CN211979597U

CN211979597U - Tablet personal computer mainboard capable of enhancing cooling based on semiconductor refrigeration technology

Info

Publication number: CN211979597U
Application number: CN202020708918.2U
Authority: CN
Inventors: 周小凤; 陈秀永; 彭玉兰
Original assignee: Shenzhen Xingrong Industrial Co ltd
Current assignee: Shenzhen Xingrong Industrial Co ltd
Priority date: 2020-05-01
Filing date: 2020-05-01
Publication date: 2020-11-20
Anticipated expiration: 2030-05-01

Abstract

The utility model discloses a tablet personal computer mainboard for enhancing cooling based on semiconductor refrigeration technology, which comprises a mainboard body, wherein an electric element is fixedly arranged at the upper end of the mainboard body, a heat dissipation substrate is arranged at the upper end of the electric element, a cushion layer is fixedly clamped between the heat dissipation substrate and the mainboard body, heat dissipation fins are symmetrically arranged at the two sides of the upper end of the heat dissipation substrate, a semiconductor refrigeration sheet is arranged at the upper end of the heat dissipation substrate, and the semiconductor refrigeration sheet is fixedly bonded on the heat dissipation substrate through heat conduction glue, the utility model discloses a second threaded hole is arranged on the heat dissipation substrate in an equidistant array, and the semiconductor refrigeration sheet is arranged above the second threaded hole, a heat dissipation fan is fixedly arranged on the heat dissipation substrate through a second bolt above the heat dissipation fin, the utility model discloses a heat quantity emitted by the electric element can be transmitted to the upper part through the, the heat dissipation area is increased, so that the semiconductor refrigerating sheet can absorb and dissipate heat more directly.

Description

Tablet personal computer mainboard capable of enhancing cooling based on semiconductor refrigeration technology

Technical Field

The utility model relates to a computer mainboard heat abstractor technical field specifically is a tablet computer mainboard of intensive cooling based on semiconductor refrigeration technology.

Background

With the rapid development of semiconductor materials in the twenty-fifth century, thermoelectric refrigerators gradually move from laboratories to engineering practices, are applied in the fields of national defense, industry, agriculture, medical treatment, daily life and the like, are large enough to be used as air conditioners of nuclear submarines and small enough to be used for cooling probes of infrared detectors, so that the thermoelectric refrigerators are generally called semiconductor refrigerators, are small in size and can be made into refrigerators with the size of less than 1cm, and are light in weight, and the micro refrigerators can be often made into small refrigerators of only a few grams or dozens of grams.

The traditional copper pipe heat dissipation is mostly adopted in the existing tablet computer mainboard heat dissipation mode, heat generated by mainboard work is conducted through heat convection of the copper pipe and the external stroke, and therefore heat dissipation is achieved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dull and stereotyped computer mainboard of intensive cooling based on semiconductor refrigeration technology to what the present dull and stereotyped computer mainboard radiating mode that proposes adopted is traditional copper pipe heat dissipation mostly in solving above-mentioned background art, with the heat that mainboard work produced, through copper pipe and external stroke heat convection, thereby realize the heat dissipation, this kind of radiating mode radiating efficiency is low, needs the problem of more refrigerant moreover.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a dull and stereotyped computer mainboard of intensive cooling based on semiconductor refrigeration technology, includes the mainboard body, mainboard body upper end fixed mounting has electric element, electric element's upper end is provided with the radiating basal plate, fixed joint has the bed course between radiating basal plate and the mainboard body, radiating basal plate's upper end bilateral symmetry is provided with heat radiation fins, radiating basal plate's upper end is provided with the semiconductor refrigeration piece, the semiconductor refrigeration piece is fixed to be bonded on radiating basal plate through heat-conducting glue, the fixed block has been cup jointed to the upper end of semiconductor refrigeration piece, the fixed block passes through third bolt fixed mounting on radiating basal plate, the last radiator fan that is provided with of heat radiation fins, radiator fan passes through second bolt fixed mounting on radiating basal plate.

Preferably, the cushion layer is a rectangular frame cushion layer, and the heat dissipation substrate is fixedly mounted on the main board body through a first bolt.

Preferably, four sets of first through holes for passing through the first bolts and four sets of first threaded holes for mounting the second bolts are symmetrically formed in the heat dissipation substrate.

Preferably, four groups of second through holes for the third bolt to pass through are symmetrically formed in the upper end of the fixing block.

Preferably, the upper end of the fixing block is provided with a convex hole, and the inner wall of the convex hole is in clearance fit with the upper end of the semiconductor refrigeration piece.

Preferably, the middle part of the heat dissipation substrate is provided with second threaded holes in an equidistant array, the second threaded holes are used for installing third bolts and are located between the heat dissipation fins which are symmetrically arranged on two sides.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a set up the radiating basal plate on electric element, be provided with heat radiation fins in radiating basal plate upper end bilateral symmetry, be provided with the semiconductor refrigeration piece between heat radiation fins of both sides, and the semiconductor refrigeration piece bonds on the radiating basal plate through heat-conducting glue, cup joint the fixed block with the upper end of semiconductor refrigeration piece, through third bolt fixed mounting on the radiating basal plate for this structure radiating efficiency is better, has promoted the utilization ratio of inner space.

2. Through the equidistance array has seted up the second screw hole on the radiating basal plate, and the semiconductor refrigeration piece sets up in the top of second screw hole, passes through the design of second bolt with radiator fan fixed mounting on the radiating basal plate above the radiating fin piece, the utility model discloses the heat that makes electric element send can pass to the top through the second screw hole, has increased heat radiating area for the semiconductor refrigeration piece can be more direct absorb the heat and disperse away.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation substrate of the present invention;

fig. 3 is a schematic structural diagram of the fixing block of the present invention.

In the figure: 1. a main board body; 2. a heat-dissipating substrate; 3. heat dissipation fins; 4. a first through hole; 5. a first threaded hole; 6. a second threaded hole; 7. an electrical element; 8. a cushion layer; 9. a first bolt; 10. a heat radiation fan; 11. a second bolt; 12. a semiconductor refrigeration sheet; 13. heat conducting glue; 14. a fixed block; 15. a convex hole; 16. a third bolt; 17. a second via.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a tablet personal computer mainboard for enhancing cooling based on semiconductor refrigeration technology comprises a mainboard body 1, wherein an electric element 7 is fixedly installed at the upper end of the mainboard body 1, a heat dissipation substrate 2 is arranged at the upper end of the electric element 7, a cushion layer 8 is fixedly clamped between the heat dissipation substrate 2 and the mainboard body 1, the cushion layer 8 is a rectangular frame cushion layer, the heat dissipation substrate 2 is fixedly installed on the mainboard body 1 through a first bolt 9, heat dissipation fins 3 are symmetrically arranged at two sides of the upper end of the heat dissipation substrate 2, a semiconductor refrigeration sheet 12 is arranged at the upper end of the heat dissipation substrate 2, the semiconductor refrigeration sheet 12 is fixedly bonded on the heat dissipation substrate 2 through a heat conduction glue 13, a fixed block 14 is fixedly sleeved at the upper end of the semiconductor refrigeration sheet 12, the fixed block 14 is fixedly installed on the heat dissipation substrate 2 through a third bolt 16, four groups of second through holes 17 for, second threaded holes 6 used for installing third bolts 16 are formed in the middle of the radiating base plate 2 in an equidistant array mode, the second threaded holes 6 are located between radiating fins 3 which are symmetrically arranged on two sides, convex holes 15 are formed in the upper ends of fixing blocks 14, the inner walls of the convex holes 15 are in clearance fit with the upper ends of semiconductor refrigerating fins 12, radiating fans 10 are arranged on the radiating fins 3, the radiating fans 10 are fixedly installed on the radiating base plate 2 through second bolts 11, four groups of first through holes 4 used for penetrating through first bolts 9 and four groups of first threaded holes 5 used for installing the second bolts 11 are symmetrically formed in the radiating base plate 2.

The working principle is as follows: when using, some heat that electric element 7 sent is discharged through radiator fan on transmitting the radiating fin through radiating base plate 2, and another part heat is absorbed by semiconductor refrigeration piece 12 through second screw hole 6, the utility model discloses the structure radiating efficiency is better, has promoted the utilization ratio of inner space, has increased heat radiating area for semiconductor refrigeration piece 12 can be more direct absorb the heat and radiate away.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a dull and stereotyped computer mainboard of intensive cooling based on semiconductor refrigeration technique, includes mainboard body (1), its characterized in that: an electric element (7) is fixedly arranged at the upper end of the main board body (1), a heat dissipation substrate (2) is arranged at the upper end of the electric element (7), a cushion layer (8) is fixedly clamped between the heat-radiating substrate (2) and the main board body (1), radiating fins (3) are symmetrically arranged on both sides of the upper end of the radiating substrate (2), the upper end of the radiating substrate (2) is provided with a semiconductor refrigerating sheet (12), the semiconductor refrigeration sheet (12) is fixedly bonded on the heat dissipation substrate (2) through heat conduction glue (13), the upper end of the semiconductor refrigerating sheet (12) is fixedly sleeved with a fixed block (14), the fixed block (14) is fixedly arranged on the heat dissipation substrate (2) through a third bolt (16), the radiating fins (3) are provided with radiating fans (10), and the radiating fans (10) are fixedly installed on the radiating base plate (2) through second bolts (11).

2. The tablet computer mainboard with enhanced cooling based on semiconductor refrigeration technology, according to claim 1, is characterized in that: the cushion layer (8) is arranged to be a rectangular frame cushion layer, and the heat dissipation substrate (2) is fixedly installed on the main board body (1) through a first bolt (9).

3. The tablet computer mainboard with enhanced cooling based on semiconductor refrigeration technology, according to claim 2, is characterized in that: four groups of first through holes (4) used for penetrating through the first bolts (9) and four groups of first threaded holes (5) used for installing the second bolts (11) are symmetrically formed in the heat dissipation substrate (2).

4. The tablet computer mainboard with enhanced cooling based on semiconductor refrigeration technology, according to claim 1, is characterized in that: four groups of second through holes (17) for the third bolts to pass through are symmetrically formed in the upper end of the fixing block (14).

5. The tablet computer mainboard based on semiconductor refrigeration technology for enhancing cooling as claimed in claim 4, wherein: convex holes (15) are formed in the upper ends of the fixing blocks (14), and the inner walls of the convex holes (15) are in clearance fit with the upper ends of the semiconductor refrigeration pieces (12).

6. The tablet computer mainboard with enhanced cooling based on semiconductor refrigeration technology, according to claim 1, is characterized in that: second threaded holes (6) used for installing third bolts (16) are formed in the middle equidistant array of the radiating base plate (2), and the second threaded holes (6) are located between the radiating fins (3) which are symmetrically arranged on two sides.