CN208384511U

CN208384511U - A kind of CPU fin-super heat-conductive pipe integral heat dissipation device

Info

Publication number: CN208384511U
Application number: CN201821012024.9U
Authority: CN
Inventors: 樊洪明; 续玥榕
Original assignee: Beijing University of Technology
Current assignee: Beijing University of Technology
Priority date: 2018-06-28
Filing date: 2018-06-28
Publication date: 2019-01-15
Anticipated expiration: 2028-06-28

Abstract

A kind of CPU is related to CPU technical field of heat dissipation with fin-super heat-conductive pipe integral heat dissipation device, complicated to solve CPU radiating fin manufacturing process, expensive, and the problem that heat pipe is low with fin heat transfer efficiency.The device is made of U-shaped super heat-conductive pipe and the straight rectangular fin of array.Array is straight, and rectangular fin is manufactured with super heat-conductive pipe to be integrated.Array is straight, and rectangular fin is located at U-shaped super heat-conductive pipe condensation segment two sides and evaporator section upper surface, and fin is equidistant, equal thickness is evenly arranged, and all fin heights are equal.To reduce air thermal resistance, it is horizontal polished surface that evaporator section lower surface, which is bonded position with CPU,.Super heat-conductive pipe has the characteristics that plane easy to attach, flexible, uniform temperature is good, can be used as good heat conductive material to strengthen the diabatic process from CPU to ambient enviroment.Fin-super heat-conductive pipe, which is integrated, can further decrease heat transfer resistance, and then improve heat transfer efficiency.Radiator generally aluminium, is simple to manufacture, reduces cost and weight.

Description

A kind of CPU fin-super heat-conductive pipe integral heat dissipation device

Technical field

The utility model relates to CPU technical field of heat dissipation more particularly to server high heat flux density CPU heat dissipation technology to lead Domain.

Background technique

The form of the CPU radiator largely used in current all kinds of servers is to be inserted into heat pipe in plain fin.Its is excellent Point is since heat pipe has good uniform temperature, and heat pipe section is directly contacted with CPU, can more efficiently be exported CPU heat production To fin and environment, the diffusion thermal resistance of radiator bottom plate is reduced.But in order to be contacted with CPU, round copper heat pipe is squeezed into In flat and inserted radiator, technique and cost are increased.It protrudes into exist between heat pipe section and fin in fin simultaneously and connect Thermal resistance is touched, and heat pipe and fin contacts area are smaller, the fin of other parts relies on conduction heat transfer, and fin efficiency is lower.Pass through Fan forced convection by machine box for server CPU and other elements heat production heat take out of, be still most operability at present Thermal control strategy.But when heat dissipation capacity is continuously increased, fan revolution increases, and noise improves.It is further with cpu power density It improves, is badly in need of a kind of more efficient heat transfer of application, is readily produced, cheap CPU radiator.

Summary of the invention

It is complicated in order to solve CPU radiating fin manufacturing process, it is expensive, and the problem that heat pipe is low with fin heat transfer efficiency, The utility model provides a kind of CPU fin-super heat-conductive pipe integral heat dissipation device.Specific technical solution is as follows:

A kind of CPU radiator, including U-shaped super heat-conductive pipe (1), array is straight rectangular fin (2).It is characterized by: Array is straight, and rectangular fin is manufactured with super heat-conductive pipe to be integrated.Array is straight, and rectangular fin (2) is located at U-shaped super heat-conductive pipe (1) condensation segment (3) two sides and evaporator section (4) upper surface, fin is equidistant, equal thickness is evenly arranged, and all fin heights are equal. To reduce air thermal resistance, it is horizontal polished surface that evaporator section (4) lower surface, which is bonded position with CPU,.

Compared with prior art, the utility model has the beneficial effects that using super heat-conductive pipe technology, platen surface is easy to It is bonded with cpu chip, reduces process costs；It is pliable at different shapes, can be made into the U-shaped inner space to save cabinet；And It strengthens the diabatic process from CPU to ambient enviroment as good heat conductive material；Application continuum array fin eliminates fin Thermal contact resistance between super heat-conductive pipe, while making fin equalizing temperature, fin efficiency improves；Radiator material is generally Aluminium mitigates weight while reducing cost.And this CPU radiator can be according to server internal space and CPU heat radiation power Carry out the increase of modularization quantity.

Detailed description of the invention

Fig. 1 is the main view of the utility model.

In figure: 1-U type super heat-conductive pipe；2- array is straight rectangular fin；3-U type super heat-conductive pipe condensation segment；4-U type superconduction Heat pipe evaporator section.

Fig. 2 is the right view of Fig. 1.

Fig. 3 is the top view of Fig. 1.

Specific embodiment

The present invention will be further described with reference to the accompanying drawing:

The utility model provides a kind of technical solution: a kind of CPU fin-super heat-conductive pipe integral heat dissipation device, including U Type super heat-conductive pipe (1), array is straight rectangular fin (2).As shown in Fig. 1, the straight rectangular fin of array (2) is located at U-shaped The equidistant gap of super heat-conductive pipe (1) condensation segment (3) two sides and evaporator section (4) upper surface, every group of fin is air flow channel, for sky Gas, which flows through, takes away the heat on fin.U-shaped heat pipe two sides are full symmetric, and all fin heights are equal.Condensation as shown in Fig. 2 Evaporator section (4) upper surface fin (2) shown in section (3) two sides fin (2) and attached drawing 3, to increase heat convection area, array fin Equidistantly uniformly it is abound with.To reduce air thermal resistance, it is horizontal polished surface that evaporator section (4) lower surface, which is bonded position with CPU,.Heat dissipation It should be that direction windward is mounted on above CPU according to attached main view direction shown in FIG. 1, between radiator and CPU when device works Heat-conducting silicone grease should be smeared to reduce thermal contact resistance.

Based on the invention, the transmittance process of core cpu heat production in server are as follows: successively pass to CPU encapsulation by thermally conductive Silicone grease, super heat-conductive pipe aluminium outer wall outer surface, the super heat-conductive pipe aluminium outer wall inner surface smeared between lid, CPU and cooling fin are rear logical It crosses surface convection current and passes to internal liquid medium by heat pipe evaporator section inner wall, be evaporated to after liquid medium is heated in evaporator section Gas, gas reach condensation segment after by convective heat transfer transfer heat to heat pipe condenser section inner wall condense, condensation segment inner wall Heat is transferred to heat pipe aluminium outer wall wing base, fin end portion by thermally conductive, and the heat for reaching fin is passed heat by forced convertion Surrounding air is passed, is taken away heat by fan.Each link thermal resistance includes: silicone grease layer thermal resistance, from silicone grease layer upper surface to heat pipe The heat pipe aluminium outer wall thermal resistance of inner wall, inside heat pipe thermal resistance, from heat pipe inner wall to wing base heat pipe aluminium outer wall thermal resistance, from fin to air Thermal-convection resistance.When the utility model is used, the excellent heat conductivity performance that super heat-conductive pipe has, so that the thermal conduction resistance in heat pipe It can ignore substantially, while heat pipe aluminium outer wall and aluminum fin-stock are integrated, and are reduced by aluminium outer wall to this part between fin Thermal resistance, and then improve heat transfer efficiency.

Claims

1. a kind of CPU fin-super heat-conductive pipe integral heat dissipation device, including U-shaped super heat-conductive pipe (1), it is characterised in that: array Formula is straight, and rectangular fin (2) is located at U-shaped super heat-conductive pipe (1) condensation segment (3) two sides and evaporator section (4) upper surface.

2. a kind of CPU according to claim 1 fin-super heat-conductive pipe integral heat dissipation device, it is characterised in that: fin It is equally spaced, all fin heights are equal, and thickness is equal.

3. a kind of CPU according to claim 1 fin-super heat-conductive pipe integral heat dissipation device, it is characterised in that: for drop Low latitude gas thermal resistance, it is horizontal polished surface that evaporator section (4) lower surface, which is bonded position with CPU,.

4. a kind of CPU according to claim 1 fin-super heat-conductive pipe integral heat dissipation device, it is characterised in that: heat dissipation Device material is aluminium.