JPH0572144U - Connection structure of circuit element to wiring board - Google Patents

Abstract

(57) [Summary] [Object] When connecting a plurality of semiconductor elements in parallel on a wiring board, it is possible to form a wide conductor capable of driving a large current load. [Structure] Gate terminals 39, 49 and source terminals 38, 4
8 is formed to extend to one side of the element body, and heat sinks 32a and 42a for heat dissipation are drain terminals 37 and 47.
Since it also serves as the element, it is formed so as to extend to the other side of the element body. Therefore, the conductors 14, 15 and 16 can be formed to have a wide width, and a large current load can be driven. Further, since the conductors do not intersect, the process for forming the pattern is simplified.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connection structure that is preferably implemented when a circuit element is surface-mounted on a wiring board. More specifically, the invention relates to a wiring element for a circuit element such as a semiconductor element for controlling a large current such as a power transistor. Regarding connection structure.

[0002]

[Prior Art]

 When mounting semiconductor elements used in electronic equipment, especially circuit elements such as power transistors used to drive loads with relatively high power consumption, such as electromagnetic solenoids and motors, on the wiring board, circuits such as the power transistors When multiple elements are connected in parallel, a typical prior art conductor is formed as shown in FIG. 6 and FIG. 7, which is a cross-sectional view of FIG. 6 taken along section line BB. ..

That is, a plurality of transistor elements 12 and 22 are surface-mounted on the surface of the wiring board 1 by screwing and fixing them with screws 13 and 23 by heat radiating plates 12 a and 22 a, respectively. The conductors 4, 5 and 6 are formed on the surface of the wiring board 1, and the conductors 4, 5 and 6 are terminals corresponding to the transistor elements 12 and 22, respectively, which are opposite to the heat sinks 12a and 22a. The drain terminals 17 and 27, the source terminals 18 and 28, and the gate terminals 19 and 29 arranged on the side are formed to have the same length and connected. Thus, the transistor elements 12 and 22 can be connected in parallel to drive the load.

[0004]

[Problems to be solved by the device]

 In the above-described conventional technique, it is necessary to intersect the conductor 4 and the conductor 5 at the intersecting position indicated by the reference numeral 20 with the insulator 10 interposed therebetween. The steps for producing such a wiring board 1 are as follows. First, an aluminum layer is formed on the wiring board 1, and a photosensitive resin is applied thereon. Then, exposure is performed through a mask on which a circuit pattern is formed, and the patterned portion is solidified. After that, cleaning is performed, aluminum is etched by an etching solution, and the photosensitive resin is removed.

Therefore, in order to intersect the conductors 4 and 5, the above steps have to be performed twice, and a step for forming the insulator 10 between the conductors 4 and 5 is also required. Therefore, the manufacturing process becomes complicated. Also, of the gate terminals 19 and 29, the drain terminals 17 and 27, and the source terminals 18 and 28, the gate terminals 19 and 29 are inputting control signals, and only a small current load needs to be driven. Although there is no problem if the width is narrow, driving power is input / output to / from the drain terminals 17 and 27 and the source terminals 18 and 28, and a large current load may be driven. Therefore, it is necessary to form a conductor having a large resistance and a reduced resistance value. However, if conductors are formed at the positions corresponding to terminals of the same length, the conductor width cannot be widened in the limited space on the substrate surface, making it difficult to drive a large-current load. ..

An object of the present invention is to provide a structure for connecting a semiconductor element to a wiring board, which is capable of forming a wide conductor capable of driving a load of large current.

[0007]

[Means for Solving the Problems]

 According to the present invention, a plurality of conductors for supplying a control signal and a drive signal are provided on a wiring board, and at least a conductor for supplying drive power is formed to have a larger cross-sectional area than a conductor for supplying a control signal. , At least one of the terminals used for inputting or outputting the driving power for a circuit element having terminals corresponding to the conductors and connected to the conductors and an element body to which the terminals are connected. Are formed to extend on the opposite side of the element body from the terminals to which the control signal is input, and the at least one drive power input / output terminal and drive power input / output formed to extend on the opposite side of the element body. The drive power supply conductors corresponding to the power supply terminals are formed on opposite sides of the element body, and have a connection structure to the wiring board.

[0008]

[Action]

 According to the present invention, when a circuit element such as a power transistor is mounted on a wiring board, at least one terminal for inputting or outputting the driving power of the circuit element is an element to which a control signal is input. It is formed to extend to the opposite side of the body. For example, when the circuit element is a field effect transistor, the terminal for inputting the control signal and the driving power input terminal are formed to extend to one side of the element body, and the driving power output terminal is formed on the other side of the element body. It is formed to extend to the side.

Therefore, in the vicinity of the mounting position of the circuit element on the wiring board, the degree of freedom in routing the conductor to be connected to each terminal is improved. As a result, the conductor supplying the driving power can be formed to have a larger cross-sectional area than the conductor supplying the control signal. That is, when the material forming the conductors is the same, the conductor width for driving power can be widened without being affected by the control signals formed adjacently. Corresponding terminals of the circuit elements are connected to the conductors thus formed, and the circuit elements are connected in parallel.

Therefore, it is possible to form a wide conductor for a large current in a limited space on the wiring board.

[0011]

【Example】

 FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along the section line AA of FIG. A plurality of transistor elements 32, 42 are fixed to the surface of the wiring board 11 by screws 33, 43 with the radiator plates 12a, 22a, respectively, or the radiator plates 12a, 22a are mounted on the wiring board 11 by wiring. Surface mounted by soldering with pattern. Conductors 14, 15 and 16 extending in the arrangement direction of the transistor elements 32 and 42 are formed on the surface of the wiring board 11, and the conductor 14 has drain terminals also serving as heat sinks for the transistor elements 32 and 42 corresponding to each other. 37, 47 are connected, and the source terminals 38, 48 and the gate terminals 39, 49 corresponding to the respective transistor elements 32, 42 are bent to the conductors 15, 16 side to the conductors 15, 16 by soldering. Are connected, and thus the transistor elements 32 and 42 are connected in parallel.

FIG. 3 (1) is a perspective view of a power transistor element 12 used conventionally, and FIG. 3 (2) is a perspective view of a power transistor element 32 used in an embodiment of the present invention. is there. The power transistor element 32 of this embodiment is formed by cutting the drain terminal 17 of the power transistor element 12 of FIG. The power transistor element 12 comprises a main body 12b, a heat radiating plate 12a extending to one side on the back surface side of the main body 12b, and three terminals extending to the other side, that is, a gate terminal 19, a drain terminal 17 and a source terminal 18. The gate terminal 19, the drain terminal 17, and the source terminal 18 extend linearly, and three of them have the same length.

FIG. 4 is a circuit diagram showing the electrical structure of the power transistor element 32 of this embodiment. The power transistor element 32 includes, for example, a field effect transistor, and its drain electrode D and the heat sink 32a are electrically connected internally. Therefore, in the present invention, the heat dissipation plate 32a is used as the drain terminal 37. The electric structure of the power transistor element 42 including the field effect transistor is also the same. As a result, as shown in FIG. 3B, the drain terminal 37b to which the drain electrode D is connected is disconnected so as not to damage the power transistor element 32 by connecting to the conductors 15 and 16. ing. The drain electrode D is electrically connected to the conductor 14 via the heat dissipation plate 32a. In the present invention, the lengths of the source terminal 38 and the gate terminal 39 are different from each other in accordance with the arrangement positions of the conductors 15 and 16, and the source terminal 38 is short.

As described above, since the drain conductor 14 and the source conductor 15 are arranged on the opposite sides with respect to the element body 32b, the conductors 14 and 15 can be formed to have wide widths, respectively, and the conduction can be improved. The resistance can be reduced, a large current load can be driven, and since the conductors 14 to 16 do not intersect with each other, the process for pattern formation is simplified.

FIG. 5 is a diagram of another embodiment of the present invention. It should be noted that, in the present embodiment, the central drain terminal is eliminated, and it is electrically connected to the conductor through the heat dissipation member, but the remaining source terminals 58, 68 and the gate terminal 59, The lengths of 69 and 69 are equal to each other. Therefore, the conductors 25 and 26 are formed in a meandering manner so as not to intersect.

That is, on the surface of the wiring board 21, a plurality of power transistor elements 52, 62 are screwed and fixed by screws 53, 63 by heat radiating plates 52a, 62a, or surface-mounted only by soldering. A conductor 24 is formed on the surface of the wiring board 21 so as to extend in the arrangement direction of the power transistor elements 52 and 62, and terminals 57 and 67 corresponding to each other of the power transistor elements 52 and 62 are connected to each other. The conductors 25 and 26 are formed in a meandering manner so that they do not cross each other, and the terminals 58, 68; 59, 69 corresponding to each other of the power transistor elements 52, 62 are connected by soldering. In this way, the power transistor elements 52 and 62 are connected in parallel.

Also in this case, a sufficient conductor width can be secured and the manufacturing process can be simplified.

[0018]

[Effect of the device]

 As described above, according to the present invention, at least one of the terminals for inputting or outputting the driving power is formed on the side opposite to the terminal for the control signal of the element body. The degree of freedom in routing the conductor in the vicinity can be improved.

Therefore, the conductor for supplying drive power is larger than the conductor for control signal in a limited space on the wiring board without being affected by the conductor for control signal formed adjacently. When the area, that is, the conductor thickness is the same, the conductor width can be widened. Further, as described above, by using the heat sink as the power input / output terminal, the heat generated in the element body can be conducted and dissipated from the heat sink to the wiring board.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the section line AA of FIG.

FIG. 3 is a perspective view of a power transistor element 17.

FIG. 4 is a circuit diagram showing an electrical structure of a power transistor element 17.

FIG. 5 is a front view of another embodiment of the present invention.

FIG. 6 is a front view of a conventional technique.

7 is a cross-sectional view taken along the section line BB in FIG.

[Explanation of symbols]

11,21 Wiring board 14,15,16,24,25,26 Conductor 37,37b, 38,39,47,48,49,57,
58, 59, 67, 68, 69 Terminal 32, 42, 52, 62 Semiconductor element 32a, 42a, 52a, 62a Heat sink

Claims (1)

[Scope of utility model registration request] 1. A plurality of conductors for supplying a control signal and a drive signal are provided on a wiring board, and at least a conductor for supplying drive power is formed to have a larger cross-sectional area than a conductor for supplying a control signal. Regarding a circuit element having terminals corresponding to the conductors and respectively connected to the conductors and an element body to which the terminals are connected, at least one of the terminals used for inputting or outputting the driving power is A terminal to which a control signal is input is formed to extend on the opposite side of the element body, the at least one drive power input / output terminal and a drive power input / output terminal formed to extend on the opposite side of the element body. A connection structure to a wiring board, wherein the driving power supply conductors corresponding to and are formed on opposite sides of the element body.