CN205017777U - Ripple heat abstractor - Google Patents
Ripple heat abstractor Download PDFInfo
- Publication number
- CN205017777U CN205017777U CN201520791770.2U CN201520791770U CN205017777U CN 205017777 U CN205017777 U CN 205017777U CN 201520791770 U CN201520791770 U CN 201520791770U CN 205017777 U CN205017777 U CN 205017777U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat absorption
- lid
- protuberance
- absorption lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a ripple heat abstractor, it is including heat dissipation lid (1), metal mesh (2), support column (3), the heat absorption is covered (4) and is sealed tub (5), it forms a cavity to be somebody's turn to do in the heat dissipation between (1) and the heat absorption lid (4), the internal surface that (1) and heat absorption lid (4) were somebody's turn to do in the heat dissipation is provided with a metal mesh, support column (3) are passed metal mesh (2) respectively for a plurality of and its both ends and are lain in heat dissipation lid (1) and the internal surface of heat absorption lid (4), heat dissipation lid (1) is constituteed by base plate (7) and with base plate (7) integrated into one piece fin (6), fin (6) are the wave bits, heat absorption lid (1) comprises copper layer (44) and aluminium matter layer (42), and copper layer (44) is located aluminium matter layer (42) below. The beneficial effects of the utility model are that: it have simple structure, easily processing and the high advantage of radiating efficiency.
Description
Technical field
The utility model relates to cooling electronic component field, particularly a kind of corrugated fins device.
Background technology
In recent years, along with the high speed development of information industry, electronic device in various electronic equipment is towards miniaturization, high integrated, high speed, high power future development, these electronic devices inevitably produce than more hot before, if the heat dissipation problem of electronic device is not resolved, high temperature declines directly causing electronic device usefulness; For making the usefulness of its electronic device stablize, the design of the heat-sinking capability of electronic device becomes of crucial importance.
Current corrugated fins device (soaking plate), generally form airtight hollow cavity by copper sheet, its cavity portion is evacuated and inserts working fluid, cavity inner wall attachment capillary.Under vacuum condition, as long as namely the heat that working fluid absorbs thermal source by the heat absorbing side of cavity can vaporize rapidly, and this heat is via after the heat radiation side discharge of cavity, working fluid and the condensation of vaporization return to fluid original state, heat absorbing side is led back to again, repeatedly to carry out the circulation of this suction heat via capillary structure.But soaking plate itself does not have heat sinking function, the heat radiation side device radiation sheet of soaking plate (the heat absorption end or punching press fasten fin), heat need be passed to fin timely and effectively and distribute.Present soaking plate and the juncture of fin need a kind of medium (low thermal resistance tin cream) just can engage one to reach the usefulness of heat trnasfer.Still can produce obvious thermal resistance with upper type and cannot accomplish the end in view, so that the integral heat sink efficiency of fin is not satisfactory.
Along with the maturation of diffusion bond technology, combined by diffusion bond mode, solve the problem that low thermal resistance tin cream affects heat trnasfer, but its dissipating cover adopts aluminium material or copper material usually, but aluminium material is for some high heating heat radiation elements, then its heat dispersion can not meet requirement, and copper material perfect heat-dissipating, but its cost compare is expensive, causes production cost significantly to improve.
Utility model content
The purpose of this utility model is the shortcoming overcoming prior art, provide a kind of structure simple, be easy to processing and corrugated fins device.
The purpose of this utility model is achieved through the following technical solutions: a kind of corrugated fins device, it comprises dissipating cover, wire netting, support column, heat absorption lid and sealing tube, described dissipating cover and heat absorption lid combine in diffusion bond mode, and dispelling the heat and should form a chamber with absorbing heat between lid, the inner surface of described heat radiation this and heat absorption lid is all provided with a wire netting in diffusion bond mode, described support column is multiple and its two ends are each passed through wire netting and are combined in the inner surface of dissipating cover and heat absorption lid in diffusion bond mode, described dissipating cover forms by substrate and with the integrated fin of substrate, described fin is wave gear piece, described heat absorption lid is made up of copper layer and aluminium layer, wherein copper layer and aluminium layer are compound integral structure, and copper layer is positioned at below aluminium layer.
Be provided with the first protuberance in the middle part of one side of described heat absorption lid, dissipating cover is provided with and covers the second protuberance that the first protuberance matches with absorbing heat; Described first protuberance and the second protuberance are provided with a sealing tube, and offer the groove installing sealing tube respectively on the first protuberance and the second protuberance.
The utility model has the following advantages:
1, heat absorption lid adopts and integrally meets shaping copper layer and aluminium layer, and copper layer contacts with electronic devices and components, thus makes that heat transfer efficiency is high, heat transfer effect good, compares, saved production cost with the heat absorption lid of fine copper;
2, fin adopts corrugate fin, and its runner feature makes fluid constantly change direction, strengthens because there being the effect flow-disturbing of speed at crest and trough place, and resistance coefficient becomes large, heat exchange property is strengthened, produces preferably heat exchange and radiating effect.
Accompanying drawing explanation
Fig. 1 is a kind of corrugated fins device of the utility model decomposing schematic representation;
Fig. 2 is a kind of corrugated fins device of the utility model overall perspective view;
Fig. 3 is A-A cross-sectional schematic in Fig. 2;
In figure, 1-dissipating cover, 2-wire netting, 3-support column, 4-absorbs heat lid, 5-sealing tube, 6-fin, 7-substrate, 13-second protuberance, 41-first protuberance, 42-aluminium layer, 43-groove, the copper layer of 44-.
Embodiment
Be further described the utility model below in conjunction with accompanying drawing, protection range of the present utility model is not limited to the following stated:
As shown in Fig. 1 ~ Fig. 2, a kind of corrugated fins device, it comprises dissipating cover 1, wire netting 2, support column and heat absorption lid 45, described dissipating cover 1 and heat absorption lid 4 combine in diffusion bond mode, and a chamber is formed between heat radiation this 1 and heat absorption lid 4, described heat radiation this 1 and heat absorption lid 4 inner surface all diffusion bond mode is provided with a wire netting, described support column 3 is multiple and its two ends are each passed through wire netting 2 and are combined in the inner surface of dissipating cover 1 and heat absorption lid 1 in diffusion bond mode, as shown in Figure 3, described dissipating cover 1 forms by substrate 7 and with the integrated fin 6 of substrate 7, described fin 6 is wave gear piece, described heat absorption lid 4 is made up of copper layer 44 and aluminium layer 42, wherein copper layer 44 and aluminium layer 42 are compound integral structure, and copper layer 44 is positioned at below aluminium layer 42, copper layer 44 can draw the heat on electronic element fast, thus radiating efficiency is improved, described fin 6 is wave gear piece, the runner feature of ripple gear piece makes fluid constantly change direction wherein, at crest and trough place, have again the change suddenly of speed, such flow-disturbing strengthens, exacerbate the destructiveness in boundary layer, heat exchange is strengthened, heat exchange coefficient becomes large, suddenly the change of speed, makes partial pressure differential become large, and bring the change of pressure drag large, resistance coefficient becomes large.The heat exchange factor of ripple gear piece improves about 20-50% than straight gear piece.The step pitch of ripple gear piece is larger, and heat exchange Summing Factor resistance factor is less, and gear piece step pitch is chosen smaller value and is conducive to heat exchange; The wavelength of ripple gear piece is longer, and heat exchange Summing Factor resistance factor is less, is also conducive to heat exchange when same wavelength gets the small value; The increase of ripple gear piece wave amplitude, heat exchange Summing Factor resistance factor is larger, therefore selects suitable ripple gear piece, contributes to heat exchange, accelerates radiating efficiency.
In the present embodiment, be provided with the first protuberance 41 in the middle part of described heat absorption lid 4, dissipating cover 1 is provided with the second protuberance 13 matched with the first protuberance 41 on the lid 4 that absorbs heat; Described first protuberance 41 and the second protuberance 13 are provided with a sealing tube 5, and offer the groove 43 installing sealing tube 5 respectively on the first protuberance 41 and the second protuberance 13.
Claims (2)
1. a corrugated fins device, it comprises dissipating cover (1), wire netting (2), support column (3), heat absorption lid (4) and sealing tube (5), described dissipating cover (1) and heat absorption lid (4) combine in diffusion bond mode, and a chamber should be formed between (1) and heat absorption lid (4) in heat radiation, the inner surface that (1) and heat absorption lid (4) are somebody's turn to do in described heat radiation is all provided with a wire netting in diffusion bond mode, described support column (3) is each passed through wire netting (2) for multiple and its two ends and is combined in the inner surface of dissipating cover (1) and heat absorption lid (4) in diffusion bond mode, it is characterized in that: described dissipating cover (1) forms by substrate (7) and with substrate (7) integrated fin (6), described fin (6) is wave gear piece, described heat absorption lid (1) is made up of copper layer (44) and aluminium layer (42), wherein copper layer (44) and aluminium layer (42) are compound integral structure, and copper layer (44) is positioned at aluminium layer (42) below.
2. a kind of corrugated fins device according to claim 1, it is characterized in that: be provided with the first protuberance (41) in the middle part of described heat absorption lid (4), dissipating cover (1) is provided with and covers the second protuberance (13) that (4) upper first protuberance (41) matches with absorbing heat; Described first protuberance (41) and the second protuberance (13) are provided with a sealing tube (5), and offer the groove (43) installing sealing tube (5) respectively on the first protuberance (41) with the second protuberance (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520791770.2U CN205017777U (en) | 2015-10-14 | 2015-10-14 | Ripple heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520791770.2U CN205017777U (en) | 2015-10-14 | 2015-10-14 | Ripple heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205017777U true CN205017777U (en) | 2016-02-03 |
Family
ID=55216358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520791770.2U Expired - Fee Related CN205017777U (en) | 2015-10-14 | 2015-10-14 | Ripple heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205017777U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455456A (en) * | 2016-12-06 | 2017-02-22 | 株洲南车奇宏散热技术有限公司 | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method |
| CN110360861A (en) * | 2019-07-19 | 2019-10-22 | 常州恒创热管理有限公司 | A kind of processing method of the inflation type soaking plate with capillary structure |
| CN110369502A (en) * | 2019-07-19 | 2019-10-25 | 常州恒创热管理有限公司 | A kind of processing method of inflation type soaking plate |
-
2015
- 2015-10-14 CN CN201520791770.2U patent/CN205017777U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455456A (en) * | 2016-12-06 | 2017-02-22 | 株洲南车奇宏散热技术有限公司 | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method |
| CN110360861A (en) * | 2019-07-19 | 2019-10-22 | 常州恒创热管理有限公司 | A kind of processing method of the inflation type soaking plate with capillary structure |
| CN110369502A (en) * | 2019-07-19 | 2019-10-25 | 常州恒创热管理有限公司 | A kind of processing method of inflation type soaking plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160203 Termination date: 20191014 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |