CN106455456A - Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method - Google Patents
Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method Download PDFInfo
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- CN106455456A CN106455456A CN201611109321.0A CN201611109321A CN106455456A CN 106455456 A CN106455456 A CN 106455456A CN 201611109321 A CN201611109321 A CN 201611109321A CN 106455456 A CN106455456 A CN 106455456A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a copper-aluminum compound water-cooling plate and a processing and manufacturing method thereof as well as a water-cooling heat dissipation method. The copper-aluminum compound water-cooling plate comprises a base plate and a cover plate, wherein a cooling liquid flow channel is formed in the base plate; the base plate comprises a copper plate and an aluminum plate laminated together with the copper plate; the copper plate used for mounting a module component is arranged on the front of the base plate; the aluminum plate is arranged on the back of the base plate; the cooling liquid flow channel is formed in the aluminum plate; a jujube-pit-shaped structure is arranged in the cooling liquid flow channel. The copper-aluminum compound water-cooling plate has the characteristics of high welding performance of copper and high heat conductivity and machinability of aluminum, and is compact in structure and light in weight; the flow channel layout manner adopts an arrangement manner of combination of parallel connection and serial connection of the jujube-pit-shaped structure; the disturbance effect of the cooling liquid is greatly improved; the heat exchange area is increased while the pressure loss is also reduced; through the flow channel structure, the heat dissipation efficiency of a water-cooling plate applied to a power module of a high-power converter can be greatly improved; meanwhile, the flow channel structure is low in flow resistance and high in reliability; the requirement on heat dissipation of high-power modules can be met.
Description
Technical field
The present invention relates to technical field of heat dissipation.
Background technology
Develop toward miniaturization, lightweight direction with electronic equipment and electronic devices and components, the performance requirement of components and parts and work(
Rate density requirements improve further, and due to the coupled thermomechanics characteristic of device itself, its loss is consequently increased.There are some researches show,
In the most common failure of electronic equipment, lead to up to 50% the 60% of equipment cisco unity malfunction because electronic equipment temperature is too high,
Temperature rise therefore in electronic equipment must strictly control, and to guarantee that heater element is normal, reliably to run, and uses good dissipating
Thermal element is electronics cooled plate is the only way which must be passed solving the above problems to the radiating of these high power devices.
At present, heat sink arrangement main flow locomotive being carried out heat extraction to converter module mainly has water-cooled and air-cooled two kinds of sides
Formula, the air-cooled cooling requirements being generally unsuitable for high power density module.And in water-cooling pattern coolant convection transfer rate
Height, the exchange capability of heat of water-filled radiator is strong, and the little, compact in design that takes up room, the high power device such as IGBT in converter module
Cooling typically select the high water cooling method of radiating efficiency.Because of the good weldability of aluminium, heat conductivity and processing performance, mesh
The front IGBT cooled plate commonly used both at home and abroad is all to adopt aluminum structure, and the mode that IGBT module is threaded connection, in module table
Face and cooled plate contact surface apply one layer of heat-conducting silicone grease and are fixed, and the heat of components and parts passes through cooled plate internal cooling liquid band
Walk, to reach the effect of radiating.Traditional aluminum cooled plate, needs directly to apply heat-conducting silicone grease between module and cold drawing, then leads to
Cross bolt secured fit, so on the one hand can increase the thermal contact resistance between cooled plate and module, be unfavorable for that heat dissipates；Another
When heat-conducting silicone grease dries up as changed not in time, module temperature can rise rapidly aspect, increased maintenance cost and the later stage uses
Risk.
In prior art, the Chinese utility model of Application No. 201620020908.3 discloses a kind of water-cooling plate,
Including lower house and be arranged on upper shell in lower casing body, described upper shell is tightly connected with described lower house, described upper casing
The Copper-Aluminum compound substrate that body is formed in one, described lower house head and the tail two ends offer water inlet and outlet, described upper shell
Bottom is provided with some thermal columns, and the uniform row of some described thermal columns is located at upper shell bottom and be located within lower house the
In one die cavity, it is provided with arc shape inside described lower house raised.The Chinese utility model of Application No. 201520138853.1 is public
Open a kind of cooled plate, including substrate, cover plate, cover plate is connected to the back side of substrate, and substrate back is provided with cooling liquid flowing channel, cold
What but liquor stream road included being sequentially connected enters salty platform, intermediate flow channel and goes out salty platform；Intermediate flow channel is using in parallel plus series system
Connect.Intermediate flow channel includes several flow units, after the parallel connection of several flow units its two ends connect respectively into salty platform and
Go out salty platform；Each flow unit all includes three shallow heavy platforms, connects with the 3rd shallow heavy platform after the shallow heavy platform parallel connection of wherein two.
Above prior art it is difficult to meet the radiating requirements of high power module, and with by radiating element to be fixedly connected mode single.
Content of the invention
The problem to be solved in the present invention is, for the deficiency of existing aluminum cooled plate, provides a kind of Copper-Aluminum compound cooled plate
And its processing method, water-cooling method, it has the high-termal conductivity of the good welds performance of copper and aluminum and machinability
Feature, can meet the radiating requirements of high power module, have very high heat transfer efficiency and radiating effect.
The technical scheme is that：A kind of Copper-Aluminum compound cooled plate, including substrate and the cover plate being connected to substrate back,
Be provided with cooling liquid flowing channel on described substrate, described substrate adopt copper-aluminum composite board structure, substrate include copper coin and with copper coin pressure
The aluminium sheet being combined, substrate front side is the copper coin for installing module device, and substrate back is aluminium sheet, and cooling liquid flowing channel is arranged
In aluminium sheet part；It is provided with Fructus Jujubae nutty structure inside described cooling liquid flowing channel：Cooling liquid flowing channel inner surface setting has some Semen Jujubae shapes
Projection, Semen Jujubae shape projection is arranged in the cooling liquid flowing channel of substrate back by the way of distribution side by side plus series arrangement combine
Interior.
Described cooling liquid flowing channel is water channel.
Described substrate back is provided with positioning boss, and cover plate is provided with the groove matching with positioning boss, and groove is fastened on
On positioning boss.
Described substrate back periphery is additionally provided with slot cover, described substrate and cover plate be using male-female engagement method positioning welding and
The integral structure that agitating friction welding is formed.
Described Copper-Aluminum compound cooled plate also includes the joint water nozzle being fixed on substrate, and cooling liquid flowing channel two ends are respectively connected with
Joint water nozzle.
Described joint water nozzle is fixed on two corners on the copper face left side.
A kind of water-cooling method, copper coin and aluminium sheet is pressed together and is fabricated to Copper-Aluminum compound cooled plate, and its copper face is straight
Connecing and be welded as a whole with module device, thus reducing thermal contact resistance, improving system reliability；In aluminum face, cooling liquid flowing channel is set,
Fructus Jujubae nutty structure is set in cooling liquid flowing channel：Cooling liquid flowing channel inner surface setting some Semen Jujubae shape projection, Semen Jujubae shape projection is adopted
Arranged with the mode that distribution side by side plus series arrangement combine, stream is increased by setting Fructus Jujubae nutty structure in cooling liquid flowing channel
Body disturbance, reduction flow resistance, thus improve radiating efficiency.
Water-cooling is carried out using above-mentioned Copper-Aluminum compound cooled plate；By carrying out concave-convex design in aluminum face and being rubbed using stirring
Wipe the mode of welding procedure, reduce leakage hidden trouble risk, and solve the technique that cannot be carried out between copper-copper or copper-aluminum welding
Difficult point.
The processing method of above-mentioned Copper-Aluminum compound cooled plate, comprises the steps：
Step one：Make substrate：
A, get out copper coin and aluminium sheet, copper coin and aluminium sheet pressing are formed blank substrate；
B, make joint water nozzle, joint water nozzle is fixed on by way of agitating friction welds blank substrate copper face；
C, blank substrate aluminum face is processed, first processes cooling liquid flowing channel, then processing generates Semen Jujubae in cooling liquid flowing channel
Shape structure, the arrangement of Semen Jujubae shape projection is by the way of distribution side by side plus series arrangement combine；In the processing of blank substrate back
Go out positioning boss and slot cover, so that cooling liquid flowing channel is connected with joint water nozzle, the making of completing substrate；
Step 2：Make cover plate：Get out cover plate raw material, make cover plate, process on the cover board and the convex on substrate
The groove that platform matches, makes slot cover cooperation, the groove on cover plate and the substrate positioning boss on cover plate appearance profile and substrate
Cooperation positioning；
Step 3：Cover plate and substrate are passed through groove and positioning boss positioning assembles, will be covered using stirring friction-welding technique
Plate and substrate weld together, and form Copper-Aluminum compound cooled plate；
Step 4：Polish is carried out to Copper-Aluminum compound water-cooled plate surface, completes the processing and fabricating of Copper-Aluminum compound cooled plate.
The present invention has the good welds performance of copper and the high-termal conductivity of aluminum and machinability feature, compact conformation, quality
Gently, the radiating requirements of high power module can be met, there is very high heat transfer efficiency and radiating effect, reduce maintenance cost and after
Phase application risk.Runner layout type adopts the Fructus Jujubae nutty structure arrangement mode adding tandem compound in parallel, considerably increases cooling
The disturbance effect of liquid, simultaneously because of the distinctive streamlined structure of Semen Jujubae shape projection, also can reduce pressure while increasing heat exchange area
Damage, this kind of flow passage structure can increase substantially the radiating efficiency of high-power converter power model cooled plate, and flow resistance is low,
Good reliability.Cover plate is connected to the back side of substrate by way of agitating friction welds, and so can avoid large-area welding
Leak risk, reduces the welding procedure difficulty that copper is welded with aluminum agitating friction with the welding of copper agitating friction or copper again.With me
State IGBT industry lightweight（This is also a bright spot and the advantage of product of the present invention, and product thickness of the present invention is thin and light, area
Little, can heat radiation power big）, the trend of integrated development, whole product layout is compact, meets light-weighted of integration module from now on
Exhibition requires.The application of Copper-Aluminum compound cooled plate of the present invention will be more and more extensive.
Brief description
Fig. 1 is the main structure diagram of the Copper-Aluminum compound cooled plate in the present invention；
Fig. 2 is the left view structural representation of the Copper-Aluminum compound cooled plate in the present invention；
Fig. 3 is the overlooking the structure diagram of the Copper-Aluminum compound cooled plate in the present invention；
Fig. 4 is the backsight structural representation of the substrate in the present invention；
Fig. 5 is the cross section structure diagram of the line A-A along along Fig. 4；
Fig. 6 is the cross section structure diagram of the line B-B along along Fig. 4；
Fig. 7 is the main structure diagram of the cover plate in the present invention；
Fig. 8 is the cross section structure diagram of the line C-C along along Fig. 7；
In figure：1st, substrate, 2, cover plate, 3, joint water nozzle；
11st, copper coin, 12, aluminium sheet, 121, water channel, 122, Fructus Jujubae nutty structure, 123, positioning boss, 124, slot cover；
21st, groove.
Specific embodiment
With specific embodiment, the present invention is further elaborated below in conjunction with the accompanying drawings, to be more clearly understood this
Plant new construction feature and the method for operation of Copper-Aluminum compound cooled plate.Refer to Fig. 1 to Fig. 8, the Copper-Aluminum compound water-cooled of the present embodiment
Plate, including substrate 1, cover plate 2 and joint water nozzle 3.Substrate adopts copper-aluminum composite board structure, and substrate 1 includes copper coin 11 and and copper coin
It is closely pressed together on aluminium sheet 12 together, substrate front side is steel structure, for installing module device, substrate back is constructed of aluminium, aluminum
Structure division arranges cooling liquid flowing channel, and cooling liquid flowing channel is the water channel that inside is provided with Fructus Jujubae nutty structure., cooling liquid flowing channel and joint
Water nozzle is connected.Aluminium sheet 12 is provided with water channel 121, Fructus Jujubae nutty structure 122, positioning boss 123, slot cover 124；Set on cover plate 2
Fluted 21.Positioning boss 123 is matched with groove 21 and is correspondingly arranged, and cover plate is fastened on substrate, and the groove 21 of cover plate is buckled
Together on the positioning boss 123 of substrate, thus realizing the fixation of substrate 1 and cover plate 2.
Water-cooling method using above-mentioned Copper-Aluminum compound cooled plate can radiate to high power module, by by copper coin
Press together with aluminium sheet and be fabricated to Copper-Aluminum compound cooled plate, its copper face can be directly welded as a whole with IGBT, thus reducing
Thermal contact resistance, improves system reliability；Cooling liquid flowing channel is set in aluminum face, Fructus Jujubae nutty structure is set in cooling liquid flowing channel：Cold
But liquor stream road inner surface setting some Semen Jujubae shape projection, Semen Jujubae shape projection is by the way of distribution side by side plus series arrangement combine
Arrangement, being increased flow disturbance, being reduced flow resistance, thus improving radiating by setting Fructus Jujubae nutty structure in cooling liquid flowing channel
Efficiency.By way of agitating friction welding, cover plate is welded with substrate（Joint water nozzle and substrate are also adopted by agitating friction weldering
Connect mode）, reduce leakage hidden trouble risk.
First, when designing the substrate 1 of Copper-Aluminum compound cooled plate, by joint water nozzle 3 by way of agitating friction welds
It is fixed on two corner positions on the copper face left side, so that joint water nozzle is connected with water channel and its sealing is good, more multiple to copper aluminum
The aluminum face of plywood is processed, and processes some generally uniform densely covered streamlined Semen Jujubae shapes in cooling liquid flowing channel inner surface and dashes forward
Rise, generate the structures such as Fructus Jujubae nutty structure 122, positioning boss 123, the distance keeping between adjacent Semen Jujubae shape projection and Semen Jujubae shape are dashed forward
Direction risen etc. determines according to actual needs, the orientation of single Semen Jujubae shape projection（I.e. two tips of Semen Jujubae shape projection connect
The rectilinear direction becoming）Can keep consistent with water (flow) direction, make multiple arrangements also dependent on being actually needed.Secondly, Fructus Jujubae nutty structure
In the arrangement of Semen Jujubae shape projection using distribution side by side plus by the way of series arrangement combines, while increasing flow disturbance, reduce
The flow resistance of water-filled radiator, improves radiating efficiency.Again, cover plate appearance profile and the slot cover on substrate coordinate,
Groove is matched according to jog with substrate positioning boss and carries out assembling positioning, and substrate and cover plate adopt agitating friction to weld work
Skill carries out being welded to connect integrated structure.Finally, Copper-Aluminum compound water-cooled plate surface is carried out with polish, the copper face part of substrate
Can with IGBT module integrally welded structure.
The processing method of above-mentioned Copper-Aluminum compound cooled plate, specifically includes following steps：
Step one：Get out material requested, instrument, equipment and parts, and start from substrate：
A, the suitable copper coin of selection and aluminium sheet, its shape is processed into the shape needed for substrate, and copper coin and aluminium sheet are passed through compacting
Equipment pressing forms blank substrate；
B, make joint water nozzle, joint water nozzle is fixed on by way of agitating friction welds blank substrate copper face with
Two adjacent corner；
C, the shape of pre-designed cooling liquid flowing channel, positioning boss and slot cover and cooling liquid flowing channel, positioning boss and lid
Position on substrate back aluminium sheet for the board slot；Blank substrate aluminum face is processed, first processes cooling liquid flowing channel, then in cooling
In liquor stream road, processing generates Fructus Jujubae nutty structure, and the arrangement of Semen Jujubae shape projection adds, using distribution side by side, the side that series arrangement combines
Formula；Process positioning boss and slot cover in blank substrate back, so that cooling liquid flowing channel is connected with joint water nozzle, completing substrate
Making；
Step 2：Make cover plate：Get out cover plate raw material, make cover plate, process on the cover board and the convex on substrate
The groove that platform matches, makes slot cover cooperation, the groove on cover plate and the substrate positioning boss on cover plate appearance profile and substrate
Cooperation positioning；
Step 3：Cover plate and substrate are passed through groove and positioning boss positioning assembles, will be covered using stirring friction-welding technique
Plate and substrate weld together, and form Copper-Aluminum compound cooled plate；
Step 4：Polish is carried out to Copper-Aluminum compound water-cooled plate surface；
Step 5：Carry out test and other rounding-off works, complete the processing and fabricating of Copper-Aluminum compound cooled plate.
Generally radiator is full aluminum or full copper, and full aluminium radiator effect is not so good as full copper radiator, full copper radiating
Though the radiating effect of device is good, cost is higher than full Aluminium Radiator, and not as Aluminium Radiator economy, and copper radiator is true
Empty soldering or stirring friction-welding technique are difficult to realize, so the cooled plate being used for IGBT cooling on the market seldom has fine copper to tie
Structure, is almost aluminum material.But junction is typically fine copper structure below IGBT module, universal fine aluminium cooled plate with
Heat-conducting silicone grease need to be applied during IGBT laminating and add screw threads for fastening.The present invention provide Copper-Aluminum compound cooled plate, its copper face can directly and
IGBT is welded as a whole, thus effectively reducing thermal contact resistance, improves system reliability.Carry out concave-convex design using above-mentioned in aluminum face
And the mode of stirring friction-welding technique, on the one hand solve the critical technological point of agitating friction welding between copper-copper or copper-aluminum；
On the other hand reduce leakage hidden trouble risk.The good heat conductivity of copper coin, ductility can be taken into account simultaneously and can solve the problem that IGBT
The integrally welded problem of module, also has the characteristics that aluminium sheet light weight, good processing and welding usability simultaneously（This
It is also a light-weighted bright spot）.
In the design process of cooled plate, its inner flow passage（I.e. cooling liquid flowing channel）The design of radiating fin is impact radiating
The key factor of effect, existing fin structure has the structures such as straight channel type, wing pillar and microchannel.But existing cooled plate stream
There are the following problems for road and fin machining：1st, straight channel type structure, is direct Milling Process in runner, when module power density very
When big, in order to improve fin efficiency, need to increase fin number minimizing fin clearance, but the actual CNC of too small fin clearance
Processing is difficult to, and efficiency is very low；Although the 2, wing pole structure avoids to flow uneven shortcoming in straight channel type structure, by force
Change heat exchange, but to compare the former much bigger for its flow resistance；3rd, the radiating fin MCA of molding, Neng Gouzeng are utilized
The disturbance performance of high current body, also increases the local detachment loss in flow process and whirlpool loss simultaneously.Enhanced heat exchange and stream
The optimization design of this contradictory relation of dynamic resistance feedwater cold heat sink brings a lot of difficulties.And it is subject to molding fin machining technique
Limit, the thickness of fin is difficult to increase and spacing is difficult to reduce, this is all unfavorable for improving cooled plate heat exchange efficiency.
By contrast, the present invention adopts Copper-Aluminum compound panel material to replace traditional aluminum material, carries out the design of cooled plate
And processing, copper-aluminum composite board, as a kind of new composite, is widely used in the fields such as electronics, electrical equipment, automobile, the energy.
Runner layout type of the present invention adopts the Fructus Jujubae nutty structure arrangement mode adding tandem compound in parallel, considerably increases disturbing of coolant
Dynamic effect, simultaneously because of the distinctive streamlined structure of Semen Jujubae shape projection, also can reduce crushing, this kind while increasing heat exchange area
Flow passage structure can increase substantially the radiating efficiency of high-power converter power model cooled plate, and flow resistance is low, reliability
Good.Cover plate is connected to the back side of substrate by way of agitating friction welds, and so can avoid the leak wind of large-area welding
Danger, reduces the welding procedure difficulty that copper is welded with aluminum agitating friction with the welding of copper agitating friction or copper again.The present invention's is new
Copper-Aluminum compound cooled plate structure, its maximum feature is fundamentally to solve the fastening problems of cooled plate and IGBT module, simultaneously
Take full advantage of the thermal conductive resin of copper and the welding processing performance of aluminum again.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., be all contained within protection scope of the present invention.
Claims (9)
1. a kind of Copper-Aluminum compound cooled plate, including substrate and the cover plate being connected to substrate back, described substrate is provided with cooling
Liquor stream road, is characterized in that, described substrate adopts copper-aluminum composite board structure, and substrate includes copper coin and the aluminum pressing together with copper coin
Plate, substrate front side is the copper coin for installing module device, and substrate back is aluminium sheet, and cooling liquid flowing channel is arranged on aluminium sheet part；
It is provided with Fructus Jujubae nutty structure inside described cooling liquid flowing channel：Cooling liquid flowing channel inner surface setting has some Semen Jujubae shape projections, Semen Jujubae shape
Projection is in the cooling liquid flowing channel being arranged in substrate back by the way of distribution side by side plus series arrangement combine.
2. Copper-Aluminum compound cooled plate according to claim 1, is characterized in that, described cooling liquid flowing channel is water channel.
3. Copper-Aluminum compound cooled plate according to claim 1, is characterized in that, described substrate back is provided with positioning boss, lid
Plate is provided with the groove matching with positioning boss, and groove is fastened on positioning boss.
4. Copper-Aluminum compound cooled plate according to claim 3, is characterized in that, described substrate back periphery is additionally provided with cover plate
Groove, described substrate and cover plate are the integral structure being formed using male-female engagement method positioning welding and agitating friction welding.
5. Copper-Aluminum compound cooled plate according to claim 1, is characterized in that, described Copper-Aluminum compound cooled plate also includes fixing
Joint water nozzle on substrate, cooling liquid flowing channel two ends are respectively connected with joint water nozzle.
6. Copper-Aluminum compound cooled plate according to claim 5, is characterized in that, described joint water nozzle is fixed on the copper face left side
Two corners.
7. a kind of water-cooling method, is characterized in that, copper coin and aluminium sheet is pressed together and is fabricated to Copper-Aluminum compound cooled plate, its
Copper face is directly welded as a whole with module device, thus reducing thermal contact resistance, improves system reliability；In aluminum face, coolant is set
Runner, arranges Fructus Jujubae nutty structure in cooling liquid flowing channel：Cooling liquid flowing channel inner surface setting some Semen Jujubae shape projection, Semen Jujubae shape is dashed forward
Rise and arrange by the way of distribution side by side plus series arrangement combine, increased by setting Fructus Jujubae nutty structure in cooling liquid flowing channel
Plus flow disturbance, reduction flow resistance, thus improving radiating efficiency.
8. water-cooling method according to claim 7, is characterized in that, using the Copper-Aluminum compound water described in claim 1
Cold drawing carries out water-cooling；By way of carrying out concave-convex design and adopt stirring friction-welding technique in aluminum face, reduce leak
Hidden danger risk.
9. a kind of processing method of the Copper-Aluminum compound cooled plate described in claim 1, is characterized in that, comprise the steps：
Step one：Make substrate：
A, get out copper coin and aluminium sheet, copper coin and aluminium sheet pressing are formed blank substrate；
B, make joint water nozzle, joint water nozzle is fixed on by way of agitating friction welds blank substrate copper face；
C, blank substrate aluminum face is processed, first processes cooling liquid flowing channel, then processing generates Semen Jujubae in cooling liquid flowing channel
Shape structure, the arrangement of Semen Jujubae shape projection is by the way of distribution side by side plus series arrangement combine；In the processing of blank substrate back
Go out positioning boss and slot cover, so that cooling liquid flowing channel is connected with joint water nozzle, the making of completing substrate；
Step 2：Make cover plate：Get out cover plate raw material, make cover plate, process on the cover board and the convex on substrate
The groove that platform matches, makes slot cover cooperation, the groove on cover plate and the substrate positioning boss on cover plate appearance profile and substrate
Cooperation positioning；
Step 3：Cover plate and substrate are passed through groove and positioning boss positioning assembles, will be covered using stirring friction-welding technique
Plate and substrate weld together, and form Copper-Aluminum compound cooled plate；
Step 4：Polish is carried out to Copper-Aluminum compound water-cooled plate surface, completes the processing and fabricating of Copper-Aluminum compound cooled plate.
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| CN201611109321.0A CN106455456B (en) | 2016-12-06 | 2016-12-06 | Copper-aluminum composite water cooling plate, processing and manufacturing method thereof and water cooling method |
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| CN201611109321.0A CN106455456B (en) | 2016-12-06 | 2016-12-06 | Copper-aluminum composite water cooling plate, processing and manufacturing method thereof and water cooling method |
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| CN109341372A (en) * | 2018-09-21 | 2019-02-15 | 贵州永红换热冷却技术有限公司 | A kind of frame-type cold plate and its processing method |
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| CN110690184A (en) * | 2019-09-12 | 2020-01-14 | 无锡江南计算技术研究所 | Double-sided enhanced heat exchange cold plate with multi-mass composite three-dimensional flow channel |
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| CN112930091A (en) * | 2021-02-09 | 2021-06-08 | 联想(北京)有限公司 | Heat radiation structure and electronic equipment |
| CN113644037A (en) * | 2020-05-11 | 2021-11-12 | 北京金风科创风电设备有限公司 | Heat dissipation element and electric power device module |
| CN113904527A (en) * | 2021-09-15 | 2022-01-07 | 江苏德耐美克电气有限公司 | Water-cooled high-voltage shore power supply power unit and assembling and cooling method thereof |
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| WO2020019183A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市大疆创新科技有限公司 | Heat dissipation structure for controller, and controller |
| CN110720140A (en) * | 2018-07-25 | 2020-01-21 | 深圳市大疆创新科技有限公司 | Controller heat radiation structure and controller |
| CN109341372A (en) * | 2018-09-21 | 2019-02-15 | 贵州永红换热冷却技术有限公司 | A kind of frame-type cold plate and its processing method |
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| CN112846443A (en) * | 2021-01-14 | 2021-05-28 | 南阳理工学院 | Welding device and method for liquid cooling plate of micro-channel |
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| CN112930091B (en) * | 2021-02-09 | 2022-05-31 | 联想(北京)有限公司 | Heat radiation structure and electronic equipment |
| CN113904527A (en) * | 2021-09-15 | 2022-01-07 | 江苏德耐美克电气有限公司 | Water-cooled high-voltage shore power supply power unit and assembling and cooling method thereof |
| CN113904527B (en) * | 2021-09-15 | 2024-01-09 | 江苏德耐美克电气有限公司 | Water-cooled high-voltage shore power supply power unit and assembling and cooling method thereof |
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Address after: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Applicant after: Zhuzhou Zhongche AVC Cooling Technology Co. Ltd. Address before: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Applicant before: Zhuzhou CSR Qihong Heat Dissipation Technology Co., Ltd. |
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