CN109728737B - Brushless motor controller system and assembly method thereof - Google Patents
Brushless motor controller system and assembly method thereof Download PDFInfo
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- CN109728737B CN109728737B CN201910068104.9A CN201910068104A CN109728737B CN 109728737 B CN109728737 B CN 109728737B CN 201910068104 A CN201910068104 A CN 201910068104A CN 109728737 B CN109728737 B CN 109728737B
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 230000017525 heat dissipation Effects 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 4
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention provides a brushless motor controller system and an assembly method thereof, wherein the system comprises a heat dissipation substrate, an MOS tube and a controller control main board; the heat dissipation substrate is provided with a signal output terminal and a plurality of MOS (metal oxide semiconductor) tubes, each MOS tube is provided with two upward bent pins and a heat dissipation metal substrate, the pins are inserted into a controller control main board, a large current loop and a small current loop are arranged in the controller control main board, the large current loop is connected with the two upward bent pins of each MOS tube, and the heat dissipation metal substrate is connected with the signal output terminal. According to the invention, the MOS tube radiating metal substrate is used as a heavy current conductor, so that the length of a heavy current loop is shortened, the problem of overhigh heating temperature of a circuit board is effectively solved, and the step of additionally installing a heavy current copper bar as a conductor is eliminated.
Description
Technical Field
The invention relates to the technical field of garden electric tool control, in particular to a brushless motor controller system and an assembly method thereof.
Background
The brushless motor controller is an inverter converting direct current into alternating current, and usually, a plurality of MOS (metal oxide semiconductor) tubes packaged by TO-220 are needed, and the MOS tubes are high-current power devices, so that working current is high, and heat is generated during working. As shown in fig. 2, in the conventional controller MOS tube mounting process, the MOS tube is welded on a PCB circuit board, and the PCB circuit board is provided with a copper bar conductor for enlarging current, so as to meet the requirement of heavy current, the MOS tube is heat-dissipating by fixing a metal substrate for heat dissipation of the MOS tube on a heat dissipation plate (for example, aluminum alloy plate in fig. 2) with a screw, and insulating treatment is performed between the metal substrate for heat dissipation and the heat dissipation plate, for example, a heat-conducting insulating spacer and an insulating plastic sleeve of the screw are added, so that the heat-conducting coefficient of the spacer is relatively low, the heat-conducting effect is not ideal, the insulating process of the screw mounting process is complex, on one hand, the risk of electric leakage exists, on the other hand, the heat cannot be effectively dissipated, and the drain of the MOS tube is easy to break down, so that a scheme for solving the heat dissipation of the MOS tube is required.
In the prior art, a scheme for solving the problem of heat dissipation of the MOS tube is also disclosed, for example, chinese patent publication No. CN107276462A discloses a brushless motor controller system beneficial to heat dissipation of the MOS tube, and the brushless motor controller system beneficial to heat dissipation of the MOS tube comprises a shell, a motor body and a controller which are arranged in the shell, wherein the motor body and the controller are electrically connected with each other; the controller comprises a ventilation base, a first circuit board and a second circuit board; the MOS tube of the controller is arranged on the second circuit board, and the rest electronic components of the controller are arranged on the first circuit board; the first circuit board is electrically connected with the second circuit board; the ventilation base is provided with the vent, and first circuit board, second circuit board all set up on the ventilation base. The existing brushless motor controller system beneficial to MOS tube heat dissipation independently sets the MOS tube with high power consumption and large heat productivity on the second circuit board, is beneficial to heat dissipation and cooling of the MOS tube, can avoid the increase of MOS tube power loss and even suffers from heat damage, and prolongs the service life of a circuit system. The scheme can also radiate heat for the MOS tube, but the radiating effect is still poor, and the cost is high.
Disclosure of Invention
The invention aims to provide a brushless motor controller system and an assembly method thereof, which are used for solving the problems of poor heat dissipation effect and high cost of a circuit board of the existing brushless motor controller.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a brushless motor controller system comprises a heat dissipation substrate and a controller control main board;
the heat dissipation substrate is provided with a signal output terminal and a plurality of MOS (metal oxide semiconductor) tubes, the MOS tubes are provided with two upward bending pins and a heat dissipation metal substrate, and the two upward bending pins are inserted into the controller control main board;
the controller controls the main board to be provided with a heavy current loop, the heavy current loop with two upwards bent pins of MOS pipe are electric to be connected, the heat dissipation metal substrate welds to on the heat dissipation base plate and with signal output terminal electricity is connected.
Preferably, the heat dissipation substrate is an aluminum substrate, screw holes for inserting bolts are respectively formed in two corners of the heat dissipation substrate, and the bolts pass through the screw holes to fixedly install the heat dissipation fins.
Preferably, the screw holes are centrosymmetric with respect to the geometric center of the aluminum substrate.
Preferably, the plurality of MOS tubes are formed with a first MOS tube group and a second MOS tube group, a source electrode of the MOS tube in the first MOS tube group is connected with the heat dissipation substrate, a drain electrode of the MOS tube in the first MOS tube group and a drain electrode of the MOS tube in the second MOS tube group are jointly inserted into the same jack of the controller control main board, and a gate electrode of the MOS tube in the first MOS tube group and a gate electrode of the MOS tube in the second MOS tube group are respectively inserted into different jacks of the controller control main board.
Preferably, the first MOS tube group and the second MOS tube group are arranged opposite to each other, and three MOS tubes are respectively disposed in the first MOS tube group and the second MOS tube group.
Preferably, the heat dissipation substrate is further provided with a positive and negative patch base and a small current loop, and the positive and negative patch base is inserted into the controller control main board so that the controller control main board is connected with the small current loop.
Preferably, components are arranged at the bottom of the controller control main board, the heights of the components are the same as those of the radiating fins, and the components comprise a patch inductor and a patch electrolytic capacitor.
A method of assembling a brushless motor controller system, comprising the steps of:
molding the MOS tube into a patch package, and welding the patch package on a heat-dissipating substrate in an automatic patch mode;
respectively inserting pins and positive and negative patch bases of the MOS tube which are bent upwards into a control main board of the controller;
and the radiating fin is installed and fixed on the radiating substrate through the screw holes on the radiating substrate.
According to the invention, on one hand, the MOS radiating metal substrate is used as a heavy current conductor, so that heating is reduced, the need of additionally installing a heavy current copper bar as a conductor is eliminated, and on the other hand, the heavy current loop and the light current loop on the controller are mutually separated, so that heat dissipation is facilitated, the problem that the whole circuit board is affected by heating is solved, and the MOS tube is formed into a patch package, so that the MOS tube can be automatically welded on an aluminum substrate, the heat dissipation capacity is improved, manual welding is avoided, and the labor cost is saved.
Drawings
Fig. 1 is a schematic structural diagram of a MOS transistor according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating the installation of MOS transistors in a conventional brushless motor controller system;
fig. 3 is a schematic diagram of a MOS transistor molded into a chip package according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a position structure of a MOS tube, a positive and negative patch base, and a base provided in an embodiment of the present invention;
FIG. 5 is a schematic diagram of a brushless motor controller system according to an embodiment of the invention;
FIG. 6 is a flow chart of a method of assembling a brushless motor controller according to one embodiment of the invention;
wherein, 1, a first MOS tube, 11, a source electrode, 12, a drain electrode, 13, a grid electrode, 2, a second MOS tube, 22, a drain electrode, 23, a grid electrode, 3, a heat dissipation metal substrate, 4, a heat dissipation substrate, 41, screw holes, 5, signal output terminals, 6, positive and negative patch bases, 7, a controller control main board, 8, an aluminum alloy plate, 81, a PCB (printed circuit board), 82 and welding points.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
Example 1
Referring to fig. 3, 4 and 5, the present embodiment provides a brushless motor controller system, which includes a heat dissipation substrate 4 and a controller control motherboard 7;
be provided with signal output terminal 5 and a plurality of MOS pipe on the radiating substrate 4, a plurality of MOS pipe includes first MOS pipe 1 and second MOS pipe 2, and first MOS pipe 1 and second MOS pipe 2 have two crooked pins and heat dissipation metal substrate 3, and two crooked pins insert in the controller control mainboard 7, are provided with the heavy current return circuit in the controller control mainboard 7, and the heavy current return circuit is connected with two crooked pins of first MOS pipe 1, second MOS pipe 2, and heat dissipation metal substrate 3 is connected with signal output terminal 5.
The high-current loop is a circuit loop electrically connected with the MOS tube so as to output a driving signal to the brushless motor through the MOS tube.
The brushless motor controller is an inverter for converting direct current into alternating current, and a large current loop is generally arranged on a control main board of the controller, and is used for inputting and outputting control signals because the MOS tube is a large current power device and the large current required by the MOS tube is met by arranging the large current loop. Wherein the current of the small current loop is smaller than the current of the large current loop.
The brushless motor controller system in the embodiment is applied to the field of garden electric tools.
Referring to fig. 1, fig. 1 shows a structure of a MOS transistor, which includes three pins and a heat dissipation metal substrate 3, which is a conventional MOS transistor applied to a brushless motor controller, and detailed principle and function description are not made in this embodiment.
