CN210325777U - Liquid cooling heat dissipation device for copper-aluminum pipe - Google Patents
Liquid cooling heat dissipation device for copper-aluminum pipe Download PDFInfo
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- CN210325777U CN210325777U CN201921725175.3U CN201921725175U CN210325777U CN 210325777 U CN210325777 U CN 210325777U CN 201921725175 U CN201921725175 U CN 201921725175U CN 210325777 U CN210325777 U CN 210325777U
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Abstract
The utility model relates to the technical field of radiators, and provides a copper aluminum tube liquid cooling heat abstractor, aiming at solving the problems of power heat dissipation, reliability and cost of IGBT semiconductor elements in central air conditioning, new energy and power electronic equipment, and the liquid cooling system in the prior art can not adapt to the power heat dissipation problem, reliability problem and cost problem of the power electronic equipment, comprising a base plate, a brazing filler metal plate and a cover plate which are sequentially arranged from top to bottom, wherein the base plate is welded with the cover plate into a whole through the brazing filler metal plate; the liquid cooling tank is divided into a water inlet section, a first cooling area, a second cooling area and a water return section along the moving direction of the cooling liquid in sequence. The utility model discloses be particularly useful for semiconductor element's high-efficient heat dissipation among the power electronic equipment, have higher social use value and application prospect.
Description
Technical Field
The utility model relates to a radiator technical field, concretely relates to copper aluminium pipe liquid cooling heat abstractor.
Background
With the increasing capacity and power density of power elements of power electronic equipment, the heat consumption of the equipment during operation is larger and larger, the traditional air-cooled heat dissipation cannot meet the operation requirement of high-power electronic components, and the liquid-cooled heat dissipation technology is gradually replacing the air-cooled heat dissipation, so that the requirements of modern power electronic equipment on reliability, performance index, power density and the like are further improved, and the thermal design of the power electronic equipment is more and more important. The IGBT element is a key device in a central air conditioner and new energy power electronic equipment, the reliability, the safety and the service life of the whole machine are directly influenced by the quality of the working state of the IGBT element, and the heat dissipation of the IGBT element is of great importance.
At present, IGBT components and parts can generate conduction and switching loss when in work, so that cooling equipment needs to be installed for heat dissipation to reduce the junction temperature of power devices and ensure that the IGBT components and parts can normally and reliably run at an allowable temperature. At present, the cooling modes of the IGBT device mainly comprise air cooling, liquid cooling, refrigerants and the like, and along with the further improvement of the performance requirement and the power density of the device, the heat dissipation requirement and the cost control are more and more strict. In view of reliability, a liquid cooling radiator with high heat dissipation efficiency is generally selected to cool the power device.
Traditional central air conditioning IGBT heat dissipation is copper pipe radiator, it is according to specific design fluting on the base plate, simultaneously with the bender to the copper pipe be rolled over into the same shape with the fluting radian on the base plate, inlay the copper pipe again in the base plate, then at the electronic components of base plate face installation, adopt the structural technology of copper pipe return bend in order to reduce radiator conduction thermal resistance requirement, it is with high costs to see whole copper pipe, can't realize copper aluminium pipe conversion, and current liquid cooling board runner is simple, the security risk that heat dispersion is low is high.
Therefore, a liquid cooling heat dissipation device of the copper aluminum tube is provided.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a copper aluminium pipe liquid cooling heat abstractor has overcome the not enough of prior art, reasonable in design, compact structure aims at solving central air conditioning, new forms of energy, power electronic equipment, and the unable power heat dissipation problem, the reliability problem and the cost problem that adapt to IGBT semiconductor element among the current power electronic equipment of prior art liquid cooling system.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a copper aluminum tube liquid cooling heat dissipation device comprises a base plate, a brazing filler metal plate and a cover plate which are sequentially arranged from top to bottom, wherein the base plate is welded with the cover plate into a whole through the brazing filler metal plate, a liquid cooling tank for liquid cooling heat dissipation of a cooling liquid circulation is arranged on the lower end face of the base plate, a plurality of heat dissipation fins are arranged in the liquid cooling tank, and a water flow channel inlet and a water flow channel outlet which penetrate through the side wall of the base plate are respectively formed in two ends of the liquid cooling tank;
the liquid cooling tank is sequentially divided into a water inlet section, a first cooling area, a second cooling area and a water return section along the movement direction of cooling liquid,
the starting end of the water inlet section is communicated with the inlet of the water flow channel and is used for allowing cooling liquid to enter the liquid cooling tank;
the first cooling area consists of two cooling subareas which are arranged in parallel along the movement direction of the cooling liquid, and a plurality of radiating fins are transversely arranged in the two cooling subareas;
the second cooling area consists of three cooling subareas which are arranged in parallel along the movement direction of the cooling liquid, and a plurality of radiating fins are vertically arranged in the three cooling subareas;
the tail end of the water return section is communicated with the outlet of the water flow channel and used for discharging the cooling liquid out of the liquid cooling tank.
Furthermore, an inlet water nozzle is arranged at the position, corresponding to the inlet of the water flow channel, of the upper end of the substrate through an inlet aluminum pipe and an inlet aluminum pipe, and an outlet water nozzle is arranged at the position, corresponding to the outlet of the water flow channel, of the upper end of the substrate through an outlet aluminum pipe and an outlet copper pipe.
Further, the inlet aluminum pipe is arranged at the upper end of the inlet aluminum pipe and is welded in a seamless mode through a resistor, and the outlet aluminum pipe is arranged at the upper end of the outlet copper pipe and is welded in a seamless mode through a resistor.
Furthermore, the inlet water nozzle and the outlet water nozzle are made of all-copper materials, and the inlet water nozzle and the outlet water nozzle are respectively connected with the output ends of the inlet copper pipe and the outlet copper pipe through brazing.
Furthermore, a plurality of radiating fins in the cooling subarea are arranged in parallel at equal intervals, and the distance between every two adjacent radiating fins is 2-8 mm.
(III) advantageous effects
The embodiment of the utility model provides a copper aluminium pipe liquid cooling heat abstractor possesses following beneficial effect:
1. through the innovative design of the complex water flow channels of the radiating fins, the radiating fins in the substrate are mutually arranged and communicated, so that when a coolant flows through the radiating fins, the water flow channels are formed, the radiating area is effectively increased, the radiating energy consumption is reduced, and the radiating efficiency and the radiating performance of the high-power electronic component are greatly improved.
2. The copper-aluminum tube solderless seamless butt welding technology is realized by directly welding the copper tube and the aluminum tube, and the copper-aluminum tube solderless seamless butt welding technology is applied to IGBT heat dissipation in the central air conditioner and power electronic industry, is a reliable and low-cost processing method, can realize excessive conversion of the copper-aluminum tube, and effectively improves the use stability and reliability of the heat dissipation device.
3. The water nozzle, the copper pipe, the aluminum pipe and the substrate are connected in series and welded into a whole to form the closed circulating water channel, the use strength and the sealing performance are higher than those of the traditional method, and the use stability and the reliability of the heat dissipation device are effectively improved.
Drawings
The above features, technical features, advantages and implementation manners of a liquid-cooled heat dissipation device with copper aluminum tubes will be further described in the following detailed description of preferred embodiments with reference to the accompanying drawings.
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic view of the overall assembly of the present invention;
FIG. 3 is a schematic view of the combined structure of the liquid cooling tank and the moving direction of the cooling liquid according to the present invention;
FIG. 4 is a schematic view of the combined structure of the liquid cooling tank and the heat dissipating fins of the present invention;
in the figure: the cooling device comprises an inlet water nozzle 001, an inlet aluminum pipe 002, an inlet aluminum pipe 003, a water flow channel inlet 004, an outlet water nozzle 005, an outlet copper pipe 006, an outlet aluminum pipe 007, a water flow channel outlet 008, a base plate 009, a brazing filler metal plate 010, a cover plate 011, a radiating fin 012, a water inlet section 013, a first cooling area 014, a second cooling area 015 and a water return section 016.
Detailed Description
The invention will be further described with reference to the following figures 1-4 and examples:
example 1
The utility model provides a copper aluminium pipe liquid cooling heat abstractor, includes base plate 009, brazing filler metal plate 010 and the apron 011 that top-down set gradually, base plate 009 welds integratively with apron 011 through brazing filler metal plate 010, and the lower terminal surface of base plate 009 offers and is used for the coolant liquid circulation to carry out the radiating liquid cooling groove of liquid cooling, is equipped with a plurality of radiating fin 012 in the liquid cooling groove, rivers passageway entry 004 and the rivers passageway export 008 of lining up base plate 009 lateral wall are seted up respectively to the both ends of liquid cooling groove, and the effectual cooperation rivers passageway entry 004 of liquid cooling groove and rivers passageway export 008 form the liquid cooling passageway that link up for walk the cooling of IGBT semiconductor element work.
In this embodiment, as shown in fig. 3 and 4, the liquid cooling tank is sequentially divided into a water inlet section 013, a first cooling region 014, a second cooling region 015 and a water return section 016 along the moving direction of the cooling liquid,
the starting end of the water inlet section 013 is communicated with the water flow channel inlet 004 and is used for allowing cooling liquid to enter the liquid cooling tank;
the first cooling area 014 is composed of two cooling partitions arranged in parallel along the moving direction of the cooling liquid, and a plurality of radiating fins 012 are transversely installed in each of the two cooling partitions;
the second cooling area 015 is composed of three cooling subareas which are arranged in parallel along the movement direction of the cooling liquid, and a plurality of cooling fins 012 are vertically installed in each of the three cooling subareas, it can be understood that the three cooling subareas in the second cooling area 015 and the two cooling subareas in the first cooling area 014 are vertically arranged at 90 degrees, and the plurality of cooling fins 012 are also vertically arranged at 90 degrees, so that the liquid cooling efficiency is fully ensured;
the end of the backwater section 016 is communicated with the water flow channel outlet 008 for discharging the cooling liquid out of the liquid cooling tank.
It can be understood that, in this embodiment, the coolant enters the water inlet section 013 from the water flow channel inlet 004, and sequentially passes through the first cooling area 014 and the second cooling area 015, and then flows out from the water flow channel outlet 008 at the end of the water return section 016, wherein the coolant cooperates with the plurality of cooling fins 012 to form a plurality of liquid cooling channels in 5 cooling partitions of the first cooling area 014 and the second cooling area 015, so as to effectively increase the heat dissipation area, reduce the heat dissipation energy consumption, and greatly improve the heat dissipation efficiency and the heat dissipation performance of the high-power electronic component.
In this embodiment, as shown in fig. 1 and 2, an inlet water nozzle 001 is installed on a position, corresponding to the water flow channel inlet 004, of the upper end of the substrate 009 through an inlet aluminum pipe 003 and an inlet aluminum pipe 002, an outlet water nozzle 005 is installed on a position, corresponding to the water flow channel outlet 008, of the upper end of the substrate 009 through an outlet aluminum pipe 007 and an outlet copper pipe 006, the water nozzles are connected in series with the copper pipes, the aluminum pipes and the substrate 009 into a whole to form a closed circulating water flow channel, the use strength and the sealing performance are higher than those of a traditional direct connection mode, and the use stability and the reliability of.
In this embodiment, as shown in fig. 1 and 2, the inlet aluminum pipe 002 is disposed at the upper end of the inlet aluminum pipe 003 and is welded through resistance seamless welding, the outlet aluminum pipe 007 is disposed at the upper end of the outlet copper pipe 006 and is welded through resistance seamless welding, the inlet aluminum pipe 002 and the inlet aluminum pipe 003 are welded through resistance seamless welding with the outlet aluminum pipe 007 and the outlet copper pipe 006 (conventionally, through thread fastening or adhesive bonding) to realize a copper-aluminum pipe solderless seamless butt welding technology, and are applied to IGBT heat dissipation in the central air conditioning and power electronics industries.
In this embodiment, entry water injection well choke 001 and export water injection well choke 005 are the full copper material, and entry water injection well choke 001 and export water injection well choke 005 are connected through brazing with the output of entry copper pipe 002 and export copper pipe 006 respectively, adopt brazed mode, are favorable to forming inclosed circulating water circulation passageway, and use intensity and sealing performance all are higher than traditional lug connection mode, effectively improve stability and the reliability that heat abstractor used.
In this embodiment, as shown in fig. 4, the plurality of fins 012 in the cooling partition are arranged in parallel and equidistantly, and the distance between two adjacent fins 012 is 2-8 mm, so as to effectively ensure the penetration and circulation of the cooling liquid in the plurality of liquid cooling channels formed by the plurality of fins 012, and facilitate the cooling liquid to take away the temperature of the IGBT semiconductor element during operation.
The embodiment of the present invention discloses a preferred embodiment, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention according to the above embodiment, and make different extensions and changes, but do not depart from the spirit of the present invention, all of which are within the protection scope of the present invention.
Claims (5)
1. A copper aluminum tube liquid cooling heat dissipation device comprises a base plate, a brazing filler metal plate and a cover plate which are sequentially arranged from top to bottom, and is characterized in that the base plate and the cover plate are welded into a whole through the brazing filler metal plate, a liquid cooling tank for liquid cooling heat dissipation is arranged on the lower end face of the base plate, a plurality of heat dissipation fins are arranged in the liquid cooling tank, and a water flow channel inlet and a water flow channel outlet which penetrate through the side wall of the base plate are respectively arranged at two ends of the liquid cooling tank;
the liquid cooling tank is sequentially divided into a water inlet section, a first cooling area, a second cooling area and a water return section along the movement direction of cooling liquid,
the starting end of the water inlet section is communicated with the inlet of the water flow channel and is used for allowing cooling liquid to enter the liquid cooling tank;
the first cooling area consists of two cooling subareas which are arranged in parallel along the movement direction of the cooling liquid, and a plurality of radiating fins are transversely arranged in the two cooling subareas;
the second cooling area consists of three cooling subareas which are arranged in parallel along the movement direction of the cooling liquid, and a plurality of radiating fins are vertically arranged in the three cooling subareas;
the tail end of the water return section is communicated with the outlet of the water flow channel and used for discharging the cooling liquid out of the liquid cooling tank.
2. The liquid-cooled heat sink of copper aluminum tube as claimed in claim 1, wherein: the water flow channel comprises a base plate, a water flow channel inlet, an inlet aluminum pipe, an outlet copper pipe and a water outlet pipe.
3. The liquid-cooled heat sink of copper aluminum tube as claimed in claim 2, wherein: the inlet aluminum pipe is arranged at the upper end of the inlet aluminum pipe and is welded in a seamless mode through a resistor, and the outlet aluminum pipe is arranged at the upper end of the outlet copper pipe and is welded in a seamless mode through a resistor.
4. The liquid-cooled heat sink of copper aluminum tube as claimed in claim 2, wherein: the inlet water nozzle and the outlet water nozzle are made of all-copper materials, and the inlet water nozzle and the outlet water nozzle are respectively connected with the output ends of the inlet copper pipe and the outlet copper pipe through brazing.
5. The liquid-cooled heat sink of copper aluminum tube as claimed in claim 1, wherein: a plurality of radiating fins in the cooling subarea are arranged in parallel at equal intervals, and the distance between every two adjacent radiating fins is 2-8 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921725175.3U CN210325777U (en) | 2019-10-15 | 2019-10-15 | Liquid cooling heat dissipation device for copper-aluminum pipe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921725175.3U CN210325777U (en) | 2019-10-15 | 2019-10-15 | Liquid cooling heat dissipation device for copper-aluminum pipe |
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| CN210325777U true CN210325777U (en) | 2020-04-14 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768332A (en) * | 2017-11-03 | 2018-03-06 | 浙江嘉科电子有限公司 | A kind of liquid-cooling heat radiator for load balance factor test system |
| CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
| CN114531819A (en) * | 2020-11-09 | 2022-05-24 | 富联精密电子(天津)有限公司 | Liquid cooling heat dissipation system and server system |
-
2019
- 2019-10-15 CN CN201921725175.3U patent/CN210325777U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768332A (en) * | 2017-11-03 | 2018-03-06 | 浙江嘉科电子有限公司 | A kind of liquid-cooling heat radiator for load balance factor test system |
| CN107768332B (en) * | 2017-11-03 | 2024-04-09 | 浙江嘉科电子有限公司 | Liquid cooling heat dissipation device for load traction test system |
| CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
| CN114531819A (en) * | 2020-11-09 | 2022-05-24 | 富联精密电子(天津)有限公司 | Liquid cooling heat dissipation system and server system |
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