CN212211742U

CN212211742U - Air-cooled radiator and electronic device

Info

Publication number: CN212211742U
Application number: CN202020395694.4U
Authority: CN
Inventors: 万虎; 冯先强
Original assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Current assignee: Guangzhou Shiyuan Electronics Thecnology Co Ltd
Priority date: 2020-03-25
Filing date: 2020-03-25
Publication date: 2020-12-22
Anticipated expiration: 2030-03-25

Abstract

The utility model relates to the technical field of electronic device heat dissipation, and discloses an air-cooled radiator and an electronic device, wherein the air-cooled radiator comprises a heat dissipation body, the heat dissipation body is surrounded by a temperature-uniforming plate to form an internal channel structure, heat dissipation fins are arranged inside the channel structure and/or outside the heat dissipation body, a cavity is arranged inside the temperature-uniforming plate body, and a heat exchange medium is filled in the cavity; the end part of the heat dissipation body, which is positioned on the channel structure, is provided with a heat dissipation fan. The air-cooled radiator can quickly dissipate heat and cool down a heat power consumption device, has good temperature equalization performance, can effectively take away heat through the cooling fan, improves the heat exchange capacity, and improves the stability of operation and the service life. The electronic device comprises a thermal power consumption device and the air-cooled radiator, wherein the thermal power consumption device is arranged inside and/or outside the air-cooled radiator. The electronic device has good heat dissipation effect and stable operation.

Description

Air-cooled radiator and electronic device

Technical Field

The utility model relates to an electron device heat dissipation technical field especially relates to an air-cooled radiator and electron device.

Background

With the development of electronic technology, electronic devices tend to be miniaturized and light and thin, and meanwhile, the performance and power of electronic components are continuously improved, and the heat flux density is rapidly increased, so that how to effectively solve the problem of heat dissipation becomes a bottleneck of further development of electronic technology.

For medium and high power devices such as air-conditioning heat pump controllers, industrial power supplies, motor drivers, high-performance workstations, servers, IGBTs and the like, the air-cooled radiator is required to effectively reduce the temperature rise of the heat dissipation device so that the heat dissipation device can be maintained in a normal working temperature range after the system reaches thermal balance, and meanwhile, the whole heat dissipation system is required to be more compact in design and higher in integration level, so that the air-cooled radiator is suitable for the current trend of miniaturization and light weight of electronic products. This almost contradictory requirement also makes the design of air-cooled heat sinks an unprecedented challenge, and therefore, new technologies and structural design ideas are urgently needed in the market to meet the heat dissipation challenge of current high power density products.

The aluminum profile air-cooled radiator is a popular air-cooled radiator in high-power equipment at present, and has the characteristics of attractive appearance, light weight, good heat dissipation performance, good energy-saving effect and the like. The application scenes of the aluminum profile air-cooled radiator can be divided into forced convection heat dissipation and natural convection heat dissipation, for the forced convection heat dissipation, the air-cooled radiator is usually installed on a power device in the prior art, heat is transferred to a base of the air-cooled radiator through a contact surface of the air-cooled radiator and the base of the air-cooled radiator, then the heat is diffused to fins of the air-cooled radiator, and then air which is forced to flow is input by an air suction fan or an air blowing fan to transfer the heat to an external environment, so that the purpose of. The heat dissipation efficiency of the forced convection air-cooled radiator depends on the heat transfer efficiency of the base of the air-cooled radiator and the heat convection capacity of the heat dissipation fins after the fan is installed, for the traditional aluminum air-cooled radiator, the heat conductivity coefficient of the aluminum material of the base is within 230W/m k, the heat transfer capacity is limited, and large temperature difference exists in each area of the air-cooled radiator, so that the heat exchange temperature difference is not uniform, and the heat exchange performance of the air-cooled radiator is reduced; on the other hand, in order to improve the heat dissipation efficiency of the heat dissipation fins, according to the theory of heat transfer science, the heat exchange area and the convection heat exchange coefficient of the heat dissipation fins need to be increased, so that the volume and the specific gravity of the current air-cooled heat dissipater are increasingly large, because the air channel of the traditional air-cooled heat dissipater is open, part of air volume does not flow through the air-cooled heat dissipater to participate in heat exchange, in order to improve the effective air volume, the fan tends to be high in power and high in rotating speed, and the problems of low utilization rate of the internal space of the device.