Referring TO fig. 3, fig. 3 is a schematic diagram of a molding method of a MOS tube provided in this embodiment, in which a TO-220 packaging method (such as the MOS tube in fig. 1 and fig. 2) is adopted in the existing conventional MOS tube, and in this embodiment, an SMD patch packaging method is adopted, and this molding method can enable the MOS tube TO be automatically attached TO a circuit board by an automatic attaching process, that is, by using an attaching machine or the like, without manually welding the pin of the MOS tube by using an electric soldering iron or the like, thereby improving the welding efficiency and saving the labor cost.
In addition, the heat dissipation metal substrate of the MOS tube in fig. 2 is fixed to the aluminum alloy plate by screws, and the process can only be assembled by manual work, but in this embodiment, the MOS tube is directly welded on the heat dissipation substrate 4 by adopting an automatic surface mounting process, so that the heat dissipation metal substrate 3 of the MOS tube does not need to be fixed manually, and isolation by using an insulating gasket or the like is not needed, thereby ensuring that the MOS tube cannot break down and leak.
In addition, since the heat dissipation substrate 4 in the embodiment is an aluminum substrate, the heat conductivity coefficient of the aluminum substrate is very good, and when the MOS tube is welded on the aluminum substrate, the heat dissipation can be effectively performed through the aluminum substrate.
In fig. 3, the MOS transistor has two forms, one MOS transistor has three pins (i.e., the first MOS transistor 1), two pins 12 and 13 of the two pins are bent vertically upward, the other pin 11 is bent vertically downward, the other MOS transistor has two pins (i.e., the second MOS transistor 2), two pins 21 and 22 are bent vertically upward, and the drain 12 and the drain 22 of the two MOS transistors (i.e., the pins bent vertically upward) are inserted into the same jack of the controller control motherboard 7 together.
Referring to fig. 4 and fig. 5, three jacks with different apertures are provided on the controller motherboard, the first jack is used for simultaneously inserting the drain 12 of the first MOS transistor 1 and the drain 22 of the second MOS transistor 2, the second jack is used for inserting the gate 23 of the second MOS transistor 2, and the third jack is used for inserting the gate 13 of the first MOS transistor 1.
The heat dissipation substrate 4 is also provided with a signal output terminal 5, the signal output terminal 5 is connected with the heat dissipation metal substrate 3 of the MOS tube welded on the heat dissipation substrate 4, and the heat dissipation metal substrate 3 of the MOS tube is used as the input and output of large current in the connection mode, so that the heat dissipation metal substrate 3 serves as a heat conduction copper bar in the prior art, the use of a diversion copper bar is avoided, and the production cost is reduced.
The signal output terminal 5 is of an integrally formed U-shaped structure and comprises an upper end metal sheet and a lower end metal sheet, wherein the lower end metal sheet is welded on the heat dissipation substrate 4, and a circular through hole is formed in the upper end metal sheet and used for being connected with a motor control wire of the brushless motor controller so as to control the brushless motor to work through the motor control wire.
The invention is connected with the heat radiation substrate 4 and the motor control lead through the signal output terminal 5, thereby avoiding the problems that the motor control lead is inconvenient to weld, the operation efficiency is low, the welding is not stable enough, and the input and output lead is easy to fall off from the aluminum substrate. And this embodiment can make the wire through circular through-hole and signal output terminal 5 and whole aluminium base board electricity be connected through setting up signal output terminal 5, and it is firm reliable more that it connects, connects more conveniently moreover, and connection efficiency is higher.
It should be further noted that, the heat dissipation metal substrate 3 of the MOS tube is one of three polarities of G (gate 13), D (drain 12) and S (source 11) of the MOS tube, which is D (drain 12), and can be electrically connected, so that the heavy current loop of the controller is directly connected with the MOS tubes 1 and 2, and the MOS tube is used as a heavy current carrier, so that no additional diversion copper bar is required to be arranged on the PCB, the cost is saved, and the MOS tube is welded on an aluminum substrate with very good heat conductivity, thereby effectively dissipating heat and avoiding the influence caused by heat.
Referring to fig. 4, screw holes 41 are respectively provided at two corners of the aluminum substrate in the present embodiment, and the screw holes 41 are centrally symmetrical with respect to the geometric center of the aluminum substrate.
The bolts can fix the cooling fin on the aluminum substrate through the screw holes 41, and the installation position of the cooling fin is not shown in fig. 4, it should be understood that the cooling fin is used for further cooling the MOS tube, and the specific installation position of the cooling fin can be adjusted according to the actual situation, which is not described in this embodiment.
Through setting two screw 41 of central symmetry for only need two screw 41 on the corner just can effectually fix the fin, and need not provide six screw and fix the heat dissipation metal substrate of MOS pipe and dispel the heat, reduced the quantity of screw, improve the operating efficiency of installation assembly.
The two sets of MOS tube sets, namely a first MOS tube set and a second MOS tube set, are arranged oppositely, each set of MOS tube sets comprises three MOS tubes in parallel, wherein an S-pole (source 11) of a first MOS tube 1 in the first MOS tube set is connected with the heat dissipation substrate 4, a D-pole (drain 12) of the first MOS tube 1 in the first MOS tube set and a D-pole (drain 22) of a second MOS tube in the second MOS tube set are jointly inserted into the same jack of the controller control main board 7, so that the assembly is convenient, the production efficiency is high, the integration level of a circuit is improved, the volume is reduced, and a G-pole (gate 13) of the first MOS tube 1 in the first MOS tube set and a G-pole (gate 23) of the second MOS tube 2 in the second MOS tube set are respectively inserted into different jacks of the controller control main board 7.
Preferably, the D pole (drain 12) of the first MOS transistor 1 in the first MOS transistor group is spaced apart from the D pole (drain 22) of the second MOS transistor in the second MOS transistor group by a predetermined distance, and the D pole (drain 12) of the first MOS transistor 1 in the first MOS transistor group is connected to the D pole (drain 22) of the second MOS transistor in the second MOS transistor group by welding, so that the device is not only reliable in fixation, but also easier to assemble. In a preferred embodiment, the insertion hole into which the D-pole (drain 12) of the first MOS transistor 1 and the D-pole (drain 22) of the second MOS transistor are inserted in the first MOS transistor group is formed by two intersecting circular holes, so that the fixation is more reliable. It will be appreciated that the shape and configuration of the receptacle is not particularly limited herein.
As can be seen from comparison between fig. 4 and fig. 2, the first MOS transistor 1 and the second MOS transistor 2 in fig. 4 are attached to the heat dissipation substrate 4, and are connected to the heat dissipation substrate 4 by means of automatic soldering, the heat dissipation metal substrate 3 of the MOS transistor serves as a heavy current conductor, the MOS transistor in fig. 2 needs to fix the heat dissipation metal substrate 3 on the aluminum alloy plate by means of screws, and an insulating spacer is further required between the heat dissipation metal substrate 3 and the aluminum alloy plate, so that breakdown leakage and the like are easy to occur, and a diversion copper bar is further required to be added on the PCB board in fig. 2 to guide heavy current, thereby increasing cost.
In this embodiment, the heat dissipation substrate 4 is further provided with a positive and negative patch base 6 and a low-current loop, and the positive and negative patch base 6 is inserted into the controller control motherboard 7, so that the controller control motherboard 7 is connected with the low-current loop.
The low current loop includes a loop for controlling signal input and output, and similar to a conventional brushless motor controller, a conventional brushless motor controller has a low current loop and a high current loop, which are not described in detail herein.
By arranging the small current loop on the heat dissipation substrate 4, the small current loop is separated from the large current loop, the small current loop is positioned on the heat dissipation substrate 4, the large current loop is positioned on the controller control main board 7, the heat dissipation substrate 4 is connected with the large current loop on the controller control main board 7 through the MOS tubes 1 and 2, and the controller control main board 7 is connected with the small current loop on the heat dissipation substrate 4 through the positive and negative patch bases 6.
After the small current loop and the large current loop are separated, the influence of heat generation on the whole PCB can be avoided.
In this embodiment, a component is disposed at the bottom of the controller control motherboard 7, and the height of the component is the same as that of the heat sink, and the component includes a chip inductor and a chip electrolytic capacitor.
The bottom of the controller control main board 7 is opposite to the upper surface of the heat dissipation substrate 4, the upper surface of the heat dissipation substrate 4 is provided with MOS tubes, and the bottom of the controller control main board 7 is provided with components of a high-current loop or other components of the controller, so that the height of the whole controller can be effectively reduced, and the space is fully utilized.
Because the radiating substrate 4 is also provided with radiating fins, the height of the components cannot exceed the height of the radiating fins, so that the whole controller is more compact in structure, the whole volume of the controller is reduced, and the installation and the assembly are convenient.
According to the embodiment, on one hand, the radiating metal substrate of the MOS is used as a heavy current conductor, heating is reduced, the need of additionally installing a heavy current copper bar as a conductor is eliminated, on the other hand, a heavy current loop and a light current loop on a controller are mutually separated, heat dissipation is facilitated, the problem that the whole circuit board is affected by heating is solved, the MOS tube is formed into a patch package, the MOS tube can be automatically welded on an aluminum substrate, the radiating capacity is improved, manual welding is avoided, and labor cost is saved.
Example two
The present embodiment provides an assembling method of a brushless motor controller system, as shown in fig. 6, including the steps of:
molding the MOS tube into a patch package, and welding the patch package on a heat-dissipating substrate through automatic patch welding;
respectively inserting pins and positive and negative patch bases of the MOS tube which are bent upwards into a control main board of the controller;
and the radiating fin is installed and fixed on the radiating substrate through the screw holes on the radiating substrate.
Compared with the existing controller assembly mode, the mounting mode in the embodiment is very convenient, the existing MOS tube cannot be directly welded on the radiating substrate by adopting an automatic surface mounting technology due TO the fact that TO-220 packaging is adopted, manual welding is needed, the radiating metal substrate is also needed TO be fixed on the aluminum alloy plate by screws, the process also needs TO be fixed manually, and the operation steps of the whole assembly process are complex.
In the assembly mode in this implementation, the MOS tube can be automatically attached by adopting the chip mounter, and is welded on the heat dissipation substrate, and the heat dissipation metal substrate of the MOS tube is not required to be fixed by screws and the like, so that the manual operation cost is saved, and the overall assembly efficiency is improved.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (5)
1. A brushless motor controller system is characterized by comprising a heat dissipation substrate and a controller control main board;
the heat dissipation substrate is provided with a signal output terminal and a plurality of MOS (metal oxide semiconductor) tubes, the MOS tubes are provided with two upward bending pins and a heat dissipation metal substrate, and the two upward bending pins are inserted into the controller control main board;
the controller is used for controlling the main board to be provided with a high-current loop, the high-current loop is electrically connected with two upward bent pins of the MOS tube, and the heat dissipation metal substrate is welded on the heat dissipation substrate and is electrically connected with the signal output terminal;
the MOS tubes are formed with a first MOS tube group and a second MOS tube group, the source electrode of the MOS tube in the first MOS tube group is connected with the heat dissipation substrate, the drain electrode of the MOS tube in the first MOS tube group and the drain electrode of the MOS tube in the second MOS tube group are jointly inserted into the same jack of the controller control main board, and the grid electrode of the MOS tube in the first MOS tube group and the grid electrode of the MOS tube in the second MOS tube group are respectively inserted into different jacks of the controller control main board;
the first MOS tube group and the second MOS tube group are arranged oppositely, and three MOS tubes are respectively arranged in the first MOS tube group and the second MOS tube group;
the heat dissipation substrate is also provided with a positive patch base, a negative patch base and a small current loop, wherein the positive patch base and the negative patch base are inserted into the controller control main board so that the controller control main board is connected with the small current loop.
2. The brushless motor controller system according to claim 1, wherein the heat dissipation substrate is an aluminum substrate, screw holes for inserting bolts are respectively provided at two corners of the heat dissipation substrate, and the bolts pass through the screw holes to fixedly mount the heat sink.
3. A brushless motor controller system according to claim 2, wherein the screw holes are centrally symmetrical about a geometric center of the aluminum substrate.
4. A brushless motor controller system according to claim 1 or 2, wherein the bottom of the controller control main board is provided with components, the height of the components is the same as the height of the heat sink, and the components include a chip inductor and a chip electrolytic capacitor.
5. A method of assembling a brushless motor controller system, characterized by being applied to a brushless motor controller system as claimed in any one of claims 1 to 4; the assembly method comprises the following steps:
molding the MOS tube into a patch package, and welding the patch package on a heat-dissipating substrate in an automatic patch mode;
respectively inserting pins and positive and negative patch bases of the MOS tube which are bent upwards into a control main board of the controller;
and the radiating fin is installed and fixed on the radiating substrate through the screw holes on the radiating substrate.
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| CN110337194B (en) * | 2019-07-25 | 2024-02-13 | 苏州华之杰电讯股份有限公司 | Connecting structure of parallel double MOS (Metal oxide semiconductor) tubes and PCBA (printed circuit board assembly) |
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| CN207603400U (en) * | 2017-10-20 | 2018-07-10 | 台州赛盈电机科技有限公司 | A kind of radiator structure of drive system of electric motor vehicle |
| CN109088551A (en) * | 2018-10-11 | 2018-12-25 | 浙江动新能源动力科技股份有限公司 | A kind of board structure of circuit of super-high-current |
| CN209516953U (en) * | 2019-01-24 | 2019-10-18 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system |
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| CN109728737A (en) | 2019-05-07 |
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