CN205356935U - Water -cooled heat abstractor - Google Patents
Water -cooled heat abstractor Download PDFInfo
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- CN205356935U CN205356935U CN201620059640.4U CN201620059640U CN205356935U CN 205356935 U CN205356935 U CN 205356935U CN 201620059640 U CN201620059640 U CN 201620059640U CN 205356935 U CN205356935 U CN 205356935U
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- fish scale
- water
- scale fin
- cover plate
- substrate
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Abstract
The utility model discloses a water -cooled heat abstractor, which comprises a cover plate, brazing filler metal board and base plate, the apron welds integratively through brazing filler metal board and base plate, the inside fish scale fin recess that is equipped with of apron, fish scale fin recess inside is equipped with a plurality of fish scale fins, substrate bonding forms fish scale fin rivers passageway with fish scale fin recess on apron fish scale fin recess, the base plate side is equipped with rivers channel entrance and the export of rivers passageway, correspond position inlet porting water injection well choke and export water injection well choke respectively at its surface, the inside water conservancy diversion hole that is equipped with of base plate, be equipped with the guiding gutter on the brazing filler metal board, there is fish scale fin rivers passageway at the base plate front and the back all connection cover plate and cloth, the positive back of base plate is equipped with a plurality of components and parts mounting holes. The utility model discloses a water -cooled heat abstractor adopts two -sided fish scale fin rivers access structure, effectively strengthens heat radiating area and eddy current effect, reduces the thermal resistance by a wide margin and satisfies high power device heat dissipation requirement.
Description
Technical field
This utility model relates to heat sink technology field, particularly relates to a kind of suitable in the water-cooled power converter at high-power thyristor, IGBT power electronic power device.
Background technology
Reliability requirement, performance indications, power density etc. are required to improve further by modern electronic equipment, and the thermal design of electronic equipment is also more and more important.Power device is the Primary Component in most electronic equipment, and the quality of its duty directly affects whole aircraft reliability, safety and service life.The heat sink conception of power device except effectively dissipating heat, reliability also it is critical that.
Current IGBT components and parts operationally can produce conducting and switching loss, it is therefore desirable to installs cooling device and dispels the heat, to reduce the junction temperature of power device, it is ensured that IGBT components and parts are normal, reliability service under allowing temperature.The type of cooling of current power device mainly has air-cooled, water-cooled and heat pipe etc., along with the further raising of device performance requirements and power density, cooling requirements is also more and more harsh.Considering from reliability, power device is cooled down by the water-filled radiator that general selection radiating efficiency is high, and owing to low discharge high power consumption becomes a kind of trend, and the straight channel structure of routine is difficult to high power density cooling requirement, it is necessary to adopt strengthening heat dissipation technology.
Traditional water-filled radiator is by opening straight trough on water-cooling base plate, again in centre, water-cooling cover plate is pressed from both sides one layer of solder sheet with substrate to be welded together by vacuum brazing, install electronic device in cover plate face, the cover plate of employing mostly is thin-walled plate structures to reduce radiator thermal-conduction resistance requirement.Visible existing cooled plate runner is simple, and heat dispersion is low and there is risk of leaking during the mounting related components of cover plate face.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of water-cooled power converter, solves prior art electronic equipment water-cooling system and cannot adapt to the problem that in existing electronic equipment, heater element power increases.
The technical solution adopted in the utility model is as follows:
A kind of water-cooled power converter, including cover plate, solder plate and substrate, described cover plate is integrally welded by solder plate and substrate, fish scale fin notches it is provided with inside described cover plate, some fish scale fins it are provided with inside fish scale fin notches, the dislocation arrangement of fish scale fin, baseplate-laminating forms fish scale fin water stream channel with described fish scale fin notches on cover plate fish scale fin notches, described substrate side surfaces is provided with water stream channel entrance and water stream channel outlet, and entrance water nozzle and outlet water nozzle it is respectively provided with at its outer surface correspondence position, pod apertures it is provided with inside substrate, solder plate is provided with guiding gutter, described substrate front side and the back side all connect cover plate and are furnished with fish scale fin water stream channel, the positive back side of substrate is provided with multiple components and parts installing hole.
Described fish scale fin water stream channel overall structure is the one in circular, square, polygon.
Several support columns are set in described fish scale fin water stream channel.
Described components and parts installing hole is directly processed to form on substrate, and components and parts installing hole is not passed through cover plate weld layer.
When this utility model uses, coolant enters pod apertures and guiding gutter by entrance water nozzle from water stream channel entrance and then flows out through outlet water nozzle from water stream channel outlet then through fish scale fin water stream channel, thus being taken away by heat on cover plate.
Compared with the prior art, the beneficial effects of the utility model are as follows:
(1) water-cooled power converter of the present utility model, adopts fish scale fin water stream channel structure, effectively strengthens area of dissipation and eddy current effect；Described substrate front side and the back side all connect cover plate and are furnished with fish scale fin water stream channel, by just carrying on the back two-side radiation, thermal resistance is greatly lowered and meets high power device cooling requirements.
(2) water-cooled power converter of the present utility model, by arranging several support columns in fish scale fin water stream channel, effectively supports pressure-bearing, improves device reliability.
(3) water-cooled power converter of the present utility model, the positive back side of substrate is provided with multiple components and parts installing hole, and components and parts installing hole is directly processed to form on substrate, and components and parts installing hole is not passed through cover plate weld layer, it is possible to increase the safety of single unit system.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is this utility model overall package schematic diagram；
Fig. 3 is the fish scale fin water stream channel structural representation of embodiment 1.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the utility model will be further described.
Embodiment 1:
Referring to accompanying drawing, a kind of water-cooled power converter, including cover plate 001, solder plate 002 and substrate 003, described cover plate 001 is integrally welded by solder plate 002 and substrate 003, described cover plate 001 is internal is provided with fish scale fin notches 004, fish scale fin notches 004 is internal is provided with some fish scale fins 005, fish scale fin 005 dislocation arrangement, substrate 003 is fitted on cover plate fish scale fin notches 004 and described fish scale fin notches forms fish scale fin water stream channel 006, fish scale fin water stream channel 006 overall structure is square, squama fin water stream channel 006 is internal is provided with several support columns 007, described substrate 003 side is provided with water stream channel entrance 008 and water stream channel outlet 009, and entrance water nozzle 010 and outlet water nozzle 011 it is respectively provided with at its outer surface correspondence position, substrate 003 is internal is provided with pod apertures 012, solder plate 002 is provided with guiding gutter 013, described substrate 003 front and the back side all connect cover plate 001 and are furnished with fish scale fin water stream channel 006, the positive back side of substrate 003 is provided with multiple components and parts installing hole 014, described components and parts installing hole 014 is directly processed to form on substrate, components and parts installing hole is not passed through cover plate weld layer.When this utility model uses, coolant enters pod apertures 012 and guiding gutter 013 by entrance water nozzle 010 from water stream channel entrance 008 and then flows out through outlet water nozzle 011 from water stream channel outlet 009 then through fish scale fin water stream channel 006, thus being taken away by heat on cover plate.
Water-cooled power converter of the present utility model, adopts fish scale fin water stream channel structure, effectively strengthens area of dissipation and eddy current effect；Described substrate front side and the back side all connect cover plate and are furnished with fish scale fin water stream channel 006, by just carrying on the back two-side radiation, thermal resistance is greatly lowered and meets high power device cooling requirements；By arranging several support columns 007 in fish scale fin water stream channel, effectively support pressure-bearing, improve device reliability, the positive back side of substrate is provided with multiple components and parts installing hole 014, components and parts installing hole is directly processed to form on substrate, components and parts installing hole is not passed through cover plate weld layer, it is possible to increase the safety of single unit system.
Claims (4)
1. a water-cooled power converter, it is characterized in that: include cover plate, solder plate and substrate, described cover plate is integrally welded by solder plate and substrate, fish scale fin notches it is provided with inside described cover plate, some fish scale fins it are provided with inside fish scale fin notches, the dislocation arrangement of fish scale fin, baseplate-laminating forms fish scale fin water stream channel with described fish scale fin notches on cover plate fish scale fin notches, described substrate side surfaces is provided with water stream channel entrance and water stream channel outlet, and entrance water nozzle and outlet water nozzle it is respectively provided with at its outer surface correspondence position, pod apertures it is provided with inside substrate, solder plate is provided with guiding gutter, described substrate front side and the back side all connect cover plate and are furnished with fish scale fin water stream channel, the positive back side of substrate is provided with multiple components and parts installing hole.
2. water-cooled power converter according to claim 1, it is characterised in that: described fish scale fin water stream channel overall structure is the one in circular, square, polygon.
3. water-cooled power converter according to claim 1, it is characterised in that: set several support columns in described fish scale fin water stream channel.
4. water-cooled power converter according to claim 1, it is characterised in that: described components and parts installing hole is directly processed to form on substrate, and components and parts installing hole is not passed through cover plate weld layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059640.4U CN205356935U (en) | 2016-01-21 | 2016-01-21 | Water -cooled heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059640.4U CN205356935U (en) | 2016-01-21 | 2016-01-21 | Water -cooled heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205356935U true CN205356935U (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620059640.4U Active CN205356935U (en) | 2016-01-21 | 2016-01-21 | Water -cooled heat abstractor |
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| CN (1) | CN205356935U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054150A (en) * | 2018-01-10 | 2018-05-18 | 深圳市智通电子有限公司 | A kind of high-power IGBT liquid-cooling heat radiator |
| CN110636742A (en) * | 2019-08-16 | 2019-12-31 | 电子科技大学 | Fish scale-like micro-channel and multi-layer cold plate mounting rack based on 3D printing technology |
| CN110828401A (en) * | 2019-11-20 | 2020-02-21 | 中国电子科技集团公司第三十八研究所 | Ultra-high heat flow density micro-channel heat sink cold plate |
| CN112404634A (en) * | 2020-10-27 | 2021-02-26 | 吴彦君 | Flip-chip LED chip welding protection architecture |
-
2016
- 2016-01-21 CN CN201620059640.4U patent/CN205356935U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054150A (en) * | 2018-01-10 | 2018-05-18 | 深圳市智通电子有限公司 | A kind of high-power IGBT liquid-cooling heat radiator |
| CN110636742A (en) * | 2019-08-16 | 2019-12-31 | 电子科技大学 | Fish scale-like micro-channel and multi-layer cold plate mounting rack based on 3D printing technology |
| CN110636742B (en) * | 2019-08-16 | 2021-02-05 | 电子科技大学 | Fish scale-like micro-channel and multi-layer cold plate mounting rack based on 3D printing technology |
| CN110828401A (en) * | 2019-11-20 | 2020-02-21 | 中国电子科技集团公司第三十八研究所 | Ultra-high heat flow density micro-channel heat sink cold plate |
| CN112404634A (en) * | 2020-10-27 | 2021-02-26 | 吴彦君 | Flip-chip LED chip welding protection architecture |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 245300 Jinping Road, eco industrial park, Jixi County, Xuancheng, Anhui Province, No. 19 Patentee after: Anhui Xiang Bo heat transfer technology Co., Ltd. Address before: 245300 eco industrial park, Jixi County, Anhui, Xuancheng Patentee before: Anhui Heyi Electrical Technology Co., Ltd. |