In conclusion, in order to solve the heat dissipation problem of the high-power-density electronic device, a novel air-cooled heat dissipation device which has the advantages of good temperature equalization performance, strong heat exchange capability, light weight and small volume, can improve the utilization rate of the internal space of the device, improves the efficiency of a fan, and reduces the comprehensive cost is developed, and has great significance for improving the system reliability, the long-term operation stability, the service life and the like of an electronic product.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide an air-cooled radiator and electron device, it is inhomogeneous to have solved the heat dissipation of current radiator, and the heat-sinking capability is poor, bulky problem.

To achieve the purpose, the utility model adopts the following technical proposal:

the embodiment of the utility model provides an air-cooled radiator, including the heat dissipation body, the heat dissipation body is enclosed by the temperature-uniforming plate and is established the inside and form the access structure, the access structure inside and/or the heat dissipation body outside is provided with radiating fin, the temperature-uniforming plate body is inside to be provided with the cavity, the cavity intussuseption is filled with heat transfer medium; and a heat radiation fan is arranged at the end part of the heat radiation body, which is positioned on the channel structure.

This air-cooled radiator's heat dissipation body encloses by the temperature-uniforming plate and establishes inside formation access structure, access structure's inside and/or the outside of heat dissipation body are provided with radiating fin, pack heat transfer medium through the inside cavity of temperature-uniforming plate, the radiator fan that is located access structure's tip of heat dissipation body, the air-cooled radiator of this structure, can carry out quick heat dissipation cooling to the heat power consumption device, the temperature-uniforming performance is good, and can effectively take away the heat through radiator fan, improve heat transfer capacity, the stability and the life of operation have been improved.

As a preferable scheme of the air-cooled radiator, a groove is arranged in the cavity, and the groove is communicated with the cavity.

The arrangement of the groove in the cavity can increase the surface area in the cavity, and the phase change of the heat exchange medium is facilitated.

As a preferable mode of the air-cooled radiator, the height of the groove does not exceed 1/2 of the height of the chamber. The arrangement ensures the space required by the phase change of the heat exchange medium.

As a preferable scheme of the air-cooled radiator, the volume of the heat exchange medium is 3% -45% of the volume of the chamber. This setting can ensure better heat exchange effect.

As a preferable scheme of the air-cooled radiator, the heat dissipation body comprises two side plates arranged in an opposite manner and a top plate connecting the two side plates, the side plates and the top plate enclose the inside to form the channel structure, a mounting opening is formed between one ends, far away from the top plate, of the two side plates, and the mounting opening is communicated with the inside of the channel structure.

The heat dissipation body of this structure simple structure can stretch into inside the access structure through the installing port heat-power consumption device of being convenient for.

As a preferable scheme of the air-cooled radiator, the heat dissipation fins located outside the heat dissipation body are first heat dissipation fins, and the first heat dissipation fins are wrapped outside the side plates and the top plate. The first radiating fin of this structure can dispel the heat fast.

In a preferred embodiment of the air-cooled radiator, the first heat dissipating fin is corrugated or zigzag, and the first heat dissipating fin is formed by folding a plate-shaped heat dissipating fin. The first radiating fin of the structure increases the surface area and improves the radiating efficiency.

As a preferable scheme of the air-cooled heat sink, the heat dissipation fins located inside the channel structure are second heat dissipation fins, and the second heat dissipation fins include multiple layers of heat dissipation fins arranged in parallel and at intervals. The second radiating fins of the structure are placed inside the channel structure, and the radiating efficiency is improved through the multiple layers of radiating fins which are arranged in parallel and at intervals.

As a preferable scheme of the air-cooled radiator, the second heat dissipation fins are provided with avoidance grooves and/or avoidance holes, and the avoidance grooves and/or the avoidance holes can accommodate thermal power consumption devices. The heat dissipation device can be accommodated by the avoiding groove and/or the avoiding hole, so that heat dissipation of the heat dissipation device is facilitated.

As a preferable mode of the air-cooled radiator, the size of the heat radiation fan is equal to the size of the cross section inside the channel structure. The size of the radiating fan is equal to the size of the cross section inside the channel structure, so that the equal cross section butt joint of the radiating fan and the channel structure is ensured, and the loss of wind pressure and wind volume is avoided.

As a preferable scheme of the air-cooled radiator, the radiating body is formed by bending the temperature equalizing plate. The heat dissipation body is formed by bending the temperature equalization plate, and is simple in structure and easy to prepare.

An embodiment of the utility model provides an electronic device, including thermal power consumption device and foretell air-cooled radiator, the thermal power consumption device set up in the inside and/or the outside of air-cooled radiator. The electronic device has good heat dissipation effect and stable operation.

The utility model discloses beneficial effect of embodiment:

the embodiment of the utility model provides an air-cooled radiator, the heat dissipation body is enclosed into access structure by the temperature equalization board, access structure's inside and/or the outside of heat dissipation body are provided with radiating fin, pack heat transfer medium in the cavity through the temperature equalization inboard, the radiator fan that is located access structure's tip of heat dissipation body, the air-cooled radiator of this structure, can carry out the cooling of dispelling the heat fast to the heat power consumption device, the temperature equalization performance is good, and set up in the tip of wind channel structure through radiator fan, effective amount of wind has been improved, can effectively take away the heat, improve heat transfer capacity, reduce the whole volume of air-cooled radiator, the stability and the life of operation have been improved.

The embodiment of the utility model provides an electron device, the radiating effect is better, and the operation is stable.

Drawings

Fig. 1 is a schematic structural diagram of an air-cooled radiator according to an embodiment of the present invention;

fig. 2 is a schematic view of a structure to be installed of a cooling fan of an air-cooled heat sink according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a heat dissipation body, a first heat dissipation fin and a second heat dissipation fin to be mounted according to an embodiment of the present invention;

fig. 4 is a cross-sectional view of a heat dissipating body according to an embodiment of the present invention;

fig. 5 is a partially enlarged schematic view at a in fig. 4.

Fig. 6 is a schematic structural view illustrating a first heat dissipating fin disposed outside a heat dissipating body according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of the channel structure provided by the embodiment of the present invention, in which the first heat dissipation fins are disposed.

In the figure:

1. a heat dissipation body; 11. a chamber; 12. a groove; 13. a side plate; 14. a top plate; 15. an installation port; 16. a support structure;

2. a heat radiation fan; 21. an air suction fan; 22. a blowing fan;

3. a first heat radiation fin;

4. a second heat radiation fin; 41. avoiding the hole.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

An embodiment of the utility model provides an electronic device, including heat-work consumption device and air-cooled radiator, the heat-work consumption device sets up in the inside and/or the outside of air-cooled radiator.

Specifically, as shown in fig. 1 and fig. 2, the air-cooled radiator includes a radiating body 1, the radiating body 1 is surrounded by a temperature-uniforming plate, an interior of the channel structure and/or an exterior of the radiating body 1 forms a channel structure, a radiating fin is disposed inside the channel structure and/or outside the radiating body 1, a cavity 11 is disposed inside the temperature-uniforming plate, and a heat exchange medium is filled in the cavity 11; the end part of the heat dissipation body 1, located on the channel structure, is provided with the heat dissipation fan 2, the air-cooled radiator with the structure can quickly dissipate heat and cool down a heat power consumption device, the temperature equalization performance is good, heat can be effectively taken away through the heat dissipation fan 2, the heat exchange capacity is improved, and the operation stability and the service life are improved.

In one embodiment, the heat dissipation body 1 and the heat dissipation fins are made of aluminum, so that the heat dissipation effect is good.

The heat dissipation body 1 can be installed on a clamping plate in an electronic device to dissipate heat of the clamping plate, and the installation mode of the heat dissipation body 1 on the clamping plate can be but is not limited to stitch welding, screw locking or buckle fixing and the like. The length and depth of the heat dissipating body 1 may be designed and arranged according to the card board.

As shown in fig. 3 and 4, the heat dissipating body 1 includes two side plates 13 disposed opposite to each other and a top plate 14 connecting the two side plates 13, the side plates 13 and the top plate 14 enclose an interior to form a channel structure, an installation opening 15 is formed between ends of the two side plates 13 far away from the top plate 14, and the installation opening 15 is communicated with the interior of the channel structure. The heat dissipation body 1 with the structure is simple in structure, and can facilitate the heat dissipation device to stretch into the channel structure through the mounting port 15, so that the heat dissipation device can dissipate heat, and the space utilization rate of the inside of an electronic device can be improved. Wherein, curb plate 13 is L shape structure, and two L shape structures set up relatively, and heat dissipation body 1 is buckled by a samming board and is formed, simple structure, easy preparation.

As shown in fig. 5, a groove 12 is provided in the chamber 11 inside the temperature equalization plate body, the groove 12 extends along the length direction of the temperature equalization plate, and the groove 12 is communicated with the chamber 11. The arrangement of the groove 12 in the cavity 11 ensures that the heat exchange medium can generate gas-liquid phase change, and the heat dissipation effect of the temperature equalizing plate is improved.

In one embodiment, the grooves 12 are multiple, and the multiple grooves 12 may be connected or may be separate structures. In order to enhance the supporting strength of the temperature equalizing plate, a plurality of supporting structures 16 are arranged at intervals inside the chamber 11, the supporting structures 16 are columnar structures, and two ends of each supporting structure 16 are respectively connected to the upper surface and the lower surface of the chamber 11.

Optionally, the height of the groove 12 does not exceed 1/2 the height of the chamber 11. The arrangement ensures the space required by the phase change of the heat exchange medium. The size and shape of the microchannel structure 12 and the cavity 11 can be set according to requirements, and can be controlled by adjusting the structural parameters of the die.

The volume of the heat exchange medium is 3-45% of the volume of the chamber 11. This setting can ensure better heat exchange effect. Wherein, the heat exchange medium can be ammonia, acetone, methanol, ethanol or HFC refrigerant, and the specific selection can be selected according to the requirement.

As shown in fig. 1, the heat dissipating fins located outside the heat dissipating body 1 are first heat dissipating fins 3, the heat dissipating fins located inside the channel structure are second heat dissipating fins 4, and the first heat dissipating fins 3 and the second heat dissipating fins 4 are mounted on the heat dissipating body 1 in a manner including, but not limited to, welding, bonding, riveting, or fin inserting.

The first heat dissipating fins 3 are wrapped around the side plates 13 and the top plate 14. The first heat radiation fins 3 of this structure can radiate heat quickly. The first radiating fins 3 are corrugated or zigzag and are formed by folding plate-shaped radiating fins so as to enhance the surface area of the first radiating fins 3, the first radiating fins 3 can be prepared by processes such as punch forming or clamp bending, the surface area of the first radiating fins 3 is increased, and the radiating efficiency is improved.

As shown in fig. 3, the second heat dissipating fin 4 includes a plurality of layers of heat dissipating fins arranged in parallel and spaced apart. The second radiating fins 4 of the structure are placed inside the channel structure, and the radiating efficiency is improved through the multiple layers of radiating fins which are arranged in parallel and at intervals. The second heat dissipation fin 4 can also be processed into a vacancy with a certain shape through a blanking process so as to mount a thermal power consumption device and improve the mounting density. When the heat power consumption device is accommodated in the channel structure, the avoidance space is arranged on the second radiating fin 4, the avoidance space can be a avoidance groove or a avoidance hole 41, and the heat power consumption device can be accommodated in the avoidance groove or the avoidance hole 41, so that the heat power consumption device can be conveniently radiated, and the space utilization rate in the device is improved. Wherein the cross section of the avoidance groove or the avoidance hole 41 may be a geometric shape such as a circle, a square or a rectangle. In one embodiment, the second heat dissipating fin 4 is provided with an avoiding hole 41.

The heat dissipation fans 2 may be disposed at one end or both ends of the channel structure, as shown in fig. 1, the heat dissipation fans 2 are disposed at both ends of the channel structure, the two heat dissipation fans 2 are respectively disposed with an air suction fan 21 and an air blowing fan 22, and the rotation directions of the air suction fan 21 and the air blowing fan 22 are the same.

In one embodiment, the size of the heat dissipation fan 2 is equal to the cross-sectional size of the inside of the channel structure. The size of the heat radiation fan 2 is equal to the size of the cross section inside the channel structure, so that the heat radiation fan 2 is ensured to be in butt joint with the cross section of the channel structure, and the loss of wind pressure and wind volume is avoided.

As shown in fig. 1, 6 and 7, the heat dissipation fins combined with the heat dissipation body 1 may be disposed inside the channel structure or attached to the outside of the heat dissipation body 1, or attached to both the inside of the channel structure and the outside of the heat dissipation body 1.

The mounting position of the heat-consuming device can be the inner part of the heat-dissipating body 1, the front end and the rear end of the heat-dissipating body 1 or the left side and the right side of the heat-dissipating body 1, and can be adjusted according to the mounting direction of the heat-dissipating device during working and the layout of electronic components, and the mounting positions of the first heat-dissipating fins 3, the second heat-dissipating fins 4 and the heat-dissipating fan 2 are adjusted according to the mounting position of the heat-consuming device.

When the heat power consumption devices are arranged on the two sides of the heat dissipation body 1, the heat power consumption devices are arranged in a cross mode, and the phenomenon that the heat power consumption devices on the two sides of the heat dissipation body 1 are located on the same micro channel structure to cause temperature equalization performance to be poor is avoided; when the thermal power consumption device is disposed at the front end or the rear end of the heat dissipation body 1, the disposition of the heat dissipation fan 2 at the same position should be cancelled.

When the air-cooled radiator is combined in the radiating fins on the radiating body 1 and is arranged in the channel structure, and a thermal power consumption device is arranged in the channel structure, an avoiding space can be reserved on the second radiating fins 4 in a blanking processing mode and the like so as to avoid the thermal power consumption device in the channel structure.

When the air-cooled radiator is combined with the radiating fins on the radiating body 1 and is arranged in the channel structure, and no thermal power consumption device is arranged in the channel structure, the second radiating fins 4 can be directly arranged in the radiating body 1. At this time, the heat dissipation device may be placed outside the heat dissipation body 1 to dissipate heat.

The air-cooled radiator has high space utilization rate and compact structure, can greatly improve the installation density of devices, reduce the volume of the devices, facilitate the miniaturization and light and thin design of products, and reduce materials and production cost.

The heat of the heat power consumption device can be rapidly transferred and diffused by utilizing the gas-liquid phase change of the heat exchange medium in the temperature equalizing plate, and then the heat is efficiently dissipated to the surrounding environment by combining the large-area folded radiating fins and the radiating fan 2, so that the heat transfer and radiating performance is improved, and the temperature equalizing plate is suitable for solving the radiating problem of a high-power device.

This air-cooled radiator has avoided traditional air-cooled radiator because the wind channel is open, and partial amount of wind does not flow through the problem that the radiator participates in the heat transfer, through making cross section installation such as wind channel structure and fan, realizes the restraint and the planning in wind channel, improves effective amount of wind, thereby strengthen the heat transfer ability of radiator greatly, simultaneously because the effective amount of wind of air-cooled radiator structure accounts for the relative altitude, still can reduce 2 powers and the rotational speed of radiator fan to a certain extent, thereby reduce 2 noises and manufacturing cost of radiator fan.

According to the air-cooled radiator, thermal power consumption devices such as inductors and capacitors which are inconvenient to install the radiator can be arranged in a channel structure, devices with regular surface shapes such as MOS (metal oxide semiconductor) tubes and IGBTs (insulated gate bipolar transistor) are arranged on the outer surface of the radiating body 1, so that unified planning of heat sources is realized, and the radiating problem of multiple heat sources is solved synchronously.

The preparation method of the air-cooled radiator comprises the following steps:

1. firstly, the structural size of the air-cooled radiator is designed according to the use requirement, and the structural parameters of the uniform temperature plate of the air-cooled radiator are obtained.

2. The macroscopic size of the temperature-uniforming plate of the air-cooled radiator and the size of the inner groove 12 can be controlled by the design of the cross-sectional shape and size of the die, and the temperature-uniforming plate shell with the grooves 12 and the two open ends is prepared by an extrusion molding process.

3. And (4) degreasing, washing and drying the prepared uniform temperature plate shell.

4. Welding and sealing two ends of the temperature-equalizing plate shell by welding technologies such as friction stir welding or ultrasonic welding, and reserving liquid filling ports at any positions of the two ends.

5. And vacuumizing the inside of the temperature-equalizing plate through a reserved liquid filling opening by using vacuum filling equipment, simultaneously injecting a certain amount of heat exchange medium into the temperature-equalizing plate, sealing the liquid filling opening by rolling, and reinforcing the seal by brazing.

6. And removing the allowance of the temperature equalizing plate and shaping.

7. One end of the temperature equalizing plate is fixed by a special clamp and is continuously bent for 3 times to form a cabinet body structure.

8. The second heat dissipation fins 4 are prepared from aluminum sheets with certain thickness by combining the internal size of the cabinet body, the specific fin height and fin spacing design and through processes of stamping or bending forming and the like.

9. The first radiating fins 3 are prepared by combining an aluminum sheet with a certain thickness with the external space of the radiating body 1, the design of space avoidance and limiting, safety regulation specification, specific fin height and fin spacing and through the processes of stamping or bending forming and the like.

10. The first radiating fins 3 and the second radiating fins 4 are attached to the temperature-uniforming plate cabinet body through processes of welding, bonding, riveting or fin inserting and the like.

11. And obtaining the air-cooled radiator after the air-cooled radiator is qualified through appearance inspection and safety test.

The method can flexibly adjust the heat exchange capacity by increasing and decreasing the number and density of the folded fins inside and outside the heat dissipation body 1, thereby achieving the optimal heat dissipation effect.

In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are used in a descriptive sense or positional relationship based on the orientation or positional relationship shown in the drawings for convenience of description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single technical solution, and such description is for clarity only, and those skilled in the art should take the description as a whole, and the technical solutions in the embodiments may be appropriately combined to form other embodiments that may be understood by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. The air-cooled radiator is characterized by comprising a radiating body (1), wherein the radiating body (1) is surrounded by a temperature-equalizing plate to form a channel structure, radiating fins are arranged inside the channel structure and/or outside the radiating body (1), a cavity (11) is arranged inside the temperature-equalizing plate, and a heat exchange medium is filled in the cavity (11); and a heat radiation fan (2) is arranged at the end part of the heat radiation body (1) positioned at the channel structure.

2. An air-cooled heat sink according to claim 1, wherein a recess (12) is provided in the chamber (11), the recess (12) communicating with the chamber (11).

3. The air-cooled heat sink according to claim 2, wherein the height of the groove (12) does not exceed 1/2 of the height of the chamber (11).

4. An air-cooled radiator according to claim 1, characterised in that the volume of the heat exchange medium is 3-45% of the volume of the chamber (11).

5. The air-cooled radiator according to any one of claims 1-4, wherein the radiating body (1) comprises two side plates (13) arranged oppositely and a top plate (14) connecting the two side plates (13), the side plates (13) and the top plate (14) enclose the interior to form the channel structure, a mounting opening (15) is formed between the ends of the two side plates (13) far away from the top plate (14), and the mounting opening (15) is communicated with the interior of the channel structure.

6. The air-cooled radiator according to claim 5, wherein the heat dissipation fins outside the radiator body (1) are first heat dissipation fins (3), and the first heat dissipation fins (3) are wrapped outside the side plates (13) and the top plate (14).

7. The air-cooled radiator according to claim 6, wherein the first radiating fins (3) are corrugated or serrated, and the first radiating fins (3) are formed by folding plate-shaped fins.

8. An air-cooled heat sink according to any one of claims 1-4, characterised in that the heat-radiating fins inside the channel structure are second heat-radiating fins (4), the second heat-radiating fins (4) comprising a plurality of layers of parallel and spaced-apart fins.

9. The air-cooled heat sink according to claim 8, wherein the second heat dissipating fins (4) are provided with avoiding grooves and/or avoiding holes (41), and the avoiding grooves and/or the avoiding holes (41) can accommodate thermal power dissipation devices therein.

10. An air-cooled heat sink according to any one of claims 1-4, characterised in that the dimensions of the cooling fan (2) are equal to the cross-sectional dimensions of the interior of the channel structure.

11. The air-cooled radiator according to any one of claims 1-4, wherein the heat dissipation body (1) is formed by bending the temperature equalization plate.

12. An electronic device, comprising a thermal power dissipation device and the air-cooled heat sink as recited in any one of claims 1-11, wherein the thermal power dissipation device is disposed inside and/or outside the air-cooled heat sink.