CN110829901A

CN110829901A - Brushless motor controller system and assembling method thereof

Info

Publication number: CN110829901A
Application number: CN201910970680.2A
Authority: CN
Inventors: 王洪波; 柳景弟; 李雪晖
Original assignee: Zhejiang Move A New Energy Power Polytron Technologies Inc
Current assignee: Zhejiang Move A New Energy Power Polytron Technologies Inc; Zhejiang Lera New Energy Power Technology Co Ltd
Priority date: 2019-10-12
Filing date: 2019-10-12
Publication date: 2020-02-21

Abstract

The invention belongs to the technical field of garden electric tool control, and provides a brushless motor controller system which comprises a control mainboard, a heat-conducting silica gel pad and a radiating fin, wherein the control mainboard is provided with a plurality of heat-conducting silica gel pads; an MOS tube is arranged on the control main board and is provided with a heat dissipation metal substrate and three pins; the heat dissipation metal substrate is welded on the control main board; three pins of the MOS tube are connected to the control main board; the heat-conducting silica gel pad is arranged on the heat-radiating metal substrate of the MOS tube; the radiating fins are arranged on the heat-conducting silica gel pads. Compared with the prior art, the invention has the advantages that the pins of the MOS tube arranged in the system are directly connected on the control mainboard, then the heat-conducting silica gel pad is arranged on the heat-radiating metal substrate of the MOS tube or at the top of the MOS tube, the heat-radiating aluminum plate is not required to be arranged on the heat-conducting silica gel pad, the structure is simpler, and the size of the controller is smaller.

Description

Brushless motor controller system and assembling method thereof

Technical Field

The invention belongs to the technical field of garden electric tool control, and particularly relates to a brushless motor controller system and an assembly method thereof.

Background

The brushless motor controller is a direct current-TO-alternating current inverter, and usually needs a plurality of MOS (metal oxide semiconductor) tubes packaged by TO-220 or DFN56, wherein the MOS tubes are large-current power devices, so that the working current is large, and the working heat is large.

As shown in fig. 1, the conventional mounting process of the controller MOS transistor is as follows: the MOS tube is welded on the PCB, a copper bar conductor for expanding current is arranged on a large-current loop of the PCB so as to meet the requirement of large current, the heat dissipation mode of the MOS tube is that a heat dissipation iron head of the MOS tube is fixed on a heat dissipation sheet by a screw, insulation treatment is needed between the heat dissipation iron head and the heat dissipation sheet, a heat conduction insulating gasket and an insulating plastic sleeve of the screw are needed to be added, the heat conduction coefficient of the gasket is lower, the heat conduction effect is not ideal, the insulation process in the screw installation process is complex, the breakdown leakage risk is high, and therefore the scheme of heat dissipation of the MOS tube needs to be solved.

At present, there is also a solution to the heat dissipation of MOS transistors, for example, chinese patent publication No. CN109728737A discloses a brushless motor controller system and an assembly method thereof, and the application provides a brushless motor controller system and an assembly method thereof, the system includes a heat dissipation substrate, MOS transistors and a controller control motherboard; the heat dissipation base plate is provided with a signal output terminal and a plurality of MOS pipes, each MOS pipe is provided with two pins bent upwards and a heat dissipation metal substrate, the pins are inserted into the controller control main board, a large current loop and a small current loop are arranged in the controller control main board, the large current loop is connected with the two pins bent upwards of the MOS pipe, and the heat dissipation metal substrate is connected with the signal output terminal. The scheme can effectively solve the problem of overhigh heating temperature of the circuit board, but has complex structure and larger volume of the controller; the MOS tube packaged by the patch is also fixed singly.

Disclosure of Invention

The invention aims to solve the technical problem of the current state of the prior art and provides a brushless motor controller system which has the advantages of good heat dissipation effect, simple structure, low cost and small controller structure and can be suitable for various MOS (metal oxide semiconductor) tubes and an assembly scheme thereof.

The technical scheme adopted by the invention for solving the technical problems is as follows: a brushless motor controller system is provided, which comprises a control mainboard, a heat-conducting silica gel pad and a radiating fin;

an MOS tube is arranged on the control main board and is provided with a heat dissipation metal substrate and three pins; the heat dissipation metal substrate is welded on the control main board; three pins of the MOS tube are connected to the control main board;

the heat-conducting silica gel pad is arranged on the heat-radiating metal substrate of the MOS tube;

the radiating fins are arranged on the heat-conducting silica gel pads.

Further, the radiating fins are arc-shaped radiating fins, and radiating fin screw holes are formed in the radiating fins.

Further, the number of the MOS tubes is multiple, the multiple MOS tubes comprise a first MOS tube group and a second MOS tube group, and the first MOS tube group and the second MOS tube group are arranged oppositely.

Furthermore, a mainboard screw hole used for being fixedly connected with the radiating fin screw hole is formed in the control mainboard between the first MOS pipe group and the second MOS pipe group.

Further, the MOS tube is a TO-200 packaging MOS tube or a DFN56 packaging MOS tube.

Further, be provided with components and parts on the control mainboard, the height of components and parts is the same with the height of fin, components and parts include paster inductance and paster electrolytic capacitor.

Furthermore, a large-current loop is arranged on the control main board, and the large current is electrically connected with three pins of the MOS tube; and the control main board is also provided with a small current loop, and the small current loop is directly electrically connected with the control main board.

A method of assembling a brushless motor controller system, comprising the steps of:

forming the MOS tube into a chip package, and welding the chip package on the control mainboard in an automatic chip mounting mode;

welding a heat dissipation metal substrate of the MOS tube on the control main board, and connecting three pins of the MOS tube with the control main board;

placing a heat-conducting silica gel pad on a heat-radiating metal substrate of the MOS tube;

and the radiating fins are fixedly arranged on the radiating metal substrate provided with the heat-conducting silica gel pad through screw holes on the control main board.

Compared with the prior art, the invention at least comprises the following beneficial effects:

(1) the pin lug connection of the MOS pipe that sets up in this brushless motor controller system is on the control mainboard, then is provided with heat conduction silica gel pad on the heat dissipation metal substrate of MOS pipe or MOS pipe top, is provided with the fin on heat conduction silica gel pad, need not to set up heat dissipation aluminum plate, and the structure is simpler for the volume of controller is littleer.

(2) The brushless motor controller system can be matched with two different patch-packaged MOS (metal oxide semiconductor) tubes, and the application range is wider.

(3) The heat dissipation metal substrate through the MOS pipe in the brushless motor controller system is used as a large-current conductor, so that heat generation is reduced, and a large-current copper bar which needs to be additionally installed is removed and used as a conductor.

(4) The large-current loop and the small-current loop on the control mainboard in the brushless motor controller system are mutually separated, so that heat dissipation is facilitated.

(5) The MOS pipe among this brushless motor controller system is the paster encapsulation, but automatic weld has improved the heat-sinking capability on the control mainboard, has avoided manual welding, saves the cost of labor.

Drawings

FIG. 1 illustrates a prior art method for mounting MOS transistors in a brushless motor controller system;

FIG. 2 is a schematic diagram of a MOS transistor formed as a TO-220 chip package according TO an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a brushless motor controller system with a TO-220 packaged MOS device according TO an embodiment of the present invention;

fig. 4 is a schematic diagram of a MOS transistor formed as a DFN56 chip package according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a brushless motor controller system in which a packaged MOS device is packaged in DFN56 according to an embodiment of the present invention;

fig. 6 is a flowchart of a method for assembling a brushless motor controller according to an embodiment of the present invention.

10, a plastic shell, 20, a control mainboard, 21, mainboard screw holes, 30, a chip packaging MOS tube, 31, a heat dissipation metal substrate, 40, a heat conduction silica gel pad, 50, a heat dissipation sheet and 51 heat dissipation screw holes.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

Example one

As shown in fig. 2 to 3, the present embodiment provides a brushless motor controller system, which includes a control motherboard, a heat conductive silicone pad, and a heat sink; an MOS tube is arranged on the control main board and is provided with a heat dissipation metal substrate and three pins; the heat dissipation metal substrate is welded on the control main board; three pins of the MOS tube are connected to the control main board; the heat-conducting silica gel pad is arranged on the heat-radiating metal substrate of the MOS tube; the radiating fins are arranged on the heat-conducting silica gel pads.

As shown in fig. 2, fig. 2 is a packaging method of the MOS transistor provided in this embodiment, wherein the TO-220 package is SMD chip package, and this molding method enables the MOS transistor TO adopt an automatic chip mounting process, i.e. the MOS transistor can be automatically welded on the circuit board by a chip mounter, and the pin of the MOS transistor does not need TO be manually welded by using an electric iron or the like, thereby improving the welding efficiency and saving the labor cost.

At present the heat dissipation metal substrate of MOS pipe is through screw etc. fixed to the aluminium alloy plate on, this process also can only be assembled through the manual work generally, and in this embodiment, has adopted automatic paster technology, directly welds the heat dissipation metal substrate of MOS pipe on control mainboard 20, so does not need the manual work to fix the heat dissipation metal substrate 31 of MOS pipe, need not use insulating gasket etc. to keep apart moreover, has guaranteed that the MOS pipe can not take place to puncture electric leakage phenomenon.

The TO-220 chip-packaged MOS transistor provided in this embodiment includes three pins, namely a G-pole (gate), a D-pole (drain), and an S-pole (source), which are all vertically bent downward, and the bending direction points TO a heat dissipation metal substrate, and the three pins are all connected TO a control motherboard; the heat dissipation metal substrate 31 of MOS pipe itself is G (grid 13) of MOS pipe, D (drain 12), one in the three polarity of S (source 11), it is D (drain 12), it itself also can regard as electrical connection, make the heavy current return circuit of controller directly be connected with the MOS pipe like this, regard the carrier of MOS pipe as the heavy current, thereby need not set up extra water conservancy diversion copper bar on the main board of the secondary control, the cost is saved, and because the MOS pipe is on the aluminium base board that the coefficient of heat conductivity is very good on the control main board, thereby can effectively dispel the heat, avoid the influence that generates heat and bring.

As shown in fig. 3, the number of MOS transistors provided in this embodiment is six, and the six MOS transistors include a first MOS transistor group and a second MOS transistor group, and the first MOS transistor group and the second MOS transistor group are arranged oppositely. The pins of the two groups of MOS tubes are correspondingly arranged, and the heat dissipation metal substrates of the two groups of MOS tubes are respectively arranged at the outer sides of the two groups of MOS tubes. Due to the arrangement, the heat dissipation metal substrates can be uniformly arranged in a row, so that the heat conduction silica gel pads can be placed on the arranged heat dissipation metal substrates, and the heat dissipation fins are placed on the heat conduction silica gel pads, so that better heat dissipation is realized.

The fin that this embodiment provided is bow-shaped fin, and wherein the fin recess position is used for placing the MOS pipe, and the bellied position of fin and silica gel heat conduction pad in close contact with for dispel the heat to the heat dissipation metal substrate of MOS pipe below the silica gel heat conduction pad.

The mainboard screw holes and the heat dissipation screw holes provided in the embodiment are correspondingly arranged and used for fixing the heat dissipation fins on the control mainboard, and due to the arrangement of the arched heat dissipation fins, the heat dissipation screw holes on the heat dissipation fins are only 2 as shown in fig. 3, so that the material and process cost is saved.

The small current loop on the control motherboard includes a loop for controlling signal input and output, and similar to a conventional brushless motor controller, the conventional brushless motor controller generally has a small current loop and a large current loop, which are not described in detail herein.

Through set up the undercurrent return circuit on the control mainboard for undercurrent return circuit is cut apart with the heavy current return circuit, and convenient heat dissipation can avoid generating heat to the influence of whole PCB board.

In this embodiment, be provided with components and parts in the bottom of control mainboard, components and parts's height is the same with the height of fin, and components and parts include paster inductance and paster electrolytic capacitor, reduce the whole volume of controller.

Example two

This embodiment provides a brushless motor controller system, as shown in fig. 4 and 5, this brushless motor controller system is as shown in fig. 4, fig. 4 is the encapsulation mode of the MOS pipe that this embodiment provided, wherein the encapsulation of DFN56 adopts SMD paster encapsulation, this kind of forming mode can make the MOS pipe adopt automatic paster technology, can be through the automatic welding of chip mounter on the circuit board, and need not use electric iron etc. to carry out manual welding to the pin department of MOS pipe, welding efficiency is improved, save the cost of labor.

The MOS transistor of the DFN56 chip package provided in this embodiment includes a G-pole (gate), i.e., pin 4 in fig. 4, a D-pole (drain), i.e., pin 5, 6, 7, and 8 in fig. 4, and an S-pole (source), i.e., pin 123 in the figure; its DFN56 paster encapsulation MOS pipe bottom large tracts of land fin can regard as the face of weld also to be the D utmost point that MOS pipe itself also can be regarded as, thereby the welding is on the control mainboard and control mainboard electrical connection, make the direct and MOS union coupling of heavy current return circuit of controller like this, regard the carrier of MOS pipe as the heavy current, thereby need not set up extra water conservancy diversion copper bar on the additional control mainboard again, the cost is saved, and because the MOS pipe is on the aluminium base board that the coefficient of heat conductivity is very good on the control mainboard, thereby can effectively dispel the heat, avoid generating heat the influence that brings.

As shown in fig. 5, the number of the MOS transistors provided in this embodiment is 12, where the 12 MOS transistors include a first MOS transistor group and a second MOS transistor group, and the first MOS transistor group and the second MOS transistor group are arranged oppositely, that is, the bottoms of the two MOS transistors are soldered to the control motherboard. Due to the arrangement, the MOS tubes can be uniformly arranged into two rows, so that the heat-conducting silica gel pads can be placed on the top of the arranged MOS tubes, and the radiating fins are placed on the heat-conducting silica gel pads, so that better heat dissipation is realized.

The bottom of the fin that this embodiment provided is the plane setting, for better and the laminating setting of heat conduction silica gel pad, is provided with corresponding screw on fin and the control mainboard respectively, and the fin passes through screw and control mainboard fixed connection.

This embodiment uses as the heavy current conductor through the bottom large tracts of land fin of MOS on the one hand, reduce and generate heat, it needs additionally to install heavy current copper bar as the conductor to have got rid of, on the other hand, heavy current return circuit and the undercurrent return circuit on the controller are the separation of each other, convenient heat dissipation has solved the problem that generates heat and influence whole circuit board, and be the paster encapsulation with the MOS pipe shaping, but automatic weld is on aluminium base board, improve the heat-sinking capability, manual welding has been avoided, save the cost of labor.

EXAMPLE III

The present embodiment provides an assembling method of a brushless motor controller system, as shown in fig. 6, including the steps of:

According to the assembling method of the brushless motor controller system, the heat dissipation metal substrate passing through the MOS tube is used as a high-current conductor, so that heating is reduced, and the requirement of additionally installing a high-current copper bar as a conductor is eliminated. A heat-conducting silica gel pad is arranged on the heat-radiating metal substrate of the MOS tube or on the top of the MOS tube, and a heat radiating fin is arranged on the heat-conducting silica gel pad, so that the assembly structure is simpler;

and MOS pipe among this brushless motor controller system is the paster encapsulation, but automatic welding has improved the heat-sinking capability on the control mainboard, has avoided manual welding, saves the cost of labor.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the described embodiments may be made by those skilled in the art without departing from the scope and spirit of the invention as defined by the accompanying claims.

Claims

1. A brushless motor controller system is characterized by comprising a control mainboard, a heat-conducting silica gel pad and a radiating fin;

the radiating fins are arranged on the heat-conducting silica gel pads.

2. The brushless motor controller system of claim 1, wherein the heat sink is an arcuate heat sink having heat sink screw holes formed therein.

3. The brushless motor controller system of claim 2, wherein the number of the MOS transistors is plural, and the plural MOS transistors include a first MOS transistor group and a second MOS transistor group, and the first MOS transistor group and the second MOS transistor group are arranged in an opposite manner.

4. The brushless electric machine controller system of claim 3, wherein the control motherboard between the first MOS tube set and the second MOS tube set is provided with motherboard screw holes for fixedly connecting with the heat sink screw holes.

5. The brushless motor controller system of claim 3, wherein the MOS transistor is a TO-200 packaged MOS transistor or a DFN56 packaged MOS transistor.

6. The brushless motor controller system of claim 1, wherein the control motherboard has components disposed thereon, the components having a height that is the same as a height of the heat sink, the components including a chip inductor and a chip electrolytic capacitor.

7. The brushless electric machine controller system according to claim 1, wherein the control main board is provided with a large current loop, and the large current loop is electrically connected with three pins of the MOS transistor; and the control main board is also provided with a small current loop, and the small current loop is directly electrically connected with the control main board.

8. A method of assembling a brushless motor controller system, comprising the steps of: