CN214279960U

CN214279960U - Liquid cooling radiator with integrated water cooling module

Info

Publication number: CN214279960U
Application number: CN202120572700.3U
Authority: CN
Inventors: 夏波涛; 曾茂进; 王捷; 胡利辉; 骆凯; 韩豪雷
Original assignee: Xiangbo Heat Transfer Technology Co ltd
Current assignee: Xiangbo Heat Transfer Technology Co ltd
Priority date: 2021-03-19
Filing date: 2021-03-19
Publication date: 2021-09-24
Anticipated expiration: 2031-03-19

Abstract

The utility model relates to a liquid cooling radiator with integrated water cooling module, which comprises a radiator base body and an IGBT integrated module; the IGBT integrated module comprises an IGBT module and a fin substrate welded on the IGBT module; the radiator base body is provided with a mounting groove for mounting the IGBT integrated module and a fin groove for mounting the fin substrate; a plurality of sealing rings for sealing each IGBT module are further arranged in the radiator base body; the cooling liquid enters from the water nozzle of the radiator base body, flows through the fin grooves, exchanges heat with the fins on the fin base plate and then flows out from the other water nozzle, and heat dissipation of the IGBT module is achieved.

Description

Liquid cooling radiator with integrated water cooling module

Technical Field

The utility model relates to a liquid cooling radiator, concretely relates to liquid cooling radiator of water-cooling module integration.

Background

The IGBT module double-sided compression joint heat dissipation liquid cooling radiator is connected through scribbling heat conduction silicone grease and design insulation system or other forms's insulation and heat dissipation in module both sides. Because thermal contact resistance exists between the surface of the IGBT module and the surface of the radiator, heat-conducting glue is generally arranged between the surface of the module and the surface of the radiator or heat-conducting silicone grease is coated on the surface of the module and the surface of the radiator so as to reduce the thermal resistance and improve the heat-conducting performance, and cooling liquid flows through a flow channel to take away heat on two sides of the module. But this kind of structure is when the IGBT high-power consumption is great and the area is less when heat current density is great, sets up heat conduction glue or scribble heat conduction silicone grease through above-mentioned mode and all can't be fine reach the heat dissipation demand, and the life of heat conduction silicone grease is two to three years mostly moreover, and especially under long-term high temperature condition, the longer heat conduction efficiency is worse more.

In view of the above, there is a need for a heat sink with significantly improved lifetime and improved heat transfer efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a liquid cooling radiator of water-cooling module integration to the above-mentioned problem that exists among the prior art.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: a liquid cooling radiator with integrated water cooling module comprises a radiator base body and an IGBT integrated module; the IGBT integrated module comprises an IGBT module and a fin substrate welded on the IGBT module; the radiator base body is provided with a mounting groove for mounting the IGBT integrated module and a fin groove for mounting the fin substrate; a plurality of sealing rings for sealing each IGBT module are further arranged in the radiator base body; and the cooling liquid enters from the water nozzle of the radiator base body, flows through the fin groove, exchanges heat with the fins on the fin substrate and flows out from the other water nozzle, so that the heat dissipation of the IGBT module is realized.

The working principle and the beneficial effects are as follows: 1. compared with the original mode of filling the gap between the IGBT module and the fin substrate by adopting heat-conducting glue or heat-conducting silicone grease, the IGBT integrated module structure has the advantages that by adopting the welding mode, the heat-conducting coefficient is higher than that of the heat-conducting glue and the heat-conducting silicone grease, the heat-conducting efficiency can be obviously improved, the heat-radiating upper limit capacity of a radiator is improved, the service life is far longer than that of the prior art, manual coating is not needed, the liquid solder can be adopted in the welding mode, and the welding is convenient;

2. the size of the fin substrate is inconvenient to control by adopting the heat-conducting glue and the heat-conducting silicone grease, so that size deviation is easily caused, the condition that the fin substrate cannot be assembled by the fin substrate possibly exists, and the assembly requirement of workers is higher;

3. the scheme is not only suitable for double-sided IGBT heat dissipation, but also suitable for single-sided IGBT heat dissipation, is particularly suitable for conventional liquid cooling heat dissipation, and is more suitable for vehicle heat dissipation with small volume and high power density;

4. the modular arrangement enables mass production of the parts, thereby reducing the cost of the single piece.

Further, the heat sink base body comprises an upper heat sink and a lower heat sink detachably connected with the upper heat sink; fin substrates are welded on the upper surface and the lower surface of the IGBT module; an installation groove for installing the IGBT integrated module and a fin groove for installing a fin substrate are formed between the upper radiator and the lower radiator, and a plurality of sealing rings for sealing each IGBT module are arranged between the upper radiator and the lower radiator; and cooling liquid enters from the water nozzles of the upper radiator or the lower radiator, flows through the fin grooves, exchanges heat with the fins on the fin substrate and flows out from the other water nozzle, so that the heat dissipation of the IGBT module is realized. This setting is applicable to two-sided heat radiation structure, when guaranteeing every IGBT module heat dissipation, also can better guarantee the water-proof effects of IGBT module.

Furthermore, each IGBT module corresponds to two fin substrates, and the fin grooves correspond to the fin substrates one to one. This setting, compact structure for the sealing washer is not located the fin inslot, can prevent that the sealing washer from being in high temperature environment for a long time, slows down the ageing speed of sealing washer, also can make upper and lower radiator can cooperate better with the sealing washer, need not to adopt bigger sealing washer.

Furthermore, every IGBT module all is equipped with two sealing washers all around, and two sealing washers are located every respectively the upper and lower two sides of IGBT module, just go up radiator and when lower radiator merges with every sealing washer interference fit. By adopting the arrangement, the double-sided heat dissipation structure is more compact in matching between the sealing ring and the radiator, and the waterproof effect of each IGBT module can be ensured.

Further, go up the radiator and include upper radiator apron and last radiator main part, lower radiator includes radiator apron and lower radiator main part down, all be equipped with the fin groove that supplies the installation of fin base plate on upper radiator main part and the lower radiator main part. This setting carries out more step refining to every radiator, and through setting up the fin groove in the radiator main part, the accessible mills etc. and processes and form, and radiator cover plate accessible is processed alone and forms, fixes two radiators about through radiator cover plate, reduces the processing degree of difficulty of single part, has also improved overall structure's maintainability.

Furthermore, the upper radiator cover plate and the upper radiator main body and the lower radiator cover plate and the lower radiator main body are fixedly connected through vacuum brazing. This setting utilizes the advantage of vacuum brazing, can show the use that reduces the metal brazing flux, also need not complicated solder flux and washs, has reduced manufacturing cost, and the heat conduction efficiency of brazing is far higher than heat conduction silicone grease and heat-conducting glue moreover, and life is far higher than heat conduction silicone grease and heat-conducting glue far away.

Further, the upper radiator and the lower radiator are fixed through a connecting piece. This setting for go up radiator and lower radiator can conveniently carry out the dismouting, and it is convenient to maintain.

Furthermore, a sealing groove for installing a sealing ring is formed in the periphery of each fin groove. This setting can make things convenient for the installation of sealing washer for can cooperate better between sealing washer and the radiator main part, improve sealing capacity.

Further, the fin substrate is provided with a Pin-fin structure. The Pin-fin is a copper substrate with a needle-shaped structure, can obviously improve the heat exchange efficiency with liquid, is a mature technology on the market, can be directly customized to a manufacturer, and does not need additional design cost.

Further, the sealing ring is a high-temperature resistant sealing ring. According to the arrangement, the high-temperature resistance of the sealing ring can be obviously improved, so that the service life of the sealing ring is prolonged, and particularly, the metal sealing ring is adopted, so that the service life is longer.

Drawings

Fig. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is an exploded view of one embodiment of the present invention;

FIG. 3 is a perspective view of the assembled FIG. 2;

FIG. 4 is a perspective view of another embodiment;

fig. 5 is a schematic view of the internal structure of fig. 4.

In the figure, 1, a radiator base; 2. an IGBT integrated module; 3. a water nozzle; 4. a seal ring; 5. mounting grooves; 6. fin grooves; 7. a bolt; 8. a nut; 9. a water inlet; 10. a water outlet; 11. an upper heat sink; 12. a lower heat sink; 13. a sealing groove; 111. an upper heat sink cover plate; 112. an upper heat sink body; 121. a lower heat sink cover plate; 122. a lower heat sink body; 21. an IGBT module; 22. and a fin substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art all belong to the protection scope of the present invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered limiting.

As shown in fig. 1, the liquid cooling radiator integrated with the water cooling module includes a radiator base 1 and an IGBT integrated module 2.

Specifically, the IGBT module 2 includes an IGBT module 21 and a fin substrate 22 soldered on the IGBT module 21, where the IGBT module 21 is in the prior art, and the fin substrate 22 is a common copper substrate with a Pin-fin structure, and is soldered on the IGBT module 21 by vacuum soldering or liquid solder to form the IGBT module 2, which improves heat conduction efficiency and prolongs service life.

