CN213803602U - High-elasticity heat dissipation adhesive tape based on polyimide foam - Google Patents
High-elasticity heat dissipation adhesive tape based on polyimide foam Download PDFInfo
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- CN213803602U CN213803602U CN202021991454.7U CN202021991454U CN213803602U CN 213803602 U CN213803602 U CN 213803602U CN 202021991454 U CN202021991454 U CN 202021991454U CN 213803602 U CN213803602 U CN 213803602U
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- Prior art keywords
- heat
- layer
- foam
- conducting
- adhesive layer
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- 239000006260 foam Substances 0.000 title claims abstract description 44
- 229920001721 polyimide Polymers 0.000 title claims abstract description 33
- 239000004642 Polyimide Substances 0.000 title claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 7
- 239000010410 layer Substances 0.000 claims abstract description 84
- 239000012790 adhesive layer Substances 0.000 claims abstract description 35
- 239000000843 powder Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 229920000297 Rayon Polymers 0.000 claims description 2
- 238000005187 foaming Methods 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000006261 foam material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model relates to the field of adhesive tapes, in particular to a high-elasticity heat-dissipation adhesive tape based on a polyimide foaming body, which comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer. The utility model provides a labour saving and time saving, simple structure's high elasticity heat dissipation sticky tape based on polyimide foaming body.
Description
Technical Field
The utility model relates to an sticky tape field especially relates to a high elasticity heat dissipation sticky tape based on polyimide foaming body.
Background
At present, digital products such as mobile phones and tablet computers have a trend of light weight and enhanced performance. The light and thin structure means that electronic devices in digital products are arranged more and more compactly, the spare space is more and more narrow, and the performance enhancement means that the operational capability of processor chips is more and more high, the capacity of lithium batteries is more and more high, and the heat productivity is more and more large. Both of these changes place higher demands on current heat dissipation materials.
The conventional OLED screen is thin, screen breakage is easy to occur in the process of assembly or use, foam is usually required to be added in the screen manufacturing process to serve as a buffer protection layer, and heat dissipation measures are required to be added due to the fact that the heat resistance and the heat conductivity of common foam are poor. A commonly used heat sink material in this case is a copper foil pressure sensitive tape. The steps of the conventional screen assembly design scheme are somewhat complicated, and generally, a heat dissipation module of an OLED screen generally comprises a screen, an acrylic foam buffer layer and a copper foil adhesive tape. The copper foil tape has the advantages of being large in material quantity, complex in assembly process, easy to generate bubbles and fold marks when being pasted on foam, difficult in improvement of yield, time-consuming, labor-consuming and not beneficial to production.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a labour saving and time saving, simple structure's high elasticity heat dissipation sticky tape based on polyimide foaming body.
The utility model adopts the following technical scheme:
a high-elasticity heat-dissipation adhesive tape based on a polyimide foam body comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer.
The technical proposal is further improved in that the foam layer is a heat-conducting polyimide foam layer, and the thickness of the foam layer is 50-500 μm.
The technical scheme is further improved in that the first adhesive layer and the second adhesive layer are both made of heat-conducting acrylate pressure-sensitive adhesive layers.
The technical scheme is further improved in that a heat-conducting powder layer is filled in the heat-conducting acrylate pressure-sensitive adhesive layer.
The technical proposal is further improved in that the thicknesses of the first adhesive layer and the second adhesive layer are both set to be 10-35 μm.
The technical scheme is further improved in that the heat conduction film layer is a high heat conduction polyimide film layer.
The technical scheme is further improved in that the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m.
The technical scheme is further improved in that the heat conducting layer is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK.
The further improvement to above-mentioned technical scheme does, the bottom on second viscose layer is equipped with from the type rete, it establishes to PET reticulation from the type rete.
The technical scheme is further improved in that the thickness of the release film layer is set to be 50-100 mu m, and the release film layer is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer.
The utility model has the advantages that:
on the first hand, compared with other traditional foam materials, the polyimide foam material of the utility model has better performance, heat resistance and sound absorption performance; in the second aspect, the polyimide foam is filled with the heat-conducting gel with high heat conductivity coefficient, and the heat-conducting gel has the advantages of high heat conductivity coefficient, high resilience, low oil absorption rate, flame retardance and the like, so that the heat dissipation performance and the elastic buffer performance of the whole body are greatly enhanced; in a third aspect, the adhesive layer is filled with heat-conducting powder, the heat-conducting powder comprises one or more of alumina, magnesia, silica, aluminum hydroxide, antimony trioxide, graphite, carbon nanotubes and the like, and the heat-radiating and heat-conducting effect of the utility model is further improved; fourth aspect, the utility model discloses a structural adhesion is high, and the weatherability is good, and the subsides are obeyed well, and laminating transparent or white PET reticulation is from type membrane, the cross cutting processing of being convenient for, and integration volume production feasibility is high, saves technology step and human cost.
