CN205356935U - Water -cooled heat abstractor - Google Patents

Abstract

The utility model discloses a water -cooled heat abstractor, which comprises a cover plate, brazing filler metal board and base plate, the apron welds integratively through brazing filler metal board and base plate, the inside fish scale fin recess that is equipped with of apron, fish scale fin recess inside is equipped with a plurality of fish scale fins, substrate bonding forms fish scale fin rivers passageway with fish scale fin recess on apron fish scale fin recess, the base plate side is equipped with rivers channel entrance and the export of rivers passageway, correspond position inlet porting water injection well choke and export water injection well choke respectively at its surface, the inside water conservancy diversion hole that is equipped with of base plate, be equipped with the guiding gutter on the brazing filler metal board, there is fish scale fin rivers passageway at the base plate front and the back all connection cover plate and cloth, the positive back of base plate is equipped with a plurality of components and parts mounting holes. The utility model discloses a water -cooled heat abstractor adopts two -sided fish scale fin rivers access structure, effectively strengthens heat radiating area and eddy current effect, reduces the thermal resistance by a wide margin and satisfies high power device heat dissipation requirement.

Description

A water-cooled radiator

technical field

The utility model relates to the technical field of radiators, in particular to a water-cooled radiator suitable for high-power thyristors and IGBT power electronic power devices.

Background technique

The requirements for reliability, performance index, and power density of modern electronic equipment are further improved, and the thermal design of electronic equipment is becoming more and more important. Power devices are key devices in most electronic equipment, and their working status directly affects the reliability, safety and service life of the whole machine. In addition to effectively dissipating heat, the heat dissipation solution of power devices is also crucial to reliability.

Current IGBT components will generate conduction and switching losses during operation, so it is necessary to install cooling equipment for heat dissipation to reduce the junction temperature of power devices and ensure normal and reliable operation of IGBT components at the allowable temperature. At present, the cooling methods of power devices mainly include air cooling, water cooling, and heat pipes. With the further improvement of device performance requirements and power density, the heat dissipation requirements are becoming more and more stringent. From the perspective of reliability, water-cooled radiators with high heat dissipation efficiency are generally used to cool power devices. Due to the trend of low flow and high power consumption, conventional straight channel structures are difficult to achieve high power density cooling requirements, and enhanced heat dissipation is required. technology.

The traditional water-cooled radiator is made by opening a straight groove on the water-cooled base plate, and then the water-cooled cover plate and the base plate are sandwiched by a layer of brazing filler metal through vacuum brazing, and electronic devices are installed on the cover plate surface. Most of them are thin-walled plate structures to reduce the heat conduction thermal resistance requirements of the radiator. It can be seen that the existing water-cooled plate has simple flow channels, low heat dissipation performance, and there is a risk of water leakage when installing components on the cover surface.

Utility model content

The purpose of the utility model is to overcome the deficiencies of the prior art and provide a water-cooled heat dissipation device, which solves the problem that the prior art electronic equipment water-cooling system cannot adapt to the increased power of heating elements in the existing electronic equipment.

The technical scheme that the utility model adopts is as follows:

A water-cooled heat dissipation device, comprising a cover plate, a solder plate and a base plate, the cover plate is welded together with the base plate through the solder plate, the inside of the cover plate is provided with fish scale fin grooves, and the inside of the fish scale fin grooves A number of scale fins are provided, and the scale fins are arranged in a dislocation manner. The base plate is attached to the scale fin groove of the cover plate and forms a scale fin water flow channel with the scale fin groove of the cover plate. A water flow channel is provided on the side of the base plate The inlet and the outlet of the water flow channel, and the inlet nozzle and the outlet nozzle are respectively arranged at the corresponding positions on the outer surface, the inside of the substrate is provided with a diversion hole, the solder plate is provided with a diversion groove, and the front and back of the substrate are connected to the cover The board is also equipped with fish-scale fin water flow channels, and there are multiple component mounting holes on the front and back of the substrate.

The overall structure of the fish scale fin water flow channel is one of circular, square and polygonal.

A plurality of support columns are arranged in the fish scale fin water flow channel.

The component installation holes are directly processed and formed on the substrate, and the component installation holes do not pass through the welding layer of the cover plate.

When the utility model is in use, the cooling liquid enters the diversion hole and the diversion groove from the inlet of the water flow channel through the inlet water nozzle, then passes through the fish scale fin water flow channel, and then flows out from the outlet of the water flow channel through the outlet nozzle, thereby taking away the heat on the cover plate .

Compared with the prior art, the beneficial effects of the utility model are as follows:

(1) The water-cooled heat dissipation device of the present utility model adopts the fish scale fin water flow channel structure, which effectively enhances the heat dissipation area and the eddy current effect; Double-sided heat dissipation, greatly reducing thermal resistance to meet the heat dissipation requirements of high-power devices.

(2) In the water-cooled heat dissipation device of the present invention, a plurality of support columns are arranged in the water flow channel of the fish scale fins to effectively support and bear pressure and improve the reliability of the device.

(3) In the water-cooled heat dissipation device of the present invention, a plurality of component mounting holes are provided on the front and back of the substrate, and the component mounting holes are directly processed and formed on the substrate, and the component mounting holes do not pass through the welding layer of the cover plate, which can improve the overall device security.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is a schematic diagram of the overall assembly of the utility model;

FIG. 3 is a schematic diagram of the structure of the fish scale fin water flow channel in Embodiment 1. FIG.

detailed description

Below in conjunction with embodiment and accompanying drawing, the utility model is further described.

Example 1:

Referring to the accompanying drawings, a water-cooled heat dissipation device includes a cover plate 001, a solder plate 002, and a base plate 003. The cover plate 001 is welded together with the base plate 003 through the solder plate 002. Fish scales are arranged inside the cover plate 001. The fin groove 004 and the fish scale fin groove 004 are provided with a number of fish scale fins 005, the fish scale fins 005 are misplaced, and the substrate 003 is attached to the fish scale fin groove 004 of the cover plate and the said fish scale fins The grooves form the fish scale fin water flow channel 006. The overall structure of the fish scale fin water flow channel 006 is square. There are several support columns 007 inside the scale fin water flow channel 006. The side of the base plate 003 is provided with a water flow channel inlet 008 and a water flow channel. The outlet 009, and the inlet nozzle 010 and the outlet nozzle 011 are respectively arranged at the corresponding positions on the outer surface, the inside of the substrate 003 is provided with a diversion hole 012, the solder plate 002 is provided with a diversion groove 013, the front of the substrate 003 and The back is connected to the cover plate 001 and is equipped with fish scale fin water flow channels 006. There are multiple component mounting holes 014 on the front and back of the substrate 003. The component mounting holes 014 are directly processed on the substrate. The component mounting holes are not Weld the layer through the cover plate. When the utility model is used, the coolant enters the diversion hole 012 and the diversion groove 013 from the water flow channel inlet 008 through the inlet water nozzle 010, then passes through the scale fin water flow channel 006, and then flows out from the water flow channel outlet 009 through the outlet water nozzle 011, thereby Take the heat away from the cover.

The water-cooled heat dissipation device of the present utility model adopts the water flow channel structure of fish scale fins, which effectively enhances the heat dissipation area and the eddy current effect; Heat dissipation, greatly reducing thermal resistance to meet the heat dissipation requirements of high-power devices; by setting several support columns 007 in the fish scale fin water flow channel, it can effectively support the pressure and improve the reliability of the device. There are multiple component mounting holes on the front and back of the substrate 014. The component mounting holes are directly processed on the substrate, and the component mounting holes do not pass through the welding layer of the cover plate, which can improve the safety of the overall device.

Claims (4)

1. a water-cooled power converter, it is characterized in that: include cover plate, solder plate and substrate, described cover plate is integrally welded by solder plate and substrate, fish scale fin notches it is provided with inside described cover plate, some fish scale fins it are provided with inside fish scale fin notches, the dislocation arrangement of fish scale fin, baseplate-laminating forms fish scale fin water stream channel with described fish scale fin notches on cover plate fish scale fin notches, described substrate side surfaces is provided with water stream channel entrance and water stream channel outlet, and entrance water nozzle and outlet water nozzle it is respectively provided with at its outer surface correspondence position, pod apertures it is provided with inside substrate, solder plate is provided with guiding gutter, described substrate front side and the back side all connect cover plate and are furnished with fish scale fin water stream channel, the positive back side of substrate is provided with multiple components and parts installing hole.

2. water-cooled power converter according to claim 1, it is characterised in that: described fish scale fin water stream channel overall structure is the one in circular, square, polygon.

3. water-cooled power converter according to claim 1, it is characterised in that: set several support columns in described fish scale fin water stream channel.

4. water-cooled power converter according to claim 1, it is characterised in that: described components and parts installing hole is directly processed to form on substrate, and components and parts installing hole is not passed through cover plate weld layer.