CN109088551A - A kind of board structure of circuit of super-high-current - Google Patents
A kind of board structure of circuit of super-high-current Download PDFInfo
- Publication number
- CN109088551A CN109088551A CN201811185988.8A CN201811185988A CN109088551A CN 109088551 A CN109088551 A CN 109088551A CN 201811185988 A CN201811185988 A CN 201811185988A CN 109088551 A CN109088551 A CN 109088551A
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- metal
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- current
- circuit
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 88
- 239000004065 semiconductor Substances 0.000 claims abstract description 85
- 229910052742 iron Inorganic materials 0.000 claims abstract description 44
- 238000009434 installation Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 239000011889 copper foil Substances 0.000 abstract description 9
- 206010037660 Pyrexia Diseases 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000010949 copper Substances 0.000 abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Abstract
The present invention relates to a kind of board structure of circuit of super-high-current, including circuit board and installation on circuit boards and with the metal-oxide-semiconductor of circuit board electrical connection (1), the metal-oxide-semiconductor (1) has connection pin (11) and drain electrode iron head (12), and the drain electrode iron head (12) of metal-oxide-semiconductor (1) is directly and circuit board electrical connection.The board structure of circuit of super-high-current in the present invention makes full use of the design feature of metal-oxide-semiconductor itself, i.e., the drain electrode iron head itself in metal-oxide-semiconductor with big cross-sectional area is also the drain electrode of MOS, can also be electrically connected.It is such then the drain electrode iron head of metal-oxide-semiconductor is directly connected to circuit board, and then the drain electrode iron head of metal-oxide-semiconductor is used as the conductor of super-high-current, the drain electrode iron head of the metal-oxide-semiconductor can not only meet the requirement of super-high-current, the path-length of high current can also be shortened, reduce fever, no longer needs to using the copper bar or copper foil being additionally arranged in the prior art.
Description
Technical field
The present invention relates to circuit board technology field, in particular to a kind of board structure of circuit of super-high-current.
Background technique
Brushless motor controller is the inverter that direct current delivers stream, usually requires the MOS for using 6 TO-220 encapsulation
Pipe, wherein metal-oxide-semiconductor is super-current power unit, and operating current is big, is generated heat in the process of work also big.Existing brushless motor
The mounting process of controller metal-oxide-semiconductor are as follows: metal-oxide-semiconductor is welded on pcb board, setting expands electric current in big current loop on pcb board
Copper bar conductor, to meet needed for high current.And the heat dissipation of metal-oxide-semiconductor is then by consolidating the heat dissipation drain electrode iron head screw of metal-oxide-semiconductor
Fixed to realize on a heat sink, the heat dissipation drain electrode iron head of metal-oxide-semiconductor itself also needs insulation processing between cooling fin, needs to increase and lead
The gasket of thermal insulation and the ambroin casing of screw, gasket thermal coefficient itself is relatively low, and heat-conducting effect is undesirable, screw
The insulating process of installation process is very complicated, and breakdown leakage risk is very high.
Such as the Chinese utility model patent that Authorization Notice No. is CN204794157U (application No. is 201520383234.9)
" board structure of circuit of solar charging controller ", disclosed in board structure of circuit, then copper foil, function are set on circuit boards
Rate metal-oxide-semiconductor then passes through the copper foil and is electrically connected with the circuit on circuit board, when super-high-current, heat that the pin of metal-oxide-semiconductor generates
Amount is transmitted on copper foil, and copper foil is not easy to be blown, and prevents the appearance of short circuit phenomenon.In the program there is still a need for setting copper foil,
Circuit board cost is high, and low current circuit and high-current circuit is arranged in circuit board simultaneously, the whole hair of circuit board
Enthusiastic condition can not solve the heat dissipation problem of circuit board entirety than more serious.
Summary of the invention
First technical problem to be solved by this invention be one kind is provided for the above-mentioned prior art can be without volume
Guarantee high current safety under conditions of outer setting copper foil or copper bar, and the circuit that can reduce the super-high-current of fever is hardened
Structure.