Drawings
Fig. 1 is a schematic structural view of a polyimide foam-based high-elasticity heat dissipation tape according to the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, a polyimide foam-based high-elasticity heat dissipation tape comprises a foam layer 10, a first adhesive layer 20, a heat conductive film layer 30, and a second adhesive layer 40; the heat conduction layer 11 is filled in the foam layer 10; the bottom of the foam layer 10 is arranged on the upper part of the first adhesive layer 20; the bottom of the first adhesive layer 20 is arranged on the upper part of the heat-conducting film layer 30; the bottom of the heat conductive film layer 30 is disposed on the upper portion of the second adhesive layer 40.
The foam layer 10 is a heat-conducting polyimide foam layer, the polyimide foam is better in performance, heat resistance and sound absorption performance compared with other traditional foam materials, the heat-conducting effect is good, the thickness of the foam layer 10 is 50-500 microns, the thickness of the foam layer 10 is selected according to actual conditions, cost is effectively saved, and the yield is improved.
The first adhesive layer 20 and the second adhesive layer 40 are both made of heat-conducting acrylate pressure-sensitive adhesive layers; the thickness of the first adhesive layer 20 and the second adhesive layer 40 is set to be 10-35 μm; the interior of the heat conductive acrylate pressure sensitive adhesive layer is filled with a heat conductive powder layer 60. According to the configuration, the heat dissipation effect is further improved, and the practicability is high.
The heat-conducting film layer 30 is a high heat-conducting polyimide film layer; the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m. Make the utility model provides promote heat dispersion, the practicality is strong.
The heat conducting layer 11 is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK. Heat conduction gel has advantages such as high coefficient of heat conductivity, high resilience, low oil absorption rate and fire-retardant, strengthens greatly the utility model discloses holistic heat dispersion and shock-absorbing capacity.
A release film layer 50 is arranged at the bottom of the second adhesive layer 40, and the release film layer 50 is a PET reticulate release film layer; the thickness of the release film layer 50 is set to be 50-100 μm, and the release film layer 50 is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer. The laminating is transparent or white PET reticulate pattern is from type membrane, the cross cutting processing of being convenient for, and integration volume production feasibility is high, labour saving and time saving, and the practicality is strong.
On the first hand, compared with other traditional foam materials, the polyimide foam material of the utility model has better performance, heat resistance and sound absorption performance; in the second aspect, the polyimide foam is filled with the heat-conducting gel with high heat conductivity coefficient, and the heat-conducting gel has the advantages of high heat conductivity coefficient, high resilience, low oil absorption rate, flame retardance and the like, so that the heat dissipation performance and the elastic buffer performance of the whole body are greatly enhanced; in a third aspect, the adhesive layer is filled with heat-conducting powder, the heat-conducting powder comprises one or more of alumina, magnesia, silica, aluminum hydroxide, antimony trioxide, graphite, carbon nanotubes and the like, and the heat-radiating and heat-conducting effect of the utility model is further improved; fourth aspect, the utility model discloses a structural adhesion is high, and the weatherability is good, and the subsides are obeyed well, and laminating transparent or white PET reticulation is from type membrane, the cross cutting processing of being convenient for, and integration volume production feasibility is high, saves technology step and human cost.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A high-elasticity heat dissipation adhesive tape based on polyimide foam is characterized in that: comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer.
2. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the foam layer is a heat-conducting polyimide foam layer, and the thickness of the foam layer is 50-500 mu m.
3. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: and the first adhesive layer and the second adhesive layer are both made of heat-conducting acrylate pressure-sensitive adhesive layers.
4. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 3, characterized in that: and a heat-conducting powder layer is filled in the heat-conducting acrylate pressure-sensitive adhesive layer.
5. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 3, characterized in that: the thickness of the first adhesive layer and the second adhesive layer is set to be 10-35 mu m.
6. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the heat conduction film layer is a high heat conduction polyimide film layer.
7. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 6, characterized in that: the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m.
8. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the heat conducting layer is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK.
9. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the bottom on second viscose layer is equipped with from the type rete, it establishes to PET reticulation from the type rete to leave the type rete from the type rete.
10. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 9, characterized in that: the thickness of the release film layer is set to be 50-100 mu m, and the release film layer is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021991454.7U CN213803602U (en) | 2020-09-11 | 2020-09-11 | High-elasticity heat dissipation adhesive tape based on polyimide foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021991454.7U CN213803602U (en) | 2020-09-11 | 2020-09-11 | High-elasticity heat dissipation adhesive tape based on polyimide foam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213803602U true CN213803602U (en) | 2021-07-27 |
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ID=76953390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021991454.7U Active CN213803602U (en) | 2020-09-11 | 2020-09-11 | High-elasticity heat dissipation adhesive tape based on polyimide foam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213803602U (en) |
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2020
- 2020-09-11 CN CN202021991454.7U patent/CN213803602U/en active Active
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