to heat dissipation sheet of mobile phone motherboard |
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| Publication Number | Publication Date |
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| CN210381721U true CN210381721U (en) | 2020-04-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920923186.6U Active CN210381721U (en) | 2019-06-18 | 2019-06-18 | Be applied to heat dissipation sheet of mobile phone motherboard |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111320946A (en) * | 2020-04-27 | 2020-06-23 | 苏州佳值电子工业有限公司 | Graphite heat dissipation film with multifunctional layer |
| CN113085294A (en) * | 2021-04-26 | 2021-07-09 | 湖南沛德新材料有限公司 | Graphite flake with controllable thickness and preparation process thereof |
-
2019
- 2019-06-18 CN CN201920923186.6U patent/CN210381721U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111320946A (en) * | 2020-04-27 | 2020-06-23 | 苏州佳值电子工业有限公司 | Graphite heat dissipation film with multifunctional layer |
| CN113085294A (en) * | 2021-04-26 | 2021-07-09 | 湖南沛德新材料有限公司 | Graphite flake with controllable thickness and preparation process thereof |
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