Specifically, the radiator base body 1 is provided with a mounting groove 5 for mounting the IGBT integrated module 2 and a fin groove 6 for mounting the fin base plate 22, and by mounting the fin portion of the fin base plate 22 in the fin groove 6, the coolant enters from the water nozzle 3 of the radiator base body 1, flows through the fin groove 6, exchanges heat with the fin on the fin base plate 22, and then flows out from the other water nozzle 3, thereby realizing heat dissipation of the IGBT module 21.

Specifically, a plurality of sealing rings 4 for sealing each IGBT module 21 are further provided in the heat sink base 1, and in this embodiment, the sealing rings 4 are high-temperature resistant sealing rings 4. This setting can show the high temperature resistant ability that promotes sealing washer 4 to improve sealing washer 4's life, especially adopt metal sealing washer 4, life is longer, can also be the sealing washer 4 of other materials certainly.

Referring to fig. 2-3, in another embodiment, the heat sink base 1 includes an upper heat sink 11 and a lower heat sink 12 detachably connected to the upper heat sink 11; fin substrates 22 are welded on the upper surface and the lower surface of the IGBT module 21; an installation groove 5 for installing the IGBT integrated module 2 and a fin groove 6 for installing a fin substrate 22 are formed between the upper radiator 11 and the lower radiator 12, and a plurality of sealing rings 4 for sealing each IGBT module 21 are arranged between the upper radiator 11 and the lower radiator 12; the cooling liquid enters from the water nozzle 3 of the upper radiator 11 or the lower radiator 12, flows through the fin groove 6, exchanges heat with the fins on the fin substrate 22 and then flows out from the other water nozzle 3, and therefore heat dissipation of the IGBT module 21 is achieved. This setting is applicable to two-sided heat radiation structure, when guaranteeing every IGBT module 21 heat dissipation, also can better guarantee IGBT module 21's water-proof effects.

Specifically, each IGBT module 21 corresponds to two fin substrates 22, and the fin grooves 6 correspond to the fin substrates 22 one to one. This setting, compact structure for sealing washer 4 is not located fin groove 6, can prevent that sealing washer 4 from being in high temperature environment for a long time, slows down the ageing speed of sealing washer 4, also can make upper and lower radiator 12 can cooperate better with sealing washer 4, need not to adopt bigger sealing washer 4.

Specifically, each IGBT module 21 all is equipped with two sealing washer 4 all around, and two sealing washers 4 are located every the upper and lower two sides of IGBT module 21 respectively, just go up radiator 11 and when radiator 12 merges down with every sealing washer 4 interference fit, every fin groove 6 all is equipped with the seal groove 13 that supplies sealing washer 4 to install all around. This setting. By adopting the arrangement, the double-sided heat dissipation structure is more compact in matching between the sealing ring 4 and the radiator, and the waterproof effect of each IGBT module 21 can be ensured.

Specifically, the upper heat sink 11 includes an upper heat sink cover plate 111 and an upper heat sink main body 112, the lower heat sink 12 includes a lower heat sink cover plate 121 and a lower heat sink main body 122, and the upper heat sink main body 112 and the lower heat sink main body 122 are both provided with fin grooves 6 for mounting the fin base plate 22. This setting is more refined to every radiator, through setting up fin groove 6 on the radiator main part, the accessible mills etc. and processes and form, and radiator cover plate accessible is processed alone and forms, fixes two radiators about through radiator cover plate, reduces the processing degree of difficulty of single part, has also improved overall structure's maintainability. A channel for cooling liquid to flow is arranged between the two radiator main bodies and is communicated with the fin grooves 6, and the specific flow channel is set to be a conventional technical means and is not described again.

Specifically, the upper radiator cover 111 and the upper radiator main body 112, and the lower radiator cover 121 and the lower radiator main body 122 are fixedly connected by vacuum brazing. This setting utilizes the advantage of vacuum brazing, can show the use that reduces the metal brazing flux, also need not complicated solder flux and washs, has reduced manufacturing cost, and the heat conduction efficiency of brazing is far higher than heat conduction silicone grease and heat-conducting glue moreover, and life is far higher than heat conduction silicone grease and heat-conducting glue far away.

Specifically, the upper heat sink 11 and the lower heat sink 12 are fixed by bolts 7 and nuts 8. With the arrangement, the upper radiator 11 and the lower radiator 12 can be conveniently disassembled and assembled, and the maintenance is convenient.

Referring to fig. 4 and 5, in another single-side heat dissipation structure, the scheme is used in a conventional liquid-cooled radiator to dissipate heat of a single-side heat dissipation module, the IGBT integrated heat dissipation module is mounted on the liquid-cooled radiator through a connecting hole by using a screw, a fin groove 6 for mounting an IGBT substrate fin and a sealing groove 13 for mounting a sealing ring 4 are formed in a radiator cover plate, and the radiator is sealed by extruding the sealing ring 4 through the module. The cooling liquid enters the radiator from the water inlet 9, flows through the fins on the IGBT substrate, directly radiates the IGBT module 21, and then flows out from the water outlet 10. The heat dissipation device is suitable for the heat dissipation working conditions with high power, water cooling design and high requirement on heat resistance.

The part of the utility model which is not described in detail is the prior art, so the utility model does not detail the part.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Although the terms of the radiator base 1, the IGBT module 2, the water nozzle 3, the packing 4, the mounting groove 5, the fin groove 6, the bolt 7, the nut 8, the water inlet 9, the water outlet 10, the upper radiator 11, the lower radiator 12, the seal groove 13, the upper radiator cover 111, the upper radiator main body 112, the lower radiator cover 121, the lower radiator main body 122, the IGBT module 21, the fin base plate 22, and the like are used more herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by the teaching of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as the present invention, fall within the protection scope of the present invention.

Claims

1. A liquid cooling radiator with integrated water cooling modules is characterized by comprising a radiator base body and an IGBT integrated module; the IGBT integrated module comprises an IGBT module and a fin substrate welded on the IGBT module; the radiator base body is provided with a mounting groove for mounting the IGBT integrated module and a fin groove for mounting the fin substrate; a plurality of sealing rings for sealing each IGBT module are further arranged in the radiator base body; and the cooling liquid enters from the water nozzle of the radiator base body, flows through the fin groove, exchanges heat with the fins on the fin substrate and flows out from the other water nozzle, so that the heat dissipation of the IGBT module is realized.

2. The liquid-cooled heat sink with integrated water-cooling module as claimed in claim 1, wherein the heat sink base comprises an upper heat sink and a lower heat sink detachably connected to the upper heat sink; fin substrates are welded on the upper surface and the lower surface of the IGBT module; an installation groove for installing the IGBT integrated module and a fin groove for installing a fin substrate are formed between the upper radiator and the lower radiator, and a plurality of sealing rings for sealing each IGBT module are arranged between the upper radiator and the lower radiator; and cooling liquid enters from the water nozzles of the upper radiator or the lower radiator, flows through the fin grooves, exchanges heat with the fins on the fin substrate and flows out from the other water nozzle, so that the heat dissipation of the IGBT module is realized.

3. The liquid-cooled radiator with integrated water-cooling modules as claimed in claim 2, wherein each IGBT module corresponds to two fin substrates, and the fin grooves correspond to the fin substrates one to one.

4. The liquid cooling radiator with integrated water cooling module as claimed in claim 3, wherein each IGBT module is provided with two sealing rings around, the two sealing rings are respectively located on the upper and lower surfaces of each IGBT module, and the upper radiator and the lower radiator are in interference fit with each sealing ring when combined.

5. The liquid cooling radiator with integrated water cooling module as claimed in any one of claims 2 to 4, wherein the upper radiator comprises an upper radiator cover plate and an upper radiator main body, the lower radiator comprises a lower radiator cover plate and a lower radiator main body, and the upper radiator main body and the lower radiator main body are respectively provided with a fin groove for mounting a fin substrate.

6. The liquid-cooled radiator with integrated water-cooling module as claimed in claim 5, wherein the upper radiator cover plate and the upper radiator main body and the lower radiator cover plate and the lower radiator main body are fixedly connected by vacuum brazing.

7. The liquid-cooled radiator with integrated water-cooling module as claimed in claim 2, wherein the upper radiator and the lower radiator are fixed by a connecting member.

8. The liquid-cooled radiator with integrated water-cooling module as claimed in claim 5, wherein each fin groove is provided with a sealing groove around for installing a sealing ring.

9. The liquid-cooled heat sink with integrated water-cooling module as claimed in claim 1, wherein the fin substrate is provided with a Pin-fin structure.

10. The liquid-cooled heat sink with integrated water-cooling module as claimed in claim 1, wherein the sealing ring is a high temperature-resistant sealing ring.