CN209516953U - A kind of brushless motor controller system - Google Patents
A kind of brushless motor controller system Download PDFInfo
- Publication number
- CN209516953U CN209516953U CN201920122012.XU CN201920122012U CN209516953U CN 209516953 U CN209516953 U CN 209516953U CN 201920122012 U CN201920122012 U CN 201920122012U CN 209516953 U CN209516953 U CN 209516953U
- Authority
- CN
- China
- Prior art keywords
- metal
- oxide
- semiconductor
- heat
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of brushless motor controller system, which includes heat-radiating substrate, metal-oxide-semiconductor and controller control mainboard；Signal output terminal and multiple metal-oxide-semiconductors are provided on the heat-radiating substrate, there are two the pins and heat radiating metal substrate that are bent upwards for the metal-oxide-semiconductor tool, the pin is inserted into controller control mainboard, big current loop and low current circuit are provided in the controller control mainboard, the big current loop is connect with two pins being bent upwards of the metal-oxide-semiconductor, and the heat radiating metal substrate is connect with the signal output terminal.The utility model has been shortened big current loop length, has effectively solved the problems, such as that circuit board heating temperature is excessively high, eliminated the step of additional installation high current copper bar of needs is as conductor by being used using metal-oxide-semiconductor heat radiating metal substrate as high-current conductor.
Description
Technical field
The utility model relates to gardens electric tool control technology field more particularly to a kind of brushless motor controller systems
System.
Background technique
Brushless motor controller is the inverter that direct current delivers stream, usually requires the MOS for using multiple TO-220 encapsulation
Pipe, metal-oxide-semiconductor is super-current power unit, and operating current is big, and fever is big when work.As shown in Fig. 2, traditional controller metal-oxide-semiconductor
Mounting process is that metal-oxide-semiconductor is welded in PCB circuit board, and PCB circuit board setting expands the copper bar conductor of electric current, to meet big electricity
Needed for stream, the radiating mode of metal-oxide-semiconductor is metal-oxide-semiconductor heat radiating metal substrate to be screwed in cooling fin (such as aluminium in Fig. 2 closes
Golden plate) on, heat radiating metal substrate itself carries out insulation processing between cooling fin, such as increases the gasket and screw of heat conductive insulating
Ambroin casing, gasket thermal coefficient itself is relatively low, and heat-conducting effect is undesirable, and the insulating process of screw installation process is very
On the one hand there is the risk of electric leakage in complexity, another aspect heat can not be distributed effectively, be easy to cause metal-oxide-semiconductor drain break down, therefore needs
It is proposed a kind of scheme of solution metal-oxide-semiconductor heat dissipation.
Also there are the scheme for solving metal-oxide-semiconductor heat dissipation, such as the Chinese patent of Publication No. CN107276462A in the prior art
A kind of brushless motor controller system conducive to metal-oxide-semiconductor heat dissipation is disclosed, the brushless motor controller system of metal-oxide-semiconductor heat dissipation should be conducive to
System is electrically connected to each other including shell and the motor body, the controller that are built in shell, motor body with controller；Controller
Including the pedestal, first line plate, the second wiring board of divulging information；The metal-oxide-semiconductor of controller is set to the second wiring board, controller remaining
Electronic component is set to first line plate；First line plate and the second circuit board electrical connection；Ventilation pedestal is provided with ventilation opening,
First line plate, the second wiring board are all set on ventilation pedestal.The existing brushless motor control conducive to metal-oxide-semiconductor heat dissipation
The big metal-oxide-semiconductor of power consumption height and calorific value is independently arranged at the second wiring board by device system, can conducive to the radiating and cooling of metal-oxide-semiconductor
It avoids metal-oxide-semiconductor power loss from increasing even by heat damage, extends the service life of circuit system.The program also can be
Metal-oxide-semiconductor radiates, and still, heat dissipation effect is still poor, at high cost.
Summary of the invention
The technical problems to be solved in the utility model is designed to provide a kind of brushless motor controller system, to solve
Poor, the at high cost problem of existing brushless motor controller heat dissipation for circuit board effect.
To achieve the goals above, the technical solution adopted in the utility model is as follows:
A kind of brushless motor controller system, including heat-radiating substrate and controller control mainboard；
Signal output terminal and multiple metal-oxide-semiconductors are provided on the heat-radiating substrate, there are two upwards for the metal-oxide-semiconductor tool
Curved pin and heat radiating metal substrate, described two pins being bent upwards are inserted into the controller control mainboard；
It is provided with big current loop in the controller control mainboard, two of the big current loop and the metal-oxide-semiconductor
Be bent upwards pin electrical connection, the heat radiating metal substrate be welded on the heat-radiating substrate and with the signal output terminal
Electrical connection.
Preferably, the heat-radiating substrate is aluminum substrate, and two edges of the heat-radiating substrate are separately provided for inserting
If the screw hole of bolt, the bolt is by the screw hole cooling fin is fixedly mounted.
Preferably, the screw hole is centrosymmetric about the geometric center of the aluminum substrate.Preferably, multiple MOS
Pipe is formed with the first metal-oxide-semiconductor group and the second metal-oxide-semiconductor group, the source electrode of metal-oxide-semiconductor and the heat-radiating substrate in the first metal-oxide-semiconductor group
It connects, the drain electrode of metal-oxide-semiconductor and the drain electrode of metal-oxide-semiconductor in the second metal-oxide-semiconductor group are inserted into the controller control jointly in the first metal-oxide-semiconductor group
In the same jack of mainboard processed, the grid of metal-oxide-semiconductor point in the grid of the first metal-oxide-semiconductor group metal-oxide-semiconductor and the second metal-oxide-semiconductor group
It is not inserted into the different jacks of the controller control mainboard.
Preferably, the first metal-oxide-semiconductor group and the second metal-oxide-semiconductor group arranged opposite,
Metal-oxide-semiconductor there are three being respectively set in first metal-oxide-semiconductor group and the second metal-oxide-semiconductor group.
Preferably, positive and negative patch pedestal and low current circuit, the positive and negative patch are additionally provided on the heat-radiating substrate
Pedestal is inserted into the controller control mainboard, so that the controller control mainboard is connect with the low current circuit.
Preferably, the bottom of the controller control mainboard is provided with component, and the height of the component is dissipated with described
The height of backing is identical, and the component includes chip inductor and patch electrolytic capacitor.
It using the utility model, is used on the one hand by the heat radiating metal substrate of MOS as high-current conductor, reduces hair
Heat, eliminating needs, additionally installation high current copper bar is as conductor, on the other hand, big current loop and small electricity on controller
Flow back to road be it is disconnected from each other, facilitate heat dissipation, solve the problems, such as that fever influences whole circuit board, and metal-oxide-semiconductor is shaped to
Patch encapsulation, can automatic welding on aluminum substrate, improve heat-sinking capability, avoid human weld, save labour turnover.
Detailed description of the invention
Fig. 1 is the metal-oxide-semiconductor structural schematic diagram that one embodiment of the utility model provides；
Fig. 2 is metal-oxide-semiconductor mounting means structural schematic diagram in existing brushless motor controller system；
Fig. 3 is the MOS for being shaped to patch encapsulation that one embodiment of the utility model provides
Pipe schematic diagram；
Fig. 4 is the positional structure of the metal-oxide-semiconductor of one embodiment of the utility model offer, positive and negative patch pedestal and pedestal
Schematic diagram；
Fig. 5 is a kind of brushless motor controller system that one embodiment of the utility model provides
System structural schematic diagram；
Wherein, the 1, first metal-oxide-semiconductor, 11, source electrode, 12, drain electrode, 13, grid, the 2, second metal-oxide-semiconductor, 22, drain electrode, 3, heat dissipation gold
Category substrate, 4, heat-radiating substrate, 41, screw hole, 5, signal output terminal, 6, positive and negative patch pedestal, 7, controller control mainboard, 8,
Aluminium alloy plate, 81, PCB circuit board, 82, pad.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further
Description, but the utility model is not limited to these examples.
Embodiment one
With reference to Fig. 3, Fig. 4 and Fig. 5, a kind of brushless motor controller system, including heat-radiating substrate 4 are present embodiments provided
And controller control mainboard 7；
Signal output terminal 5 and multiple metal-oxide-semiconductors are provided on heat-radiating substrate 4, multiple metal-oxide-semiconductors include the first MOS
There are two the pin being bent upwards and heat radiating metal linings for pipe 1 and the second metal-oxide-semiconductor 2, the first metal-oxide-semiconductor 1 and the second metal-oxide-semiconductor 2 tool
Bottom 3, two pins being bent upwards are inserted into controller control mainboard 7, are provided with high current in controller control mainboard 7
Circuit, big current loop are connect with two pins being bent upwards of the first metal-oxide-semiconductor 1, the second metal-oxide-semiconductor 2, heat radiating metal substrate 3
It is connect with signal output terminal 5.
Wherein, the big current loop refers to is electrically connected with the metal-oxide-semiconductor, with by above-mentioned metal-oxide-semiconductor that driving signal is defeated
The circuit loop of brushless motor is arrived out.
Brushless motor controller is the inverter that direct current delivers stream, and big electricity is generally both provided in controller control mainboard
Road is flowed back to, this is because metal-oxide-semiconductor is super-current power unit, high current needed for metal-oxide-semiconductor is met by setting big current loop,
In the prior art, in control mainboard can also low current circuit, be used for input/output control signal.Wherein, the low current returns
The electric current on road is less than the electric current of the big current loop.
Wherein, the brushless motor controller system in the present embodiment is applied to gardens field of power tools.
With reference to Fig. 1, the structure of metal-oxide-semiconductor is shown in Fig. 1 comprising three pins and heat radiating metal substrate 3, to answer
With the conventional metal-oxide-semiconductor on brushless motor controller, detailed principle function introduction is not done in the present embodiment.
With reference to Fig. 3, Fig. 3 is a kind of molding mode of metal-oxide-semiconductor provided in this embodiment, what existing traditional metal-oxide-semiconductor used
It is TO-220 packaged type (metal-oxide-semiconductor in such as Fig. 1 and Fig. 2), and in the present embodiment, using is the encapsulation of SMD patch, this
Molding mode enables to metal-oxide-semiconductor that can use automatic pasting technique, it can is attached to circuit by automatic weldings such as chip mounters
On plate, without using electric iron etc. to human weld is carried out at the pin of metal-oxide-semiconductor, welding efficiency is improved, is saved artificial
Cost.
And the heat radiating metal substrate of the metal-oxide-semiconductor in Fig. 2 is fixed on aluminium alloy plate by screw etc., this process
Generally, due to using automatic pasting technique, directly metal-oxide-semiconductor can only also be welded by manually assembling, and in the present embodiment
On heat-radiating substrate 4, therefore the heat radiating metal substrate 3 for manually fixing metal-oxide-semiconductor is not needed, and do not need using insulation spacer etc.
It is isolated, ensure that metal-oxide-semiconductor will not occur to puncture leaky.
It and is aluminum substrate by heat-radiating substrate 4 in this present embodiment, the thermal coefficient of aluminum substrate is very good, works as metal-oxide-semiconductor
After being welded on aluminum substrate, can effectively it be radiated by aluminum substrate.
Metal-oxide-semiconductor in Fig. 3 is there are two types of form, and a kind of metal-oxide-semiconductor tool is there are three pin (i.e. the first metal-oxide-semiconductor 1), and two therein
Pin 12,13 upward vertical curves, another pin 11 are bent downwardly, and there are also a kind of metal-oxide-semiconductor tool, there are two pins (i.e. second
Metal-oxide-semiconductor 2), two pins 21,22 are all upward vertical curves, and drain electrode 12, the drain electrode 22 of both metal-oxide-semiconductors (are hung down upwards
Straight curved pin) it is inserted into the same jack of controller control mainboard 7 jointly.
Wherein, it can refer to Fig. 4 and Fig. 5, there are three the jack of different pore size, first jacks for setting on controller mainboard
For being inserted into the drain electrode 12 of the first metal-oxide-semiconductor 1 and the drain electrode 22 of the second metal-oxide-semiconductor 2 simultaneously, second jack is for being inserted into second
The grid of metal-oxide-semiconductor 2, third jack are used to be inserted into the grid 13 of the first metal-oxide-semiconductor 1.
It is additionally provided with signal output terminal 5 on heat-radiating substrate 4, signal output terminal 5 and is welded on heat-radiating substrate 4
The heat radiating metal substrate 3 of metal-oxide-semiconductor connects, by this connection type, by the heat radiating metal substrate 3 of metal-oxide-semiconductor as high current
Input and output avoid so that heat radiating metal substrate 3 acts as the function of thermally conductive copper bar in the prior art using water conservancy diversion copper
Item reduces production cost.
The U-shaped structure that signal output terminal 5 is integrally formed, including upper end sheet metal and lower end sheet metal, lower end gold
Belong to piece to be welded on heat-radiating substrate 4, circular through hole is provided on the sheet metal of upper end, for the motor control with brushless motor controller
Conducting wire connection processed, to be worked by the motor control polygon control survey brushless motor.
The present invention is connect by signal output terminal 5 with heat-radiating substrate 4 and the motor control conducting wire, is avoided motor
Pilot is welded on aluminum substrate, so that being inconvenient to weld, operating efficiency is low, and welding is not sufficiently stable, so that input and output are led
Line is easy the problem of falling off from aluminum substrate.And the present embodiment enables to conducting wire that can lead to by setting signal output terminal 5
It crosses circular through hole to be electrically connected with signal output terminal 5 and entire aluminum substrate, what is connected is stronger reliable, and connects more
Add conveniently, joint efficiency is higher.
Explanation is needed further exist for, the heat radiating metal substrate 3 of metal-oxide-semiconductor itself is also the G (grid 13) of MOS pipe, D (leakage
Pole 12), one in three polarity of S (source electrode 11), be D (drain electrode 12), itself can be used as being electrically connected, make in this way
The big current loop for obtaining controller is directly connect with metal-oxide-semiconductor 1,2, using metal-oxide-semiconductor as the carrier of high current, without again
Additional water conservancy diversion copper bar is set on pcb board, saves cost, and since metal-oxide-semiconductor is welded to the extraordinary aluminium of thermal coefficient
On substrate, so as to effectively radiate, fever bring is avoided to influence.
With reference to Fig. 4, two edges of the aluminum substrate in the present embodiment are respectively arranged with screw hole 41, and screw hole 41 is about aluminium
The geometric center of substrate is centrosymmetric.
Cooling fin can be fixed on aluminum substrate by bolt by screw hole 41, and the installation position of cooling fin is not shown in Fig. 4
It sets, it needs to be understood that, cooling fin is used to further be what MOS pipe radiated, and specific installation site can basis
Actual conditions make adjusting, and the present embodiment is not described.
By being arranged to centrosymmetric two screw holes 41, so that only needing two screw holes 41 on corner can be effective
Fixing cooling fins, radiate, reduce to fix the heat radiating metal substrate of metal-oxide-semiconductor without providing six screw holes
The quantity of screw hole improves the operating efficiency of installation assembly.
It include two groups of metal-oxide-semiconductor groups, i.e. the first metal-oxide-semiconductor group and the 2nd MOS pipe group in Fig. 4, the first metal-oxide-semiconductor group and the
Two metal-oxide-semiconductor pipe group arranged opposites, interior each group of metal-oxide-semiconductor group includes three metal-oxide-semiconductors arranged side by side, wherein first in the first metal-oxide-semiconductor group
The pole S (source electrode 11) of metal-oxide-semiconductor 1 is connect with heat-radiating substrate 4, the pole D (drain electrode 12) of the first metal-oxide-semiconductor 1 and the in the first metal-oxide-semiconductor group
The pole D (drain electrode 22) of two the second metal-oxide-semiconductors of metal-oxide-semiconductor group is inserted into jointly in the same jack of controller control mainboard 7, because without
Only convenient for assembly, high production efficiency, and the integrated level of circuit is improved, reduces volume, the first MOS in the first MOS pipe group
The pole G (grid) of the second metal-oxide-semiconductor 2 is inserted respectively into controller control master in the pole G (grid 13) of pipe 1 and the second metal-oxide-semiconductor group
In the difference of plate 7.
Preferably, D of the pole D (drain electrode 12) of the first metal-oxide-semiconductor 1 with second the second metal-oxide-semiconductor of metal-oxide-semiconductor group in the first metal-oxide-semiconductor group
Pole (drain electrode 22) is spaced pre-determined distance, the pole D (drain electrode 12) of the first metal-oxide-semiconductor 1 and the second metal-oxide-semiconductor group second in the first metal-oxide-semiconductor group
It is weldingly connected between the pole D (drain electrode 22) of metal-oxide-semiconductor by welding object, thus not only fixes relatively reliable, but also be easier assembly.?
In a kind of preferred embodiment, the pole D (drain electrode 12) of the first metal-oxide-semiconductor 1 and second the second metal-oxide-semiconductor of metal-oxide-semiconductor group in the first metal-oxide-semiconductor group
The circular hole that the jack of the pole D (drain electrode 22) insertion is intersected by two is formed, thus fixation is relatively reliable.It is understood that described insert
The shape and structure in hole are not specifically limited herein.
By Fig. 4 and Fig. 2 comparison as it can be seen that the first metal-oxide-semiconductor 1 and the second metal-oxide-semiconductor 2 in Fig. 4 are to be attached to heat-radiating substrate 4
On, it being connect by way of automatic welding with heat-radiating substrate 4, the heat radiating metal substrate 3 of metal-oxide-semiconductor acts as high-current conductor,
Metal-oxide-semiconductor in Fig. 2 needs that heat radiating metal substrate 3 is fixed on aluminium alloy plate by screw, and heat radiating metal substrate 3 with
Insulation spacer is also needed between aluminium alloy plate, this mode is easy to produce breakdown electric leakage etc., and also needs on the pcb board in Fig. 2
Increase water conservancy diversion copper bar to guide high current, increases cost.
In the present embodiment, positive and negative patch pedestal 6 and low current circuit, positive and negative patch bottom are additionally provided on heat-radiating substrate 4
In 6 inserting controller control mainboards 7 of seat, so that controller control mainboard 7 is connect with low current circuit.
Low current circuit includes the circuit for controlling signal input and output, similar with conventional brushless motor controller,
Generally conventional brushless motor controller all has low current circuit and big current loop, does not elaborate herein.
By the way that low current circuit is arranged on heat-radiating substrate 4, so that low current circuit and big current loop are separated, it is small
Current loop is located on heat-radiating substrate 4, and big current loop is located in controller control mainboard 7, and heat-radiating substrate 4 passes through metal-oxide-semiconductor 1,2
It is connect with the big current loop in controller control mainboard 7, controller control mainboard 7 passes through positive and negative patch pedestal 6 and heat dissipation base
Low current circuit connection on plate 4.
After low current circuit and big current loop separate, the influence generated heat to whole pcb board can be avoided.
In the present embodiment, the bottom of controller control mainboard 7 is provided with component, the height of component and cooling fin
Highly identical, component includes chip inductor and patch electrolytic capacitor.
The bottom of controller control mainboard 7 is opposite with the upper surface of heat-radiating substrate 4, is arranged on the upper surface of heat-radiating substrate 4
There is metal-oxide-semiconductor, in the component of the bottom of controller control mainboard 7 setting big current loop or other components of controller, energy
The height of entire controller is enough effectively reduced, makes full use of space.
Due to also needing to be arranged cooling fin on heat-radiating substrate 4, therefore the height of component is no more than the height of cooling fin,
The structure of entire controller could be made more compact in this way, reduce the volume of controller entirety, installation is facilitated to assemble.
The heat radiating metal substrate that the present embodiment passes through MOS on the one hand is used as high-current conductor, reduces fever, removal
Additional installation high current copper bar is needed to be used as conductor, another aspect, big current loop and low current circuit on controller
Be it is disconnected from each other, facilitate heat dissipation, solve the problems, such as fever influence whole circuit board, and by metal-oxide-semiconductor be shaped to patch envelope
Dress, can automatic welding on aluminum substrate, improve heat-sinking capability, avoid human weld, save labour turnover.
Mounting means in the present embodiment is unusual convenient, existing MOS relative to existing controller assembly method
Pipe can not be directly welded on heat-radiating substrate using automatic pasting technique due to encapsulating using TO-220, need people
Work is welded, and heat radiating metal substrate also needs to be fixed on aluminium alloy plate by screw, this process also needs
Artificial fixed, entire assembling process operating procedure is comparatively laborious.
And the assembly method in this implementation, metal-oxide-semiconductor can use chip mounter automatic chip mounting, be welded to heat-radiating substrate
On, and the heat radiating metal substrate for the fixed metal-oxide-semiconductor such as do not need screw, artificial running cost is saved, whole assembly is improved
Efficiency.
The specific embodiments described herein are merely examples of the spirit of the present invention.The utility model institute
Belonging to those skilled in the art can make various modifications or additions to the described embodiments or using similar
Mode substitute, but without departing from the spirit of the present application or beyond the scope of the appended claims.
Claims (7)
1. a kind of brushless motor controller system, which is characterized in that including heat-radiating substrate and controller control mainboard；
It is provided with signal output terminal and multiple metal-oxide-semiconductors on the heat-radiating substrate, there are two be bent upwards for the metal-oxide-semiconductor tool
Pin and heat radiating metal substrate, described two pins being bent upwards are inserted into the controller control mainboard；
It is provided with big current loop in the controller control mainboard, two of the big current loop and the metal-oxide-semiconductor are upwards
Curved pin electrical connection, the heat radiating metal substrate are welded on the heat-radiating substrate and are electrically connected with the signal output terminal
It connects.
2. a kind of brushless motor controller system according to claim 1, which is characterized in that the heat-radiating substrate is aluminium base
Plate, two edges of the heat-radiating substrate are separately provided for plugging the screw hole of bolt, and the bolt passes through the screw hole
Cooling fin is fixedly mounted.
3. a kind of brushless motor controller system according to claim 2, which is characterized in that the screw hole is about the aluminium
The geometric center of substrate is centrosymmetric.
4. a kind of brushless motor controller system according to claim 1 or 2, which is characterized in that multiple metal-oxide-semiconductor shapes
At having the first metal-oxide-semiconductor group and the second metal-oxide-semiconductor group, the source electrode of metal-oxide-semiconductor and the heat-radiating substrate connect in the first metal-oxide-semiconductor group
It connects, the drain electrode of metal-oxide-semiconductor and the drain electrode of metal-oxide-semiconductor in the second metal-oxide-semiconductor group are inserted into the controller jointly and control in the first metal-oxide-semiconductor group
In the same jack of mainboard, the grid difference of metal-oxide-semiconductor in the grid of the first metal-oxide-semiconductor group metal-oxide-semiconductor and the second metal-oxide-semiconductor group
It is inserted into the different jacks of the controller control mainboard.
5. a kind of brushless motor controller system according to claim 4, which is characterized in that the first metal-oxide-semiconductor group with
Metal-oxide-semiconductor there are three being respectively set in the second metal-oxide-semiconductor group arranged opposite, the first metal-oxide-semiconductor group and the second metal-oxide-semiconductor group.
6. a kind of brushless motor controller system according to claim 1, which is characterized in that also set on the heat-radiating substrate
It is equipped with positive and negative patch pedestal and low current circuit, the positive and negative patch pedestal is inserted into the controller control mainboard, so that
The controller control mainboard is connect with the low current circuit.
7. a kind of brushless motor controller system according to claim 2, which is characterized in that the controller control mainboard
Bottom be provided with component, the height of the component is identical as the height of the cooling fin, and the component includes patch
Inductance and patch electrolytic capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920122012.XU CN209516953U (en) | 2019-01-24 | 2019-01-24 | A kind of brushless motor controller system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920122012.XU CN209516953U (en) | 2019-01-24 | 2019-01-24 | A kind of brushless motor controller system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209516953U true CN209516953U (en) | 2019-10-18 |
Family
ID=68202331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920122012.XU Active CN209516953U (en) | 2019-01-24 | 2019-01-24 | A kind of brushless motor controller system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209516953U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109728737A (en) * | 2019-01-24 | 2019-05-07 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system and its assembly method |
-
2019
- 2019-01-24 CN CN201920122012.XU patent/CN209516953U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109728737A (en) * | 2019-01-24 | 2019-05-07 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system and its assembly method |
| CN109728737B (en) * | 2019-01-24 | 2024-03-01 | 浙江动一新能源动力科技股份有限公司 | Brushless motor controller system and assembly method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208240659U (en) | Highly integrated intelligent power module and air conditioner | |
| CN113746351B (en) | A motor controller and vehicle | |
| CN109728737A (en) | A kind of brushless motor controller system and its assembly method | |
| CN209516953U (en) | A kind of brushless motor controller system | |
| CN207690782U (en) | Power module and air conditioner | |
| CN211209613U (en) | Brushless motor controller system | |
| CN217719583U (en) | Half-bridge diode integrated device, power module and frequency converter | |
| CN211182190U (en) | Insulated gate bipolar transistor, intelligent power module and air conditioner | |
| CN110085579B (en) | High-integration intelligent power module, method for making the same, and air conditioner | |
| CN101582414A (en) | Power module by directly bonding power terminal | |
| CN109088551A (en) | A kind of board structure of circuit of super-high-current | |
| CN209747503U (en) | An integrated power module radiator | |
| CN109411462B (en) | Highly integrated power modules and appliances | |
| CN110829901A (en) | Brushless motor controller system and assembling method thereof | |
| CN211702829U (en) | Electric appliance structure with heat dissipation shielding function | |
| CN209105041U (en) | A kind of board structure of circuit of super-high-current | |
| CN211321839U (en) | Radiator with built-in power resistor | |
| CN211959896U (en) | Heat dissipation structure for switching power supply power device and switch | |
| CN203607387U (en) | Power module with double-face heat radiation | |
| CN114937651A (en) | Inverted packaging power semiconductor device with raised base and manufacturing method | |
| CN218243363U (en) | Control panel and air conditioner | |
| CN209326019U (en) | Highly integrated power modules and appliances | |
| CN207233722U (en) | A kind of New IGBT module encapsulation construction | |
| CN214429775U (en) | Single-tube IGBT assembly structure of frequency converter | |
| CN210743936U (en) | Heat radiator for semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: NINGBO JINHONGSHENG ELECTROMECHANICAL TECHNOLOGY CO.,LTD. Assignor: ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY Co.,Ltd. Contract record no.: X2022330000168 Denomination of utility model: A brushless motor controller system Granted publication date: 20191018 License type: Common License Record date: 20220607 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| CP02 | Change in the address of a patent holder |
Address after: 315000 No. 255, Kesheng Road, Wangchun Industrial Park, Haishu District, Ningbo City, Zhejiang Province Patentee after: ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY Co.,Ltd. Address before: 398 Longtan Road, Fenghua District, Ningbo City, Zhejiang Province Patentee before: ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |