CN213803602U

CN213803602U - High-elasticity heat dissipation adhesive tape based on polyimide foam

Info

Publication number: CN213803602U
Application number: CN202021991454.7U
Authority: CN
Inventors: 方友; 杨永林
Original assignee: Guangdong Hongqing Electronic Material Technology Co Ltd
Current assignee: Guangdong Hongqing Electronic Material Technology Co Ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2021-07-27
Anticipated expiration: 2030-09-11

Abstract

The utility model relates to the field of adhesive tapes, in particular to a high-elasticity heat-dissipation adhesive tape based on a polyimide foaming body, which comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer. The utility model provides a labour saving and time saving, simple structure's high elasticity heat dissipation sticky tape based on polyimide foaming body.

Description

High-elasticity heat dissipation adhesive tape based on polyimide foam

Technical Field

The utility model relates to an sticky tape field especially relates to a high elasticity heat dissipation sticky tape based on polyimide foaming body.

Background

At present, digital products such as mobile phones and tablet computers have a trend of light weight and enhanced performance. The light and thin structure means that electronic devices in digital products are arranged more and more compactly, the spare space is more and more narrow, and the performance enhancement means that the operational capability of processor chips is more and more high, the capacity of lithium batteries is more and more high, and the heat productivity is more and more large. Both of these changes place higher demands on current heat dissipation materials.

The conventional OLED screen is thin, screen breakage is easy to occur in the process of assembly or use, foam is usually required to be added in the screen manufacturing process to serve as a buffer protection layer, and heat dissipation measures are required to be added due to the fact that the heat resistance and the heat conductivity of common foam are poor. A commonly used heat sink material in this case is a copper foil pressure sensitive tape. The steps of the conventional screen assembly design scheme are somewhat complicated, and generally, a heat dissipation module of an OLED screen generally comprises a screen, an acrylic foam buffer layer and a copper foil adhesive tape. The copper foil tape has the advantages of being large in material quantity, complex in assembly process, easy to generate bubbles and fold marks when being pasted on foam, difficult in improvement of yield, time-consuming, labor-consuming and not beneficial to production.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a labour saving and time saving, simple structure's high elasticity heat dissipation sticky tape based on polyimide foaming body.

The utility model adopts the following technical scheme:

a high-elasticity heat-dissipation adhesive tape based on a polyimide foam body comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer.

The technical proposal is further improved in that the foam layer is a heat-conducting polyimide foam layer, and the thickness of the foam layer is 50-500 μm.

The technical scheme is further improved in that the first adhesive layer and the second adhesive layer are both made of heat-conducting acrylate pressure-sensitive adhesive layers.

The technical scheme is further improved in that a heat-conducting powder layer is filled in the heat-conducting acrylate pressure-sensitive adhesive layer.

The technical proposal is further improved in that the thicknesses of the first adhesive layer and the second adhesive layer are both set to be 10-35 μm.

The technical scheme is further improved in that the heat conduction film layer is a high heat conduction polyimide film layer.

The technical scheme is further improved in that the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m.

The technical scheme is further improved in that the heat conducting layer is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK.

The further improvement to above-mentioned technical scheme does, the bottom on second viscose layer is equipped with from the type rete, it establishes to PET reticulation from the type rete.

The technical scheme is further improved in that the thickness of the release film layer is set to be 50-100 mu m, and the release film layer is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer.

The utility model has the advantages that:

on the first hand, compared with other traditional foam materials, the polyimide foam material of the utility model has better performance, heat resistance and sound absorption performance; in the second aspect, the polyimide foam is filled with the heat-conducting gel with high heat conductivity coefficient, and the heat-conducting gel has the advantages of high heat conductivity coefficient, high resilience, low oil absorption rate, flame retardance and the like, so that the heat dissipation performance and the elastic buffer performance of the whole body are greatly enhanced; in a third aspect, the adhesive layer is filled with heat-conducting powder, the heat-conducting powder comprises one or more of alumina, magnesia, silica, aluminum hydroxide, antimony trioxide, graphite, carbon nanotubes and the like, and the heat-radiating and heat-conducting effect of the utility model is further improved; fourth aspect, the utility model discloses a structural adhesion is high, and the weatherability is good, and the subsides are obeyed well, and laminating transparent or white PET reticulation is from type membrane, the cross cutting processing of being convenient for, and integration volume production feasibility is high, saves technology step and human cost.

Drawings

Fig. 1 is a schematic structural view of a polyimide foam-based high-elasticity heat dissipation tape according to the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

As shown in fig. 1, a polyimide foam-based high-elasticity heat dissipation tape comprises a foam layer 10, a first adhesive layer 20, a heat conductive film layer 30, and a second adhesive layer 40; the heat conduction layer 11 is filled in the foam layer 10; the bottom of the foam layer 10 is arranged on the upper part of the first adhesive layer 20; the bottom of the first adhesive layer 20 is arranged on the upper part of the heat-conducting film layer 30; the bottom of the heat conductive film layer 30 is disposed on the upper portion of the second adhesive layer 40.

The foam layer 10 is a heat-conducting polyimide foam layer, the polyimide foam is better in performance, heat resistance and sound absorption performance compared with other traditional foam materials, the heat-conducting effect is good, the thickness of the foam layer 10 is 50-500 microns, the thickness of the foam layer 10 is selected according to actual conditions, cost is effectively saved, and the yield is improved.

The first adhesive layer 20 and the second adhesive layer 40 are both made of heat-conducting acrylate pressure-sensitive adhesive layers; the thickness of the first adhesive layer 20 and the second adhesive layer 40 is set to be 10-35 μm; the interior of the heat conductive acrylate pressure sensitive adhesive layer is filled with a heat conductive powder layer 60. According to the configuration, the heat dissipation effect is further improved, and the practicability is high.

The heat-conducting film layer 30 is a high heat-conducting polyimide film layer; the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m. Make the utility model provides promote heat dispersion, the practicality is strong.

The heat conducting layer 11 is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK. Heat conduction gel has advantages such as high coefficient of heat conductivity, high resilience, low oil absorption rate and fire-retardant, strengthens greatly the utility model discloses holistic heat dispersion and shock-absorbing capacity.

A release film layer 50 is arranged at the bottom of the second adhesive layer 40, and the release film layer 50 is a PET reticulate release film layer; the thickness of the release film layer 50 is set to be 50-100 μm, and the release film layer 50 is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer. The laminating is transparent or white PET reticulate pattern is from type membrane, the cross cutting processing of being convenient for, and integration volume production feasibility is high, labour saving and time saving, and the practicality is strong.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A high-elasticity heat dissipation adhesive tape based on polyimide foam is characterized in that: comprises a foam layer, a first adhesive layer, a heat-conducting film layer and a second adhesive layer; the heat conduction layer is filled in the foam layer; the bottom of the foam layer is arranged on the upper part of the first adhesive layer; the bottom of the first adhesive layer is arranged on the upper part of the heat-conducting film layer; the bottom of the heat conduction film layer is arranged on the upper portion of the second adhesive layer.

2. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the foam layer is a heat-conducting polyimide foam layer, and the thickness of the foam layer is 50-500 mu m.

3. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: and the first adhesive layer and the second adhesive layer are both made of heat-conducting acrylate pressure-sensitive adhesive layers.

4. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 3, characterized in that: and a heat-conducting powder layer is filled in the heat-conducting acrylate pressure-sensitive adhesive layer.

5. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 3, characterized in that: the thickness of the first adhesive layer and the second adhesive layer is set to be 10-35 mu m.

6. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the heat conduction film layer is a high heat conduction polyimide film layer.

7. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 6, characterized in that: the thickness of the high-thermal-conductivity polyimide film layer is set to be 6-50 mu m.

8. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the heat conducting layer is a heat conducting gel layer, and the heat conducting coefficient of the heat conducting gel layer is larger than 5W/mK.

9. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 1, characterized in that: the bottom on second viscose layer is equipped with from the type rete, it establishes to PET reticulation from the type rete to leave the type rete from the type rete.

10. The polyimide foam-based high-elasticity heat-dissipating tape according to claim 9, characterized in that: the thickness of the release film layer is set to be 50-100 mu m, and the release film layer is set to be one of a transparent PET reticulate release film layer or a white PET reticulate release film layer.