CN2785322Y - Heat radiator - Google Patents

Heat radiator Download PDF

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Publication number
CN2785322Y
CN2785322Y CN 200520056121 CN200520056121U CN2785322Y CN 2785322 Y CN2785322 Y CN 2785322Y CN 200520056121 CN200520056121 CN 200520056121 CN 200520056121 U CN200520056121 U CN 200520056121U CN 2785322 Y CN2785322 Y CN 2785322Y
Authority
CN
China
Prior art keywords
radiating fin
fin group
radiator
heat
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200520056121
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Chinese (zh)
Inventor
陈俊吉
冯成斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CN 200520056121 priority Critical patent/CN2785322Y/en
Application granted granted Critical
Publication of CN2785322Y publication Critical patent/CN2785322Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a heat radiator, which is used for radiating the heat generated by an electronic component. The utility model comprises a base, a first heat radiating fin group arranged on the base, a top plate connected with the top end of the first heat radiating fin group, at least one first heat pipe which is connected with the base and the top plate, a second heat radiating fin group which is adjacent to the first heat radiating fin group, and at least one second heat pipe which is connected with the base and the second heat radiating fin group, wherein the arranging mode of the first heat radiating fin group and the second heat radiating fin group is in the cross status. The wind pressure of an air flow channel of the heat radiator is higher, the heat exchange of the air flow and the radiating fins can be effectively prompted, the top end of the heat radiator is provided with the top plate, the heat can be evenly transferred at the top ends of the heat radiating fins and the structure of the heat radiator is stable.

Description

Radiator
[technical field]
The utility model is about a kind of radiator, particularly a kind of effectively heat-pipe radiator of cooling electronic components.
[background technology]
Along with electronic industry constantly develops, electronic component (particularly central processing unit) speed of service and overall performance are in continuous lifting.The heat of its generation simultaneously also increases thereupon, makes its temperature constantly raise, and temperature rise will cause the decline of electronic component runnability, can normally move for guaranteeing electronic component, must in time discharge a large amount of heats that it produced.
For this reason, industry uses a kind of radiator to dispel the heat usually, and these existing radiators include a base and the some radiating fins that are located on the base, and this heat dissipation base is the level and smooth entity metal in bottom surface, its central processing unit surface that is sticked.Along with the central processing unit volume is more and more littler, it is also more concentrated to generate heat, because of being confined to the heat transfer property of metal, the heat of heat dissipation base center is often too concentrated, and can't effectively be delivered to radiator around and fin, thereby have a strong impact on the integral heat sink effect, make central processing unit because of overheated decreased performance, can't significance arithmetic, even burn.
For overcoming the problems referred to above, it is increasing that industry is used heat-pipe radiator, heat pipe is that capillary structure thing (as powder sintered thing, groove structure, screen net structure etc.) is set in the metal body, and the sealing hydraulic fluid (as water, alcohol etc.) of packing into, be evacuated to vacuum state then, carry out after being heated by hydraulic fluid that liquid gas two phase change absorb, release heat, owing to the Heat Transfer of Heat Pipe on Heat Pipe non-directional and heat transfer distances is long is used widely.
The TaiWan, China patent announcement has disclosed a kind of radiator that uses heat pipe No. 532758, the heat pipe that it comprises a pedestal, is arranged at the some radiating fins that are parallel to each other on the pedestal and roughly is " コ " shape.This base bottom surface and electronical elements surface are fitted, and the ora terminalis correspondence is offered semi-circular recesses under this pedestal upper surface and the radiating fin, and this heat pipe one free end is fixed in the above-mentioned groove.These radiating fins are offered perforation away from the appropriate location of pedestal, for being sheathed on another free end of heat pipe.The heat transferred that electronic component produces is to pedestal, one part heat directly is delivered to the position, top of radiating fin by heat pipe, another part heat is directly delivered to radiating fin from pedestal, and the heat on the last radiating fin is dispersed in the surrounding air, reaches the purpose of cooling electronic components.But, above-mentioned heat abstractor heat pipe and radiating fin are less away from the contact area at the position of pedestal, be difficult to heat evenly is sent to the position away from pedestal of radiating fin, thereby reduce the utilance of heat pipe and radiating fin, and be difficult to guarantee the structure steadiness at position, radiating fin upper end, radiating fin also causes noise thereupon producing vibrations when fan shakes; In addition, above-mentioned heat abstractor is because of single being arranged in parallel of each radiating fin, and less to the flow resistance of air-flow in the gas channel of its formation, blast is lower, and the radiating fin surface is low, insufficient with the heat exchanger effectiveness of air-flow.
[summary of the invention]
The radiator with heat pipe that provides a kind of radiating efficiency high is provided the purpose of this utility model.
The purpose of this utility model is achieved through the following technical solutions:
Radiator of the present utility model, in order to distributing the heat that electronic component produces, it comprises a pedestal, is arranged at the first radiating fin group on this pedestal, a top board that is connected with the first radiating fin group top, at least one first heat pipe that connects this pedestal and top board, abut the first radiating fin group the second radiating fin group, be connected at least one second heat pipe of this pedestal and the second radiating fin group.
The utility model is compared with prior art has following advantage: because the radiator top is connected a top board, and this pedestal is connected by first heat pipe with top board, thereby make heat can be sent to the position, top of radiating fin uniformly, improve the utilance of heat pipe and radiating fin, and make heat spreader structures firm.
The further improvement of the utility model radiator is, the cross-shaped attitude of arrangement mode of the above-mentioned first radiating fin group and the second radiating fin group.The first radiating fin group of radiator and the second radiating fin group staggered form abut against together, its gas channel that is combined to form middle part forms flow resistance, higher when out-of-date its blast of air flow stream, effectively promote the heat exchange of air-flow and radiating fin, thereby improve the radiating efficiency of radiator.
With reference to the accompanying drawings, the utility model will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of the utility model radiator.
Fig. 2 is the stereogram before the utility model radiator and fan are installed.
Fig. 3 is the three-dimensional assembly diagram of the utility model radiator.
Fig. 4 is the end view of the utility model radiator.
[embodiment]
See also Fig. 1 to Fig. 4, the utility model radiator is used for being installed on the central processing unit heat-generating electronic elements such as (figure do not show) it is dispelled the heat.This radiator comprise pair of lamina substrate 10, vertically stand on the first radiating fin group 20, first heat pipe 30, that connects the substrate 10 and the first radiating fin group 20 on the substrate 10 be parallel to substrate 10 and be connected with the second radiating fin group 40, that the first radiating fin group 20 be close to mutually the substrate 10 and the second radiating fin group 40 second heat pipe 50, reach a top board 60 that is arranged at first and second radiating fin group 20,40 tops.
Aforesaid substrate 10 comprises a copper coin that contacts with electronic component 12 and is posted by aluminium sheet 14 on this copper coin 12, the corresponding groove 16,18 of ccontaining above-mentioned first and second heat pipe 30,50 1 ends respectively that is provided with between this copper coin 12 and the aluminium sheet 14, these aluminium sheet 14 4 corners have extended to form fixing feet 140 respectively, are assembled with buckling piece 142 in advance on this fixing feet 140.These buckling pieces 142 can closely be fixed in radiator on the electronic component.
The above-mentioned first radiating fin group 20 is erected in this aluminium sheet 14 surfaces, it is made up of some equidistantly first transversely arranged radiating fins 22, the ora terminalis up and down of this first radiating fin 22 bends in the same way and extends a flanging 24, this flanging 24 is replaced adjacent radiating fin 22, thereby form the gas channel of a side direction between per two adjacent first radiating fins 22, these first radiating fin group, 20 tops are provided with the groove 26 that contacts with above-mentioned first heat pipe, 30 other ends, its lateral margin horizontal expansion one stage portion 28, this first heat pipe 30 probably is " ㄈ " font, it has two free ends and connects this two free-ended middle part, this two free end is inserted in groove 16 and the groove 26 from side direction respectively, the free end that this first heat pipe 30 combines with groove 16 is an evaporation ends, and the free end that combines with groove 26 is a condensation end.
The above-mentioned second radiating fin group 40 is set in parallel in aluminium sheet 14 tops and abuts the first radiating fin group 20, its second radiating fin 42 by some equidistant stacked arrangement is formed, the both sides ora terminalis of each radiating fin 42 bends in the same way and extends a flanging 44, its undermost radiating fin 42 folded being against on the stage portion 28 of the above-mentioned first radiating fin group 20, this each second radiating fin 42 is offered the perforation 46 that its periphery has contact-making surface respectively near the two side ends place, above-mentioned second heat pipe 50 is " U " font, it has two free ends and connects this two free-ended middle part, 50 liang of free ends of this heat pipe (condensation end) are in the perforation 46 of extending and from bottom to top passing respectively the second radiating fin group 40 vertically upward, in this heat pipe 50 middle parts (evaporation ends) groove 18 between copper coin 12 and aluminium sheet 14, make the arrangement mode of win the radiating fin group 20 and the second radiating fin group 40 be the right-angled intersection state.
Above-mentioned first and second radiating fin group 20,40 tops are provided with above-mentioned top board 60 jointly, this top board 60 is provided with a groove 62, this groove 62 is combined into a pore with the groove 26 of the above-mentioned first radiating fin group 20, this pore makes first heat pipe, 30 1 ends be placed in it fully, thereby the heat of these first heat pipe, 30 ends also can be sent to each position, top of the first radiating fin group 20 uniformly, and this top board 60 can also firm heat spreader structures.In addition, a fan 70 is installed on the outside of the above-mentioned second radiating fin group 40 by fan Fixture 72, and this fixed mount 72 is clamped the both side ends of the second radiating fin group 40 from both sides, and substrate 10 lateral margins are fixed in its bottom and top board 60 lateral margins are fixed at the top.
When electronic component moves, the heat that it produced conducts to first fast by copper coin 12, two heat pipes 30,50 evaporation ends and aluminium sheet 14, and this first, two heat pipes 30, the heat of 50 evaporation ends transfer to its condensation end rapidly and be sent to be in contact with it first, two radiating fins 22,42 (heat of first heat pipe 30 is sent to top board 60 simultaneously), because the heat transfer rate of copper coin 12 is very fast, its heat distribution is more even, can provide than the even temperature environment electronic component, heat on this aluminium sheet 14 reach be in contact with it each first, two radiating fins 22,42 and first, two heat pipes 30,50 evaporation ends, at last, be sent to first, two radiating fin groups 20, heat on 40 forced draft surperficial by it and that fan 70 blows contacts carries out heat exchange.
Because first and second radiating fin group 20,40 of this radiator forms the staggered form arrangement mode, when crossing these first and second radiating fin group 20,40 abutting end places, air communication produces flow resistance, make its blast height, rate of heat exchange is fast, thereby improves the radiating rate of radiator.Above-mentioned radiator is because the radiator top is connected with top board, make heat also can be sent to radiator each position uniformly away from pedestal, make full use of heat pipe and radiating fin, and two groups of radiating fins form the arrangement mode of right-angled intersection, its abutting end place blast is higher, make that radiating fin and air-flow exchange capability of heat are stronger, improve the heat-sinking capability of radiator.
Above-mentioned radiator only is the preferred embodiment of the utility model radiator, this radiator can also comprise more other embodiment, can increase an other radiating fin group and above-mentioned first and second radiating fin group is combined to form various staggered form gas channels as radiator; Radiator base also can be copper pedestal being made into integration or the shape of copper coin can be circle, polygon etc.; Also have, the number of first and second heat pipe can increase to two or more respectively, can also use template or flat hot pipe etc.; Have again, fan can be installed in the first radiating fin group outside or increase number of fans, and two fans are installed in first and second radiating fin outside or the like respectively.

Claims (9)

1. radiator, in order to distribute the heat that electronic component produces, it comprises a pedestal, is arranged at the first radiating fin group on this pedestal, it is characterized in that: this radiator also comprises a top board, at least one first heat pipe that connects this pedestal and top board, the second radiating fin group that abuts the first radiating fin group that is connected with the first radiating fin group top, at least one second heat pipe that is connected this pedestal and the second radiating fin group.
2. radiator as claimed in claim 1 is characterized in that: the cross-shaped attitude of arrangement mode of the above-mentioned first radiating fin group and the second radiating fin group.
3. radiator as claimed in claim 2 is characterized in that: the above-mentioned first radiating fin group is equidistantly arranged by first radiating fin of some vertical pedestals and is formed, and this second radiating fin group is by equidistant stacked the forming of second radiating fin of some parallel pedestals.
4. radiator as claimed in claim 3 is characterized in that: lateral margin horizontal expansion one stage portion of the above-mentioned first radiating fin group, the undermost radiating fin of the above-mentioned second radiating fin group is taken and is against on this stage portion.
5. radiator as claimed in claim 4, it is characterized in that: the top of the above-mentioned first radiating fin group and top board correspondence are provided with the groove of ccontaining first heat pipe, one end, above-mentioned first heat pipe is " ㄈ " font, and the one free end is connected with said base, and another free end is connected with this groove.
6. radiator as claimed in claim 5, it is characterized in that: above-mentioned each second radiating fin is provided with perforation, above-mentioned second heat pipe is " U " font, and its two free end from bottom to top passes the perforation of the second radiating fin group respectively, and this heat pipe middle part is connected with pedestal.
7. as each described radiator in the claim 1 to 6, it is characterized in that: said base comprises a copper coin that contacts with electronic component and an aluminium sheet that is posted by on the copper coin, the corresponding groove that combines with above-mentioned first and second heat pipe respectively that is provided with between this copper coin and the aluminium sheet.
8. radiator as claimed in claim 7 is characterized in that: fixing feet is extended in above-mentioned aluminium sheet four corners respectively, and this fixing feet is assembled with buckling piece in advance.
9. as each described radiator in the claim 1 to 6, it is characterized in that: a fan is installed in the second radiating fin group side of this radiator.
CN 200520056121 2005-03-19 2005-03-19 Heat radiator Expired - Fee Related CN2785322Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520056121 CN2785322Y (en) 2005-03-19 2005-03-19 Heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520056121 CN2785322Y (en) 2005-03-19 2005-03-19 Heat radiator

Publications (1)

Publication Number Publication Date
CN2785322Y true CN2785322Y (en) 2006-05-31

Family

ID=36772282

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520056121 Expired - Fee Related CN2785322Y (en) 2005-03-19 2005-03-19 Heat radiator

Country Status (1)

Country Link
CN (1) CN2785322Y (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102934535A (en) * 2010-06-07 2013-02-13 三菱电机株式会社 Heat sink, and method for producing same
CN106558562A (en) * 2016-11-21 2017-04-05 武汉精立电子技术有限公司 A kind of high power load metal-oxide-semiconductor heat abstractor
CN109407806A (en) * 2018-12-06 2019-03-01 深圳市超频三科技股份有限公司 A kind of radiator
CN109668346A (en) * 2017-12-28 2019-04-23 杭州大和热磁电子有限公司 A kind of novel semi-conductor refrigeration radiating module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102934535A (en) * 2010-06-07 2013-02-13 三菱电机株式会社 Heat sink, and method for producing same
CN102934535B (en) * 2010-06-07 2016-03-30 三菱电机株式会社 Radiator and its preparation method
CN106558562A (en) * 2016-11-21 2017-04-05 武汉精立电子技术有限公司 A kind of high power load metal-oxide-semiconductor heat abstractor
CN109668346A (en) * 2017-12-28 2019-04-23 杭州大和热磁电子有限公司 A kind of novel semi-conductor refrigeration radiating module
CN109407806A (en) * 2018-12-06 2019-03-01 深圳市超频三科技股份有限公司 A kind of radiator

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060531

Termination date: 20140319