CN217085689U

CN217085689U - Compound computer heat abstractor of polypropylene graphite alkene

Info

Publication number: CN217085689U
Application number: CN202123387739.7U
Authority: CN
Inventors: 马宝光; 胡敏锐; 何达帆; 卢家伟; 蔡倩莹
Original assignee: Jiangmen Guangrui New Material Technology Co ltd
Current assignee: Jiangmen Guangrui New Material Technology Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-07-29
Anticipated expiration: 2031-12-29

Abstract

The utility model belongs to the technical field of heat abstractor, concretely relates to compound computer heat abstractor of polypropylene graphite alkene. The heat pipe comprises a first end and a second end opposite to the first end, the first end and the second end of the heat pipe are connected to form a U shape, the first end of the heat pipe is embedded in the heat conduction connecting plate, the second end of the heat pipe is embedded in the heat dissipation fin, the heat conduction connecting plate is spaced from the heat dissipation fin, the heat conduction connecting plate is used for connecting a heat-dissipated element, the heat pipe is used for conducting heat of the heat-dissipated element to the heat dissipation fin, the heat dissipation fan is located on one side of the heat dissipation fin, and when the heat dissipation fan works, the air flow speed around the heat dissipation fin is accelerated. The utility model discloses the radiating effect is excellent, can adapt to current computer heat dissipation demand well.

Description

Compound computer heat abstractor of polypropylene graphite alkene

Technical Field

The utility model belongs to the technical field of heat abstractor, concretely relates to compound computer heat abstractor of polypropylene graphite alkene.

Background

With the continuous improvement of computer performance, the generated heat is also increasing, so the heat dissipation problem of the computer is to be solved urgently. On the other hand, most hardware of the computer is composed of semiconductors, and the hardware can work efficiently only at a proper and cooler temperature, but the heat generated by the operation of the computer can cause the temperature of the semiconductors to rise sharply, thereby causing unstable operation, affecting the performance and shortening the service life. Taking the CPU as an example, if the temperature of the CPU reaches a high temperature, the CPU will take down frequency measures to continue normal operation, and the operation performance of the CPU will also be degraded at a high temperature. This is why the hardware inside the computer needs to dissipate heat.

At present, a traditional computer heat dissipation mode is that a heat dissipation fan is adopted for heat dissipation, a temperature sensor is used for collecting real-time temperature, and the rotating speed of the fan is automatically adjusted according to the temperature detected by a probe, so that the burden of a computer mainboard caused by overhigh temperature is prevented. In order to further increase the heat dissipation effect of the heat sink, some heat sinks and heat dissipation fans are used to dissipate heat of the computer, however, with the development of the society, data to be processed of the computer motherboard becomes larger and larger, and the heat dissipation method cannot be well adapted to the existing requirements, so that a heat sink with excellent heat dissipation effect needs to be developed.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a compound computer heat abstractor of polypropylene graphite alkene.

The utility model provides a compound computer heat abstractor of polypropylene graphite alkene, it includes radiator fan, radiating fin, heat pipe and heat conduction connecting plate, the heat pipe include first end and with the relative second end that sets up of first end is held, the first end and the second end of heat pipe are connected and are formed the U type, the first end of heat pipe is inlayed and is established in the heat conduction connecting plate, the second end of heat pipe is inlayed and is established in the radiating fin, the heat conduction connecting plate with the radiating fin is spaced mutually, the heat conduction connecting plate is used for connecting by radiator element, the heat pipe is used for the conduction by radiator element's heat extremely radiating fin, radiator fan is located radiating fin one side, radiator fan during operation makes air velocity around the radiating fin accelerates.

Preferably, the compound computer heat abstractor of polypropylene graphite alkene still includes fixed frame, the lower extreme of fixed frame with radiating fin fixed connection, the upper end of fixed frame with radiator fan fixed connection.

Preferably, the fixed frame with radiator fan all is provided with the screw hole, the compound computer heat abstractor of polypropylene graphite alkene still includes the screw, fixed frame with radiator fan, through the cooperation fixed connection of screw hole and screw.

Preferably, the heat dissipation fins are arranged at intervals, the relatively wide faces of the heat dissipation fins face the transverse direction of the polypropylene graphene compounded computer heat dissipation device, connecting holes are formed in the relatively wide faces of the heat dissipation fins, and the second ends of the heat pipes are embedded in the heat dissipation fins through the connecting holes.

Preferably, the side surface of the heat-conducting connecting plate, which is far away from the radiating fins, is provided with a mounting groove, and the first end of the heat pipe is embedded in the heat-conducting connecting plate through the mounting groove.

Preferably, a matching surface is formed at the lower end of the second end of the heat pipe, the first end of the heat pipe is embedded in the heat conduction connecting plate, the matching surface of the heat pipe is matched with the side surface, away from the radiating fins, of the heat conduction connecting plate, and when the heat conduction connecting plate is connected with a radiated element, the matching surface of the heat pipe is abutted to the radiated element.

Preferably, the polypropylene and graphene compounded computer heat dissipation device further comprises a graphene heat conduction film, and the heat conduction connecting plate and the heat-dissipated element are respectively connected with the upper surface and the lower surface of the graphene heat conduction film.

Preferably, the graphene heat conduction film and the heat conduction connecting plate are both made of graphene polypropylene composite materials.

Preferably, the heat-conducting connecting plate is further provided with mounting holes penetrating through the upper surface and the lower surface of the heat-conducting connecting plate, and the heat-conducting connecting plate is fixedly connected to the heat-radiated element through the mounting holes.

Preferably, the surfaces of the heat dissipation fins and/or the heat pipe are coated with graphene coatings.

The utility model provides a compound computer heat abstractor of polypropylene graphite alkene, its radiating effect is excellent, can adapt to current computer heat dissipation demand well.

Drawings

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a schematic structural view of a main view provided by an embodiment of the present invention;

FIG. 2 is a schematic structural view of a cross-sectional view A-A of FIG. 1;

FIG. 3 is a schematic structural view of a cross-sectional view B-B in FIG. 1;

FIG. 4 is a schematic bottom view of a heat-conducting connecting plate;

fig. 5 is a schematic structural diagram of the heat-conducting connecting plate and the heat pipe.

In the figure: the heat radiation device comprises a heat radiation fan 1, a screw hole 11, a fixing frame 2, a heat radiation fin 3, a heat pipe 4, a matching surface 41, a heat conduction connecting plate 5, a mounting hole 51 and a mounting groove 52.

Detailed Description

To facilitate an understanding of the present invention, the present invention will now be described more fully with reference to the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only. It will be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be in any way limiting of the invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1-5, the utility model provides a compound computer heat abstractor of polypropylene graphite alkene, it includes radiator fan 1, radiating fin 3, heat pipe 4 and heat-conducting connecting plate 5, heat pipe 4 includes first end and the second end that sets up relatively with the first end, the first end and the second end of heat pipe 4 are connected and are formed the U type, the first end of heat pipe 4 is inlayed and is established in heat-conducting connecting plate 5, the second end of heat pipe 4 is inlayed and is established in radiating fin 3, heat-conducting connecting plate 5 and radiating fin 3 looks interval, heat-conducting connecting plate 5 is used for connecting by radiating element, heat pipe 4 is used for conducting by radiating element's heat to radiating fin 3, radiator fan 1 is located radiating fin 3 one side, during radiator fan 1 work, make the air velocity around radiating fin 3 accelerate.

Referring to fig. 1-5, the heat pipe 4, the heat dissipating fins 3 and the heat dissipating fan 1 of the present invention cooperate with each other to enhance the heat dissipating capability, and the heat dissipating elements generally refer to the display card, CPU, motherboard and other electrical components inside the computer, which generate a large amount of heat during operation. The heat pipe 4 makes full use of the heat conduction principle and the rapid heat transfer property of the phase change medium, the heat of the heating object is rapidly transferred to the outside of the heat source through the heat pipe 4, and the heat conduction capability of the heat pipe exceeds the heat conduction capability of any known metal. The working principle of the heat pipe 4 is as follows: at the evaporation zone of heating heat pipe 4, the working liquid in the wick is heated and evaporated to take away heat, this heat is the evaporation latent heat of working liquid, and steam flows to the condensation zone of heat pipe 4 from the central channel, condenses into liquid, releases latent heat simultaneously, and under the effect of capillary force, liquid flows back to the evaporation zone. In this way, a closed cycle is completed, thereby transferring a large amount of heat from the heating section to the heat dissipation section.

