CN2736932Y - Integrated circuit heat sink employing heat pipe technique - Google Patents
Integrated circuit heat sink employing heat pipe technique Download PDFInfo
- Publication number
- CN2736932Y CN2736932Y CN 200420013450 CN200420013450U CN2736932Y CN 2736932 Y CN2736932 Y CN 2736932Y CN 200420013450 CN200420013450 CN 200420013450 CN 200420013450 U CN200420013450 U CN 200420013450U CN 2736932 Y CN2736932 Y CN 2736932Y
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- heat
- fin
- integrated circuit
- base plate
- heat pipe
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat exchanging apparatus without direct contact of heat exchange media, particularly an integrated circuit heat sink adopting a heat pipe technique. The utility model comprises a fin, a heat pipe radiator, a bottom plate, working media, a radiator fan, a fixed bracket, etc., wherein, the outer surface of the bottom plate is tightly jointed with the upper surface of an integrated circuit, and the upper surface of the heat pipe radiator is provided with one or a plurality of convex long heat radiation intensifying structures; the outer surface of the heat pipe radiator is provided with the fin, and generatrix of the fin is parallel or perpendicular to the bottom plate; the upper end of the heat pipe radiator is closed and hollow, forming a vacuum negative-pressure structure with other elements. The utility model adopts the heat pipe heat radiating member, so that heat resistance from a heat source to the heat radiating surface is largely reduced, the fin efficiency is enhanced, and the effective heat radiating area of the radiator is increased. The utility model has the advantage of simple structure, and the radiator can be produced by extrusion process, so that cost is largely lowered.
Description
Technical field the utility model relates to the heat-exchange apparatus that a kind of heat exchange medium does not directly contact, and specifically, is a kind of integrated circuit heat dissipation device that adopts hot pipe technique.
Background technology is along with the develop rapidly of semiconductor technology, and the integrated level of integrated circuit (IC) chip improves constantly, and the operating frequency of chip also improves constantly, and the caloric value of integrated circuit (IC) chip has increased widely.Especially in computer realm, the heat dissipation problem of high primary frequency CPU also more and more becomes a problem that can not be ignored.For example the Prescott of INTEL Corp. processor caloric value is surprising, reaches 89W-103W, even to more than the 120W.
The heat dissipating method that the most generally uses is that the heat that CPU produces is directly delivered to fin at present, and the heat of fin being accumulated by the fan of quick rotation is taken away again.Although the capacity of heat transmission of aluminum or copper fin is very strong, and can increase area of dissipation by increasing fin.But owing to the increase of fin efficiency along with the distance of fin and thermal source (CPU) reduces.Therefore the thermal resistance of heat pipe (phase transformation) heat transfer element adopts heat pipe (phase transformation) heat transfer element can improve fin efficiency greatly than the low tens of and even hundreds of times of thermal resistance of aluminum or copper heat transfer element, thereby breaks through the fin thermal resistance limit.
As everyone knows, the radiator of hot pipe technique has appearred adopting in the domestic and international market, but because the structural manufacturing process complexity, cost is higher.The inventor had once applied for utility model---" a kind of integrated circuit heat-pipe radiating apparatus ", the structure that indicates in this patent can not be used the extrusion process manufacturing of present maturation, and technology difficulty is big, the cost height.
The summary of the invention the purpose of this utility model is the integrated circuit heat dissipation device that a kind of agent structure of design can adopt extrusion process employing hot pipe technique that make, that cost is low, efficient is high.
The utility model is realized by following technical solution:
Comprise a kind of integrated circuit heat dissipation device that adopts hot pipe technique of radiator fan, heat transfer fin, base plate, the plate outer surface of radiator and integrated circuit upper surface fit tightly.The strip heat radiation that heat pipe heat radiation body upper surface is provided with one or some projectioies strengthens structure.The heat pipe heat radiation external surface is provided with fin, and the bus of fin is parallel to base plate.Heat pipe heat radiation body upper end closed, hollow, lower end and base plate and side plate constitute the cavity of sealing, form the negative pressure of vacuum structure.
Comprise a kind of integrated circuit heat dissipation device that adopts hot pipe technique of radiator fan, heat transfer fin, base plate, the plate outer surface of radiator and integrated circuit upper surface fit tightly.The heat pipe heat radiation external surface is provided with fin, and the bus of fin is perpendicular to base plate, and heat pipe heat radiation body upper end is sealed by top cover, hollow, and lower end and base plate constitute the cavity of sealing, form the negative pressure of vacuum structure.
The utility model is applicable to heat pipe (phase transformation) cooling system of integrated circuit, and it is simple in structure, and cost is low.The utility model has adopted the heat pipe heat radiation element, and the thermal resistance from the thermal source to the heat-delivery surface is reduced significantly, thereby improves fin efficiency, has increased the efficiently radiates heat area of radiator.Adopt ripe at present extrusion process, heat pipe heat radiation body and fin etc. can one-shot formings, and cost reduces significantly.
Description of drawings is further described the utility model below in conjunction with accompanying drawing:
Fig. 1 looks full sectional view for master of the present utility model
Fig. 2 is the full sectional view of overlooking of the present utility model
Fig. 3, Fig. 4 are respectively that the master of another embodiment of the utility model looks full sectional view and overlooks full sectional view
Fig. 5, Fig. 6 are respectively that the master of the another embodiment of the utility model looks full sectional view and overlooks full sectional view
Fig. 7, Fig. 8 are respectively that the master of the another embodiment of the utility model looks full sectional view and overlooks full sectional view
1 is fin; 2 is the heat pipe heat radiation body; 3 is base plate; 4 is working media; 5 is side plate; 6 is radiator fan and fixed support; 7 are strip heat radiation enhancing structure; 8 is top cover; 9 is terminal jag; 10 is the dendroid radiator structure.
The embodiment the purpose of this utility model is also again further to realize by following technology solution:
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, base plate 3 outer surfaces and the integrated circuit upper surface of wherein said radiator fit tightly, and are coated with silica gel etc. to reduce contact heat resistance.
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, the strip heat radiation that wherein said heat pipe heat radiation body 2 upper surfaces are provided with one or some projectioies strengthens structure 7, heat pipe heat radiation body 2 outer surfaces are provided with fin 1, the bus of fin 1 is parallel to base plate, heat pipe heat radiation body 2 upper end closeds, hollow, lower end and base plate 3 and side plate 5 constitute the cavity of sealing, form the negative pressure of vacuum structure.
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, wherein said heat pipe heat radiation body 2 outer surfaces are provided with fin 1, and the bus of fin 1 is perpendicular to base plate, 8 sealings of heat pipe heat radiation body 2 upper end top covers, hollow, lower end and base plate 3 constitute the cavity of sealing, form the negative pressure of vacuum structure.
The cavity shape of wherein said heat pipe heat radiation body 2 can be that any directrix is a kind of in the cylinder of closed curve.
Wherein said heat pipe heat radiation body 2 external boundaries are shaped as circle, and fin 1 is along the circumferential direction uniform, and the directrix of fin 1 boundary face can be the cylinder of straight line, circular arc or any smooth curve, and terminal jag 9, to strengthen radiating effect.
Wherein said heat pipe heat radiation body 2 external boundaries are shaped as rectangle or square, and fin 1 is arranged perpendicular to the boundary line, and the diagonal on the border is provided with dendroid radiator structure 10, to make full use of the space.
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, the material of wherein said fin 1, heat pipe heat radiation body 2, base plate 3 usefulness are aluminium and aluminium alloy or copper and copper alloy.
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, wherein said heat pipe heat radiation body 2 expands near bottom parts, increases heat pipe and CPU contact area.For the complexity that reduces mould also can be with heat pipe heat radiation body 2 whole increases.
Above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, the upper surface of wherein said base plate 3 are surface textures such as the thin ball of sintering, filamentary webs, burr body, pearl particle.
It is in the organic substance compatible with selected case material any that above-mentioned a kind of integrated circuit heat dissipation device that adopts hot pipe technique, wherein said heat pipe heat radiation body 2, base plate 3 and side plate 5 constitute working media 4 in the negative pressure of vacuum structures.For example: at 0-100 ℃, the working media 4 compatible with aluminium has ammonia, fluorine Lyons-21, Freon-11, freon-113, acetone; The working media compatible with copper has Freon-11, freon-113, hexane, acetone, ethanol, methyl alcohol etc.
A kind of integrated circuit heat dissipation device that adopts hot pipe technique, it comprises fin 1, heat pipe heat radiation body 2, base plate 3, working media 4, side plate 5 and radiator fan and fixed support 6.Heat pipe heat radiation body 2, base plate 3 and side plate 5 constitute the cavity of sealing, in a little amount of work medium 4 is arranged.The strip heat radiation that heat pipe heat radiation body 2 upper surfaces are provided with one or some projectioies strengthens structure 7.Heat pipe heat radiation body 2 outer surfaces are provided with fin 1, and the bus of fin 1 is parallel to base plate.Heat pipe heat radiation body 2 upper end closeds, hollow, lower end and base plate 3 and side plate 5 constitute the cavity of sealing, form the negative pressure of vacuum structure.Radiator fan and fixed support 6 are installed in heat pipe heat radiation body 2 sides.
A kind of integrated circuit heat dissipation device that adopts hot pipe technique, it comprises fin 1, heat pipe heat radiation body 2, base plate 3, working media 4, top cover 8 and radiator fan and fixed support 6.Heat pipe heat radiation body 2, base plate 3 and top cover 8 constitute the cavity of sealing, in a little amount of work medium 4 is arranged.Heat pipe heat radiation body 2 outer surfaces are provided with fin 1, and the bus of fin 1 is perpendicular to base plate, and heat pipe heat radiation body 2 upper ends are sealed by top cover 8, hollow, and lower end and base plate 3 constitute the cavity of sealing, form the negative pressure of vacuum structure.Radiator fan and fixed support 6 are installed in heat pipe heat radiation body 2 end faces.
As Fig. 1 and Fig. 2 or Fig. 3 and Fig. 4, the utility model by fin 1, heat pipe heat radiation body 2, base plate 3, side plate 5 and radiator fan and fixed support 6 and the working media 4 that is enclosed in the negative pressure of vacuum structure that heat pipe heat radiation body 2, base plate 3 and side plate 5 constitute form.The strip heat radiation that heat pipe heat radiation body 2 upper surfaces are provided with one or some projectioies strengthens structure 7.Heat pipe heat radiation body 2 outer surfaces are provided with fin 1, and the bus of fin 1 is parallel to base plate.Heat pipe heat radiation body 2 upper end closeds, hollow, lower end and base plate 3 and side plate 5 constitute the cavity of sealing, form the negative pressure of vacuum structure.Fin 1, heat pipe heat radiation body 2 and base plate 3 can extrusion modlings.Radiator fan and fixed support 6 are installed in heat pipe heat radiation body 2 sides.
As Fig. 5 and Fig. 6 or Fig. 7 and Fig. 8, the utility model by fin 1, heat pipe heat radiation body 2, base plate 3, top cover 8 and radiator fan and fixed support 6 and the working media 4 that is enclosed in the negative pressure of vacuum structure that heat pipe heat radiation body 2, base plate 3 and top cover 8 constitute form.Heat pipe heat radiation body 2 outer surfaces are provided with fin 1, and the bus of fin 1 is perpendicular to base plate, and heat pipe heat radiation body 2 upper ends are sealed by top cover 8, hollow, and lower end and base plate 3 constitute the cavity of sealing, form the negative pressure of vacuum structure.Fin 1 and heat pipe heat radiation body 2 can extrusion modlings.Radiator fan and fixed support 6 are installed in heat pipe heat radiation body 2 end faces.
Its course of work is as follows: base plate 3 outer surfaces and the integrated circuit upper surface of radiator fit tightly.The heat that integrated circuit produces arrives working media 4 through base plate 3.Because the negative pressure of vacuum structure that heat pipe heat radiation body 2, base plate 3 and side plate 5 or top cover 8 constitute, working media 4 is under the vacuum negative pressure condition, vaporizes, and produces steam and enters in the cavity of heat pipe heat radiation body 2.Because heat pipe heat radiation body 2 and fin 1 are subjected to the cold wind cooling that radiator fan 6 blows out, so the steam that working media 4 vaporizations produce is in the inner surface condensation of heat pipe heat radiation body 2, then reflux and fall back at last along wall and continue to be heated vaporization in the working media 4, the cooling of realization to integrated circuit so moves in circles.
Claims (8)
1. integrated circuit heat dissipation device that adopts hot pipe technique, comprise heat transfer fin (1), base plate (3), radiator fan (6), it is characterized in that: the base plate of radiator (3) outer surface and integrated circuit upper surface fit tightly, heat pipe heat radiation body (2) outer surface is provided with fin (1), the bus of fin (1) is parallel to base plate, heat pipe heat radiation body (2) upper end closed, hollow, lower end and base plate (3) and side plate (5) constitute the cavity of sealing, form the negative pressure of vacuum structure.
2. a kind of integrated circuit heat dissipation device that adopts hot pipe technique according to claim 1, it is characterized in that: the strip heat radiation that heat pipe heat radiation body (2) upper surface is provided with or some projectioies strengthens structure (7), heat pipe heat radiation body (2) outer surface is provided with fin (1), the bus of fin (1) is parallel to base plate, heat pipe heat radiation body (2) upper end closed, hollow, lower end and base plate (3) and side plate (5) constitute the cavity of sealing, form the negative pressure of vacuum structure.
3. integrated circuit heat dissipation device that adopts hot pipe technique, comprise heat transfer fin (1), base plate (3), radiator fan (6), it is characterized in that: the base plate of radiator (3) outer surface and integrated circuit upper surface fit tightly, heat pipe heat radiation body (2) outer surface is provided with fin (1), the bus of fin (1) is perpendicular to base plate, and heat pipe heat radiation body (2) upper end is by top cover (8) sealing, hollow, lower end and base plate (3) constitute the cavity of sealing, form the negative pressure of vacuum structure.
4. a kind of integrated circuit heat dissipation device that adopts hot pipe technique according to claim 3 is characterized in that: the cavity shape of heat pipe heat radiation body (2) can be that directrix is a kind of in the cylinder of closed curve.
5. a kind of integrated circuit heat dissipation device that adopts hot pipe technique according to claim 3, it is characterized in that: heat pipe heat radiation body (2) external boundary is shaped as circle, fin (1) is along the circumferential direction uniform, the directrix of fin (1) boundary face can be the cylinder of straight line, circular arc or smooth curve, and terminal jag (9).
6. a kind of integrated circuit heat dissipation device that adopts hot pipe technique according to claim 3, it is characterized in that: heat pipe heat radiation body (2) external boundary is shaped as rectangle or square, fin (1) is arranged perpendicular to the boundary line, in peripheral diagonal dendroid radiator structure (10) can be set.
7. according to claim 1 or 3 described a kind of integrated circuit heat dissipation devices that adopt hot pipe technique, it is characterized in that: the material of fin (1), heat pipe heat radiation body (2), base plate (3) usefulness is aluminium and aluminium alloy or copper and copper alloy.
8. according to claim 1 or 3 described a kind of integrated circuit heat dissipation devices that adopt hot pipe technique, it is characterized in that: the upper surface of base plate (3) is the surface texture of the thin ball of sintering, filamentary webs, burr body, pearl particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420013450 CN2736932Y (en) | 2004-06-21 | 2004-12-22 | Integrated circuit heat sink employing heat pipe technique |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420067465.0 | 2004-06-21 | ||
| CN200420067465 | 2004-06-21 | ||
| CN 200420013450 CN2736932Y (en) | 2004-06-21 | 2004-12-22 | Integrated circuit heat sink employing heat pipe technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2736932Y true CN2736932Y (en) | 2005-10-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420013450 Expired - Fee Related CN2736932Y (en) | 2004-06-21 | 2004-12-22 | Integrated circuit heat sink employing heat pipe technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2736932Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846300A (en) * | 2010-04-16 | 2010-09-29 | 江苏尚恩光电科技有限公司 | Honeycomb-shaped heat radiator of LED lamp fitting |
| CN101893399A (en) * | 2010-07-17 | 2010-11-24 | 邓克天 | Heat pipe type fin heat exchanger |
| CN102345991A (en) * | 2010-07-25 | 2012-02-08 | 东莞市为开金属制品厂 | Heat pipe type radiator |
| CN106028764A (en) * | 2016-07-29 | 2016-10-12 | 全椒赛德利机械有限公司 | Heat pipe type radiator and production process thereof |
-
2004
- 2004-12-22 CN CN 200420013450 patent/CN2736932Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101846300A (en) * | 2010-04-16 | 2010-09-29 | 江苏尚恩光电科技有限公司 | Honeycomb-shaped heat radiator of LED lamp fitting |
| CN101893399A (en) * | 2010-07-17 | 2010-11-24 | 邓克天 | Heat pipe type fin heat exchanger |
| CN102345991A (en) * | 2010-07-25 | 2012-02-08 | 东莞市为开金属制品厂 | Heat pipe type radiator |
| CN106028764A (en) * | 2016-07-29 | 2016-10-12 | 全椒赛德利机械有限公司 | Heat pipe type radiator and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |