CN218603821U

CN218603821U - Heat dissipation structure and electronic equipment

Info

Publication number: CN218603821U
Application number: CN202221343798.6U
Authority: CN
Inventors: 王连民; 傅东生
Original assignee: Shenzhen Miracle Intelligent Network Co Ltd
Current assignee: Shenzhen Miracle Intelligent Network Co Ltd
Priority date: 2022-05-30
Filing date: 2022-05-30
Publication date: 2023-03-10
Anticipated expiration: 2032-05-30

Abstract

The utility model provides a heat radiation structure, be in including casing and setting heating source in the casing, heat radiation structure is still including consecutive heat absorption end, heat conduction structure and exothermic end, heat absorption end with the source that generates heat is supported and is leaned on the connection, the casing has the cooling surface, exothermic end with the cooling surface is supported and is leaned on the connection, heat conduction structure can buckle. The utility model discloses a heat radiation structure's radiating effect is good, and the cooperation precision requirement of structure is not high, and the source that generates heat is difficult for also impairedly. The utility model discloses still relate to an electronic equipment.

Description

Heat radiation structure and electronic equipment

Technical Field

The utility model relates to a heat dissipation technical field especially relates to a heat radiation structure and electronic equipment.

Background

With the high integration of electronic devices, the computing performance is improved and the heat productivity is also increased. In order to solve the problem of heat dissipation, two commonly used heat dissipation methods, namely active heat dissipation and passive heat dissipation, are adopted. The active heat dissipation adopts fans and the like to strengthen air circulation and actively dissipate heat, and the passive heat dissipation adopts large-area heat dissipation fins for passive heat dissipation.

However, in an electronic device requiring a closed space, if active heat dissipation is used, the hot air inside cannot be exhausted, and the internal temperature gradually rises. Even if heat can be transferred to the shell through hot air, the shell transfers the heat to the outside, and the heat transfer efficiency of the air is low, so that poor heat dissipation and over-high internal temperature can be finally caused. Furthermore, the moving parts such as the fan which actively radiates heat have limited service life, and long-term reliable operation cannot be ensured. Therefore, enclosed electronic devices typically do not employ active heat dissipation.

The existing closed electronic equipment mostly adopts a passive heat dissipation mode, the internal heating source is directly connected with the shell through materials such as copper and aluminum with high heat conductivity, and the internal heat is quickly conducted to the shell and then is transmitted to the outside through the shell. This kind of mode radiating effect is good, but has higher requirement to the structure of shell. And when the heat generating device is assembled, one surface of the shell parallel to the heat generating source is required to be capable of vertically moving, and the other surface of the shell parallel to the heat generating source is incapable of being used if the surface of the shell parallel to the heat generating source cannot vertically move.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat radiation structure, its radiating effect is good, and the cooperation required precision of structure is not high, and the source that generates heat is difficult for also impairedly.

The utility model provides a heat radiation structure, be in including casing and setting heating source in the casing, heat radiation structure is still including consecutive heat absorption end, heat conduction structure and exothermic end, heat absorption end with the source that generates heat is supported and is leaned on the connection, the casing has the cooling surface, exothermic end with the cooling surface is supported and is leaned on the connection, heat conduction structure can buckle.

Further, the shell is of a closed structure.

Furthermore, the heat conduction structure comprises a pipe shell, a liquid absorption core and working liquid, wherein the liquid absorption core and the working liquid are arranged in the pipe shell, the heat absorption end and the heat release end seal the pipe shell, negative pressure is arranged in the pipe shell, one end of the heat conduction structure is an evaporation section, the other end of the heat conduction structure is a condensation section, the evaporation section is connected with the heat absorption end, and the condensation section is connected with the heat release end.

Furthermore, a plurality of radiating fins are arranged on the outer side of the radiating surface.

Further, the casing still has bottom plate and lateral wall, the bottom plate with the cooling surface sets up relatively, the lateral wall is connected the bottom plate with between the cooling surface, be equipped with the mounting panel in the casing, the source of generating heat sets up on the mounting panel.

Further, the mounting plate and the heat dissipation surface are perpendicular to each other.

Furthermore, the mounting plate and the radiating surface are parallel to each other and arranged in a staggered mode.

The utility model also provides an electronic equipment, including foretell heat radiation structure.

Further, the heat source is a central processing unit.

The utility model provides a heat radiation structure and electronic equipment is through setting up consecutive heat absorption end, heat conduction structure and the end of releasing heat, and the heat absorption end supports with the source that generates heat and leans on to be connected, and the casing has the cooling surface, and the end of releasing heat supports with the cooling surface and leans on to be connected, and the radiating effect is good, and heat conduction structure can buckle, and the cooperation required precision between cooling surface and the source that generates heat is not high, and the source that generates heat is also difficult for impairedly.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention can be implemented according to the content of the description, and in order to make the other objects, features, and advantages of the heat dissipation structure and the electronic device of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure according to a first embodiment of the present invention.

Fig. 2 is a schematic view of a folding structure of the heat dissipation structure according to the first embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a heat dissipation structure according to a first embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a heat dissipation structure according to a second embodiment of the present invention.

Detailed Description

To further illustrate the technical means and effects of the present invention adopted to achieve the objectives of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and preferred embodiments for the specific embodiments, structures, features and effects of the heat dissipation structure and the electronic device according to the present invention as follows:

the foregoing and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments, which is to be read in connection with the accompanying drawings. While the present invention has been described with reference to the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various modifications, equivalents and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

[ first embodiment ] A method for manufacturing a semiconductor device

Referring to fig. 1 to 3, the heat dissipation structure includes a housing 1 and a heat source 20 disposed in the housing 1, the heat dissipation structure includes a heat absorption end 31, a heat conduction structure 32 and a heat release end 33 connected in sequence, the heat absorption end 31 is connected to the heat source 20, the housing 1 has a heat dissipation surface 11, the heat release end 33 is connected to the heat dissipation surface 11, and the heat conduction structure 32 is bendable.

Specifically, the housing 1 is a sealed structure.

In the present embodiment, the housing 1 has a hexahedral structure. The housing 1 further has a bottom plate (not shown for the sake of easy viewing of the internal structure) disposed opposite the heat radiating surface 11, and a side wall 12 connected between the bottom plate and the heat radiating surface 11. A mounting plate 40 is arranged in the casing 1, and the heat source 20 is arranged on the mounting plate 40. The heat releasing end 33 is parallel to the heat dissipating surface 11, the heat absorbing end 31 is parallel to the mounting plate 40, the mounting plate 40 is perpendicular to the heat dissipating surface 11 (i.e. the heat absorbing end 31 is perpendicular to the heat releasing end 33), and the heat conducting structure 32 can be bent to a suitable shape (e.g. 90 °) to adapt to the positions of the heat absorbing end 31 and the heat releasing end 33.

The heat absorbing end 31 and the heat releasing end 33 can be fixed by bolts or springs, the heat absorbing end 31 is tightly attached to the heat source 20, and the heat releasing end 33 is tightly attached to the heat dissipating surface 11. In this embodiment, the heat absorbing end 31 is fixed to the mounting plate 40 by bolts. The heat radiating end 33 is fixed to the heat radiating surface 11 by a bolt. The heat-dissipating surface 11 is in turn fastened to the side wall 12 by means of bolts. The heat absorbing end 31 and the heat releasing end 33 are perpendicular to each other, and the heat can be released by changing the bending of the heat conducting structure 32 even if the heat source 20 is not parallel to the heat releasing surface 11 and is not closely attached thereto.

Further, heat conduction structure 32 includes the tube and sets up imbibition core and the working fluid in the tube, and heat absorption end 31 has the negative pressure with sending out heat end 33 with the tube is sealed and in the tube, and heat conduction structure 32's one end is the evaporation zone, and heat conduction structure 32's the other end is the condensation segment, and the evaporation zone is connected with heat absorption end 31, and the condensation segment is connected with sending out heat end 33.

Further, a plurality of fins 111 are provided outside the heat radiating surface 11. The plurality of fins 111 are arranged in parallel at intervals and are all perpendicular to the heat dissipation surface 11, and the fins 111 corresponding to the heat dissipation end 33 have notches. The gap is a wall for installing the heat radiating end 33 to allow a space. The heat radiating surface 11 and the heat radiating fins 111 transfer heat of the heat radiating end 33 to the outside (i.e., outside the case 1).

When the heat dissipation structure is installed, the heat absorption end 31, the heat conduction structure 32 and the heat dissipation end 33 which are combined into a whole are installed on the installation plate 40 together with the heat source 20, and then the heat dissipation surface 11 of the housing 1 is installed together with the side wall 12 of the housing 1. The heat radiating end 33 is fixed by a screw or a spring so that the heat radiating end 33 is closely attached to the inside of the heat radiating surface 11 of the case 1. Thus, the heat of the heat generating source 20 can be well conducted to the heat dissipating surface 11 through the heat conducting structure 32 and dissipated to the outside.

[ second embodiment ]

As shown in fig. 4, the heat dissipation structure of the second embodiment of the present invention is substantially the same as the first embodiment, and the mounting plate 40 and the heat dissipation surface 11 are parallel to each other and are arranged in a staggered manner.

In the prior art, when the heat dissipating surface 11 and the mounting plate 40 are parallel to each other, if the heat absorbing end 31, the heat conducting structure 32 and the heat releasing end 33 are not used, the heat source 20 needs to be directly attached to the heat dissipating surface 11, which has a high requirement on the structural matching accuracy, and the heat source 20 is subjected to a large stress, which is likely to cause damage. After the heat absorption end 31, the heat conduction structure 32 and the heat release end 33 are used, the heat conduction structure 32 can bear large deformation, so that the requirement on the structural matching precision can be lowered, meanwhile, the stress at the position of the heat source 20 can be lowered, and the equipment damage caused by stress is reduced. In addition, the impact conducted to the heat generating source 20 can also be reduced when the housing 1 collides.

To sum up, the embodiment of the utility model provides a heat radiation structure has following beneficial effect:

1. the requirement on the matching precision of the structure is not high.

2. The heat dissipation efficiency when the heat source 20 and the heat dissipation surface 11 are not parallel or staggered with each other can be improved, and the heat dissipation effect is good.

3. The stress on the heat source 20 can be reduced, and the damage caused by the stress can be reduced.

4. The impact force conducted to the heat generating source 20 by the case 1 when the external impact is applied can be reduced.

The utility model discloses still relate to an electronic equipment, including foretell heat radiation structure. The electronic device is, for example, a handheld electronic device such as a mobile phone and a tablet computer, or a notebook computer and a desktop computer, and the heat source 20 is a Central Processing Unit (CPU) of the electronic device.

The heat dissipation structure and the electronic device provided by the present invention are introduced in detail, and a specific example is applied to explain the principle and the implementation of the present invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be changes in the specific embodiments and the application range, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. The utility model provides a heat radiation structure, includes casing (1) and sets up heating source (20) in casing (1), its characterized in that, heat radiation structure still includes consecutive heat absorption end (31), heat-conducting structure (32) and exothermic end (33), heat absorption end (31) with heating source (20) support to lean on to be connected, casing (1) has cooling surface (11), the outside of cooling surface (11) is equipped with a plurality of fin (111), exothermic end (33) with cooling surface (11) support to lean on to be connected, heat-conducting structure (32) can buckle.

2. The heat dissipation structure according to claim 1, wherein the housing (1) is a closed structure.

3. The heat dissipation structure of claim 1, wherein the heat conduction structure (32) comprises a shell, and a wick and a working fluid disposed in the shell, the heat absorption end (31) and the heat release end (33) seal the shell and negative pressure is provided in the shell, one end of the heat conduction structure (32) is an evaporation section, the other end of the heat conduction structure (32) is a condensation section, the evaporation section is connected with the heat absorption end (31), and the condensation section is connected with the heat release end (33).

4. The heat dissipation structure according to claim 1, wherein the case (1) further has a bottom plate disposed opposite to the heat dissipation surface (11) and a side wall (12) connected between the bottom plate and the heat dissipation surface (11), a mounting plate (40) is provided in the case (1), and the heat generation source (20) is disposed on the mounting plate (40).

5. The heat dissipation structure of claim 4, wherein the mounting plate (40) and the heat dissipation surface (11) are perpendicular to each other.

6. The heat dissipating structure of claim 4, wherein the mounting plate (40) and the heat dissipating surface (11) are parallel to each other and are disposed in a staggered manner.

7. An electronic device comprising the heat dissipation structure as recited in any one of claims 1 to 6.

8. The electronic device according to claim 7, wherein the heat generating source (20) is a central processing unit.