CN206250182U - A kind of Copper-Aluminum compound cooled plate and cooled plate substrate - Google Patents
A kind of Copper-Aluminum compound cooled plate and cooled plate substrate Download PDFInfo
- Publication number
- CN206250182U CN206250182U CN201621327704.0U CN201621327704U CN206250182U CN 206250182 U CN206250182 U CN 206250182U CN 201621327704 U CN201621327704 U CN 201621327704U CN 206250182 U CN206250182 U CN 206250182U
- Authority
- CN
- China
- Prior art keywords
- substrate
- copper
- cooled plate
- cooling liquid
- liquid flowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of Copper-Aluminum compound cooled plate and cooled plate substrate, Copper-Aluminum compound cooled plate includes substrate and cover plate, cooling liquid flowing channel is provided with substrate, substrate includes copper coin and the aluminium sheet pressed together with copper coin, substrate front side is the copper coin for installing module device, substrate back is aluminium sheet, and cooling liquid flowing channel is arranged on aluminium sheet part.Jujube nutty structure is provided with inside cooling liquid flowing channel.Jujube nutty structure is provided with inside the cooling liquid flowing channel of cooled plate substrate back.Copper-Aluminum compound cooled plate has the good welds performance of copper and the high-termal conductivity of aluminium and machinability feature, compact conformation, light weight, runner layout type uses jujube nutty structure, considerably increases the disturbance effect of coolant, and crushing can be also reduced while heat exchange area is increased, this kind of flow passage structure can increase substantially the radiating efficiency of high-power converter power model cooled plate, and flow resistance is low, good reliability can meet the radiating requirements of high power module.
Description
Technical field
The utility model is related to technical field of heat dissipation.
Background technology
As electronic equipment and electronic component develop toward miniaturization, lightweight direction, the performance requirement and work(of component
Rate density requirements are further improved, and due to device coupled thermomechanics characteristic in itself, its loss is consequently increased.There are some researches show,
In the most common failure of electronic equipment, up to 50%-the 60% of equipment cisco unity malfunction is caused because electronic equipment temperature is too high,
Therefore the temperature rise in electronic equipment must be controlled strictly, to ensure that heater element is normal, reliably run, and use good dissipating
Thermal element is that electronics cooled plate is the only way which must be passed for solving the above problems to the radiating of these high power devices.
At present, carrying out the heat sink arrangement of heat extraction on main flow locomotive to converter module mainly has water-cooled and air-cooled two kinds of sides
Formula, the air-cooled cooling requirements for being generally unsuitable for high power density module.And in water-cooling pattern coolant convection transfer rate
Height, the exchange capability of heat of water-filled radiator by force, and occupies little space, compact in design, the high power device such as IGBT in converter module
The general water cooling method high from radiating efficiency of cooling.Because of the good weldability of aluminium, thermal conductivity and processing performance, mesh
Preceding IGBT cooled plates conventional both at home and abroad are all to use aluminum structure, the mode that IGBT module is connected through a screw thread, in module table
Face applies one layer of heat-conducting silicone grease and is fixed with cooled plate contact surface, and the heat of component passes through cooled plate internal cooling liquid band
Walk, to reach the effect of radiating.Traditional aluminum cooled plate between module and cold drawing, it is necessary to directly apply heat-conducting silicone grease, then lead to
Bolt secured fit is crossed, on the one hand can so increase the thermal contact resistance between cooled plate and module, be unfavorable for that heat dissipates；It is another
When heat-conducting silicone grease is dry as changed not in time, module temperature can rise rapidly aspect, increased maintenance cost and the later stage uses
Risk.
In the prior art, the Chinese utility model of Application No. 201620020908.3 discloses a kind of water-cooling plate,
Including lower house and the upper shell being arranged in lower house, the upper shell is tightly connected with the lower house, the upper casing
The Copper-Aluminum compound substrate that body is formed in one, the lower house head and the tail two ends offer water inlet and delivery port, the upper shell
Bottom is provided with some thermal columns, some thermal columns uniformly row be located at upper shell bottom and be located in inside lower house the
In one die cavity, arc shape is provided with inside the lower house raised.The Chinese utility model of Application No. 201520138853.1 is public
A kind of cooled plate, including substrate, cover plate are opened, cover plate is connected to the back side of substrate, and substrate back is provided with cooling liquid flowing channel, cold
But liquid runner includes that what is be sequentially connected enters salty platform, intermediate flow channel and go out salty platform；Intermediate flow channel is using in parallel plus series system
Connection.Intermediate flow channel includes several flow units, after the parallel connection of several flow units its two ends connect respectively into salty platform and
Go out salty platform；Each flow unit includes three shallow heavy platforms, is connected with the 3rd shallow heavy platform after the shallow heavy platform parallel connection of wherein two.
Above prior art, it is difficult to meet the radiating requirements of high power module, and with by radiating element to be fixedly connected mode single.
Utility model content
Problem to be solved in the utility model is, for the deficiency of existing aluminum cooled plate, there is provided a kind of Copper-Aluminum compound water
Cold drawing and cooled plate substrate, increase flow disturbance, reduce flow resistance by setting jujube nutty structure in cooling liquid flowing channel,
So as to improve radiating efficiency；Copper-Aluminum compound cooled plate has the good welds performance of copper and the high-termal conductivity of aluminium and machinability special
Point, can meet the radiating requirements of high power module, with heat transfer efficiency and radiating effect very high.
The technical solution of the utility model is：A kind of Copper-Aluminum compound cooled plate, including substrate and it is connected to substrate back
Cover plate, is provided with cooling liquid flowing channel on the substrate, the substrate uses copper-aluminum composite board structure, and substrate includes copper coin and and copper
The aluminium sheet that plate is pressed together, substrate front side is the copper coin for installing module device, and substrate back is aluminium sheet, cooling liquid flowing channel
It is arranged on aluminium sheet part.
Jujube nutty structure is provided with inside the cooling liquid flowing channel：Cooling liquid flowing channel inner surface setting has some jujube core shapes to dash forward
Rise, jujube core shape projection is arranged in the cooling liquid flowing channel of substrate back by the way of distribution plus series arrangement side by side are combined.
The cooling liquid flowing channel is water channel.
The substrate back is provided with positioning boss, and cover plate is provided with the groove being engaged with positioning boss, and groove is fastened on
On positioning boss.
The substrate back periphery is additionally provided with slot cover, the substrate and cover plate be using male-female engagement method positioning welding and
Agitating friction welds the integral structure to be formed.
The Copper-Aluminum compound cooled plate also includes the joint water nozzle being fixed on substrate, and cooling liquid flowing channel two ends are respectively connected with
Joint water nozzle.
The joint water nozzle is fixed on two corners on the copper face left side.
A kind of cooled plate substrate, is provided with cooling liquid flowing channel on the substrate, jujube core is provided with inside the cooling liquid flowing channel
Shape structure：Cooling liquid flowing channel inner surface setting has some jujube core shape projections, and jujube core shape projection is using distribution plus series arrangement side by side
The mode being combined is arranged in the cooling liquid flowing channel of substrate back.
The cooled plate substrate also includes the joint water nozzle being fixed on substrate, and cooling liquid flowing channel two ends are respectively connected with joint
Water nozzle, cooling liquid flowing channel is connected with joint water nozzle.
A kind of water-cooling method, copper coin and aluminium sheet is pressed together and is fabricated to Copper-Aluminum compound cooled plate, and its copper face is straight
Connect and be welded as a whole with module device, so as to reduce thermal contact resistance, improve system reliability；In aluminium face, cooling liquid flowing channel is set,
Jujube nutty structure is set in cooling liquid flowing channel：The some jujube core shape projections of cooling liquid flowing channel inner surface setting, jujube core shape projection is adopted
Arranged with the mode that distribution plus series arrangement are combined side by side, stream is increased by setting jujube nutty structure in cooling liquid flowing channel
Body disturbance, reduction flow resistance, so as to improve radiating efficiency.
Water-cooling is carried out using above-mentioned Copper-Aluminum compound cooled plate；Concave-convex design and agitating friction weldering are carried out by aluminium face
The mode of technique is connect, leakage hidden trouble risk is reduced, and solve the critical technological point that cannot be welded between copper-copper or copper-aluminium.
The processing method of above-mentioned Copper-Aluminum compound cooled plate, comprises the following steps：
Step one：Make substrate：
A, copper coin and aluminium sheet are got out, copper coin and aluminium sheet are pressed to form blank substrate；
B, joint water nozzle is made, joint water nozzle is fixed on blank substrate copper face by way of agitating friction is welded；
C, blank substrate aluminium face is processed, first processes cooling liquid flowing channel, then generation is processed in cooling liquid flowing channel
Jujube nutty structure, the arrangement of jujube core shape projection is by the way of distribution plus series arrangement are combined side by side；In blank substrate back
Positioning boss and slot cover are processed, cooling liquid flowing channel is connected with joint water nozzle, the making of completing substrate；
Step 2：Make cover plate：Cover plate raw material are got out, cover plate is made, processed on the cover board and determining on substrate
The groove that position boss is engaged, makes cover plate appearance profile coordinate with the slot cover on substrate, and the groove on cover plate is positioned with substrate
Boss coordinates positioning；
Step 3：Cover plate and substrate are welded together using stirring friction-welding technique, forms Copper-Aluminum compound cooled plate；
Step 4：Copper-Aluminum compound water-cooled plate surface is finished, the processing and fabricating of Copper-Aluminum compound cooled plate is completed.
Copper-Aluminum compound cooled plate has the good welds performance of copper and the high-termal conductivity of aluminium and machinability feature, and structure is tight
Gather, light weight can meet the radiating requirements of high power module, with heat transfer efficiency and radiating effect very high, reduce maintenance
Cost and later stage application risk.Cooled plate substrate（Including Copper-Aluminum compound cooled plate substrate）On runner layout type use jujube core
The parallel connection of shape structure plus the arrangement mode of tandem compound, considerably increase the disturbance effect of coolant, while because jujube core shape projection is special
Some streamlined structures, crushing can be also reduced while heat exchange area is increased, and this kind of flow passage structure can be increased substantially greatly
The radiating efficiency of power converter power model cooled plate, and flow resistance is low, good reliability.Cover plate is welded by agitating friction
Mode is connected to the back side of substrate, can so avoid the leak risk of large-area welding, and copper and copper agitating friction are reduced again
The welding procedure difficulty that welding or copper are welded with aluminium agitating friction.With China IGBT industry lightweights（This is also that copper aluminium is answered
One bright spot and advantage of Heshui cold drawing product, this Copper-Aluminum compound cooled plate product thickness are thin and light, and area is small, can heat radiation power
Greatly）, integrated development trend, whole product layout is compact, meets the light-weighted demand for development of integration module from now on.This copper aluminium
The application of compound cooled plate will be more and more extensive.
Brief description of the drawings
Fig. 1 is the main structure diagram of the utility model Copper-Aluminum compound cooled plate；
Fig. 2 is the left view structural representation of the utility model Copper-Aluminum compound cooled plate；
Fig. 3 is the overlooking the structure diagram of the utility model Copper-Aluminum compound cooled plate；
Fig. 4 is the backsight structural representation of the substrate in the utility model；
Fig. 5 is the cross section structure diagram of the line A-A along Fig. 4；
Fig. 6 is the cross section structure diagram of the line B-B along Fig. 4；
Fig. 7 is the main structure diagram of the cover plate in the utility model；
Fig. 8 is the cross section structure diagram of the line C-C along Fig. 7；
In figure：1st, substrate, 2, cover plate, 3, joint water nozzle；
11st, copper coin, 12, aluminium sheet, 121, water channel, 122, jujube nutty structure, 123, positioning boss, 124, slot cover；
21st, groove.
Specific embodiment
The utility model is further elaborated with specific embodiment below in conjunction with the accompanying drawings, with apparent geography
Solve the new construction feature and the method for operation of this Copper-Aluminum compound cooled plate.Refer to Fig. 1 to Fig. 8, the Copper-Aluminum compound of the present embodiment
Cooled plate, including substrate 1, cover plate 2 and joint water nozzle 3.Substrate use copper-aluminum composite board structure, substrate 1 include copper coin 11 and with
Copper coin is closely pressed together on aluminium sheet 12 together, and substrate front side is steel structure, and for installing module device, substrate back is aluminium knot
Structure, constructed of aluminium part sets cooling liquid flowing channel, and cooling liquid flowing channel is the internal water channel for being provided with jujube nutty structure., cooling liquid flowing channel
It is connected with joint water nozzle.Aluminium sheet 12 is provided with water channel 121, jujube nutty structure 122, positioning boss 123, slot cover 124；Cover plate
2 are provided with groove 21.Positioning boss 123 matches and is correspondingly arranged with groove 21, and cover plate is fastened on substrate, the groove of cover plate
21 are fastened on the positioning boss 123 of substrate, so as to realize the fixation of substrate 1 and cover plate 2.
High power module can be radiated using the water-cooling method of above-mentioned Copper-Aluminum compound cooled plate, by by copper coin
Pressed together with aluminium sheet and be fabricated to Copper-Aluminum compound cooled plate, its copper face directly can be welded as a whole with IGBT, so as to reduce
Thermal contact resistance, improves system reliability；Cooling liquid flowing channel is set in aluminium face, jujube nutty structure is set in cooling liquid flowing channel：It is cold
But some jujube core shape projections of liquid runner inner surface setting, jujube core shape projection is by the way of distribution plus series arrangement are combined side by side
Arrangement, increases flow disturbance, reduces flow resistance, so as to improve radiating by setting jujube nutty structure in cooling liquid flowing channel
Efficiency.Cover plate is welded with substrate by way of agitating friction welding（Joint water nozzle is also adopted by agitating friction weldering with substrate
Connect mode）, reduce leakage hidden trouble risk.
First, when the substrate 1 of Copper-Aluminum compound cooled plate is designed, by joint water nozzle 3 by way of agitating friction is welded
Two corner positions on the copper face left side are fixed on, joint water nozzle is connected with water channel and its sealing is good, then it is multiple to copper aluminium
The aluminium face of plywood is processed, and processing some generally uniform densely covered streamlined jujube core shapes in cooling liquid flowing channel inner surface dashes forward
Rise, the structure such as generation jujube nutty structure 122, positioning boss 123, the distance kept between adjacent jujube core shape projection and jujube core shape are prominent
The direction etc. risen determines according to actual needs, the orientation of single jujube core shape projection（That is two tips of jujube core shape projection connect
Into rectilinear direction）Can keep consistent with water (flow) direction, various arrangements are made also dependent on being actually needed.Secondly, jujube nutty structure
In the arrangement of jujube core shape projection using distribution side by side plus by the way of series arrangement is combined, while increasing flow disturbance, reduction
The flow resistance of water-filled radiator, improves radiating efficiency.Again, cover plate appearance profile coordinates with the slot cover on substrate,
Groove is engaged according to jog with substrate positioning boss and carries out assembling positioning, and substrate and cover plate weld work using agitating friction
Skill carries out being welded to connect integrated structure.Finally, Copper-Aluminum compound water-cooled plate surface is finished, the copper face part of substrate
Can be with the integrally welded structure of IGBT module.
The processing method of above-mentioned Copper-Aluminum compound cooled plate, specifically includes following steps：
Step one：Material requested, instrument, equipment and parts are got out, and starts from substrate：
A, the suitable copper coin of selection and aluminium sheet, the shape needed for its shape is processed into substrate, copper coin and aluminium sheet are passed through
Press device presses to form blank substrate；
B, joint water nozzle is made, it is same that by way of agitating friction is welded joint water nozzle is fixed on into blank substrate copper face
Two adjacent corners on one side；
Shape and cooling liquid flowing channel, the positioning boss of C, pre-designed cooling liquid flowing channel, positioning boss and slot cover
With position of the slot cover on substrate back aluminium sheet；Blank substrate aluminium face is processed, cooling liquid flowing channel is first processed, then
Processing generation jujube nutty structure in cooling liquid flowing channel, the arrangement of jujube core shape projection uses what distribution plus series arrangement side by side were combined
Mode；Positioning boss and slot cover are processed in blank substrate back, cooling liquid flowing channel is connected with joint water nozzle, complete base
The making of plate；
Step 2：Make cover plate：Cover plate raw material are got out, cover plate is made, processed on the cover board and determining on substrate
The groove that position boss is engaged, makes cover plate appearance profile coordinate with the slot cover on substrate, and the groove on cover plate is positioned with substrate
Boss coordinates positioning；
Step 3：Cover plate is positioned with substrate by groove and positioning boss and is assembled, using stirring friction-welding technique
Cover plate and substrate are welded together, Copper-Aluminum compound cooled plate is formed；
Step 4：Copper-Aluminum compound water-cooled plate surface is finished；
Step 5：Experiment and other rounding-off works are carried out, the processing and fabricating of Copper-Aluminum compound cooled plate is completed.
Usual radiator is full aluminum or full copper, and full aluminium radiator effect is not so good as full copper radiator, full copper radiating
Though the radiating effect of device is good, cost is higher than full Aluminium Radiator, and not as Aluminium Radiator economy, and copper radiator is true
Empty soldering or stirring friction-welding technique are difficult to realize, so being used for the few fine copper knots of cooled plate of IGBT coolings on the market
Structure, is almost aluminum material.But IGBT module lower section junction is typically fine copper structure, universal fine aluminium cooled plate with
IGBT need to apply heat-conducting silicone grease plus screw threads for fastening when fitting.The Copper-Aluminum compound cooled plate that the utility model is provided, its copper face can be direct
It is welded as a whole with IGBT, so as to effectively reduce thermal contact resistance, improves system reliability.Using above-mentioned concavo-convex setting is carried out in aluminium face
The mode of meter and stirring friction-welding technique, the technique on the one hand solving agitating friction welding between copper-copper or copper-aluminium is difficult
Point；On the other hand leakage hidden trouble risk is reduced.The good thermal conductivity of copper coin, ductility can be taken into account and be can solve the problem that simultaneously
The integrally welded problem of IGBT module, while the characteristics of also there is aluminium sheet light weight, good processing and welding usability
（This is also a light-weighted bright spot）.
In the design process of cooled plate, its inner flow passage（That is cooling liquid flowing channel）The design of radiating fin is influence radiating
The key factor of effect, existing fin structure has the structures such as straight channel type, wing pillar and microchannel.But existing cooled plate stream
There are the following problems for road and fin machining：1st, straight channel type structure, is the direct Milling Process in runner, when module power density very
When big, in order to improve fin efficiency, it is necessary to increase fin number reduction fin clearance, but the actual CNC of too small fin clearance
Processing is difficult to, and efficiency is very low；2nd, although wing pole structure avoids in straight channel type structure to flow uneven shortcoming, by force
Change heat exchange, but its flow resistance is much bigger compared to the former；3rd, using the radiating fin MCA of shaping, Neng Gouzeng
The disturbance performance of high current body, while local detachment loss and whirlpool loss in also increasing flow process.Enhanced heat exchange and stream
This contradictory relation of dynamic resistance brings many difficulties to the optimization design of water-filled radiator.And by shaping fin machining technique
Limitation, the thickness of fin is difficult to increase and spacing is difficult to reduce, and this is all unfavorable for improving cooled plate heat exchange efficiency.
By contrast, the utility model replaces traditional aluminum material using Copper-Aluminum compound plate material, carries out cooled plate
Design and processing, copper-aluminum composite board are widely used in the neck such as electronics, electrical equipment, automobile, energy as a kind of new composite
Domain.The utility model runner layout type is considerably increased cold using the parallel connection of jujube nutty structure plus the arrangement mode of tandem compound
But the disturbance effect of liquid, while because of the jujube core distinctive streamlined structure of shape projection, can also be reduced while heat exchange area is increased
Crushing, this kind of flow passage structure can increase substantially the radiating efficiency of high-power converter power model cooled plate, and flow resistance
It is low, good reliability.Cover plate is connected to the back side of substrate by way of agitating friction is welded, and can so avoid large-area welding
Leak risk, reduce again copper and copper agitating friction weld or copper and the welding of aluminium agitating friction welding procedure difficulty.This reality
With the compound cooled plate structure of new novel copper-aluminium, its maximum feature is that fundamentally to solve cooled plate tight with IGBT module
Gu problem, while taking full advantage of the thermal conductive resin of copper and the welding processing performance of aluminium again.