The present invention to be solved second technical problem be directed to the above-mentioned prior art provide one kind can effectively carry out it is scattered
The board structure of circuit of super-high-current hot and that board structure of circuit volume can be effectively reduced.
The present invention solves technical solution used by above-mentioned first technical problem are as follows: a kind of circuit of super-high-current is hardened
Structure, the metal-oxide-semiconductor including circuit board and installation on circuit boards and with circuit board electrical connection, the metal-oxide-semiconductor have connection pin
And drain electrode iron head, it is characterised in that: the drain electrode iron head of metal-oxide-semiconductor is directly and circuit board electrical connection.
In order to reduce the whole fever of circuit board, the circuit board includes the low current circuit board and excessive electricity of too little current
The high-current circuit plate of stream, the connection pin and low current circuit board electrical connection of metal-oxide-semiconductor, the drain electrode iron head and high current of metal-oxide-semiconductor
Circuit board electrical connection.
Preferably, the high-current circuit plate is welded to connect on the drain electrode iron head of metal-oxide-semiconductor by paster technique.
The present invention solves technical solution used by above-mentioned second technical problem are as follows: further includes the side with drain electrode iron head
The radiator become placed against.
It is installed in order to facilitate electrical connection and reduces overall volume, what the low current circuit board was arranged in metal-oxide-semiconductor has company
The side of adapter tube foot protrusion, the connection pin of the metal-oxide-semiconductor are plugged in low current circuit board and are electrically connected with low current circuit board
It connects；
The flat side of metal-oxide-semiconductor is arranged in the radiator.
Simply, the radiator includes cooling fin.
In order to guarantee good heat-conducting effect, the radiator further includes aluminum substrate, and the aluminum substrate becomes placed against
The side of drain electrode iron head, the cooling fin are sticked on aluminum substrate.
It further include shell to reduce whole volume, the circuit board and metal-oxide-semiconductor are arranged in shell, the big electricity
Connection terminal is connected separately on current circuit plate, low current circuit board, the connection terminal extends to the extending direction of cooling fin
Setting.
More simply, the cooling fin includes heat-radiating substrate and the sheet body that is connected on heat-radiating substrate side to structure, described
It is relatively set with a pair of of plate body on the other side of heat-radiating substrate and forms installation space on the other side of the heat-radiating substrate, institute
It states circuit board and metal-oxide-semiconductor is arranged in the installation space；
It is connected separately with connection terminal on the high-current circuit plate, low current circuit board, the connection terminal is to heat dissipation
The oppositely extending setting of piece median plate body extending direction.
Compared with the prior art, the advantages of the present invention are as follows: the board structure of circuit of the super-high-current in the present invention, sufficiently benefit
With the design feature of metal-oxide-semiconductor itself, i.e., the drain electrode iron head itself in metal-oxide-semiconductor with big cross-sectional area is also the drain electrode of MOS, can also
To be electrically connected.It is such then the drain electrode iron head of metal-oxide-semiconductor is directly connected to circuit board, and then the drain electrode iron head of metal-oxide-semiconductor is made
It is used for the conductor of super-high-current, the drain electrode iron head of the metal-oxide-semiconductor can not only meet the requirement of super-high-current, additionally it is possible to shorten big
The path-length of electric current reduces fever, no longer needs to using the copper bar or copper foil being additionally arranged in the prior art.In addition, this hair
It is bright it is middle set high-current circuit plate and low current circuit board for circuit board, so then can to high-current circuit and low current electricity
Road is separately positioned, reduces the whole heating problem of circuit board.
In the present invention be provided with radiator can the heat production of drain electrode iron head during the work time to metal-oxide-semiconductor carry out it is scattered
Heat, while high-current circuit plate can also be assisted to radiate, good heat dissipation effect.And due to radiator and high-current circuit
Plate is separately positioned on the two sides of the drain electrode iron head of metal-oxide-semiconductor, can effectively reduce the whole body of the board structure of circuit of the super-high-current
Product.
Detailed description of the invention
Fig. 1 is the schematic diagram of brushless motor controller in the embodiment of the present invention.
