CN211019739U

CN211019739U - Heat sink device

Info

Publication number: CN211019739U
Application number: CN201921656444.5U
Authority: CN
Inventors: 张锦峰
Original assignee: TEAM GROUP Inc
Current assignee: TEAM GROUP Inc
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-07-14
Anticipated expiration: 2029-09-30

Abstract

The utility model relates to a heat dissipation device, it sets up on a circuit board, this heat dissipation device from bottom to top sets gradually a first colloid layer, a first graphite alkene compound heat dissipation layer, a second colloid layer, a second graphite alkene compound heat dissipation layer, a resin layer, wherein, this first graphite alkene compound heat dissipation layer and this second graphite alkene compound heat dissipation layer dope a plurality of first metal particles to by a metal level cladding this first graphite alkene compound heat dissipation layer and this second graphite alkene compound heat dissipation layer respectively, above-mentioned simple structure saves space, and has good heat conductivility.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device using graphene and metal particles.

Background

The calculator device includes a plurality of electronic devices, such as a CPU, a hard disk, a display adapter, etc., disposed in the casing, and the electronic devices generate a lot of heat energy when in an operating state. In order to avoid the problem that the electronic device is affected by heat energy to cause temperature rise and further cause heat breakdown of the calculator device, how to arrange a heat dissipation structure on the electronic device to dissipate the heat energy is a very important issue for the calculator device.

Further, the heat dissipation structure for the hard disk is more important than other electronic devices. The hard disk itself stores a large amount of data, and is a place where an operating system and a driver are installed, and once the hard disk is crashed due to heat, data errors occur, and the computer device cannot be started. In addition, if the hard disk itself has no other medium to assist in guiding out heat energy, unless the environment is natural air cooling (air flows to take away heat energy) or forced air cooling (a fan in the casing forcibly blows to take away heat energy) with strong ability, the heat energy will be accumulated by plural electronic components on the hard disk for a long time in an environment with poor heat dissipation effect, and the electronic components will be aged or even damaged.

In the prior art, graphene is generally used as a conductive and heat dissipation structure, which has a significant effect of improving heat dissipation efficiency. However, graphene is bonded by using double-sided adhesive tape, and two homogeneous or heterogeneous solid materials cannot be completely and tightly bonded at a plane joint no matter how much pressure is used or how flat the two homogeneous or heterogeneous solid materials are ground, and because fine unevenness and fluctuation in the middle of the double-sided adhesive tape can cause only partial contact of a junction, pores or holes in the junction have air, the air is a poor heat transfer medium, and the heat transfer value at room temperature is only 0.0242W/mK, so that the problem that the heat transfer path is blocked by the air exists.

How to provide a heat dissipation device to overcome the problem that air still exists after the heat dissipation device is attached and improve the heat dissipation performance is the research direction of the invention.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a heat dissipation device, which solves the problem of the conventional technique that air exists between the glue layer and the heat dissipation layer, thereby reducing the heat dissipation performance.

In order to achieve the above object, the present invention discloses a heat dissipation device disposed on a circuit board, the heat dissipation device comprising: a first colloid layer arranged on the circuit board; a first graphene composite heat dissipation layer bonded to the first colloid layer; the second colloid layer is jointed on the graphene composite heat dissipation layer; a second graphene composite heat dissipation layer bonded to the second colloid layer; a resin layer disposed on the second graphene compliant heat sink layer; the first metal particles are arranged on the first graphene composite heat dissipation layer and the second graphene composite heat dissipation layer, and the first graphene composite heat dissipation layer and the second graphene composite heat dissipation layer are respectively coated by a metal layer, so that air is prevented from existing between the colloid layer and the heat dissipation layer, and the heat dissipation performance is improved.

In an embodiment of the present invention, it is also disclosed that the circuit board is a solid state disk or a memory.

In an embodiment of the present invention, it is also disclosed that the first metal particles are copper particles or aluminum particles.

In one embodiment of the present invention, the metal layer is made of copper.

In an embodiment of the present invention, it is also disclosed that the first glue layer is doped with a plurality of second metal particles, and the first glue layer is a graphene double-sided tape, an acryl double-sided tape, a silica gel double-sided tape, a grid double-sided tape, a reinforcement double-sided tape, a rubber double-sided tape, a high-temperature double-sided tape, a non-woven fabric double-sided tape, a residue-free double-sided tape, a tissue paper double-sided tape, a double-sided glass cloth tape, a PET double-sided tape, or a foam double-sided tape.

In an embodiment of the present invention, it is also disclosed that the second metal particles are copper particles or aluminum particles.

In an embodiment of the present invention, it is also disclosed that the second glue layer is doped with a plurality of third metal particles, and the second glue layer is a graphene double-sided tape, an acryl double-sided tape, a silica gel double-sided tape, a grid double-sided tape, a reinforcement double-sided tape, a rubber double-sided tape, a high-temperature double-sided tape, a non-woven fabric double-sided tape, a residue-free double-sided tape, a tissue paper double-sided tape, a double-sided glass cloth tape, a PET double-sided tape, or a foam double-sided tape.

In an embodiment of the present invention, it is also disclosed that the third metal particles are copper particles or aluminum particles.

In an embodiment of the present invention, it is also disclosed that the resin layer is one of Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene (PE), Biaxially Oriented Polypropylene (BOPP), Polycarbonate (PC), Polystyrene (PS), and Polyvinyl Chloride (PVC), or any combination thereof.

In an embodiment of the present invention, it is further disclosed that the circuit board is disposed on a motherboard, and a heat sink is disposed on the motherboard, and the heat sink is attached to the heat sink when the heat sink is disposed on the circuit board and mounted on the motherboard.

Drawings

FIG. 1: which is a side view of a first embodiment of the novel heat sink;

FIG. 2: which is an exploded view of a first embodiment of the novel heat dissipation device;

FIG. 3: which is a top view of a first embodiment of the novel heat dissipation device;

FIG. 4: which is a schematic view of the installation of a second embodiment of the heat dissipation device of the present invention.

[ brief description of the drawings ]

10 circuit board

20 heat sink

202 first colloid layer

204 first graphene composite heat dissipation layer

206 second colloid layer

208 second graphene composite heat dissipation layer

210 resin layer

212 metal layer

30 mainboard

302 heat sink

Detailed Description

In order to further understand and appreciate the structural features and functions of the present invention, preferred embodiments and associated detailed descriptions are provided below:

the utility model relates to a heat dissipation device, which solves the problem that the air exists between the colloid layer and the heat dissipation layer in the prior art, thereby reducing the heat dissipation performance.

Please refer to fig. 1, fig. 2 and fig. 3, which are a side view, an exploded view and a top view of a first embodiment of the heat dissipation device of the present invention. As shown in the drawings, in the present embodiment, the heat dissipation device 20 is disposed on a circuit board 10, and the heat dissipation device 20 includes a first colloid layer 202, a first graphene composite heat dissipation layer 204, a second colloid layer 206, a second graphene composite heat dissipation layer 208, and a resin layer 210. The first glue layer 202 is disposed on the circuit board 10; the first graphene composite heat dissipation layer 204 is bonded to the first colloid layer 202; the second glue layer 206 is bonded to the graphene composite heat dissipation layer 204; the second graphene composite heat spreader layer 208 is bonded to the second glue layer 206; the resin layer 210 is disposed on the second graphene compliant heat spreader layer 208. The first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 are doped with a plurality of first metal particles, and the addition method can be etching, doping, ion implantation, molecular beam epitaxy or vapor deposition, etc. the first metal particles, such as copper particles or aluminum particles, in this embodiment, the doping method is selected, and the first metal particles are copper particles, but not limited thereto. A metal layer 212 covers the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208, respectively. The metal layer 212 can be made of various metal materials, such as copper or aluminum, in the embodiment, copper is used, but not limited thereto.

Continuing with the above description, referring to fig. 1 to fig. 3, in the present embodiment, the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 are made of graphene copper, wherein the multi-nano-hole structure of graphene has high porosity, large specific surface area, and high metal particle adsorption performance, and combines a graphene film and a metal copper particle deposition layer into a single heterostructure conforming material. In addition, since the metal layer 212 covers the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 respectively, when the first colloid layer 202 and the second colloid layer 206 are bonded, fine unevenness and undulation can be filled up, the bonding efficiency can be increased, pores or holes can be reduced, the problem that a heat conduction path is obstructed by air can be avoided, and the heat conduction efficiency can be improved.

Subsequently, the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 are doped with the first metal particles, so that the thermal conductivity, the heat radiation performance and the heat capacity are improved. Wherein, the thermal conductivity K refers to the capability of the material to directly conduct heat energy; next, the heat capacity refers to the property of a material that absorbs (or emits) heat when it is heated (or cooled), and the magnitude of the heat capacity is expressed by the specific heat capacity, and the larger the specific heat capacity, the stronger the heat absorption or dissipation capacity of the object. The first metal particles are copper particles or aluminum particles, and in the embodiment, copper particles are selected, but not limited thereto. The thermal conductivity of graphene (less than 3 nanometers) in the XY axis is more than 1500, and the thermal conductivity of copper particle deposition is more than 300; the thermal radiation emissivity of the graphene is 0.99 in the infrared range, which is close to the thermal radiation emissivity 1 of theoretical black body radiation, and the graphene has the characteristics of heat conduction and heat radiation in the aspect of heat dissipation application; the specific heat capacity of the graphene was 720J/kg k and the copper particle deposition was 385J/kg k. Therefore, the first graphene composite heat sink layer 204 and the second graphene composite heat sink layer 208 containing the first metal particles have improved thermal conductivity, improved heat radiation performance, and improved heat capacity.

The heat dissipation efficiency is also verified through an experiment. For relevant data of the experiment, please refer to tables 1, 2 below:

table 1

Table 2

As can be seen from table 1, after the circuit board 10 is matched with the heat dissipation device 20, the cooling effect is more obvious than that without the heat dissipation device 20. Next, in table 2, the single-layer heat dissipation refers to only disposing the first colloid layer 202, the first graphene composite heat dissipation layer 204 and the resin layer 210, and the double-layer heat dissipation is the structure of this embodiment, as can be seen from table 2, compared with the single-layer heat dissipation, the double-layer heat dissipation has better heat dissipation effect and lower temperature. In the novel experiment, a simulation mode is adopted, shielding is adopted, and simulation is carried out in a fanless environment.

Referring to fig. 1 to fig. 3 and fig. 4, which are schematic installation views of a second embodiment of the heat dissipation device of the present invention, as shown in the drawings, in the present embodiment, the circuit board 10 is disposed on a main board 30, a heat dissipation member 302 is disposed on the main board 30, and when the heat dissipation device 20 is disposed on the circuit board 10 and installed on the main board 30, the heat dissipation member 302 is attached to the heat dissipation device 20. When the motherboard 30 is in a working state and generates a large amount of heat energy, the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 can rapidly transfer the heat energy from the motherboard 30 to the heat dissipation device 20; moreover, since the heat sink 302 is attached to the heat dissipation device 20, the heat sink 302 can transfer part of the heat energy of the heat dissipation device 20 to the heat sink 302, so as to reduce the temperature of the circuit board 10 and improve the working performance of the circuit board 10.

Subsequently, the circuit board 10 is a solid state disk or a memory, the first glue layer 202 and the second glue layer 206 are graphene double-sided adhesive tape, acryl double-sided adhesive tape, silica gel double-sided adhesive tape, grid double-sided adhesive tape, reinforcing double-sided adhesive tape, rubber double-sided adhesive tape, high-temperature double-sided adhesive tape, non-woven fabric double-sided adhesive tape, non-residue double-sided adhesive tape, tissue paper double-sided adhesive tape, double-sided glass cloth adhesive tape, PET double-sided adhesive tape, or foam double-sided adhesive tape, and the first glue layer 202 is doped with a plurality of second metal particles, and the second glue layer 206 is doped with a plurality of third metal particles. The circuit board 10 is provided with a first glue layer 202, a first graphene composite heat dissipation layer 204, a second glue layer 206, a second graphene composite heat dissipation layer 208, and a resin layer 210 at one time in a manner of bonding or adhering. The resin layer 210 is one of Polyimide (PI), Polyethylene terephthalate (PET), Polyethylene (PE), Biaxially oriented polypropylene (BOPP), Polycarbonate (PC), Polystyrene (PS), and Polyvinyl Chloride (PVC), or any combination thereof.

To sum up, the present novel heat dissipation device, by once setting a first colloid layer 202, a first graphene composite heat dissipation layer 204, a second colloid layer 206, a second graphene composite heat dissipation layer 208, a resin layer 210 on the circuit board 10, sets the first metal particles in the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208, and respectively coats the first graphene composite heat dissipation layer 204 and the second graphene composite heat dissipation layer 208 by the metal layer 212, reduces unevenness and undulation generated in the bonding process, increases the bonding efficiency, and improves the heat conductivity of the heat dissipation device 20.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the scope of the invention, which is defined by the appended claims.

Claims

1. A heat sink is provided, which is disposed on a circuit board, the heat sink comprising:

a first colloid layer arranged on the circuit board;

a first graphene composite heat dissipation layer bonded to the first colloid layer;

the second colloid layer is jointed on the graphene composite heat dissipation layer;

a second graphene composite heat dissipation layer bonded to the second colloid layer;

a resin layer disposed on the second graphene composite heat dissipation layer; and

the first graphene composite heat dissipation layer and the second graphene composite heat dissipation layer are doped with a plurality of first metal particles, and a metal layer respectively coats the first graphene composite heat dissipation layer and the second graphene composite heat dissipation layer.

2. The heat dissipation device of claim 1, wherein the circuit board is a solid state drive or a memory.

3. The heat dissipating device of claim 1, wherein the first metal particles are copper particles or aluminum particles.

4. The heat dissipating device of claim 1, wherein the metal layer is made of copper or aluminum.

5. The heat dissipating device of claim 1, wherein the first adhesive layer is doped with a plurality of second metal particles, and the first adhesive layer is a graphene double-sided tape, an acryl double-sided tape, a silicone double-sided tape, a grid double-sided tape, a reinforced double-sided tape, a rubber double-sided tape, a high temperature double-sided tape, a non-woven double-sided tape, a non-residue double-sided tape, a tissue double-sided tape, a double-sided glass cloth tape, a PET double-sided tape, or a foam double-sided tape.

6. The heat dissipating device of claim 5, wherein the second metal particles are copper particles or aluminum particles.

7. The heat dissipating device of claim 1, wherein the second adhesive layer is doped with a plurality of third metal particles, and the second adhesive layer is a graphene double-sided tape, an acryl double-sided tape, a silicone double-sided tape, a grid double-sided tape, a reinforced double-sided tape, a rubber double-sided tape, a high temperature double-sided tape, a non-woven double-sided tape, a non-residue double-sided tape, a tissue double-sided tape, a double-sided glass cloth tape, a PET double-sided tape, or a foam double-sided tape.

8. The heat dissipating device of claim 7, wherein the third metal particles are copper particles or aluminum particles.

9. The heat dissipating device of claim 1, wherein the resin layer is one of polyimide PI, polyethylene terephthalate PET, polyethylene PE, biaxially oriented polypropylene BOPP, polycarbonate PC, polystyrene PS, and polyvinyl chloride PVC or any combination thereof.

10. The heat dissipating device of claim 1, wherein the circuit board is disposed on a motherboard, and a heat dissipating member is disposed on the motherboard, and the heat dissipating member is attached to the heat dissipating device when the heat dissipating device is disposed on the circuit board and mounted on the motherboard.