A kind of cooled plate substrate, the substrate back is provided with cooling liquid flowing channel, and jujube is provided with inside the cooling liquid flowing channel
Nutty structure：Cooling liquid flowing channel inner surface setting has some jujube core shape projections, and jujube core shape projection is using distribution side by side plus series connection row
The mode that cloth is combined is arranged in the cooling liquid flowing channel of substrate back.The cooled plate substrate also includes being fixed on substrate front side
On joint water nozzle, cooling liquid flowing channel two ends are respectively connected with joint water nozzle, and cooling liquid flowing channel is connected with joint water nozzle.It is above-mentioned to have
Close in the content of Copper-Aluminum compound cooled plate, in addition to Copper-Aluminum compound structure, do not collide part, may be applicable to this cooled plate base
Plate.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to, for this
For the technical staff in field, the utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. are all contained within protection domain of the present utility model.
Claims (8)
1. a kind of Copper-Aluminum compound cooled plate, including substrate and the cover plate for being connected to substrate back, are provided with cooling on the substrate
Liquid runner, it is characterized in that, the substrate uses copper-aluminum composite board structure, and substrate includes copper coin and the aluminium pressed together with copper coin
Plate, substrate front side is the copper coin for installing module device, and substrate back is aluminium sheet, and cooling liquid flowing channel is arranged on aluminium sheet part.
2. Copper-Aluminum compound cooled plate according to claim 1, it is characterized in that, jujube core shape is provided with inside the cooling liquid flowing channel
Structure：Cooling liquid flowing channel inner surface setting has some jujube core shape projections, and jujube core shape projection is using distribution plus series arrangement phase side by side
With reference to mode be arranged in the cooling liquid flowing channel of substrate back.
3. Copper-Aluminum compound cooled plate according to claim 1, it is characterized in that, the substrate back is provided with positioning boss, lid
Plate is provided with the groove being engaged with positioning boss, and groove is fastened on positioning boss.
4. Copper-Aluminum compound cooled plate according to claim 3, it is characterized in that, the substrate back periphery is additionally provided with cover plate
Groove, the substrate and cover plate are to weld the integral structure to be formed using male-female engagement method positioning welding and agitating friction.
5. Copper-Aluminum compound cooled plate according to claim 1, it is characterized in that, the Copper-Aluminum compound cooled plate also includes fixing
Joint water nozzle on substrate, cooling liquid flowing channel two ends are respectively connected with joint water nozzle.
6. Copper-Aluminum compound cooled plate according to claim 5, it is characterized in that, the joint water nozzle is fixed on the copper face left side
Two corners.
7. a kind of cooled plate substrate, cooling liquid flowing channel is provided with the substrate, it is characterized in that, set inside the cooling liquid flowing channel
There is jujube nutty structure：Cooling liquid flowing channel inner surface setting has some jujube core shape projections, and jujube core shape projection is using distribution side by side plus string
The mode that townhouse cloth is combined is arranged in the cooling liquid flowing channel of substrate back.
8. cooled plate substrate according to claim 7, it is characterized in that, also including the joint water nozzle being fixed on substrate, cooling
Liquid runner two ends are respectively connected with joint water nozzle, and cooling liquid flowing channel is connected with joint water nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621327704.0U CN206250182U (en) | 2016-12-06 | 2016-12-06 | A kind of Copper-Aluminum compound cooled plate and cooled plate substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621327704.0U CN206250182U (en) | 2016-12-06 | 2016-12-06 | A kind of Copper-Aluminum compound cooled plate and cooled plate substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250182U true CN206250182U (en) | 2017-06-13 |
Family
ID=59003565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621327704.0U Active CN206250182U (en) | 2016-12-06 | 2016-12-06 | A kind of Copper-Aluminum compound cooled plate and cooled plate substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250182U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455456A (en) * | 2016-12-06 | 2017-02-22 | 株洲南车奇宏散热技术有限公司 | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method |
| CN107464902A (en) * | 2017-07-28 | 2017-12-12 | 浙江吉利汽车研究院有限公司 | A kind of battery bag cooling structure for vehicle |
| CN108668475A (en) * | 2018-07-24 | 2018-10-16 | 苏州库宁换热系统科技有限公司 | Water-cool control box |
| CN110720140A (en) * | 2018-07-25 | 2020-01-21 | 深圳市大疆创新科技有限公司 | Controller heat radiation structure and controller |
| CN110911316A (en) * | 2019-12-04 | 2020-03-24 | 宁波江丰电子材料股份有限公司 | Composite cooling water tray and manufacturing method and application thereof |
| WO2021203787A1 (en) * | 2020-04-09 | 2021-10-14 | 浙江嘉熙科技股份有限公司 | Heat superconducting heat transfer plate and radiator |
| CN114599215A (en) * | 2022-05-10 | 2022-06-07 | 远峰科技股份有限公司 | High-efficient radiating intelligent passenger cabin district liquid cooling host computer |
-
2016
- 2016-12-06 CN CN201621327704.0U patent/CN206250182U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455456A (en) * | 2016-12-06 | 2017-02-22 | 株洲南车奇宏散热技术有限公司 | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method |
| CN107464902A (en) * | 2017-07-28 | 2017-12-12 | 浙江吉利汽车研究院有限公司 | A kind of battery bag cooling structure for vehicle |
| CN108668475A (en) * | 2018-07-24 | 2018-10-16 | 苏州库宁换热系统科技有限公司 | Water-cool control box |
| CN110720140A (en) * | 2018-07-25 | 2020-01-21 | 深圳市大疆创新科技有限公司 | Controller heat radiation structure and controller |
| WO2020019183A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市大疆创新科技有限公司 | Heat dissipation structure for controller, and controller |
| CN110911316A (en) * | 2019-12-04 | 2020-03-24 | 宁波江丰电子材料股份有限公司 | Composite cooling water tray and manufacturing method and application thereof |
| WO2021203787A1 (en) * | 2020-04-09 | 2021-10-14 | 浙江嘉熙科技股份有限公司 | Heat superconducting heat transfer plate and radiator |
| CN114599215A (en) * | 2022-05-10 | 2022-06-07 | 远峰科技股份有限公司 | High-efficient radiating intelligent passenger cabin district liquid cooling host computer |
| CN114599215B (en) * | 2022-05-10 | 2022-08-23 | 远峰科技股份有限公司 | High-efficient radiating intelligent passenger cabin district liquid cooling host computer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206250182U (en) | A kind of Copper-Aluminum compound cooled plate and cooled plate substrate | |
| CN106455456A (en) | Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method | |
| CN201273941Y (en) | T/R component with cooling slot | |
| CN204392764U (en) | A kind of cooled plate | |
| CN108448205A (en) | A kind of battery modules radiator | |
| CN106486433B (en) | IGBT radiator | |
| CN208028054U (en) | cooling component | |
| CN208093548U (en) | Liquid-cooling heat radiator | |
| CN208460849U (en) | A kind of electric vehicle motor controller power module water-cooled radiator | |
| CN106601705A (en) | Liquid cooling structure | |
| CN108054150A (en) | A kind of high-power IGBT liquid-cooling heat radiator | |
| CN108336050A (en) | cooling component | |
| CN206294462U (en) | A kind of New-energy electric vehicle water-cooling heat radiating device | |
| CN205491579U (en) | IGBT heat dissipation module and have its IGBT module | |
| CN111799238A (en) | Double-sided water-cooling IGBT radiator and radiating installation structure thereof | |
| CN209626208U (en) | A kind of multi-deck screw type microchannel liquid-cooling heat radiator | |
| CN207995628U (en) | A kind of radiator for high power controller | |
| CN110416172A (en) | Liquid-cooling heat radiator and its processing method | |
| CN207781584U (en) | A kind of high-power IGBT liquid-cooling heat radiator | |
| CN212230421U (en) | Cold forging formula copper liquid cooling radiator | |
| CN207800592U (en) | Power semiconductor modular | |
| CN209880594U (en) | Water cooling plate for water-cooling power generation converter | |
| CN206471325U (en) | Liquid cooling structure | |
| CN212209473U (en) | Electronic chip radiator with air cooling and auxiliary liquid cooling heat dissipation functions | |
| CN209675457U (en) | New energy car battery packet radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Patentee after: Zhuzhou Zhongche AVC Cooling Technology Co. Ltd. Address before: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Patentee before: Zhuzhou CSR Qihong Heat Dissipation Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |