CN209747503U - An integrated power module radiator - Google Patents

Abstract

The utility model belongs to the field of electrical equipment, and in particular relates to an integrated power module radiator, which includes an IGBT module and a radiator body. The bottom plate of the IGBT module is located above the radiator body. There is a heat sink, and there is a copper-plated area between the IGBT module and the heat sink body. This integrated power module heat sink can greatly reduce thermal resistance, thereby improving performance. The power used such as IGBT or MOS Chips, which can reduce power usage, thereby reducing costs, and have a higher safety factor.

Description

An integrated power module radiator

technical field

The utility model belongs to the field of electrical equipment, in particular to an integrated power module radiator.

Background technique

Heat sinks are mostly used in electrical equipment to prevent electrical equipment from being damaged due to poor heat dissipation during use. The existing heat sink connects the module to the heat sink through thermal conductive silicone grease. The thermal resistance is very high, and most of the power is wasted on heat consumption. In order to transfer the heat generated by the device (module) to the radiator as soon as possible, a large radiator is required, causing the heating device and the radiator In order to achieve the purpose of absorbing heat, the heat dissipation efficiency is low.

Utility model content

The purpose of this utility model is to provide an integrated power module heat sink, which can greatly reduce thermal resistance, thereby improving performance, using power chips such as IGBT or MOS, which can reduce power usage, thereby reducing costs, and having a higher safety factor.

In order to achieve the above purpose, the technical solution adopted by the utility model is: an integrated power module radiator, including an IGBT module and a radiator body, the bottom plate of the IGBT module is located above the radiator body, and the heat dissipation A heat sink is provided under the radiator body, and a copper plating area is provided between the IGBT module and the radiator body.

Further, a connecting bottom plate is provided under the IGBT module, and mounting holes are provided on the connecting bottom plate, and fixing holes corresponding to the mounting holes are provided on the heat sink body.

Further, the size and shape of the copper plating area is the same as that of the bottom surface of the IGBT module.

Further, the IGBT module is welded on the copper plating area.

Further, the copper in the copper plating area is welded to the heat sink body by cold welding or hot welding technology.

Further, there are multiple heat sinks, and the distance between them is 3-5mm.

The technical effect of the utility model is that: the integrated power module radiator, the module can be welded to the radiator, the thermal resistance can be greatly reduced, thereby improving the efficiency, and the power chips such as IGBT or MOS used can reduce the power usage, and further Lower cost, higher safety factor, using cold welding technology, spraying copper on a specific position, just suitable for the module "copper complex ceramic substrate" (DBC), or the bottom plate used by other modules that can be welded to the copper heat sink, so , The positioning of the module welding is accurate (marked), and the yield rate is high. Spraying copper materials at designated locations can also greatly reduce costs.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Reference signs:

10-IGBT module; 11-connecting bottom plate; 12-installation hole; 20-radiator body; 21-radiating fin; 22-fixing hole; 30-copper plating area.

Detailed ways

An integrated power module heat sink, including an IGBT module 10 and a heat sink body 20, the IGBT module 10 is located above the heat sink body 20, and a heat sink 21 is provided below the heat sink body 20, the A copper plating area 30 is provided between the IGBT module 10 and the heat sink body 20 . Welding the module to the heat sink can greatly reduce thermal resistance, thereby improving performance. The use of power chips such as IGBT or MOS can reduce power usage, thereby reducing costs, or the margin of the original device is larger, and the safety factor is higher.

Preferably, the bottom of the IGBT module 10 is provided with a connecting bottom plate 11, the connecting bottom plate 11 is provided with mounting holes 12, and the heat sink body 20 is provided with fixing holes corresponding to the mounting holes 12. twenty two. Through the interconnection of the mounting holes and the fixing holes, the connection between the IGBT module and the heat sink body is more secure.

Preferably, the size and shape of the copper plating area 30 is the same as that of the IGBT module 10 . The copper plating area can be adjusted according to the size of the module, and there is no need for copper plating on a large area, which can greatly reduce the cost.

Preferably, the IGBT module 10 is welded on the copper plating area 30 .

Preferably, the copper in the copper plating area 30 is welded to the radiator body 20 by cold welding or hot welding technology.

Preferably, there are multiple cooling fins 21, and the distance between the cooling fins 21 is 3-5 mm.

Claims (6)

1. An integrated power module heat sink comprising an IGBT module (10) and a heat sink body (20), characterized in that: the IGBT module (10) is located above the radiator body (20), a radiating fin (21) is arranged below the radiator body (20), and a copper-plated area (30) is arranged between the IGBT module (10) and the radiator body (20).

2. The integrated power module heat sink of claim 1, wherein: the IGBT module (10) below be equipped with connecting bottom plate (11), connecting bottom plate (11) on be equipped with mounting hole (12), radiator body (20) on be equipped with mounting hole (12) correspond fixed orifices (22).

3. The integrated power module heat sink of claim 1, wherein: the copper plating area (30) is the same as the IGBT module (10) in size and shape.

4. The integrated power module heat sink of claim 2, wherein: the IGBT module (10) is welded on the copper-plated area (30).

5. The integrated power module heat sink of claim 3, wherein: the copper of the copper-plated area (30) is welded to the radiator body (20) by cold welding or hot welding technology.

6. The integrated power module heat sink of claim 1, wherein: the number of the radiating fins (21) is multiple, and the distance between every two radiating fins (21) is 3-5 mm.