Referring to fig. 1-3, in a preferred embodiment, the computer heat dissipation device compounded by polypropylene and graphene further includes a fixing frame 2, a lower end of the fixing frame 2 is fixedly connected to the heat dissipation fins 3, and an upper end of the fixing frame 2 is fixedly connected to the heat dissipation fan 1. Further, fixed frame 2 all is provided with screw hole 11 with radiator fan 1, and compound computer heat abstractor of polypropylene graphite alkene still includes the screw, and fixed frame 2 and radiator fan 1 are through the cooperation fixed connection of screw hole 11 and screw. Through the design, the heat radiation fan 1 is fixed and can be fixed on the polypropylene graphene composite computer heat radiation device, so that the stable operation of the heat radiation fan is facilitated, and the noise is reduced.

Referring to fig. 1-3, in a preferred embodiment, a plurality of heat dissipation fins 3 are arranged at intervals, the relatively wide surfaces of the heat dissipation fins 3 face the transverse direction of the computer heat dissipation device compounded by polypropylene and graphene, connection holes are formed in the relatively wide surfaces of the heat dissipation fins 3, and the second ends of the heat pipes 4 are embedded in the heat dissipation fins 3 through the connection holes. Through the design, a vertical air channel is formed between the two radiating fins 3, and when the radiating fan 1 works, air can quickly pass through the two wide surfaces on the radiating fins 3, so that heat on the radiating fins 3 is quickly taken away.

Referring to fig. 4-5, in the preferred embodiment, a mounting groove 52 is formed on a side surface of the heat-conducting connecting plate 5 away from the heat dissipating fins 3, and the first end of the heat pipe 4 is embedded in the heat-conducting connecting plate 5 through the mounting groove 52. The lower end part of the second end of the heat pipe 4 is provided with a matching surface 41, when the first end of the heat pipe 4 is embedded in the heat conduction connecting plate 5, the matching surface 41 of the heat pipe 4 is matched with the side surface of the heat conduction connecting plate 5 far away from the radiating fin 3, and when the heat conduction connecting plate 5 is connected with a radiated element, the matching surface 41 of the heat pipe 4 is abutted to the radiated element. The heat pipe 4 is generally a copper pipe, the lower end of the second end of the heat pipe 4 can be flattened by machining to form a matching surface 41, and the second end of the heat pipe 4 is more tightly attached to the heat-dissipated element through the matching surface 41, which is beneficial for the heat pipe 4 to conduct heat to the heat-dissipated element. Further, the heat conducting connecting plate 5 is further provided with mounting holes 51 penetrating through the upper and lower surfaces of the heat conducting connecting plate 5, and the heat conducting connecting plate 5 is fixedly connected to the heat-dissipated element through the mounting holes 51.

Referring to fig. 1 to 5, in a preferred embodiment, the computer heat dissipation device compounded by polypropylene and graphene further includes a graphene thermal conductive film, and the thermal conductive connection board 5 and the heat-to-be-dissipated element are respectively connected to the upper and lower surfaces of the graphene thermal conductive film. Because the heat pipe 4 is not in close contact with the heat-dissipated element, some heat-conducting glue is generally required to be filled between the heat pipe 4 and the heat-dissipated element, and the heat conductivity of the heat-conducting glue is very low, for example, the heat conductivity coefficient of the heat-conducting silica gel is generally below 3W/(m · K), so when the heat-conducting glue scheme is adopted, the heat-dissipated element cannot timely dissipate the heat, and the heat dissipation effect is poor. In a further optimized scheme of the embodiment, the graphene heat conducting film enables the heat pipe 4 to be in closer contact with the heat-dissipated element, and heat on the heat-dissipated element is more favorably conducted to the heat pipe 4. The graphene heat-conducting film and the heat-conducting connecting plate 5 are both made of graphene and polypropylene composite materials. The graphene-polypropylene composite material comprises, by weight, 100 parts of polypropylene, 1-10 parts of modified graphene and 1-20 parts of rare earth complex, wherein the modified graphene contains amino and/or azide groups, the content of the amino and/or azide groups is 0.1% -5%, and the coordination number of the rare earth complex is 3-8. Please refer to the specific preparation method, chinese invention CN202011626576.0, a polypropylene composite material and its preparation method.

In a preferred embodiment, the surfaces of the heat dissipation fins 3 and/or the heat pipes 4 are coated with graphene coatings. In terms of heat conductive materials, graphene has very good heat conductive properties. Pure defect-free single-layer graphene has a thermal conductivity as high as 5300W/(m × K), and is a carbon material having the highest thermal conductivity, and is higher than that of single-wall carbon nanotubes (3500W (m × K)) and multi-wall carbon nanotubes (3000W/(m × K)). When it is used as carrier, the thermal conductivity can reach 600-2200W/(m K). Due to the ultrahigh thermal conductivity of the graphene material, the heat dissipation effect of the heat dissipation device structure can be greatly improved.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, reference to the description of the terms "preferred embodiment," "yet another embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. The utility model provides a compound computer heat abstractor of polypropylene graphite alkene, its characterized in that, compound computer heat abstractor of polypropylene graphite alkene includes radiator fan, radiating fin, heat pipe and heat conduction connecting plate, the heat pipe include first end and with the relative second end that sets up of first end, the first end and the second end of heat pipe are connected and are formed the U type, the first end of heat pipe is inlayed and is established in the heat conduction connecting plate, the second end of heat pipe is inlayed and is established in the radiating fin, the heat conduction connecting plate with the radiating fin is spaced, the heat conduction connecting plate is used for connecting by radiating element, the heat pipe is used for the heat of conduction by radiating element to radiating fin, radiator fan is located radiating fin one side, radiator fan during operation, makes the air velocity around the radiating fin accelerates.

2. The computer heat sink with compounded polypropylene and graphene as claimed in claim 1, further comprising a fixing frame, wherein the lower end of the fixing frame is fixedly connected with the heat dissipation fins, and the upper end of the fixing frame is fixedly connected with the heat dissipation fan.

3. The computer heat sink with polypropylene and graphene composite as claimed in claim 2, wherein the fixing frame and the heat dissipation fan are both provided with screw holes, the computer heat sink with polypropylene and graphene composite further comprises screws, and the fixing frame and the heat dissipation fan are fixedly connected through the screw holes and the screws.

4. The computer heat sink of claim 1, wherein the plurality of heat dissipation fins are disposed at intervals, the relatively wide surfaces of the heat dissipation fins face the transverse direction of the computer heat sink, the relatively wide surfaces of the heat dissipation fins are provided with connection holes, and the second ends of the heat pipes are embedded in the heat dissipation fins through the connection holes.

5. The polypropylene-graphene composite computer heat dissipation device of claim 1, wherein a mounting groove is formed on a side surface of the heat conductive connection plate away from the heat dissipation fins, and the first end of the heat pipe is embedded in the heat conductive connection plate through the mounting groove.

6. The polypropylene-graphene composite computer heat dissipation device of claim 5, wherein a mating surface is formed at a lower end of the second end of the heat pipe, when the first end of the heat pipe is embedded in the heat conduction connection plate, the mating surface of the heat pipe is matched with a side surface of the heat conduction connection plate away from the heat dissipation fins, and when the heat conduction connection plate is connected with a heat-to-be-dissipated element, the mating surface of the heat pipe is abutted to the heat-to-be-dissipated element.

7. The polypropylene-graphene composite computer heat dissipation device of claim 6, further comprising a graphene thermal conductive film, wherein the thermal conductive connection plate and the heat-to-be-dissipated element are respectively connected to upper and lower surfaces of the graphene thermal conductive film.

8. The polypropylene-graphene composite computer heat dissipation device of claim 7, wherein the graphene thermal conductive film and the thermal conductive connection plate are both made of graphene-polypropylene composite material.

9. The polypropylene-graphene composite computer heat dissipation device of claim 5, wherein the heat-conducting connection plate is further provided with mounting holes penetrating through the upper and lower surfaces of the heat-conducting connection plate, and the heat-conducting connection plate is fixedly connected to a heat-dissipated element through the mounting holes.

10. The polypropylene graphene compounded computer heat dissipation device according to any one of claims 1 to 9, wherein the surface of the heat dissipation fin and/or the heat pipe is coated with a graphene coating.