Fig. 2 is the perspective view of the board structure of circuit of super-high-current in the embodiment of the present invention one.
Fig. 3 is the stereogram exploded view of the board structure of circuit of super-high-current in the embodiment of the present invention one.
Fig. 4 is the perspective view of the board structure of circuit of super-high-current in the embodiment of the present invention two.
Fig. 5 is the part-structure perspective view of the board structure of circuit of super-high-current in the embodiment of the present invention two.
Fig. 6 is the stereogram exploded view of the board structure of circuit of super-high-current in the embodiment of the present invention two.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
The board structure of circuit of super-high-current in the present embodiment can be applied in the various circuit boards using metal-oxide-semiconductor, this
For carrying out use as the circuit board of brushless motor controller using the board structure of circuit of the super-high-current in embodiment, to the mistake
The board structure of circuit of high current is described in detail.
Embodiment one
As shown in Figures 2 and 3, the board structure of circuit of the super-high-current in the present embodiment include circuit board, metal-oxide-semiconductor 1 and
Radiator 4.
Wherein circuit board includes the low current circuit board 3 of too little current and the high-current circuit plate 2 of super-high-current, i.e., will be small
Current circuit and high-current circuit are separately positioned.
Metal-oxide-semiconductor 1 has there are three pin 11 and drain electrode iron head 12 is connected, wherein three connection pins 11 are in needle-shaped, difference
For grid, source electrode and drain electrode, drain electrode iron head 12 is a sheet body 412, has biggish area, which is similarly MOS
The drain electrode of pipe 1.Three connection pins 11 of the metal-oxide-semiconductor 1 in the present embodiment are folded upward at setting relative to the ontology of metal-oxide-semiconductor 1, leakage
Pole iron head 12 then tile the ontology that metal-oxide-semiconductor 1 is set lower surface on, and the end for the iron head 12 that drains stretches out in metal-oxide-semiconductor 1
Outside the end of ontology.
The quantity of metal-oxide-semiconductor 1 is specifically arranged according to circuit needs.As shown in Figure 1, super-high-current in the present embodiment
Circuit board of the board structure of circuit as brushless motor controller then needs 6 metal-oxide-semiconductors 1, wherein the drain electrode of 3 metal-oxide-semiconductors 1 needs
Positive pole is connected, in addition the drain electrode of 3 metal-oxide-semiconductors 1 then needs to be separately connected the triple line connecting pin of motor.
6 metal-oxide-semiconductors 1 in the present embodiment are arranged in two rows, and in the connection pin 11 of 6 metal-oxide-semiconductors 1 is respectively positioned on
End, 6 metal-oxide-semiconductors 1 are respectively positioned on outer end.The top of 6 metal-oxide-semiconductors 1, the connecting tube of 6 metal-oxide-semiconductors 1 is arranged in low current circuit board 3
Foot 11 is upwardly extended and is plugged on low current circuit board 3, and the connection pin 11 of 6 metal-oxide-semiconductors 1 needs and small electricity according to circuit
Circuit on current circuit plate 3 realizes electrical connection.
Two high-current circuit plates 2 are provided in the present embodiment, one of high-current circuit plate 2 passes through automatic chip mounting skill
Art is welded on the 12 upper surface exposed portion of drain electrode iron head of wherein row's metal-oxide-semiconductor 1, and then realizes the drain electrode iron of 3 metal-oxide-semiconductors 1
First 12 with the circuit connection of high-current circuit plate 2.The drain electrode iron head 12 of this 3 metal-oxide-semiconductors 1 is connected to greatly directly as drain electrode herein
It is used on current circuit plate 2, one is connected on the high-current circuit plate 2 for connecting the connection terminal 6 of power supply.
Another high-current circuit plate 2 is welded on table on the drain electrode iron head 12 of another row's metal-oxide-semiconductor 1 by automatic chip mounting technology
On the exposed portion of face, and then realize the circuit connection of drain electrode the iron head 12 and high-current circuit plate 2 of other 3 metal-oxide-semiconductors 1.This 3
The drain electrode iron head 12 of metal-oxide-semiconductor 1 is also connected on this high-current circuit plate 2 directly as drain electrode and uses, the high-current circuit plate 2
On be connected with three connection terminals 6 for being respectively used to connection electrode triple line.
In this way, two high-current circuit plates 2 are distributed in the position of two rows of 1 avris of metal-oxide-semiconductor, due to the connection of 6 metal-oxide-semiconductors 1
Pin 11 concentrates on middle part, then the two sides of low current circuit board 3 is reserved vacancy for placing two high-current circuit plates 2, such as
This can effectively reduce installation volume.
Radiator 4 is arranged in the flat side of metal-oxide-semiconductor 1, and in the present embodiment, radiator 4 is then arranged in metal-oxide-semiconductor 1
Lower section, so then can with metal-oxide-semiconductor 1 drain 12 lower surface of iron head large area be adjacent to contacting, to metal-oxide-semiconductor 1 drain iron
The heat generated in first 12 course of work radiates.Two sides of the drain electrode iron head 12 of such metal-oxide-semiconductor 1 are able to sufficient benefit
With the one side of the drain electrode iron head 12 of metal-oxide-semiconductor 1 is connected for super-high-current, i.e., uses as high-current conductor, another side
For radiating.As high-current conductor in use, the path-length of high current can be shortened, reduce fever, no longer needs to using existing
There are the copper bar or copper foil being additionally arranged in technology.As heat dissipation in use, heat dissipation area is sufficiently large, and can be to high current
Flow-guiding radiation is realized in the fever of circuit board 2.The drain electrode iron head 12 of the metal-oxide-semiconductor 1, which is multiplexed, to be used, and setting volume has been saved.
Cooling fin 41 in the present embodiment includes heat-radiating substrate 411 and the sheet body being connected on 411 side of heat-radiating substrate
412, it is relatively set with a pair of of plate body on the other side of heat-radiating substrate 411 and forms installation on the other side of heat-radiating substrate 411
Space 40, circuit board and metal-oxide-semiconductor 1 are arranged in the installation space 40.And connection pin 11, the high-current circuit of each metal-oxide-semiconductor 1
The connection terminal 6 connected on plate 2 extends in the same direction upwards, reduces setting volume.The connection pin 11 of metal-oxide-semiconductor 1 is sudden and violent in the structure
It is exposed to the top of low current circuit board 3, is fixed without using shell, direct gluing is fixed, and operation is very easy.
Embodiment two
As shown in Figures 4 to 6, the present embodiment and the difference of embodiment one are only that: radiator 4 further includes aluminum substrate
42, aluminum substrate 42 is adjacent to the lower surface setting of the drain electrode iron head 12 of each metal-oxide-semiconductor 1, and cooling fin 41 is adjacent to the setting of aluminum substrate 42, aluminium base
Plate 42 can be very well by the heat transfer generated on the drain electrode iron head 12 of metal-oxide-semiconductor 1 to cooling fin 41, and then carries out heat spreading function.
Shell 5 is additionally included, the shell 5 is in box-packed, and circuit board and metal-oxide-semiconductor 1 are arranged in shell 5, and large-current electric
Connection terminal 6 on road plate 2 and low current circuit board 3 extends downwardly, i.e. high-current circuit plate 2 and low current circuit board 3
On connection terminal 6 then to the extending direction of cooling fin 41 be extended, so can effectively save setting volume.
Claims (9)
1. a kind of board structure of circuit of super-high-current, including circuit board and installation on circuit boards and with circuit board electrical connection
Metal-oxide-semiconductor (1), the metal-oxide-semiconductor (1) have connection pin (11) and drain electrode iron head (12), it is characterised in that: the leakage of metal-oxide-semiconductor (1)
Pole iron head (12) is directly and circuit board electrical connection.
2. the board structure of circuit of super-high-current according to claim 1, it is characterised in that: the circuit board includes too small electricity
The low current circuit board (3) of stream and the high-current circuit plate (2) of super-high-current, the connection pin (11) and low current of metal-oxide-semiconductor (1)
Circuit board (3) electrical connection, the drain electrode iron head (12) of metal-oxide-semiconductor (1) are electrically connected with high-current circuit plate (2).
3. the board structure of circuit of super-high-current according to claim 2, it is characterised in that: the high-current circuit plate (2)
It is welded to connect on the drain electrode iron head (12) of metal-oxide-semiconductor (1) by paster technique.
4. according to the board structure of circuit of super-high-current described in claim 2 to 3 any claim, it is characterised in that: also wrap
It including radiator (4), the radiator (4) and circuit board are separately positioned on the two sides of the drain electrode iron head (12) of metal-oxide-semiconductor (1),
The radiator (4) becomes placed against on the side of the drain electrode iron head (12) of metal-oxide-semiconductor (1).
5. the board structure of circuit of super-high-current according to claim 4, it is characterised in that: the low current circuit board (3)
It is arranged in the side for there are connection pin (11) to protrude of metal-oxide-semiconductor (1), the connection pin (11) of the metal-oxide-semiconductor (1) is plugged in small electricity
It is electrically connected in current circuit plate (3) and with low current circuit board (3)；
The radiator (4) is arranged in the flat side of metal-oxide-semiconductor (1).
6. the board structure of circuit of super-high-current according to claim 4, it is characterised in that: the radiator (4) includes
Cooling fin (41).
7. the board structure of circuit of super-high-current according to claim 6, it is characterised in that: the radiator (4) is also wrapped
It includes aluminum substrate (42), the aluminum substrate (42) becomes placed against in the side of drain electrode iron head (12), and the cooling fin (41) is sticked
On aluminum substrate (42).
8. the board structure of circuit of super-high-current according to claim 7, it is characterised in that: further include shell (5), the electricity
In shell (5), the high-current circuit plate (2), low current circuit board are connected separately on (3) for road plate and metal-oxide-semiconductor (1) setting
Connection terminal (6), the connection terminal (6) are extended to the extending direction of cooling fin (41).
9. the board structure of circuit of super-high-current according to claim 6, it is characterised in that: the cooling fin (41) includes dissipating
Hot substrate (411) and the sheet body (412) being connected on heat-radiating substrate (411) side, on the other side of the heat-radiating substrate (411)
It is relatively set with a pair of of plate body and forms installation space (40) on the other side of the heat-radiating substrate (411), the circuit board
With metal-oxide-semiconductor (1) setting in the installation space (40)；
Connection terminal (6), the connection terminal are connected separately on the high-current circuit plate (2), low current circuit board (3)
(6) to the oppositely extending setting of cooling fin (41) median plate body (412) extending direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811185988.8A CN109088551A (en) | 2018-10-11 | 2018-10-11 | A kind of board structure of circuit of super-high-current |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811185988.8A CN109088551A (en) | 2018-10-11 | 2018-10-11 | A kind of board structure of circuit of super-high-current |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109088551A true CN109088551A (en) | 2018-12-25 |
Family
ID=64843548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811185988.8A Pending CN109088551A (en) | 2018-10-11 | 2018-10-11 | A kind of board structure of circuit of super-high-current |
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| Country | Link |
|---|---|
| CN (1) | CN109088551A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109728737A (en) * | 2019-01-24 | 2019-05-07 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system and its assembly method |
| CN111478644A (en) * | 2020-04-10 | 2020-07-31 | 谢渊斌 | Motor controller |
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|---|---|---|---|---|
| CN109728737A (en) * | 2019-01-24 | 2019-05-07 | 浙江动一新能源动力科技股份有限公司 | A kind of brushless motor controller system and its assembly method |
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| CN111478644A (en) * | 2020-04-10 | 2020-07-31 | 谢渊斌 | Motor controller |
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Address after: 315016 No. 255, Kesheng Road, Wangchun Industrial Park, Haishu District, Ningbo City, Zhejiang Province Applicant after: ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY Co.,Ltd. Address before: 315599 No. 398, Longtan Road, Yuelin street, Fenghua District, Ningbo City, Zhejiang Province Applicant before: ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY Co.,Ltd. |