CN209747503U - Integrated power module radiator - Google Patents
Integrated power module radiator Download PDFInfo
- Publication number
- CN209747503U CN209747503U CN201920193272.6U CN201920193272U CN209747503U CN 209747503 U CN209747503 U CN 209747503U CN 201920193272 U CN201920193272 U CN 201920193272U CN 209747503 U CN209747503 U CN 209747503U
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- radiator
- power module
- radiator body
- copper
- module
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Abstract
The utility model belongs to the electrical equipment field, concretely relates to integration power module radiator, including IGBT module and radiator body, IGBT module bottom plate be located radiator body top, radiator body below be equipped with the fin, the IGBT module with the radiator body between be equipped with the copper facing district, this kind of integration power module radiator can reduce the thermal resistance by a wide margin to improve efficiency, IGBT or MOS equipower chip of use, but the fractional power use, and then reduce cost, factor of safety is higher.
Description
Technical Field
The utility model belongs to the electrical equipment field, concretely relates to integration power module radiator.
background
The radiator is used for electrical equipment, prevents that electrical equipment from damaging because the bad electrical apparatus that causes of heat dissipation in the use, and current radiator is connected module and radiator through heat conduction silicone grease. The thermal resistance is very high, most of the power is wasted on heat consumption, in order to transfer the heat generated by the device (module) to the radiator as soon as possible, a large radiator is needed, the temperature difference between the heating device and the radiator is caused, the purpose of absorbing heat is achieved, and the radiating efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an integration power module radiator can reduce the thermal resistance by a wide margin to improve efficiency, the IGBT or power chips such as MOS of use, but the reduce power use, and then reduce cost, factor of safety is higher.
In order to realize the above purpose, the utility model discloses a technical scheme be: the utility model provides an integration power module radiator, includes IGBT module and radiator body, IGBT module bottom plate be located radiator body top, radiator body below be equipped with the fin, the IGBT module with radiator body between be equipped with the copper facing district.
Furthermore, a connecting bottom plate is arranged below the IGBT module, mounting holes are formed in the connecting bottom plate, and fixing holes corresponding to the mounting holes are formed in the radiator body.
Furthermore, the size and shape of the copper plating area are the same as the bottom surface of the IGBT module.
Furthermore, the IGBT module is welded on the copper-plated area.
Furthermore, the copper of the copper-plated area is welded on the radiator body by cold welding or hot welding technology.
Furthermore, the radiating fins are multiple, and the distance between the radiating fins is 3-5 mm.
The technical effects of the utility model reside in that: this kind of integration power module radiator, with the module welding to the radiator on, can reduce the thermal resistance by a wide margin to improve efficiency, power use such as IGBT or MOS that uses can be reduced, and then reduce cost, factor of safety is higher, use cold welding technique, spray copper on specific position, just be fit for module "compound copper ceramic substrate" (DBC), or the bottom plate that can weld the copper radiator that other modules used, consequently, module welded location is accurate (there is the mark), the yield is high. The cost can be greatly reduced by spraying the copper material at the designated position.
Drawings
Fig. 1 is a schematic structural view of the present invention;
Reference numerals:
10-an IGBT module; 11-connecting the bottom plate; 12-mounting holes; 20-a heat sink body; 21-a heat sink; 22-a fixation hole; 30-copper plating area.
Detailed Description
an integrated power module radiator comprises an IGBT module 10 and a radiator body 20, wherein the IGBT module 10 is located above the radiator body 20, a radiating fin 21 is arranged below the radiator body 20, and a copper-plated area 30 is arranged between the IGBT module 10 and the radiator body 20. The module is welded on the radiator, so that the thermal resistance can be greatly reduced, the efficiency is improved, and the power consumption of the used power chips such as IGBT (insulated gate bipolar transistor) or MOS (metal oxide semiconductor) can be reduced, so that the cost is reduced, or the margin of the original device is larger, and the safety coefficient is higher
Preferably, a connection bottom plate 11 is arranged below the IGBT module 10, a mounting hole 12 is arranged on the connection bottom plate 11, and a fixing hole 22 corresponding to the mounting hole 12 is arranged on the heat sink body 20. Through the mutual connection of the mounting hole and the fixing hole, the connection between the IGBT module and the radiator body is firmer.
Preferably, the copper plated area 30 has the same size and shape as the IGBT module 10. The copper plating area can be adjusted according to the size of the module, copper plating is not needed to be carried out in a large area, and the cost can be greatly reduced.
Preferably, the IGBT module 10 is soldered to the copper-plated area 30.
Preferably, the copper of the copper plated area 30 is welded to the heat sink body 20 using cold welding or hot welding techniques.
Preferably, there are a plurality of the radiating fins 21, and the distance between the radiating fins 21 is 3-5 mm.
Claims (6)
1. An integrated power module heat sink comprising an IGBT module (10) and a heat sink body (20), characterized in that: the IGBT module (10) is located above the radiator body (20), a radiating fin (21) is arranged below the radiator body (20), and a copper-plated area (30) is arranged between the IGBT module (10) and the radiator body (20).
2. The integrated power module heat sink of claim 1, wherein: the IGBT module (10) below be equipped with connecting bottom plate (11), connecting bottom plate (11) on be equipped with mounting hole (12), radiator body (20) on be equipped with mounting hole (12) correspond fixed orifices (22).
3. The integrated power module heat sink of claim 1, wherein: the copper plating area (30) is the same as the IGBT module (10) in size and shape.
4. The integrated power module heat sink of claim 2, wherein: the IGBT module (10) is welded on the copper-plated area (30).
5. The integrated power module heat sink of claim 3, wherein: the copper of the copper-plated area (30) is welded to the radiator body (20) by cold welding or hot welding technology.
6. The integrated power module heat sink of claim 1, wherein: the number of the radiating fins (21) is multiple, and the distance between every two radiating fins (21) is 3-5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920193272.6U CN209747503U (en) | 2019-02-13 | 2019-02-13 | Integrated power module radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920193272.6U CN209747503U (en) | 2019-02-13 | 2019-02-13 | Integrated power module radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209747503U true CN209747503U (en) | 2019-12-06 |
Family
ID=68706957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920193272.6U Active CN209747503U (en) | 2019-02-13 | 2019-02-13 | Integrated power module radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209747503U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904130A (en) * | 2019-02-13 | 2019-06-18 | 浙江天毅半导体科技有限公司 | A kind of integral electrical module heat radiator |
| CN113035807A (en) * | 2021-03-08 | 2021-06-25 | 广东神思半导体有限公司 | Triode with stable heat radiation structure |
-
2019
- 2019-02-13 CN CN201920193272.6U patent/CN209747503U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904130A (en) * | 2019-02-13 | 2019-06-18 | 浙江天毅半导体科技有限公司 | A kind of integral electrical module heat radiator |
| CN113035807A (en) * | 2021-03-08 | 2021-06-25 | 广东神思半导体有限公司 | Triode with stable heat radiation structure |
| CN113035807B (en) * | 2021-03-08 | 2022-05-27 | 广东神思半导体有限公司 | Triode with stable heat radiation structure |
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