CN219536653U - Liquid cooling assembly, power module and power conversion equipment - Google Patents

Abstract

The utility model discloses a liquid cooling assembly, a power module and power conversion equipment. The liquid cooling assembly comprises an upper plate provided with a first liquid cooling sub flow channel, a lower plate provided with a second liquid cooling sub flow channel, and a temperature equalizing module arranged on one side of the upper plate away from the lower plate; the lower plate is connected with one side of the upper plate, which is provided with a first liquid cooling sub-runner, and the first liquid cooling sub-runner and the second liquid cooling sub-runner are arranged in mirror symmetry. According to the technical scheme, when the upper plate and the lower plate are in sealing connection, the first liquid cooling sub flow channel and the second liquid cooling sub flow channel are enclosed together to form a complete total flow channel, so that the cross section area of the total flow channel is larger, the flow rate of cooling liquid is increased, the heat dissipation efficiency is improved, and the heat dissipation effect is improved. Radiating fins can be further arranged between the first liquid cooling sub-runner and the second liquid cooling sub-runner, so that the radiating effect can be further improved. In addition, through setting up the samming module, the heat source spare can be stably installed on samming module to further promoted the radiating effect.

Description

Liquid cooling assembly, power module and power conversion equipment

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a liquid cooling assembly, a power module applying the liquid cooling assembly and power conversion equipment applying the power module.

Background

Along with the rising of new energy industries such as photovoltaic, wind power, energy storage and the like, equipment such as an inverter, a wind power converter, an energy storage converter and the like is iterated continuously towards a high-power and integrated direction to meet large-scale grid-connected requirements, the conventional air cooling heat dissipation or heat pipe heat dissipation mode is more and more difficult to meet industry development requirements, and a liquid cooling plate heat dissipation scheme is favored by practitioners. However, the liquid cooling plate in the prior art only processes the liquid cooling flow channel on one of the substrates, thereby resulting in poor heat dissipation effect.

Disclosure of Invention

The utility model mainly aims to provide a liquid cooling assembly, which aims to solve the problem of poor heat dissipation effect of a liquid cooling plate.

In order to achieve the above purpose, the liquid cooling assembly provided by the utility model comprises an upper plate, a lower plate and a temperature equalizing module, wherein the upper plate is provided with a first liquid cooling sub flow channel; the lower plate is connected with one side of the upper plate, provided with the first liquid cooling sub-flow passage, and one side of the lower plate facing the upper plate is provided with a second liquid cooling sub-flow passage, and the first liquid cooling sub-flow passage and the second liquid cooling sub-flow passage are arranged in a mirror symmetry manner; the temperature equalizing module is arranged on one side of the upper plate, which is away from the lower plate.

Optionally, a heat-conducting silicone grease is disposed on a side of the temperature-equalizing module away from the upper plate, and the heat-conducting silicone grease is disposed between the temperature-equalizing module and the heat source member.

Optionally, the temperature equalizing module is an aluminum plate, a copper plate or a temperature equalizing plate with a vacuum cavity.

Optionally, the thickness dimension of the upper plate is H1, H1 is more than or equal to 1mm and less than or equal to 2mm; the thickness dimension of the lower plate is H2, H1 is more than or equal to 1mm and less than or equal to 2mm;

and/or the upper plate forms a first liquid coolant channel through stamping, and the lower plate forms a second liquid coolant channel through stamping;

and/or, the upper plate and the lower plate are both Al3003 plates.

Optionally, the liquid cooling assembly further includes a heat dissipation fin, where the heat dissipation fin is disposed in a space formed by the first liquid cooling sub-flow channel and the second liquid cooling sub-flow channel.

Optionally, the heat dissipation fin is welded to the upper plate and/or the lower plate.

Optionally, the temperature equalizing modules and the radiating fins are all arranged at intervals, and the projection of each temperature equalizing module and one radiating fin on the upper plate is at least partially overlapped.

Optionally, a solder layer is disposed on a side of the upper plate facing the lower plate or a side of the lower plate facing the upper plate;

and/or, a solder layer is arranged on one side of the temperature equalizing module, which faces the upper plate.

Optionally, the liquid cooling assembly further comprises a water inlet pipe and a water outlet pipe, one end of the water inlet pipe is communicated with one end of the first liquid cooling sub flow channel or one end of the second liquid cooling sub flow channel, and the other end of the water inlet pipe extends out of a space formed by the upper plate and the lower plate in a surrounding mode; one end of the water outlet pipe is communicated with the other end of the first liquid cooling sub flow channel or the second liquid cooling sub flow channel, and the other end of the water outlet pipe extends out of a space formed by the upper plate and the lower plate in a surrounding mode.

Optionally, a connecting column is convexly arranged on one side of the upper plate, which is away from the lower plate, and the connecting column is used for being connected with the heat source piece through a connecting piece.

The utility model also provides a power module which comprises a heat source and the liquid cooling assembly, wherein the heat source component is arranged on one side of the temperature equalizing module, which is away from the upper plate.

The utility model also provides power conversion equipment comprising the power module.

According to the technical scheme, the first liquid cooling sub flow channel and the second liquid cooling sub flow channel are respectively arranged on one side of the upper plate, which faces the lower plate, and one side of the lower plate, which faces the upper plate, and are arranged in a mirror symmetry mode, when the upper plate is in sealing connection with the lower plate, the first liquid cooling sub flow channel and the second liquid cooling sub flow channel are enclosed together to form a complete total flow channel, the cross section area of the total flow channel is larger, the flow rate of cooling liquid is increased, the heat dissipation efficiency is improved, and the heat dissipation effect is improved. Further, through still setting up the samming module in one side that the upper plate deviates from the lower plate, then can install the heat source spare on samming module on the one hand to can install on comparatively smooth surface when guaranteeing the heat source spare installation, improve the steadiness of heat source spare installation, on the other hand has still increased heat radiating area, has further promoted the radiating effect.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a partially exploded view of one embodiment of a liquid cooling module according to the present utility model;

FIG. 2 is a schematic view of the structure of the upper plate facing the lower plate in the liquid cooling assembly of the present utility model;

FIG. 3 is a schematic diagram of a structure of a liquid cooling module according to the present utility model in which the heat dissipation fins are staggered fins;

FIG. 4 is a schematic view of a cooling fin of the liquid cooling module according to the present utility model;

FIG. 5 is a schematic view of a heat dissipating fin of the liquid cooling module according to the present utility model;

FIG. 6 is a top view of the liquid cooling module of the present utility model with a heat source mounted thereon;

FIG. 7 is a schematic diagram of a power module according to an embodiment of the utility model;

fig. 8 is a schematic diagram of a partially exploded structure of an embodiment of a power module according to the present utility model.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Liquid cooling assembly	110	Upper plate
111	First liquid cooling sub-flow channel	112	Connecting column
				120	Lower plate	121	Second liquid cooling sub-runner
130	Uniform temperature module	140	Radiating fin
				141	Heat sink	142	Needle-like heat dissipation column
143	Substrate board	144	Heat radiation plate
				150	Water inlet pipe	160	Water outlet pipe
200	Heat source piece	300	Shell body

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The present utility model proposes a liquid cooling assembly 100.

In the embodiment of the present utility model, referring to fig. 1 and 2 in combination, the liquid cooling assembly 100 includes an upper plate 110, a lower plate 120, and a temperature equalizing module 130, where the upper plate 110 is provided with a first liquid cooling sub-channel 111; the lower plate 120 is connected to the side of the upper plate 110, where the first liquid cooling sub-channel 111 is provided, and the side of the lower plate 120 facing the upper plate 110 is provided with a second liquid cooling sub-channel 121, where the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121 are arranged in mirror symmetry; the temperature equalizing module 130 is disposed on a side of the upper plate 110 facing away from the lower plate 120.

After the upper plate 110 and the lower plate 120 are mutually covered, since the first liquid cooling sub-channel 111 is formed on one side of the upper plate 110 facing the lower plate 120, the second liquid cooling sub-channel 121 is formed on one side of the lower plate 120 facing the upper plate 110, and the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121 are in mirror symmetry, the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121 can be jointly enclosed to form a total channel for cooling liquid to flow, and the cross-sectional area of the total channel is further made larger, so that the flow rate of cooling liquid is larger, the heat dissipation efficiency is improved, and the heat dissipation effect is improved. Specifically, the shape of the first liquid coolant channel 111 may be a straight shape, a U shape, a serpentine shape, or the like, which is not particularly limited herein. Similarly, the second liquid coolant channel 121 may have a straight shape, a U shape, a serpentine shape, or the like. The upper plate 110 and the lower plate 120 may be the same or different in material and thickness. In order to ensure the consistency of the welding of the upper plate 110 and the lower plate 120 and to realize the consistency of the two edge components, the upper plate 110 and the lower plate 120 are made of the same material and have the same thickness. For example, the upper plate 110 and the lower plate 120 may be made of aluminum materials, copper materials, or the like with good heat conductivity, and further, for cost saving, the upper plate 110 and the lower plate 120 may be made of Al3003, al6061, al6063, or the like. The first liquid coolant channel 111 and the second liquid coolant channel 121 can be processed in the same manner. For example, the first liquid coolant channel 111 and the second liquid coolant channel 121 may be formed by conventional milling processes, or may be formed by stamping using a die. It can be appreciated that by stamping the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121, on one hand, the processing time and the cost can be shortened, and on the other hand, the cross-sectional areas of the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121 are larger, so that the flow of the cooling liquid is increased, and the heat dissipation efficiency and the heat dissipation effect are further improved.

In addition, by arranging the temperature equalizing module 130 on the side of the upper plate 110 away from the lower plate 120, the heat source component 200 can be installed on the upper surface of the temperature equalizing module 130, so that on one hand, the temperature equalizing module 130 provides a relatively flat installation reference surface for the installation of the heat source component 200, and on the other hand, the heat dissipation area is increased, and the heat dissipation effect is further improved. Specifically, the temperature equalizing module 130 may be an aluminum plate, a copper plate, or a temperature equalizing plate having a vacuum chamber. It should be noted that, the temperature equalization plate in the technical scheme of the present utility model is a technology known to those skilled in the art, and thus will not be described in detail.

According to the technical scheme of the utility model, the first liquid sub-runner 111 and the second liquid sub-runner 121 are respectively arranged on one side of the upper plate 110, which faces the lower plate 120, and one side of the lower plate 120, which faces the upper plate 110, and the first liquid sub-runner 111 and the second liquid sub-runner 121 are arranged in a mirror symmetry manner, so that when the upper plate 110 and the lower plate 120 are in sealing connection, the first liquid sub-runner 111 and the second liquid sub-runner 121 are enclosed together to form a complete total runner, the cross-sectional area of the total runner is larger, the flow of cooling liquid is increased, the heat dissipation efficiency is improved, and the heat dissipation effect is improved. Further, through still setting up samming module 130 in the side that upper plate 110 deviates from lower plate 120, then on the one hand can install heat source spare 200 on samming module 130 to can install on comparatively flat surface when guaranteeing heat source spare 200 installation, improve heat source spare 200 installation's steadiness, on the other hand has still increased heat radiating area, has further promoted the radiating effect.

Further, a heat-conducting silicone grease (not shown) is disposed on a side of the temperature equalizing module 130 away from the upper plate 110, and the heat-conducting silicone grease is disposed between the temperature equalizing module 130 and the heat source 200.

It can be appreciated that, in order to ensure that the liquid cooling assembly 100 in the technical solution of the present utility model has a better heat dissipation effect on the heat source element 200, the heat source element 200 may be disposed on a side of the temperature equalizing module 130 away from the upper plate 110. Specifically, when the heat source 200 is a power device, if there are a plurality of power devices and they are disposed at intervals, the temperature equalizing module 130 may also be disposed at intervals on the side of the upper plate 110 facing away from the lower plate 120. Further, by arranging the heat-conducting silicone grease on the side of the temperature equalizing module 130 away from the upper plate 110, and arranging the heat-conducting silicone grease between the temperature equalizing module 130 and the heat source member 200, the heat emitted by the heat source member 200 can be further dissipated through the heat-conducting silicone grease, so that the heat dissipation effect is improved.

In order to reduce the weight and the cost, the thickness dimension of the upper plate 110 in the technical scheme of the utility model is H1, H1 is more than or equal to 1mm and less than or equal to 2mm; the thickness dimension of the lower plate 120 is H2, H1 is more than or equal to 1mm and less than or equal to 2mm.

The thickness dimension H1 of the upper plate 110 may be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2mm. The thickness dimension H2 of the lower plate 120 may also be 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, or 2mm. By such arrangement, the thickness dimension of the upper plate 110 and the lower plate 120 is not excessively large, so that the weight and cost of the liquid cooling assembly 100 can be reduced, and the first liquid cooling sub flow channel 111 and the second liquid cooling sub flow channel 121 can be conveniently formed through a stamping process; on the other hand, the thickness of the upper plate 110 and the lower plate 120 is not too small, so that the strength of the liquid cooling assembly 100 can be ensured.

Further, as shown in fig. 1, the liquid cooling assembly 100 further includes a heat dissipation fin 140, where the heat dissipation fin 140 is disposed in a space formed by the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121.

By providing the heat radiation fins 140 in the space defined by the first liquid cooling sub-flow passage 111 and the second liquid cooling sub-flow passage 121, the heat radiation effect of the liquid cooling assembly 100 on the heat source member 200 is further improved. In order not to affect the flow of the cooling liquid between the upper plate 110 and the lower plate 120, referring to fig. 3 to 5, the heat dissipation fins 140 may include a plurality of heat dissipation fins 141, needle-shaped heat dissipation columns 142 or heat dissipation plates 144 arranged at intervals, and the intervals between two adjacent heat dissipation fins 141 or needle-shaped heat dissipation columns 142 are communicated with the liquid inlet and the liquid outlet of the first liquid coolant channel 111; the liquid inlet and the liquid outlet of the second liquid cooling sub-channel 121 are communicated with the intervals between two adjacent cooling fins 141, needle-shaped cooling columns 142 or cooling plates 144. As shown in fig. 4 and 5, when a plurality of needle-shaped heat dissipation columns 142 or heat dissipation plates 144 are disposed at intervals, bottom ends of the needle-shaped heat dissipation columns 142 or heat dissipation plates 144 may be connected to the substrate 143. Further, when the substrate 143 is provided with a plurality of needle-shaped heat dissipation columns 142, and the plurality of needle-shaped heat dissipation columns 142 are arranged in a plurality of rows, the needle-shaped heat dissipation columns 142 of two adjacent rows may be disposed opposite to each other or may be disposed in a staggered manner. I.e., the heat dissipation fins 140 may be staggered fins (as shown in fig. 3), pin fins (as shown in fig. 4, i.e., conventional Pin fin fins), or profile plate fins (as shown in fig. 5).

Further, the heat radiating fins 140 are welded to the upper plate 110 and/or the lower plate 120. By the arrangement, the cooling liquid is prevented from flushing the radiating fins 140 in the flowing process, so that the positions of the radiating fins 140 are offset, the stability of the installation of the radiating fins 140 between the upper plate 110 and the lower plate 120 is further realized, and the radiating of a specific area is ensured. Specifically, for the staggered tooth fin, the material of the staggered tooth fin can be provided with double-sided solder layers, so that a soldering lug is not required to be additionally arranged outside; for pin fins, welding tabs may be provided on both the side that is attached to the upper plate 110 and the side that is attached to the lower plate 120, so that the pin fins can be welded to both the upper plate 110 and the lower plate 120.

Further, as shown in fig. 1, a plurality of temperature equalizing modules 130 and heat dissipating fins 140 are disposed at intervals, and each temperature equalizing module 130 is at least partially overlapped with a projection of a heat dissipating fin 140 on the upper plate 110.

Through at least partially overlapping the projections of each temperature equalizing module 130 and a heat dissipating fin 140 on the upper plate 110, each temperature equalizing module 130 and a heat dissipating fin 140 can be correspondingly arranged in the up-down direction, so that the temperature equalizing modules 130 and the heat dissipating fins 140 which are correspondingly arranged in the up-down direction can simultaneously and accurately dissipate heat of the heat source piece 200 arranged on the temperature equalizing module 130, and further a better heat dissipation effect is achieved.

Further, a side of the upper plate 110 facing the lower plate 120 or a side of the lower plate 120 facing the upper plate 110 is provided with a solder layer (not shown).

By the arrangement, the connection between the upper plate 110 and the lower plate 120 is firmer, and the connection between the upper plate 110 and the lower plate 120 is ensured to have better sealing performance, so that the cooling liquid entering between the upper plate 110 and the lower plate 120 is prevented from flowing out from the connection between the upper plate 110 and the lower plate 120. Of course, it is understood that in other embodiments, other connection modes, such as clamping, bonding, etc., may be adopted when the upper plate 110 is connected to the lower plate 120, and a sealing ring may be interposed between the upper plate 110 and the lower plate 120, so as to ensure that a better sealing effect can be still obtained after the upper plate 110 is connected to the lower plate 120.

It is understood that the side of the temperature equalizing module 130 facing the upper plate 110 may also be provided with a solder layer. By this arrangement, the connection between the temperature equalizing module 130 and the upper plate 110 is more stable. Of course, it is understood that in other embodiments, the temperature equalizing module 130 and the upper plate 110 may be connected by other methods, such as clamping, bonding, etc.

Specifically, before welding, parts of the liquid cooling assembly can be stacked according to an assembly sequence, and after being compressed by a special welding tool, the parts can be placed on a welding frame in batches, and the parts are fed into a continuous brazing furnace to be welded by a crawler, wherein the welding flux of a welding flux layer is heated and melted, the melted welding flux is adhered to two parts to be welded, and then the welding flux is condensed after being cooled, so that the welding sealing effect among the parts can be realized. Wherein the welding process is performed in a continuous brazing furnace with a higher efficiency than when welding is performed in a vacuum furnace.

Referring to fig. 1, 6 and 7 in combination, in order to facilitate the introduction of the cooling liquid into the first liquid cooling sub-channel 111 and the second liquid cooling sub-channel 121, the liquid cooling assembly 100 according to the present utility model further includes a water inlet pipe 150 and a water outlet pipe 160, wherein one end of the water inlet pipe 150 is communicated with one end of the first liquid cooling sub-channel 111 or the second liquid cooling sub-channel 121, and the other end of the water inlet pipe 150 extends out of a space formed by the upper plate 110 and the lower plate 120; one end of the water outlet pipe 160 is communicated with the other end of the first liquid cooling fluidic channel 111 or the second liquid cooling fluidic channel 121, and the other end of the water outlet pipe 160 extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding manner.

Specifically, one end of the water inlet pipe 150 is communicated with one end of the first liquid cooling sub-channel 111, and the other end extends out of a space formed by the upper plate 110 and the lower plate 120; one end of the water outlet pipe 160 is communicated with the other end of the first liquid cooling sub-channel 111, and the other end of the water outlet pipe 160 extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding mode. Or, one end of the water inlet pipe 150 is communicated with one end of the second liquid cooling sub-channel 121, and the other end extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding manner; one end of the water outlet pipe 160 is communicated with the other end of the second liquid coolant flow channel 121, and the other end of the water outlet pipe 160 extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding mode. Alternatively, one end of the water inlet pipe 150 is communicated with one end of the first liquid cooling sub-channel 111, and the other end extends out of a space formed by the upper plate 110 and the lower plate 120; one end of the water outlet pipe 160 is communicated with one end of the second liquid coolant channel 121, which is far away from the water inlet pipe 150, and the other end of the water outlet pipe 160 extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding manner. Alternatively, one end of the water inlet pipe 150 is communicated with one end of the second liquid cooling sub-channel 121, and the other end extends out of a space formed by the upper plate 110 and the lower plate 120; one end of the water outlet pipe 160 is communicated with one end of the first liquid cooling sub-runner 111 away from the water inlet pipe 150, and the other end of the water outlet pipe 160 extends out of a space formed by the upper plate 110 and the lower plate 120 in a surrounding mode.

By the arrangement, the water inlet pipe 150 and the water outlet pipe 160 can be conveniently connected with an external pipeline system, so that cooling liquid can enter a space formed by enclosing the first liquid cooling sub-flow passage 111 and the second liquid cooling sub-flow passage 121 from the water inlet pipe 150, and the cooling liquid after heat exchange can flow out from the water outlet pipe 160. Specifically, the water inlet pipe 150 and the water outlet pipe 160 may be bent pipes or straight pipes.

Further, as shown in fig. 1, a connection post 112 is protruded at a side of the upper plate 110 facing away from the lower plate 120, and the connection post 112 is connected to the heat source member 200 through a connection member.

By providing the connection column 112 protruding from the side of the upper plate 110 facing away from the lower plate 120, the connection column 112 is prevented from blocking the flow of the cooling liquid, and the heat source 200 can be connected to the connection column 112 by the connection member, so that the connection effect between the heat source 200 and the liquid cooling assembly 100 is achieved.

The present utility model also proposes a power module, please refer to fig. 7 and 8, the power module includes a heat source 200 and a liquid cooling assembly 100, and the specific structure of the liquid cooling assembly 100 refers to the above embodiment. The heat source member 200 is installed at a side of the temperature equalization module 130 facing away from the upper plate 110.

The heat source member 200 generates heat during operation, and the heat source member 200 is mounted on one side of the temperature equalizing module 130 away from the upper plate 110, so that heat can be dissipated through the temperature equalizing module 130, and heat can be exchanged with the cooling liquid in the first liquid cooling sub-flow channel 111 and the second liquid cooling sub-flow channel 121 in the liquid cooling assembly 100, so that the cooling liquid takes away the heat on the heat source member 200, and a heat dissipation effect on the heat source member 200 is realized.

Further, as shown in fig. 8, the power module further includes a housing 300, the housing 300 has a mounting cavity, and the heat source member 200 and the liquid cooling assembly 100 are disposed in the mounting cavity. By this arrangement, a good protection effect for the heat source 200 and the liquid cooling module 100 can be achieved. Further, the installation cavity is provided with an opening, and the lower plate 120 of the liquid cooling assembly 100 is arranged at the opening and seals the opening. On one hand, the heat source 200 and the liquid cooling assembly 100 inside the shell 300 are in contact with the outside, so that heat dissipation is facilitated; on the other hand, the heat source member 200 can be protected inside the housing 300, and the heat source member 200 is prevented from being damaged by external force or wet by dust and rainwater.

The utility model also provides a power conversion device, which comprises a power module, wherein the specific structure of the power module refers to the embodiment, and because the power conversion device adopts all the technical schemes of all the embodiments, the power conversion device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the detailed description is omitted. Specifically, the power conversion device may be an inverter, a converter, or the like.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims (12)

1. A liquid cooling assembly, comprising:

the upper plate, one side of the said upper plate has the first liquid cooling flow channel;

the lower plate is connected with one side of the upper plate, provided with the first liquid cooling sub-flow passage, and one side of the lower plate facing the upper plate is provided with a second liquid cooling sub-flow passage, and the first liquid cooling sub-flow passage and the second liquid cooling sub-flow passage are arranged in a mirror symmetry manner; and

and the temperature equalizing module is arranged on one side of the upper plate, which is away from the lower plate.

2. The liquid cooling assembly of claim 1, wherein a side of the temperature equalization module facing away from the upper plate is provided with a thermally conductive silicone grease disposed between the temperature equalization module and the heat source member.

3. The liquid cooling assembly of claim 1, wherein the temperature equalization module is an aluminum plate, a copper plate, or a temperature equalization plate with a vacuum chamber.

4. The liquid cooling assembly of claim 1, wherein the upper plate has a thickness dimension H1,1mm < H1 < 2mm; the thickness dimension of the lower plate is H2, H1 is more than or equal to 1mm and less than or equal to 2mm;

and/or the upper plate forms a first liquid coolant channel through stamping, and the lower plate forms a second liquid coolant channel through stamping;

and/or, the upper plate and the lower plate are both Al3003 plates.

5. The liquid cooling assembly of claim 1, further comprising a heat sink fin disposed within a space defined by the first liquid cooling sub-flow passage and the second liquid cooling sub-flow passage.

6. The liquid cooling assembly of claim 5, wherein the heat sink fins are welded to the upper plate and/or the lower plate.

7. The liquid cooling assembly of claim 6, wherein a plurality of temperature equalizing modules and heat radiating fins are arranged at intervals, and each temperature equalizing module is at least partially overlapped with the projection of one heat radiating fin on the upper plate.

8. The liquid cooling assembly according to any one of claims 1 to 7, wherein a side of the upper plate facing the lower plate or a side of the lower plate facing the upper plate is provided with a solder layer;

and/or, a solder layer is arranged on one side of the temperature equalizing module, which faces the upper plate.

9. The liquid cooling assembly according to any one of claims 1 to 7, further comprising a water inlet pipe and a water outlet pipe, wherein one end of the water inlet pipe is communicated with one end of the first liquid cooling sub-runner or the second liquid cooling sub-runner, and the other end of the water inlet pipe extends out of a space formed by the upper plate and the lower plate in a surrounding manner;

one end of the water outlet pipe is communicated with the other end of the first liquid cooling sub flow channel or the second liquid cooling sub flow channel, and the other end of the water outlet pipe extends out of a space formed by the upper plate and the lower plate in a surrounding mode.

10. The liquid cooling assembly according to any one of claims 1 to 7, wherein a side of the upper plate facing away from the lower plate is convexly provided with a connection post for connection with a heat source member through a connection member.

11. A power module comprising a heat source and a liquid cooling assembly according to any one of claims 1 to 10, wherein the heat source is mounted on a side of the temperature equalization module facing away from the upper plate.

12. A power conversion device comprising the power module of claim 11.