CN111970908A - Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof - Google Patents
Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof Download PDFInfo
- Publication number
- CN111970908A CN111970908A CN202010868245.1A CN202010868245A CN111970908A CN 111970908 A CN111970908 A CN 111970908A CN 202010868245 A CN202010868245 A CN 202010868245A CN 111970908 A CN111970908 A CN 111970908A
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- Prior art keywords
- heat pipe
- heat
- cover plate
- heat dissipation
- radiating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Abstract
An active and passive dual-purpose liquid cooling radiator is used for radiating a chip and comprises a liquid cooling base and a heat pipe radiating piece; the liquid cooling base consists of a substrate and a cover plate, and a cooling water tank is arranged on the substrate; the heat pipe radiating piece comprises a radiating block and a plurality of heat pipes; a plurality of radiating air channels are arranged on the side surface of the radiating block; the bottom surface of the radiating block is connected with the cover plate; the heat pipe is square ring, one long edge of the heat pipe crosses the heat dissipation air duct of the heat dissipation block, and the other long edge is located in the round hole. The active and passive dual-purpose liquid cooling radiator can be connected with a vehicle-mounted liquid cooling source, so that high-efficiency vehicle-mounted cooling is realized; and the outdoor cooling can be realized by a heat pipe cooling structure of the heat pipe cooling device. The invention solves the heat dissipation problem of the CPU chip of the communication equipment in the vehicle-mounted or field working environment. A method for manufacturing a radiator is characterized in that the thermal resistance of the radiator is the lowest through integral manufacturing, the heat radiation performance is the best, and the normal use of communication equipment under the conditions of vehicle-mounted or field is ensured.
Description
Technical Field
The invention relates to the technical field of chip radiators, in particular to an active and passive dual-purpose liquid cooling radiator and a manufacturing method of the radiator.
Background
The CPU of the high-power vehicle-mounted communication equipment generates a large amount of heat during working, and a good heat dissipation device is needed to cool the CPU. In order to save the space of the communication equipment, the liquid cooling plate is directly attached to the CPU for efficient heat dissipation, but the liquid cooling plate is dependent on a vehicle-mounted liquid cooling source. In order to meet the requirement of field battles, communication equipment needs to be taken out of a carriage for use temporarily, and because a liquid cooling source is not available in field use, the liquid cooling product cannot realize high-efficiency heat dissipation of a CPU, so that the normal work of the communication equipment is seriously influenced. And the heat dissipation problem of this type of use operating mode can't be solved to current technical scheme.
Disclosure of Invention
In order to overcome the defects in the background art, the invention discloses an active and passive dual-purpose liquid cooling radiator and a manufacturing method of the radiator, and aims to solve the problem of heat dissipation of a CPU chip of communication equipment in a vehicle-mounted or field working environment.
In order to realize the purpose, the following technical scheme is adopted:
an active and passive dual-purpose liquid cooling radiator is used for radiating a chip and comprises a liquid cooling base and a heat pipe radiating piece; the liquid cooling base consists of a substrate and a cover plate, wherein a cooling water tank is arranged on the substrate, the substrate is hermetically connected with the cover plate to form a cooling water channel, and the cooling water channel is detachably connected with an external cooling liquid circulating device; the substrate is connected with the chip and used for absorbing heat; the cover plate is provided with a plurality of semicircular grooves on one surface far away from the substrate; the heat pipe radiating piece comprises a radiating block and a plurality of heat pipes; a plurality of radiating air channels are arranged on the side surface of the radiating block, and a plurality of semicircular grooves corresponding to the cover plate are arranged on the bottom surface of the radiating block; the bottom surface of the heat dissipation block is connected with the cover plate, and a circular hole is formed between the bottom surface of the heat dissipation block and the corresponding semicircular groove between the cover plate; the heat pipe is square ring, one long edge of the heat pipe crosses the heat dissipation air duct of the heat dissipation block, and the other long edge is located in the round hole.
The technical scheme is further improved, the cooling water tank comprises a plurality of branch water tanks which are arranged in parallel, and two ends of each branch water tank are respectively communicated with a water inlet and a water outlet of the cooling water tank; and quick joints are respectively arranged on the water inlet and the water outlet of the cooling water tank.
The technical scheme is further improved, the base plate, the cover plate, the radiating block and the heat pipe are all made of aluminum alloy, and the base plate, the cover plate and the radiating block are integrally welded through veneering.
A manufacturing method of a heat sink comprises the following steps:
s1: respectively machining the base plate, the cover plate and the radiating block; wherein, the planeness of the connecting surface between the substrate and the cover plate is less than 0.1, and the roughness is less than 0.8 micron;
s2: the heat pipe penetrates through the heat dissipation block, and the heat pipe is bent, welded and subjected to leak detection, so that the heat dissipation piece of the heat pipe is manufactured;
s3: performing vacuum brazing on the connecting surface of the base plate and the cover plate, and performing missed detection on the connecting surface to finish the manufacture of the liquid cooling base;
s4: plating nickel on the surfaces of the liquid cooling base and the heat pipe radiating piece, then coating soldering paste on the combined surface of the liquid cooling base and the heat pipe radiating piece, and performing soldering after the temperature is raised to complete the integral welding of the radiator;
s5: the heat pipe is degassed and filled with cooling medium.
In step S1, the heat dissipation air duct of the heat dissipation block is formed by cold extrusion.
In a further improvement, in S4, a crossing connection between the heat pipe and the heat dissipation air duct on the heat dissipation block and a contact surface between the heat pipe and the circular hole are soldered.
Due to the adoption of the technical scheme, compared with the background technology, the invention has the following beneficial effects:
the radiator can be connected with a vehicle-mounted liquid cooling source, so that high-efficiency vehicle-mounted cooling is realized; can rely on self heat pipe cooling structure, realize field cooling. The invention solves the heat dissipation problem of the CPU chip of the communication equipment in the vehicle-mounted or field working environment.
The radiator manufacturing method of the invention enables the thermal resistance of the radiator to be the lowest and the heat radiation performance to be the best through the integral manufacturing, and ensures the normal use of the communication equipment under the vehicle-mounted or field condition.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of a liquid-cooled base.
Fig. 3 is a schematic structural view of a heat pipe heat sink.
Fig. 4 is a schematic structural view of a cooling water tank.
Fig. 5 is a schematic view of a connection structure of the heat pipe.
In the figure: 1. a liquid cooling base; 11. a substrate; 111. a cooling water tank; 12. a cover plate; 2. a heat pipe heat sink; 21. a heat dissipating block; 22. a heat pipe.
Detailed Description
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.
An active and passive dual-purpose liquid cooling radiator is shown in figures 1-3 and is used for radiating chips and comprises a liquid cooling base 1 and a heat pipe radiating piece 2. The liquid cooling base 1 is composed of a base plate 11 and a cover plate 12, and a cooling water tank 111 is arranged on the base plate 11. In order to improve the heat dissipation efficiency and reduce the carrying weight, the base plate 11 and the cover plate 12 are both made of 6063 aluminum alloy. As shown in fig. 4, the cooling water tank 111 includes a plurality of branch water tanks arranged in parallel, and two ends of the plurality of branch water tanks are respectively communicated with a water inlet and a water outlet of the cooling water tank 111. The sealing surface between the base plate 11 and the cover plate 12 is welded by adopting a vacuum brazing process, so that the base plate 11 and the cover plate 12 form an integrated cooling water channel. Thus, firstly, the thermal resistance can be reduced, and secondly, the sealing of the cooling water channel can be ensured. In order to adapt to field operation of communication equipment, internal threads are arranged on the water inlet and the water outlet of the cooling water tank 111, and quick connectors (not shown in the figure) are respectively arranged on the internal threads. The quick switching of the communication equipment in a vehicle or in the field can be realized through the plugging quick connector.
The exposed surface of the substrate 11 is connected to the CPU chip for absorbing heat. The cover plate 12 is provided with six semicircular grooves on one surface far away from the substrate 11. As shown in fig. 3, the heat pipe radiator element 2 includes a radiator block 21 and six heat pipes 22. The heat dissipation block 21 and the heat pipe 22 are both made of 6063 aluminum alloy, and the purpose of improving heat dissipation efficiency and reducing carrying weight is also achieved. A plurality of heat dissipation air channels are arranged on the side surface of the heat dissipation block 21, the cross section of each heat dissipation air channel is rectangular, and cooling air enters from one side of each heat dissipation air channel and flows out from the other side of each heat dissipation air channel to take away heat. Six semicircular grooves corresponding to the cover plate 12 are formed in the bottom surface of the heat dissipation block 21. As shown in fig. 5, when the bottom surface of the heat dissipation block 21 is coupled to the cover plate 12, a circular hole is formed in a corresponding semicircular groove between the bottom surface of the heat dissipation block 21 and the cover plate 12. One heat pipe 22 is mounted in each circular hole. The heat pipe 22 is in a square ring shape, one long side of the heat pipe 22 penetrates through the heat dissipation air duct of the heat dissipation block 21, and the other long side is located in the round hole. In order to reduce the contact thermal resistance of the connecting surface, the radiating block 21 and the six heat pipes 22 are welded with the liquid cooling base 1 into a whole through a soldering process. The cooling medium in the heat pipe 22 is alcohol, and the temperature of the liquid cooling base 1 is reduced by the heat absorption of the alcohol through evaporation; when the alcohol is condensed to release heat, the heat dissipation block 21 is dissipated by the heat dissipation block 21 and the cooling fan arranged on one side of the heat dissipation air duct.
When the vehicle-mounted working is carried out, the communication equipment is communicated with the vehicle-mounted liquid cooling source through the quick connector, so that the liquid cooling medium enters the liquid cooling base 1, and the CPU chip is efficiently cooled. When the communication equipment works in the field for a short time, the vehicle-mounted liquid cold source is quickly removed, the CPU chip is well radiated through the heat pipe radiating piece 2, and the normal work of the communication equipment is ensured.
In order to disclose the manufacturing method of the radiator, the manufacturing method of the radiator is also disclosed, and the manufacturing method comprises the following steps:
s1: respectively machining the base plate 11, the cover plate 12 and the radiating block 21; wherein, the planeness of the connecting surface between the substrate 11 and the cover plate 12 is less than 0.1, and the roughness is less than 0.8 micron; in order to reduce the thermal resistance generated by the contact connection of the partition plates, the heat dissipation air duct of the heat dissipation block 21 is formed by integral cold extrusion;
s2: a heat pipe 22 is arranged on the radiating block 21 in a penetrating way, and the heat pipe 22 is bent and welded; reserving an air tap on the heat pipe 22, and performing immersion leak detection on the heat pipe 22 through the air tap to complete the manufacture of the heat pipe heat dissipation part 2;
s3: carrying out vacuum brazing on the connecting surface of the base plate 11 and the cover plate 12, and carrying out leak detection on the connecting surface to finish the manufacture of the liquid cooling base 1;
s4: plating nickel on the surfaces of the liquid cooling base 1 and the heat pipe radiating piece 2, then coating solder paste on the joint surface of the liquid cooling base 1 and the heat pipe radiating piece 2, and performing soldering after the temperature is raised to complete the integral welding of the radiator; in order to reduce the thermal resistance generated by the contact between the heat pipe 22 and the radiating block 21, the transverse connection part of the heat pipe 22 and the radiating air duct on the radiating block 21 is soldered on the contact surface between the heat pipe 22 and the circular hole;
because the liquid cooling base 1 and the heat pipe heat sink 2 are both made of aluminum alloy, the surface of the aluminum alloy is easy to oxidize to affect welding; therefore, nickel plating is carried out on the surfaces of the liquid cooling base 1 and the heat pipe radiating piece 2 before welding, and the nickel plating layer has good oxidation resistance and has the advantages of quick tin plating, bright welding layer, firm welding and the like;
s5: degassing the heat pipe 22 through an air tap and filling alcohol; and after the air tap is sealed, the cooling medium of the heat pipe 22 is filled.
Through the steps, the thermal resistance of the radiator is the lowest, the radiating performance is the best, and the normal use of the communication equipment under the vehicle-mounted or field condition is ensured.
The present invention is not described in detail in the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an active passive dual-purpose liquid cooling radiator for the heat dissipation of chip, characterized by: comprises a liquid cooling base and a heat pipe heat sink; the liquid cooling base consists of a substrate and a cover plate, wherein a cooling water tank is arranged on the substrate, the substrate is hermetically connected with the cover plate to form a cooling water channel, and the cooling water channel is detachably connected with an external cooling liquid circulating device; the substrate is connected with the chip and used for absorbing heat; the cover plate is provided with a plurality of semicircular grooves on one surface far away from the substrate; the heat pipe radiating piece comprises a radiating block and a plurality of heat pipes; a plurality of radiating air channels are arranged on the side surface of the radiating block, and a plurality of semicircular grooves corresponding to the cover plate are arranged on the bottom surface of the radiating block; the bottom surface of the heat dissipation block is connected with the cover plate, and a circular hole is formed between the bottom surface of the heat dissipation block and the corresponding semicircular groove between the cover plate; the heat pipe is square ring, one long edge of the heat pipe crosses the heat dissipation air duct of the heat dissipation block, and the other long edge is located in the round hole.
2. The active and passive dual-purpose liquid-cooled heat sink of claim 1, wherein: the cooling water tank comprises a plurality of branch water tanks which are arranged in parallel, and two ends of each branch water tank are respectively communicated with a water inlet and a water outlet of the cooling water tank; and quick joints are respectively arranged on the water inlet and the water outlet of the cooling water tank.
3. The active and passive dual-purpose liquid-cooled heat sink of claim 2, wherein: the base plate, the cover plate, the radiating block and the heat pipe are all made of aluminum alloy, wherein the base plate, the cover plate and the radiating block are welded into a whole by facing.
4. A method of manufacturing the heat sink of claim 3, wherein: the method comprises the following steps:
s1: respectively machining the base plate, the cover plate and the radiating block; wherein, the planeness of the connecting surface between the substrate and the cover plate is less than 0.1, and the roughness is less than 0.8 micron;
s2: the heat pipe penetrates through the heat dissipation block, and the heat pipe is bent, welded and subjected to leak detection, so that the heat dissipation piece of the heat pipe is manufactured;
s3: performing vacuum brazing on the connecting surface of the base plate and the cover plate, and performing missed detection on the connecting surface to finish the manufacture of the liquid cooling base;
s4: plating nickel on the surfaces of the liquid cooling base and the heat pipe radiating piece, then coating soldering paste on the combined surface of the liquid cooling base and the heat pipe radiating piece, and performing soldering after the temperature is raised to complete the integral welding of the radiator;
s5: the heat pipe is degassed and filled with cooling medium.
5. A method of manufacture as claimed in claim 4, wherein: in S1, the heat dissipation air duct of the heat dissipation block is formed by cold extrusion.
6. A method of manufacture as claimed in claim 4, wherein: in S4, the cross connection between the heat pipe and the heat dissipation air duct of the heat dissipation block is soldered to the contact surface between the heat pipe and the circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010868245.1A CN111970908A (en) | 2020-08-26 | 2020-08-26 | Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010868245.1A CN111970908A (en) | 2020-08-26 | 2020-08-26 | Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN111970908A true CN111970908A (en) | 2020-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010868245.1A Pending CN111970908A (en) | 2020-08-26 | 2020-08-26 | Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114623709A (en) * | 2021-11-22 | 2022-06-14 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050141196A1 (en) * | 2003-12-17 | 2005-06-30 | Takaaki Yamatani | Liquid cooling system and electronic equipment using the same |
| US20070289719A1 (en) * | 2006-05-24 | 2007-12-20 | Asustek Computer Inc. | Cooling apparatus and system thereof |
| CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air cooling and liquid cooling dual-purpose heat radiator |
| CN104125743A (en) * | 2013-04-23 | 2014-10-29 | 华为技术有限公司 | Heat radiation system of communication device |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN105899050A (en) * | 2016-06-12 | 2016-08-24 | 厦门市福工动力技术有限公司 | Motor controller for new energy automobile |
| CN111372426A (en) * | 2020-03-13 | 2020-07-03 | 肇庆学院 | Liquid cooling heat abstractor of electromechanical device |
-
2020
- 2020-08-26 CN CN202010868245.1A patent/CN111970908A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050141196A1 (en) * | 2003-12-17 | 2005-06-30 | Takaaki Yamatani | Liquid cooling system and electronic equipment using the same |
| US20070289719A1 (en) * | 2006-05-24 | 2007-12-20 | Asustek Computer Inc. | Cooling apparatus and system thereof |
| CN104125743A (en) * | 2013-04-23 | 2014-10-29 | 华为技术有限公司 | Heat radiation system of communication device |
| CN103629851A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Air cooling and liquid cooling dual-purpose heat radiator |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN105899050A (en) * | 2016-06-12 | 2016-08-24 | 厦门市福工动力技术有限公司 | Motor controller for new energy automobile |
| CN111372426A (en) * | 2020-03-13 | 2020-07-03 | 肇庆学院 | Liquid cooling heat abstractor of electromechanical device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114623709A (en) * | 2021-11-22 | 2022-06-14 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
| CN114623709B (en) * | 2021-11-22 | 2023-12-01 | 祥博传热科技股份有限公司 | Heat pipe installation process of heat pipe radiator |
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Application publication date: 20201120 |
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