CN207781584U - A kind of high-power IGBT liquid-cooling heat radiator - Google Patents
A kind of high-power IGBT liquid-cooling heat radiator Download PDFInfo
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- CN207781584U CN207781584U CN201820039936.9U CN201820039936U CN207781584U CN 207781584 U CN207781584 U CN 207781584U CN 201820039936 U CN201820039936 U CN 201820039936U CN 207781584 U CN207781584 U CN 207781584U
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- spiral
- liquid
- labyrinth
- substrate
- fluid course
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Abstract
The utility model is related to a kind of high-power IGBT liquid-cooling heat radiators, including upper cover plate, baffle upper plate, substrate, chin spoiler and the lower cover being fixed as one successively；Baffle upper plate and chin spoiler form the first spiral labyrinth fluid course and the second spiral labyrinth fluid course with substrate respectively；The side of substrate is equipped with liquid flow inlet and fluid outlet, and the other side is equipped with busbar；Deflector hole and collecting tank are equipped in substrate, deflector hole is set to the inside of fluid outlet, and collecting tank is connected with fluid outlet；First spiral labyrinth fluid course and the second spiral labyrinth fluid course are connected with liquid flow inlet and fluid outlet.By the way that multi-deck screw type labyrinth groove fluid course is arranged, effectively enhances heat dissipation area and eddy current effect, IGBT Wen Sheng are greatly reduced, to reduce the radiating requirements of high-power IGBT device, improve the stability and reliability of IGBT；Busbar is designed with substrate disjunctor, can be reduced busbar temperature, be improved the safety of single unit system.
Description
Technical field
The utility model is related to heat sink technology field, more specifically to one kind be suitable for high-power thyristor,
The liquid-cooling heat radiator of IGBT power electronic power devices.
Background technology
Modern power electronics devices further increase the requirements such as reliability requirement, performance indicator, power density, electric power electricity
The thermal design of sub- equipment is also more and more important.IGBT (Insulated Gate Bipolar Transistor), insulated gate bipolar
Transistor npn npn is driven by the compound full-control type voltage that BJT (double pole triode) and MOS (insulating gate type field effect tube) are formed
Formula power semiconductor has advantage of both the high input impedance of MOSFET and the low conduction voltage drop of GTR concurrently.IGBT device
It is the Primary Component in rail traffic, power electronic equipment, the quality of working condition directly affects whole aircraft reliability, safety
And service life, for the heat sink conception of IGBT device other than it effectively can dissipate heat, reliability is also vital.
Current IGBT components will produce conducting and switching loss at work, it is therefore desirable to which the cooling equipment of installation carries out
Heat dissipation, to reduce the junction temperature of power device, it is ensured that IGBT components normal, reliability service at the allowed temperature.IGBT devices at present
The type of cooling of part mainly has air-cooled, liquid cooling and heat pipe etc., right with further increasing for device performance requirements and power density
Cooling requirements are also more and more harsh.Consider from reliability, the general liquid cooling heat radiator for selecting radiating efficiency high to power device into
Row cooling, since the big power consumption of small flow becomes a kind of trend, and conventional straight channel structure is difficult to realize high power density cooling
It is required that needing using reinforcing heat dissipation technology.
Traditional liquid cooling heat radiator is to press from both sides one in centre by opening straight trough on liquid cooling base, then by liquid cooling cover board and substrate
Layer solder piece is welded together by vacuum brazing, installs electronic device in cover board face, the cover board of use is mostly thin-walled plate structures
To reduce the requirement of radiator thermal-conduction resistance.It can be seen that existing liquid cooling plate runner is simple, water is cooling on single layer same plane, thermal diffusivity
It can low-security risk height.
Utility model content
The technical problems to be solved in the utility model is：A kind of high-power IGBT liquid-cooling heat radiator is provided, is overcome existing
The deficiency of technology provides a kind of high-power IGBT liquid-cooling heat radiator of a new generation, solves rail traffic, power electronics is set
Standby prior art liquid cooling system can not adapt to the problem of IGBT element powers increase fever in existing power electronic equipment.
The technical solution of the utility model is：The utility model provides a kind of high-power IGBT liquid-cooling heat radiator,
Including upper cover plate, baffle upper plate, substrate, chin spoiler and the lower cover being fixed as one successively；
The baffle upper plate and chin spoiler form the first spiral labyrinth fluid course and second with the substrate respectively
Spiral labyrinth fluid course；
The side of the substrate is equipped with liquid flow inlet and fluid outlet, and the other side is equipped with busbar；It is equipped in the substrate
Deflector hole and collecting tank, the deflector hole are set to the inside of the fluid outlet, the collecting tank and the fluid outlet phase
Connection；
The first spiral labyrinth fluid course and the second spiral labyrinth fluid course with the liquid flow inlet and
The fluid outlet is connected, and coolant liquid is flowed into from the liquid flow inlet, by the deflector hole, flows separately through first spiral shell
Rotating labyrinth fluid course and the second spiral labyrinth fluid course, are collected in the collecting tank, go out from the liquid stream
Mouth outflow.
Further, the upper cover plate is welded as a whole by baffle upper plate and the substrate, under the lower cover passes through
Deflector is welded as a whole with the substrate.
Further, the baffle upper plate is equipped with the first spiral labyrinth groove, and the chin spoiler is equipped with the second spiral
The upper and lower part of formula labyrinth groove, the substrate is equipped with the spiral labyrinth groove of third；The first spiral labyrinth is recessed
Slot and the spiral labyrinth groove dislocation arrangement of the third form the described first spiral labyrinth fluid course, second spiral
Formula labyrinth groove and the spiral labyrinth groove dislocation arrangement of the third form the described second spiral labyrinth fluid course.
Further, it is equipped with labyrinth groove liquid on the described first spiral labyrinth groove and the second spiral labyrinth groove
Inflow entrance and labyrinth groove fluid outlet；The labyrinth groove liquid flow inlet is corresponding with the position of the deflector hole, the fan
Palace groove fluid outlet is corresponding with the position of the collecting tank.
Further, the shape of the described first spiral labyrinth fluid course and the second spiral labyrinth fluid course
For round, rectangular or polygon it is therein any one.
Further, the busbar is integrated design with the substrate.
Further, the liquid flow inlet outer surface is correspondingly provided with entrance water nozzle, and the fluid outlet outer surface corresponds to and sets
There is outlet water nozzle.
Further, the baffle upper plate and chin spoiler are composite soldering plate.
The high-power IGBT liquid-cooling heat radiator for implementing the utility model, has the advantages that：(1) multiple by designing
Miscellaneous spiral labyrinth groove fluid course effectively enhances heat dissipation area and eddy current effect, thermal resistance is greatly lowered and meets big work(
Rate IGBT device radiating requirements, heat dissipation effect are good；
(2) by setting multi-deck screw type labyrinth fluid course in liquid-cooling heat radiator, multilayer liquid stream heat dissipation channel is realized,
IGBT Wen Sheng are greatly reduced, improve IGBT stability and reliabilities；
(3) substrate side surfaces are equipped with busbar, and busbar is designed with liquid-cooling heat radiator for disjunctor, can reduce busbar temperature
Degree improves the safety of single unit system；
(4) substrate front side and the back side are designed with heat-dissipating cover plate and are furnished with spiral labyrinth fluid course, it can be achieved that high-power
Crimp type IGBT device two-side radiation.
Description of the drawings
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing：
Fig. 1 is the structural decomposition diagram of the utility model high-power IGBT liquid-cooling heat radiator；
Fig. 2 is the overall package schematic diagram of the utility model high-power IGBT liquid-cooling heat radiator；
Fig. 3 is that the spiral labyrinth liquid flowing channel structure of the substrate of the utility model high-power IGBT liquid-cooling heat radiator shows
It is intended to；
Fig. 4 is the baffle upper plate and the spiral labyrinth liquid of chin spoiler of the utility model high-power IGBT liquid-cooling heat radiator
Circulation road structural schematic diagram.
Specific implementation mode
Fig. 1 to Fig. 4 shows a preferred embodiment of the utility model high-power IGBT liquid-cooling heat radiator comprising according to
The secondary upper cover plate 001 being fixed as one, baffle upper plate 002, substrate 004, chin spoiler 005 and lower cover 007；Baffle upper plate
002 and chin spoiler 005 to form the first spiral labyrinth fluid course and the second spiral labyrinth liquid stream with substrate 004 respectively logical
Road；The side of substrate 004 is equipped with liquid flow inlet 010 and fluid outlet 012, and the other side is equipped with busbar 003；It is set in substrate 004
There are deflector hole 015 and collecting tank 016, deflector hole 015 to be set to the inside of fluid outlet 012, collecting tank 016 and fluid outlet
012 is connected；First spiral labyrinth fluid course and the second spiral labyrinth fluid course with liquid flow inlet 010 and liquid stream
Outlet 012 is connected, and coolant liquid is flowed into from liquid flow inlet 010, by deflector hole 015, flows separately through the first spiral labyrinth liquid
Circulation road and the second spiral labyrinth fluid course, are collected in collecting tank 016, are flowed out from fluid outlet 012.IGBT device with
Upper cover plate 001 and lower cover 007 fit, and baffle upper plate 002 and chin spoiler 005 form the first spiral with substrate 004 respectively
Formula labyrinth fluid course and the second spiral labyrinth fluid course, in this way, coolant liquid from the first spiral labyrinth fluid course and
It is flowed through in second spiral labyrinth fluid course, thus by the heat band of the IGBT device on upper cover plate 001 and lower cover 007
It walks, fluid course is set as spiral labyrinth shape, and coolant liquid Uniform Flow in fluid course, heat exchange is abundant, effectively increases
Strong heat dissipation area and eddy current effect, are greatly lowered thermal resistance and meet high-power IGBT device radiating requirements, heat dissipation effect is good.Base
Plate 004 is equipped with liquid flow inlet 010 and fluid outlet 012, is internally provided with deflector hole 015 and collecting tank 016, deflector hole 015 is set
It is placed in the inside of fluid outlet 012, collecting tank 016 is connected with fluid outlet 012.In use, coolant liquid is from liquid flow inlet 010
Into deflector hole 015 is located at the first spiral labyrinth fluid course and the fluid course of the second spiral labyrinth fluid course enters
At mouthful, guiding coolant liquid enters the first spiral labyrinth fluid course and the second spiral labyrinth fluid course, collecting tank 016
In the fluid course exit of the first spiral labyrinth fluid course and the second spiral labyrinth fluid course, for collecting
Fully flowing carried out the coolant liquid of heat exchange, and the coolant liquid in collecting tank 016 reaches certain capacity and just released from fluid outlet 012
It releases, completes a flow of liquid-cooling heat radiation.
Upper cover plate 001 is welded as a whole by baffle upper plate 002 and substrate 004 in the present embodiment, under lower cover 007 passes through
Deflector 005 is welded as a whole with substrate 004.Common IGBT liquid-cooling heat radiators cover board is bolted with substrate, this
All devices are welded as a whole in embodiment, do not need bolt and fix, overall appearance is more beautiful.
Baffle upper plate 002 is equipped with the first spiral labyrinth groove 008 in the present embodiment, and chin spoiler 005 is equipped with the second spiral shell
Rotating labyrinth groove 014, the upper and lower part of substrate 004 are equipped with the spiral labyrinth groove of third 009；First spiral labyrinth
Groove 008 and the spiral dislocation of labyrinth groove 009 arrangement of third form the first spiral labyrinth fluid course, the second spiral fan
Palace groove 014 and the spiral dislocation of labyrinth groove 009 arrangement of third form the second spiral labyrinth fluid course.First is spiral
The shape of labyrinth fluid course and the second spiral labyrinth fluid course be round, rectangular or polygon it is therein any one.
First spiral labyrinth groove, 008 and second spiral labyrinth groove 014 is adapted with the spiral labyrinth groove of third 009,
For the two with the use of spiral labyrinth fluid course is formed, which can be set as different according to demand
Shape, the first spiral labyrinth fluid course and the second spiral labyrinth fluid course in the present embodiment are rectangular, larger journey
The enhancing heat dissipation area and eddy current effect of degree, heat dissipation effect are preferable.
Labyrinth to be equipped on 008 and second spiral labyrinth groove 014 of the first spiral labyrinth groove recessed in the present embodiment
Tank liquor inflow entrance 018 and labyrinth groove fluid outlet 017；Labyrinth groove liquid flow inlet 018 is opposite with the position of deflector hole 015
It answers, labyrinth groove fluid outlet 017 is corresponding with the position of collecting tank 016.Deflector hole 015 is located at the first spiral labyrinth liquid stream
At the labyrinth groove liquid flow inlet 018 of channel and the second spiral labyrinth fluid course, it is spiral that guiding coolant liquid enters first
Labyrinth fluid course and the second spiral labyrinth fluid course, collecting tank 016 are located at the first spiral labyrinth fluid course and
At the labyrinth groove fluid outlet 017 of two spiral labyrinth fluid courses, for collecting, fully flowing had carried out heat exchange
Coolant liquid.
Busbar 003 and substrate 004 are integrated design in the present embodiment, busbar 003 directly with cooling and radiation device disjunctor
Design, can reduce busbar temperature, improve the safety of single unit system.
010 outer surface of liquid flow inlet is correspondingly provided with entrance water nozzle 011 in the present embodiment, and 012 outer surface of fluid outlet corresponds to
Equipped with outlet water nozzle 013, inlet of the entrance water nozzle 011 as coolant liquid can also be set as pipeline, can also reach identical effect
Fruit also belongs to the design of the utility model.The outlet after water nozzle 013 is circulated as coolant liquid is exported, pipe can also be set as
Road can also reach same effect, also belong to the design of the utility model.
Baffle upper plate 002 and chin spoiler 005 are composite soldering plate in the present embodiment.Composite soldering is in general conjunction
In gold brazing filler metal it is compound enter certain volume than high temperature alloy, carbon fiber, the ceramics of the various forms as reinforced phase etc. formed
Solder, which forms the composite soldering similar to metal-base composites by complex effect, it is swollen to have lower heat
The advantages of swollen coefficient, chooses the purpose for connecing elevated temperature strength to reach reduction residual stress, has obtained extensive utilization.Make
Use composite soldering plate as baffle upper plate 002 and chin spoiler 005, baffle upper plate when avoiding the IGBT device of top and the bottom heated
002 and chin spoiler 005 expand deformation, so as to cause the first spiral labyrinth fluid course and the second spiral labyrinth liquid
Circulation road deforms, and the flowing of coolant liquid is influenced, to influence liquid-cooling heat radiation effect.
Using the utility model high-power IGBT liquid-cooling heat radiator when, coolant liquid by entrance water nozzle 011 enter liquid
Inflow entrance 010, then through deflector hole 015 flow into the first spiral labyrinth fluid course that substrate 004 and baffle upper plate 002 are formed with
And substrate 004 carries out liquid-cooling heat radiation with the second spiral labyrinth fluid course of the formation of chin spoiler 005.First is spiral
Labyrinth fluid course and the second spiral labyrinth fluid course are equipped with labyrinth groove liquid flow inlet 018 and labyrinth groove liquid stream goes out
Mouth 017, labyrinth groove liquid flow inlet 018 is corresponding with the position of deflector hole 015, labyrinth groove fluid outlet 017 and collecting tank
016 position is corresponding, and coolant liquid enters the first spiral labyrinth fluid course and the second spiral shell from labyrinth groove liquid flow inlet 018
Rotating labyrinth fluid course outflow together to collecting tank 016 from labyrinth groove fluid outlet 017 after circulating, then passes through
Fluid outlet 012 is flowed out from outlet water nozzle 013, thus by the heat band of the IGBT device on upper cover plate 001 and lower cover 007
It walks.By designing complicated spiral labyrinth groove fluid course, effectively enhances heat dissipation area and eddy current effect, be greatly lowered
Thermal resistance meets high-power IGBT device radiating requirements, and heat dissipation effect is good；By setting multi-deck screw type in liquid-cooling heat radiator
Labyrinth fluid course realizes multilayer liquid stream heat dissipation channel, and IGBT Wen Sheng are greatly reduced, and improves IGBT stability and reliabilities；Substrate
Side is equipped with busbar, and busbar is designed with liquid-cooling heat radiator for disjunctor, can reduce busbar temperature and improve single unit system
Safety；It is designed with heat-dissipating cover plate in substrate front side and the back side and is furnished with spiral labyrinth fluid course, it can be achieved that high-power
Crimp type IGBT device two-side radiation.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
It, in specific embodiments and applications can be with many changes may be made, as long as these variations are without departing from this with novel thought
The design of utility model, belongs to the scope of protection of the utility model.
Claims (8)
1. a kind of high-power IGBT liquid-cooling heat radiator, which is characterized in that including be fixed as one successively upper cover plate (001),
Baffle upper plate (002), substrate (004), chin spoiler (005) and lower cover (007)；
The baffle upper plate (002) and chin spoiler (005) form the first spiral labyrinth liquid stream with the substrate (004) respectively
Channel and the second spiral labyrinth fluid course；
The side of the substrate (004) is equipped with liquid flow inlet (010) and fluid outlet (012), and the other side is equipped with busbar
(003)；Deflector hole (015) and collecting tank (016) are equipped in the substrate (004), the deflector hole (015) is set to the liquid
The inside of outflux (012), the collecting tank (016) are connected with the fluid outlet (012)；
The first spiral labyrinth fluid course and the second spiral labyrinth fluid course with the liquid flow inlet (010) and
The fluid outlet (012) is connected, and coolant liquid is flowed into from the liquid flow inlet (010), by the deflector hole (015), divides
The described first spiral labyrinth fluid course and the second spiral labyrinth fluid course are not flowed through, are collected to the collecting tank
(016) it in, is flowed out from the fluid outlet (012).
2. high-power IGBT liquid-cooling heat radiator according to claim 1, which is characterized in that the upper cover plate (001) is logical
It crosses baffle upper plate (002) to be welded as a whole with the substrate (004), the lower cover (007) passes through chin spoiler (005) and institute
Substrate (004) is stated to be welded as a whole.
3. high-power IGBT liquid-cooling heat radiator according to claim 1, which is characterized in that the baffle upper plate (002)
Equipped with the first spiral labyrinth groove (008), the chin spoiler (005) is equipped with the second spiral labyrinth groove (014), described
The upper and lower part of substrate (004) is equipped with the spiral labyrinth groove (009) of third；The first spiral labyrinth groove
(008) and spiral labyrinth groove (009) the dislocation arrangement of the third forms the described first spiral labyrinth fluid course, described
Second spiral labyrinth groove (014) and spiral labyrinth groove (009) the dislocation arrangement of the third form second spiral
Formula labyrinth fluid course.
4. high-power IGBT liquid-cooling heat radiator according to claim 3, which is characterized in that the first spiral labyrinth
It is equipped with labyrinth groove liquid flow inlet (018) and labyrinth groove liquid stream on groove (008) and the second spiral labyrinth groove (014)
It exports (017)；The labyrinth groove liquid flow inlet (018) is corresponding with the position of the deflector hole (015), the labyrinth groove
Fluid outlet (017) is corresponding with the position of the collecting tank (016).
5. high-power IGBT liquid-cooling heat radiator according to any one of claims 1-4, which is characterized in that described first
The shape of spiral labyrinth fluid course and the second spiral labyrinth fluid course is round, rectangular or polygon is therein
Any one.
6. high-power IGBT liquid-cooling heat radiator according to claim 1, which is characterized in that the busbar (003) with
The substrate (004) is integrated design.
7. high-power IGBT liquid-cooling heat radiator according to claim 1, which is characterized in that the liquid flow inlet (010)
Outer surface is correspondingly provided with entrance water nozzle (011), and fluid outlet (012) outer surface is correspondingly provided with outlet water nozzle (013).
8. high-power IGBT liquid-cooling heat radiator according to claim 1, which is characterized in that the baffle upper plate (002)
It is composite soldering plate with chin spoiler (005).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039936.9U CN207781584U (en) | 2018-01-10 | 2018-01-10 | A kind of high-power IGBT liquid-cooling heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039936.9U CN207781584U (en) | 2018-01-10 | 2018-01-10 | A kind of high-power IGBT liquid-cooling heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207781584U true CN207781584U (en) | 2018-08-28 |
Family
ID=63223103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820039936.9U Expired - Fee Related CN207781584U (en) | 2018-01-10 | 2018-01-10 | A kind of high-power IGBT liquid-cooling heat radiator |
Country Status (1)
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| CN (1) | CN207781584U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054150A (en) * | 2018-01-10 | 2018-05-18 | 深圳市智通电子有限公司 | A kind of high-power IGBT liquid-cooling heat radiator |
-
2018
- 2018-01-10 CN CN201820039936.9U patent/CN207781584U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054150A (en) * | 2018-01-10 | 2018-05-18 | 深圳市智通电子有限公司 | A kind of high-power IGBT liquid-cooling heat radiator |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20210110 |