CN211129871U - Heat dissipation device and helmet using same - Google Patents
Heat dissipation device and helmet using same Download PDFInfo
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- CN211129871U CN211129871U CN201922401159.5U CN201922401159U CN211129871U CN 211129871 U CN211129871 U CN 211129871U CN 201922401159 U CN201922401159 U CN 201922401159U CN 211129871 U CN211129871 U CN 211129871U
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Abstract
The utility model provides a heat abstractor and use this heat abstractor's helmet, wherein, the device includes the mainboard, still includes: the graphene sheet is arranged on the upper surface and the lower surface of the main board and one end of the heat pipe, the fin is arranged at the other end of the heat pipe, and the main board is in contact with the heat pipe. Can show the increase heat radiating area through radiator fin through the heat conduction of graphene piece, heat pipe with mainboard owner chip department, come out the heat conduction of other components and parts on the mainboard through the graphene piece, realize the all-round three-dimensional heat dissipation in whole space, through the heat dissipation aluminum sheet increase heat radiating area of the other end, do not produce the noise on satisfying the radiating basis of electronic component, realize the high-efficient passive heat dissipation of intelligent helmet.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a helmet technical field especially relates to a heat abstractor and use this heat abstractor's helmet.
[ background of the invention ]
With the development of economy and the progress of society, intelligent wearable equipment gradually enters the life of people, wherein the intelligent helmet is used as a novel product integrating an electronic function part and a structure protection part, and the development process faces serious heat dissipation problems.
The existing helmet is basically provided with ventilation holes in the front and the back, and the heat of an electronic element is taken out by the rapid flow of air flow in the movement process; or a fan is additionally arranged to form forced convection so as to dissipate heat. The two modes have certain defects, and the first mode has the defects that when the helmet is static and does not move, airflow cannot flow, and the heat dissipation effect cannot be generated; the second mode generates a certain noise when the fan is turned on, which is bound to cause discomfort to the wearer.
[ Utility model ] content
The utility model aims to solve the technical problem that a heat abstractor and use this heat abstractor's helmet is provided, can pass through the graphite alkene piece, the heat pipe comes out the heat-conduction of mainboard main chip department, come out the heat conduction of other components and parts on with the mainboard through the graphite alkene piece, show increase heat radiating area through radiating fin, realize the all-round three-dimensional heat dissipation in whole space, heat dissipation aluminum sheet increase heat radiating area through the other end, do not produce the noise on satisfying the radiating basis of electronic component, realize that intelligent helmet high-efficient passive heat dissipation.
In order to solve the above technical problem, an aspect of the present invention provides a heat dissipation device, including a main board, further including: the graphene sheet is arranged on the upper surface and the lower surface of the main board and one end of the heat pipe, the fin is arranged at the other end of the heat pipe, and the main board is in contact with the heat pipe.
Preferably, the graphene sheet is arranged on the upper surface and the lower surface of the main board in a sticking manner.
Preferably, the graphene sheet is arranged at one end of the heat pipe in a sticking manner.
Preferably, the other end of the heat pipe is provided with the fin in a welding manner.
Preferably, the main plate comprises a main chip, and the contact position of the heat pipe and the main chip is kept flat.
Preferably, the back of the graphene sheet is coated with an insulating glue, and the graphene sheet is adhered to the main board through the insulating glue.
Preferably, the graphene sheet is pasted with an aluminum sheet.
Preferably, the graphene sheet is plural.
In one aspect, an embodiment of the present invention provides a helmet, including a shell and further including the above heat dissipation device.
Preferably, the shape of the heat pipe is adaptively curved according to the housing.
Compared with the prior art, the technical scheme has the following advantages: can show the increase heat radiating area through radiator fin through the heat conduction of graphene piece, heat pipe with mainboard owner chip department, come out the heat conduction of other components and parts on the mainboard through the graphene piece, realize the all-round three-dimensional heat dissipation in whole space, through the heat dissipation aluminum sheet increase heat radiating area of the other end, do not produce the noise on satisfying the radiating basis of electronic component, realize the high-efficient passive heat dissipation of intelligent helmet.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a bottom view of an embodiment of a heat dissipation device of the present invention.
Fig. 2 is a partially enlarged view of fig. 1.
Fig. 3 is a front view of an embodiment of a heat dissipation device of the present invention.
Fig. 4 is a right side view of an embodiment of the heat dissipation device of the present invention.
Fig. 5 is a top view of an embodiment of a heat dissipation device of the present invention.
Fig. 6 is an isometric view of an embodiment of a heat sink of the present invention.
Fig. 7 is a left side view of an embodiment of the heat dissipation device of the present invention.
Fig. 8 is a back view of an embodiment of a heat dissipation device of the present invention.
Fig. 9 is a bottom view of another embodiment of a heat dissipation device of the present invention.
Fig. 10 is a front view of another embodiment of a heat sink of the present invention.
Fig. 11 is a right side view of another embodiment of a heat sink of the present invention.
Fig. 12 is a left side view of another embodiment of a heat dissipation device of the present invention.
Fig. 13 is a back view of another embodiment of a heat sink of the present invention.
Fig. 14 is a top view of another embodiment of a heat dissipation device of the present invention.
Fig. 15 is an isometric view of yet another embodiment of a heat sink of the present invention.
In the figure, 1-graphene sheet, 2-aluminum sheet, 3-heat pipe, 4-fin, 5-main chip, 6-PCB board, 7-main board electronic component.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Example one
Fig. 1 is a bottom view of an embodiment of a heat dissipation device of the present invention.
Fig. 2 is a partially enlarged view of fig. 1.
Fig. 3 is a front view of an embodiment of a heat dissipation device of the present invention.
Fig. 4 is a right side view of an embodiment of the heat dissipation device of the present invention.
Fig. 5 is a top view of an embodiment of a heat dissipation device of the present invention.
Fig. 6 is an isometric view of an embodiment of a heat sink of the present invention.
Fig. 7 is a left side view of an embodiment of the heat dissipation device of the present invention.
Fig. 8 is a back view of an embodiment of a heat dissipation device of the present invention.
The mainboard is the core part of intelligent helmet, and cpu on the mainboard is main chip promptly and is the main heat source, and high temperature can lead to the mainboard to reduce the frequency and get into self-protection state, for guaranteeing the stable operation of mainboard and cpu, need carry out the heat dissipation design to it, please refer to fig. 1-8, graphite alkene piece 1 pastes on heat pipe 3, and heat pipe 3 one end directly touches with the main chip 5 heat source of 6 one sides of PCB board, and the mainboard electron 7 of mainboard another side directly pastes with graphite alkene piece 1. The main chip 5 is a main heat source, the heat is transferred by the heat pipe 3, the area is enlarged by the graphene sheet 1, and the main board electronic part 7 on the other side is an auxiliary heat source and directly conducts heat by the graphene sheet 1. The other end of the heat pipe 3 directly sleeves the fin 4. The contact position of the heat pipe 3 and the main chip 5 on the mainboard is flattened, so that good direct contact with the main chip 5 is ensured, and thermal resistance is reduced; the heat pipe 3 is bent adaptively along with the appearance of the helmet, so that the overall appearance of the helmet is not influenced; a set of radiating fins 4 are welded at the other end of the heat pipe at the position where the inner space of the helmet is large, the size of the radiating fins 4 is determined according to the size of the inner space, the natural convection radiating area is obviously increased through the radiating fins 4, and the passive radiating capacity can be greatly improved.
Example two
Fig. 9 is a bottom view of another embodiment of a heat dissipation device of the present invention.
Fig. 10 is a front view of another embodiment of a heat sink of the present invention.
Fig. 11 is a right side view of another embodiment of a heat sink of the present invention.
Fig. 12 is a left side view of another embodiment of a heat dissipation device of the present invention.
Fig. 13 is a back view of another embodiment of a heat sink of the present invention.
Fig. 14 is a top view of another embodiment of a heat dissipation device of the present invention.
Fig. 15 is an isometric view of yet another embodiment of a heat sink of the present invention.
Referring to fig. 9 to 15, in the first embodiment, a plurality of heat dissipation aluminum sheets are disposed on the copper foil graphene sheet. The aluminum sheets are used to dissipate heat from the graphene sheets. A graphene sheet heat dissipation device is arranged in a helmet main board bin, and heat of electronic components generating heat in the main board is uniformly dissipated to the whole space, so that heat dissipation of the electronic components is realized. The back of the copper foil graphene sheet is coated with heat-conducting insulating glue, the copper foil graphene sheet can be directly adhered to a mainboard, and the heat of each electronic element on the mainboard is led out through the high heat conductivity of the graphene sheet; a heat dissipation aluminum sheet is pasted at the other end of the graphene sheet, so that the heat dissipation area is obviously increased in a limited space, and the heat dissipation capability is improved.
According to the above description, use according to the utility model discloses a heat abstractor and helmet can come out the heat-conduction of mainboard main chip department through graphite alkene piece, heat pipe, comes out the heat conduction of other components and parts on the mainboard through graphite alkene piece, shows increase heat radiating area through radiating fin, realizes the all-round three-dimensional heat dissipation of whole space, and heat dissipation aluminum sheet increase heat radiating area through the other end does not produce the noise on satisfying the radiating basis of electronic component, realizes the high-efficient passive heat dissipation of intelligent helmet.
The embodiments of the present invention have been described in detail, and the principles and embodiments of the present invention have been explained herein using specific embodiments, and the above description of the embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (10)
1. The utility model provides a heat abstractor, includes the mainboard, its characterized in that still includes: the graphene sheet is arranged on the upper surface and the lower surface of the main board and one end of the heat pipe, the fin is arranged at the other end of the heat pipe, and the main board is in contact with the heat pipe.
2. The heat dissipation device of claim 1, wherein the graphene sheets are attached to the upper and lower surfaces of the main plate.
3. The heat dissipation device of claim 1, wherein the graphene sheet is attached to one end of the heat pipe.
4. The heat dissipating device of claim 1, wherein the other end of the heat pipe is provided with the fin by welding.
5. The heat dissipating device of claim 1, wherein the main plate comprises a main chip, and a contact position of the heat pipe with the main chip is kept flat.
6. The heat dissipation device of claim 2, wherein the graphene sheet is coated with an insulating glue on the back, and is attached to the main board through the insulating glue.
7. The heat dissipation device of claim 1, wherein the graphene sheet is coated with an aluminum sheet.
8. The heat dissipating device of claim 1, wherein the graphene sheet is a plurality.
9. A helmet comprising a shell and further comprising a heat sink according to any one of claims 1 to 8.
10. The helmet of claim 9, wherein the profile of the heat pipe is adapted to bend according to the shell.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922401159.5U CN211129871U (en) | 2019-12-27 | 2019-12-27 | Heat dissipation device and helmet using same |
| PCT/CN2020/087495 WO2020221249A1 (en) | 2019-04-28 | 2020-04-28 | Heat dissipation apparatus and helmet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922401159.5U CN211129871U (en) | 2019-12-27 | 2019-12-27 | Heat dissipation device and helmet using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211129871U true CN211129871U (en) | 2020-07-31 |
Family
ID=71754724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922401159.5U Active CN211129871U (en) | 2019-04-28 | 2019-12-27 | Heat dissipation device and helmet using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211129871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112315102A (en) * | 2020-10-21 | 2021-02-05 | 华能澜沧江水电股份有限公司托巴水电工程建设管理局 | Multifunctional safety helmet |
-
2019
- 2019-12-27 CN CN201922401159.5U patent/CN211129871U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112315102A (en) * | 2020-10-21 | 2021-02-05 | 华能澜沧江水电股份有限公司托巴水电工程建设管理局 | Multifunctional safety helmet |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201216 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN KUANG-CHI SUPER MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Shanghai Security Service (Group) Co.,Ltd. Address before: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN KUANG-CHI SPACE TECH. Co.,Ltd. Patentee before: SHENZHEN KUANG-CHI SUPER MATERIAL TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |