CN216927549U - High-efficient heat abstractor is used to computer CPU - Google Patents
High-efficient heat abstractor is used to computer CPU Download PDFInfo
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- CN216927549U CN216927549U CN202220709243.2U CN202220709243U CN216927549U CN 216927549 U CN216927549 U CN 216927549U CN 202220709243 U CN202220709243 U CN 202220709243U CN 216927549 U CN216927549 U CN 216927549U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本实用新型涉及计算机CPU用高效散热装置，包括导热机构，用于将CPU产生的热量传递给散热单元A和散热单元B，包括导热块，导热块面积大于CPU面积；散热单元A包括设置在导热块上端的散热基板，散热基板四角处设有安装孔，散热基板上端均匀间隔设有多个散热片，导热块上至少设有一与散热基板连接导热条；散热单元B包括至少一热管，热管设计成U型，热管一端为蒸发段，另一端为凝结段，散热基板与导热块之间设有与热管个数相等的下孔，散热片上设有与热管个数相等的上孔，热管的蒸发段设置在下孔内，热管的凝结段设置在上孔内且穿过所有散热片，热管的蒸发段上设有导热板，导热板设置在导热块上。具有结构设计合理、散热效率高、散热可靠等优点。
The utility model relates to a high-efficiency heat-dissipating device for a computer CPU, comprising a heat-conducting mechanism for transferring the heat generated by the CPU to a heat-dissipating unit A and a heat-dissipating unit B, including a heat-conducting block, the area of the heat-conducting block is larger than that of the CPU; The heat dissipation base plate on the upper end of the block has mounting holes at the four corners of the heat dissipation base plate, and the upper end of the heat dissipation base plate is provided with a plurality of heat sinks evenly spaced. The heat pipe is U-shaped. One end of the heat pipe is the evaporation section, and the other end is the condensation section. There are lower holes equal to the number of heat pipes between the heat dissipation substrate and the heat conduction block. The condensing section of the heat pipe is arranged in the lower hole, the condensation section of the heat pipe is arranged in the upper hole and passes through all the radiating fins, the evaporation section of the heat pipe is provided with a heat conduction plate, and the heat conduction plate is arranged on the heat conduction block. It has the advantages of reasonable structure design, high heat dissipation efficiency and reliable heat dissipation.
Description
The technical field is as follows:
the utility model relates to the field of computer science and technology, in particular to a high-efficiency heat dissipation device for a computer CPU.
Background art:
the Central Processing Unit (CPU) is the final execution unit for information processing and program operation, and will accelerate the development of microelectronic devices toward miniaturization, integration, and high performance with the continuous development and popularization of 5G technology. However, the problem of large heat flow per unit area of microelectronic devices becomes a key element restricting further development of the microelectronic devices, when a computer runs under an overload, a CPU generates a large amount of heat, if the heat cannot be dissipated in time, the temperature of the CPU rises, when the temperature of the CPU is too high, the problems of computer crash, automatic restart, automatic shutdown, blue screen and the like can be caused, and the service lives of a mainboard and the CPU can be influenced to a certain extent.
In order to solve the problem of CPU heat dissipation, various attempts have been made in the prior art, wherein the most widely used is an air-cooled heat sink, which mainly uses the principles of heat conduction and heat convection to dissipate heat from a CPU, and specifically, the heat generated by the CPU is conducted out through a heat sink, and then the heat of the heat sink is quickly transferred to the surrounding environment by a fan. The air-cooled radiator has the advantage of low cost, but is influenced by heat transfer coefficient, heat transfer temperature difference, heat transfer area, fluid physical properties, heat transfer surface size and shape, case space and the like, so that the radiating efficiency is general, and the radiating requirement of high heat flow on the surface of a high-performance CPU (central processing unit) cannot be met. If a liquid cooling radiator is adopted, liquid is adopted for rapid heat dissipation as the name suggests, the heat dissipation capability of the liquid cooling radiator is undeniably higher than that of an air cooling radiator, but the liquid cooling radiator has the problems of large volume, difficult installation and the like, and has extremely high requirement on the sealing property, because once liquid leaks, the serious short circuit problem is easily caused. The heat pipe heat radiation technology is developed in recent years, the core of the heat pipe heat radiation technology is that the heat pipe is adopted to take away heat, the heat pipe is generally divided into an evaporation section, a heat insulation section and a condensation section, when one end of the heat pipe is heated, liquid in a liquid absorption core is heated and vaporized to form steam, the steam flows to the condensation section under a small pressure difference, the steam is cooled and condensed into liquid to release heat, the condensed liquid flows back to the evaporation section under the action of capillary force of the liquid absorption core, and continuous and efficient heat radiation can be achieved through circulation. Although the working principle of the heat pipe in the heat pipe heat dissipation technology is mature, how to apply the heat pipe to the heat dissipation of the CPU and achieve the high-efficiency and reliable heat dissipation effect has always plagued related researchers.
The above description is included in the technical recognition scope of the inventors, and does not necessarily constitute the prior art.
The utility model has the following contents:
the utility model aims to solve the problems in the prior art, provides the efficient heat dissipation device for the CPU of the computer, and has the advantages of reasonable structural design, high heat dissipation efficiency, reliable heat dissipation and the like.
The utility model adopts the following technical scheme to realize the purpose:
high-efficient heat abstractor is used to computer CPU includes:
the heat conduction mechanism is used for transferring heat generated by the CPU to the heat dissipation unit A and the heat dissipation unit B and comprises a heat conduction block, and the area of the heat conduction block is larger than that of the CPU;
the radiating unit A comprises a radiating substrate arranged at the upper end of a heat conducting block, mounting holes are respectively formed in the four corners of the radiating substrate, a plurality of radiating fins are uniformly arranged at the upper end of the radiating substrate at intervals, and at least one heat conducting strip connected with the radiating substrate is arranged on the heat conducting block;
the heat dissipation unit B comprises at least one heat pipe, the heat pipe is designed into a U shape, one end of the heat pipe is an evaporation section, the other end of the heat pipe is a condensation section, a heat insulation section is arranged between the evaporation section and the condensation section, lower holes equal to the number of the heat pipes are formed between the heat dissipation substrate and the heat conduction block, upper holes equal to the number of the heat pipes are formed in the heat dissipation fins, the evaporation section of the heat pipe is arranged in the lower holes, the condensation section of the heat pipe is arranged in the upper holes and penetrates through all the heat dissipation fins, a heat conduction plate is arranged on the evaporation section of the heat pipe, and the heat conduction plate is arranged on the heat conduction block.
The heat conducting block, the heat conducting plate and the heat conducting strip are integrally processed and formed.
The heat conducting block, the heat conducting plate and the heat conducting strip are integrally processed and formed by adopting a copper plate.
The radiating substrate and the radiating fins are made of aluminum plates.
The radiating fins are welded on the radiating base plate.
The radiating fin comprises an A part and a B part which are integrally formed, the height of the A part is greater than that of the B part, and the upper hole is correspondingly arranged on the A part.
The thickness of each radiating fin is 0.1-0.5 mm, and the distance between every two adjacent radiating fins is 1-3 mm.
The lower hole is composed of a groove A arranged at the lower end of the heat dissipation substrate and a groove B arranged at the upper ends of the heat conduction block and the heat conduction plate.
The heat dissipation unit B comprises two heat pipes arranged at intervals, two lower holes are arranged between the corresponding heat dissipation substrate and the heat conduction block at intervals, and two upper holes are arranged on the heat dissipation sheet at intervals.
By adopting the technical scheme, the utility model can bring the following beneficial effects:
through designing heat conduction mechanism, the realization is given radiating element A and radiating element B with the heat fast transfer that CPU produced, especially through designing the heat conduction piece, the heat-conducting plate can realize giving the heat pipe with more heat transfer, the splendid heat conductivility of make full use of heat pipe reaches high-efficient radiating purpose, simultaneously again through the heat conduction piece, the heat conduction strip is given the fin with partial heat transfer and is supplyed quick heat dissipation, the whole cooperation reaches high efficiency, reliable radiating effect, and then can satisfy high performance CPU to radiating requirement.
Description of the drawings:
FIG. 1 is a schematic structural diagram of an efficient heat dissipation device according to the present invention;
FIG. 2 is a schematic structural diagram of another view angle of the efficient heat dissipation device of the present invention;
FIG. 3 is a schematic structural view of the efficient heat dissipation device of the present invention without a heat pipe;
FIG. 4 is a schematic structural diagram of a heat pipe according to the present invention;
FIG. 5 is a schematic structural diagram of a heat conducting mechanism according to the present invention;
FIG. 6 is a schematic structural diagram of a heat dissipating unit A according to the present invention;
FIG. 7 is a schematic structural view of the efficient heat dissipation device of the present invention with two heat pipes;
FIG. 8 is a schematic view of a horizontal structure of the efficient heat dissipation device of the present invention;
FIG. 9 is a schematic view of a vertical structure of the efficient heat dissipation device of the present invention;
in the figure, 1, a heat conducting mechanism, 101, a heat conducting block, 102, a heat conducting plate, 103, a heat conducting strip, 2, a heat radiating unit A, 201, a heat radiating base, 202, a mounting hole, 203, a heat radiating fin, 204, a part A, 205, a part B, 3, a heat radiating unit B, 301, a heat pipe, 302, an evaporation section, 303, a condensation section, 304, a heat insulating section, 305, a lower hole, 306, an upper hole, 307, a groove A, 308, a groove B, 4, a CPU, 5 and a mainboard.
The specific implementation mode is as follows:
in order to more clearly explain the overall concept of the utility model, the following detailed description is given by way of example in conjunction with the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from other embodiments.
In the present invention, the terms "a", "B", "upper end", "lower end", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying a position where technical features are indicated.
In the present invention, unless otherwise expressly stated or limited, the terms "provided", "disposed", "connected", "communicating", and the like are to be construed broadly, e.g., "provided" and "disposed" may be fixedly attached, detachably attached, or integrally attached; the connection can be direct connection or connection through an intermediate medium, and the communication mainly refers to gas circuit communication in the application. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the utility model, it should be noted that the working principle of the heat pipe in the application belongs to the prior art, and the heat pipe can be purchased or customized directly, and the innovation of the application lies in the design of the shape of the heat pipe, and the structural design and the connection design of the heat conducting mechanism, the heat radiating unit A and the heat radiating unit B, so that the high-efficiency and reliable heat radiating effect is achieved integrally.
As shown in fig. 1 to 9, the high efficiency heat sink for a CPU of a computer comprises:
the heat conduction mechanism 1 is used for transferring heat generated by the CPU4 to the heat dissipation unit A2 and the heat dissipation unit B3 and comprises a heat conduction block 101, wherein the area of the heat conduction block 101 is larger than that of the CPU 4;
the heat dissipation unit A2 comprises a heat dissipation substrate 201 arranged at the upper end of a heat conduction block 101, wherein mounting holes 202 are respectively arranged at four corners of the heat dissipation substrate 201, a plurality of radiating fins 203 are uniformly arranged at intervals at the upper end of the heat dissipation substrate 201, and at least one heat conduction strip 103 connected with the heat dissipation substrate 201 is arranged on the heat conduction block 101; the heat conducting strip 103 may be designed into an L shape, and a plurality of heat conducting strips may be symmetrically designed;
the heat dissipation unit B3 includes at least one heat pipe 301, the heat pipe 301 is designed into a U shape, one end of the heat pipe 301 is an evaporation section 302, the other end of the heat pipe 301 is a condensation section 303, a heat insulation section 304 is arranged between the evaporation section 302 and the condensation section 303, lower holes 305 equal to the number of the heat pipes 301 are arranged between the heat dissipation substrate 201 and the heat conduction block 101, upper holes 306 equal to the number of the heat pipes 301 are arranged on the heat dissipation sheet 203, the evaporation section 302 of the heat pipe 301 is arranged in the lower holes 305, the condensation section 303 of the heat pipe 301 is arranged in the upper holes 306 and penetrates through all the heat dissipation sheets 203, a heat conduction plate 102 is arranged on the evaporation section 302 of the heat pipe 301, and the heat conduction plate 102 is arranged on the heat conduction block 101. Through design heat conduction mechanism 1, the realization gives radiating element A2 and radiating element B3 with the heat that CPU4 produced fast transmission, especially through design heat conduction piece 101, heat-conducting plate 102 can realize giving heat pipe 301 with more heat transfer, the splendid heat conductivility of make full use of heat pipe 301, reach high-efficient radiating purpose, simultaneously again through heat conduction piece 101, heat conduction strip 103 gives radiating substrate 201 and fin 203 with partial heat transfer and complements fast heat dissipation, the whole cooperation reaches high-efficiently, reliable radiating effect, and then can satisfy high performance CPU to radiating requirement.
The heat conducting block 101, the heat conducting plate 102 and the heat conducting strip 103 are integrally formed. The structural strength and the heat conducting performance of the heat conducting mechanism are improved.
The heat conducting block 101, the heat conducting plate 102 and the heat conducting strip 103 are integrally formed by copper plates. The copper plate has excellent heat-conducting property, and the heat-conducting efficiency is obviously improved.
The heat dissipation substrate 201 and the heat dissipation fins 203 are made of aluminum plates. The aluminum plate has the advantages of relatively low cost, good heat-conducting property and the like.
The heat sink 203 is soldered to the heat sink substrate 201. The overall structural strength of the heat dissipation unit a2 is improved.
The radiating fin 203 comprises an A part 204 and a B part 205 which are integrally formed, the height of the A part 204 is greater than that of the B part 205, and the upper hole 306 is correspondingly arranged on the A part 204. The air circulation is convenient, and the heat dissipation efficiency is improved.
The thickness of the radiating fins 203 is 0.1-0.5 mm, and the distance between every two adjacent radiating fins 203 is 1-3 mm. The thickness and the interval of rationally distributed fin help improving the radiating efficiency.
The lower hole 305 is composed of a groove a307 provided at the lower end of the heat-dissipating substrate 201 and a groove B308 provided at the upper ends of the heat-conducting block 101 and the heat-conducting plate 102. And the embedded installation of the heat pipe 301 is facilitated.
The heat dissipation unit B3 includes two heat pipes 301 arranged at intervals, two lower holes 305 are arranged at intervals between the corresponding heat dissipation substrate 201 and the heat conduction block 101, and two upper holes 306 are arranged at intervals on the heat dissipation plate 203. The two heat pipes 301 can further improve the heat dissipation efficiency, and the heat dissipation requirements can be selected accordingly according to the CPU 4.
The application of the high-efficiency heat dissipation device comprises the following steps:
the application discloses high-efficient heat abstractor can the level use, also can vertical use (heat pipe 301 is just the U type and places promptly), and the radiating efficiency can be better some under the action of gravity when wherein vertical use.
When the heat pipe type heat dissipation device is used, heat-conducting silicone grease is smeared on a CPU4, then the heat-conducting block 101 and a CPU4 in the heat pipe type heat dissipation device are aligned and attached, the high-efficiency heat dissipation device is fastened on a mainboard 5 through mounting holes 202 and screws on a heat dissipation substrate 201, heat is generated when a CPU4 works, the heat is firstly transmitted to the heat-conducting block 101, the heat is respectively transmitted to a heat pipe 301 and the heat dissipation substrate 201 by the heat-conducting block 101, the heat is favorably and quickly transmitted to the heat pipe 301 by a heat conduction plate 102, the heat is favorably and uniformly and quickly transmitted to the heat dissipation substrate 201 by a heat conduction strip 103, the heat is further transmitted to a heat dissipation substrate 203 by the heat dissipation substrate 201, the heat generated by the CPU4 is quickly and efficiently transmitted and released in the air under the action of the heat pipe 301 and the heat dissipation substrate 203, and then a system fan (provided by a computer) works to carry out air convection, and quickly transmit the heat to the surrounding environment. The CPU is efficiently and reliably cooled.
The above-described embodiments should not be construed as limiting the scope of the utility model, and any alternative modifications or alterations to the embodiments of the present invention will be apparent to those skilled in the art.
The present invention is not described in detail, but is known to those skilled in the art.
Claims (9)
1. High-efficient heat abstractor is used to computer CPU, its characterized in that includes:
the heat conduction mechanism is used for transferring heat generated by the CPU to the heat dissipation unit A and the heat dissipation unit B and comprises a heat conduction block, and the area of the heat conduction block is larger than that of the CPU;
the radiating unit A comprises a radiating substrate arranged at the upper end of a heat conducting block, mounting holes are respectively arranged at four corners of the radiating substrate, a plurality of radiating fins are uniformly arranged at intervals at the upper end of the radiating substrate, and at least one heat conducting strip is arranged on the heat conducting block and connected with the radiating substrate;
the heat dissipation unit B comprises at least one heat pipe, the heat pipe is designed into a U shape, one end of the heat pipe is an evaporation section, the other end of the heat pipe is a condensation section, a heat insulation section is arranged between the evaporation section and the condensation section, lower holes equal to the number of the heat pipes are formed between the heat dissipation substrate and the heat conduction block, upper holes equal to the number of the heat pipes are formed in the heat dissipation fins, the evaporation section of the heat pipe is arranged in the lower holes, the condensation section of the heat pipe is arranged in the upper holes and penetrates through all the heat dissipation fins, a heat conduction plate is arranged on the evaporation section of the heat pipe, and the heat conduction plate is arranged on the heat conduction block.
2. The efficient heat sink for computer CPU according to claim 1, wherein said heat conducting block, said heat conducting plate and said heat conducting strip are integrally formed.
3. The efficient heat dissipating device for a computer CPU according to claim 2, wherein the heat conducting block, the heat conducting plate and the heat conducting bar are integrally formed by using a copper plate.
4. The efficient heat sink for computer CPU according to claim 3, wherein said heat sink base plate and said heat sink are made of aluminum plate.
5. The efficient heat sink for computer CPU according to claim 4, wherein said heat sink is soldered on a heat sink base plate.
6. The efficient heat sink for CPU of computer as claimed in claim 5, wherein said heat sink comprises a portion A and a portion B integrally formed, said portion A is higher than said portion B, and said upper hole is correspondingly disposed on said portion A.
7. The efficient heat sink for CPU of computer as claimed in claim 6, wherein the thickness of said heat sink is 0.1-0.5 mm, and the distance between two adjacent heat sinks is 1-3 mm.
8. The efficient heat sink for CPU in computer as claimed in claim 7, wherein said lower hole is composed of a groove A formed at the lower end of the heat dissipating substrate and a groove B formed at the upper end of the heat conducting block and the heat conducting plate.
9. The efficient heat dissipation device for computer CPUs as claimed in claim 1 or 8, wherein the heat dissipation unit B comprises two heat pipes spaced apart from each other, two lower holes are spaced apart from the corresponding heat dissipation substrate and the corresponding heat conduction block, and two upper holes are spaced apart from the corresponding heat dissipation substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220709243.2U CN216927549U (en) | 2022-03-29 | 2022-03-29 | High-efficient heat abstractor is used to computer CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220709243.2U CN216927549U (en) | 2022-03-29 | 2022-03-29 | High-efficient heat abstractor is used to computer CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216927549U true CN216927549U (en) | 2022-07-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220709243.2U Expired - Fee Related CN216927549U (en) | 2022-03-29 | 2022-03-29 | High-efficient heat abstractor is used to computer CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216927549U (en) |
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2022
- 2022-03-29 CN CN202220709243.2U patent/CN216927549U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220708 |
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| CF01 | Termination of patent right due to non-payment of annual fee |