JP2540974Y2 - Electronic component mounting structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting structure. For example, electronic components having the same function such as SCR / MOSFET and different voltage characteristics and electrode arrangements can be mounted on the same substrate. The present invention relates to an electronic component mounting structure in which part insertion holes are shared.

[0002]

2. Description of the Related Art Conventionally, electronic devices such as SCR (thyristor) and MOSFET are used as switching elements.
(MOS type field effect transistor) and the like are frequently used. By the way, while the SCR is inexpensive, in order to properly operate the SCR to which the pulsation voltage is applied, there is a characteristic that the pulsation voltage has an upper limit, so that an operation failure occurs when the voltage value is increased. MOSFET is SCR
Although it is about twice as expensive as the above, there is a characteristic that the operating voltage has no upper limit within the maximum rated voltage of the MOSFET. For this reason, depending on the applicable model, SCR and MO are considered in terms of price and performance.
It has been practiced to use SFETs properly. For example, as shown in FIG. 5 , the electrode arrangement of a general SCR1 with a resin package type heat sink is arranged in the order of a cathode electrode 2, an anode electrode 3, and a gate electrode 4.
For example, as shown in FIG. 6 , the electrode arrangement of a general MOSFET 5 with a resin package type heat sink is arranged in the order of a gate electrode 6, a drain electrode 7, and a source electrode 8. Therefore, as described above, the SCR and the MOSFET having the same function but different voltage characteristics and electrode arrangements are mounted on the same substrate,
Since it cannot be mounted in the same component insertion hole (through hole), conventionally, a component insertion hole and a pattern formed in accordance with the voltage characteristics and electrode arrangement of the SCR, and a component insertion compatible with the voltage characteristics and electrode arrangement of the MOSFET. Separately prepare the substrate on which holes and patterns are formed, and use SCR or MOS
We are mounting FETs. Reference numeral 1 in FIG. 5 and FIG. 6
Reference numerals a and 5a denote packages, and reference numerals 1b and 5b denote heat radiation plates.

[0003]

However, the above-mentioned prior art has the following problems. In other words, SCR and MOS are different in terms of voltage characteristics and electrode arrangement.
There is a restriction that the FET cannot be mounted on the same substrate or the same component insertion hole.
The board for mounting the OSFET must be prepared separately from each other, and the number of parts to be mounted on the electronic equipment such as the board and wiring will increase. Each of them has to be formed, and there are problems that the number of steps such as insertion hole processing, plating, pattern formation, etc. are doubled, the substrate manufacturing process becomes complicated, and these reasons increase the cost.

[0004] The present invention is intended to solve the above problems, for example, with functions such as SCR · MOSFET voltage characteristics and electrode arrangement with the same to allow mounting the electronic component to differences to the same substrate, the component insertion of the part It is an object of the present invention to provide an electronic component mounting structure in which the number of components such as a substrate and the cost are reduced by sharing a hole.

[0005]

In order to achieve the above object, the present invention provides an electronic component having a plurality of electrodes having both long and short lengthwise dimensions, and an electronic component having a lengthwise dimension of the one or more. br /> and other electronic components with different electrodes and said one conductive <br/> child parts of the electrode array and having an electronic component of the electrode and the symmetrical relationship, the parts insertion holes each electrode is inserted An electronic component mounting structure that can be mounted on a board at a position symmetrical to the first component insertion hole into which a long electrode of any one of the electronic components is inserted, A second long electrode into which the long electrode of the other electronic component is inserted
A parts insertion hole of use, electronic components mounted on the substrate prior to
The one electronic component or the other electronic component
Regardless of whether a short electrode having electronic components mounted on the board and the component insertion holes for a short electrode to be inserted, the first
Component insertion hole for long electrode and component for second long electrode
And a pattern for electrically connecting the insertion hole to the substrate. In order to achieve the above object, the present invention provides an electronic component having a plurality of electrodes having both long and short longitudinal dimensions, and an electronic component having a longitudinal dimension of the one.
It has a symmetrical relationship with the electrodes of the electronic component and
And other electronic components with different electrodes and child part of the electrode array, an electronic component mounting structure that can be mounted to the substrate at symmetrical positions with respect to component insertion holes each electrode is inserted, the substrate The electronic component mounted on the one electronic part
Product or the other electronic component,
Long or short electrodes of electronic components mounted on the substrate
Component insertion hole for electrode into which one of the electrodes is inserted
Inserted into the component insertion hole for the electrode of the one electronic component.
Dedicated to the one electronic component into which an electrode other than the electrode to be inserted is inserted.
And a part for the electrode of the other electronic component
The electrode other than the electrode inserted into the product insertion hole is inserted.
A component insertion hole dedicated to another electronic component and the component
And a component insertion hole dedicated to the other electronic components.
And a pattern electrically connecting the substrate to the substrate.

[0006]

According to the present invention, a long electrode and a short electrode are provided.
And have the same type of electrode, but the electrode
Of the long or short electrodes of electronic components
The electrode insertion hole of one electrode is shared and the other electrode
Provide a pattern on the board to electrically connect the electrode holes
By mounting all of the above electronic components on one board
Since the configuration is made possible, it is possible to mount electronic components having the same function but different voltage characteristics and electrode arrangements on the same substrate.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an example in which the SCR 1 with a resin package type heat sink shown in FIGS. 5 and 6 and the MOSFET 5 can be mounted on the same substrate and some of the component insertion holes (through holes) are shared. FIG. 3 is a view showing the electronic component mounting structure of the present embodiment, in which the SCR1 and the MOSFET5 are mounted.
Four component insertion holes 11, 12, 13, and 14 are formed in a penetrating state from the component surface side of the board 20 on which the electronic components such as are mounted to the solder surface side.

In the component insertion hole 11, the source electrode 8 of the MOSFET 5 and the cathode electrode 2 of the SCR 1 are inserted in a shared state. Around the insertion hole 11, a land 15 for source / cathode is formed. I have. The component insertion hole 12 is for inserting the anode electrode 3 of the SCR 1, and an anode land 16 is formed around the insertion hole 12. The component insertion hole 13 is used for inserting the gate electrode 6 of the MOSFET 5 and the gate electrode 4 of the SCR 1 in a shared state.
Are formed around the gate land 17. The component insertion hole 14 is for receiving the drain electrode 7 of the MOSFET 5. A drain land 18 is formed around the insertion hole 14. In this case, each of the component insertion holes 11 to 14 is provided with an SCR and a MOSFET.
It is preferable that the electrodes are formed at predetermined positions of the substrate in consideration of the respective electrode pitches, and the creepage distance between the lands is 2 mm or more. On the other hand, a pattern 19 as shown in FIG. 2 is formed on the solder side of the substrate, and the pattern 19 is used to form the anode land 16 and the drain land 1.
8 is connected to simplify the pattern on the artwork.

Next, the operation of the embodiment constructed as described above will be described with reference to FIGS. First, when designing the layout of the substrate 20, the packages 1a, 5a of the SCR 1 and the MOSFET 5 are placed on the component side of the substrate 20.
After securing a space in consideration of the mounting area of the heat sinks 1b and 5b, the positions where the component insertion holes 11 to 14 are formed are determined. SCR1 or MOSFET5 for the substrate 20
In the mounting process, the prepared what each electrode 2, 3 and 4 of SCR1 is central electrode 3 as shown in FIG. 5 and lead forming the L-shape so as to be longer than the other, each of MOSFET5 As shown in FIG. 6, the electrodes 6, 7, 8 are prepared by L-shaped lead forming so that the central electrode 7 is longer than the others. Then, SCR
1 is mounted on the substrate 20, the cathode electrode 2, the anode electrode 3, and the gate electrode 4 of the SCR 1 are inserted into the component insertion holes 11, 12, and 13 of the substrate 20, respectively.
The package 1a and the heat sink 1b of the CR1 are brought into close contact with the component side of the substrate 20. Similarly, when the MOSFET 5 is mounted on the substrate 20, the source electrode 8, the drain electrode 7, and the gate electrode 6 of the MOSFET 5 are inserted into the component insertion holes 11, 14, and 13 of the substrate 20, respectively.
The package 5a and the heat sink 5b of the SFET 5 are brought into close contact with the component side of the substrate 20. In this case, the component insertion hole 11
Is shared by the cathode electrode 2 of the SCR 1 and the source electrode 8 of the MOSFET 5, and the component insertion hole 13 is
1 and the gate electrode 6 of the MOSFET 5. S for the component insertion holes 11 to 14
When insertion of each electrode of CR1 or MOSFET5 is completed, each electrode is soldered to lands 15-18.

That is, according to the above embodiment, the SCR1 or the MOSFE having the same function but different voltage characteristics and electrode arrangements.
Either one of T5 is selected to be mountable in the component insertion holes 11 to 14 formed in the same substrate 20, and the component insertion hole 11 is connected to the cathode electrode 2 of the SCR 1 and the MOSFET.
5 is also used as an insertion hole for the source electrode 8 and a component insertion hole 1
3 is used as an insertion hole for the gate electrode 4 of the SCR 1 and the gate electrode 6 of the MOSFET 5,
It is not necessary to separately prepare a substrate for mounting the CR and a substrate for mounting the MOSFET, and to form component insertion holes and patterns corresponding to the electrode arrangement of the SCR and the MOSFET on each substrate, and It is possible to solve problems such as a complicated board manufacturing process and an increase in cost due to an increase in man-hours such as component insertion hole processing, plating and pattern formation on the board.

In the above embodiment, for example, SCR and MO
Although the case where one of the SFETs is mounted on the same substrate has been described as an example, the present invention is not limited to this, and another type having three electrodes having the same function but different voltage characteristics and electrode arrangements is used. It is also possible to apply to electronic components.
As this type of electronic component, there are various types such as a power FET, a power transistor (small / medium power type semiconductor), a thyristor such as a turn-off thyristor (GTO) and a triac (TRIAC), and the like.

[0012]

According to the present invention, as described above, the following effects can be obtained. It has long and short electrodes and is of the same type
An electronic part that has poles but the order of the electrodes is different
Insertion of one of the long or short electrodes
Share the hole and electrically connect the hole for the other electrode
By providing a pattern to
Since all of the electronic components can be mounted , for example, as in the case of SCR and MOSFET,
Electronic components having the same function but different voltage characteristics and electrode arrangements can be mounted on the same substrate. By the above, it is not necessary to separately prepare substrates for mounting each electronic component as in the related art, or to form component insertion holes and patterns corresponding to the electrode arrangement of each electronic component on each substrate. Further, it is possible to solve the problem that the manufacturing process of the substrate becomes complicated due to an increase in the number of steps such as component insertion hole processing, plating and pattern formation on the substrate, which increases the cost.

[Brief description of the drawings]

FIG. 1 is a plan view of a component insertion hole on a component side of a board according to an embodiment of the present invention.

FIG. 2 is a plan view of a pattern on a solder side of the substrate according to the embodiment of the present invention;

FIG. 3 is a plan view showing a state in which components are mounted on a board according to the embodiment of the present invention;

FIG. 4 is a side view showing a state in which components are mounted on a board according to the embodiment of the present invention;

FIG. 5 is a front view showing an electrode arrangement of a resin package type SCR.

FIG. 6 is a front view showing an electrode arrangement of a resin package type MOSFET.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 SCR (electronic component) 2 Cathode electrode (electrode) 3 Anode electrode (electrode) 4 Gate electrode (electrode) 5 MOSFET (electronic component) 6 Gate electrode (electrode) 7 Drain electrode (electrode) 8 Source electrode (electrode) 11 Parts Insertion hole (Common component insertion hole) 12 Component insertion hole 13 Component insertion hole (Common component insertion hole) 14 Component insertion hole 15, 16, 17, 18 Land 19 Pattern 20 Board

Claims (2)

(57) [Scope of request for utility model registration] 1. An electronic component having a plurality of electrodes having both long and short lengthwise dimensions, and said one electronic component having a lengthwise dimension symmetrical to an electrode of said one electronic component. An electronic component mounting structure that allows another electronic component provided with an electrode different from the electrode arrangement to be mounted on a substrate at a position symmetrical with respect to a component insertion hole into which each electrode is inserted , and among the parts insertion holes for first elongated electrode to which one of the electronic component a long electrode is inserted, the second long said the other long electrode of the electronic component is inserted
A component insertion hole for an electrode, and the electronic component mounted on the substrate is the one electronic component.
Irrespective of whether it is or the other electronic component,
Short short electrodes of electronic components mounted on a substrate is inserted
And parts insertion holes for electrodes, parts insertion holes and the second long conductive for the first elongated electrode
An electronic component mounting structure, wherein the substrate comprises a pattern for electrically connecting the component insertion hole for the pole to the electrode . 2. An electronic component having a plurality of electrodes having both long and short longitudinal dimensions, and a symmetrical relationship between the longitudinal dimension and the electrodes of the one electronic component.
An electrode having and different from the electrode arrangement of the one electronic component
And other electronic components having a, an electronic component mounting structure that can be mounted to the substrate at symmetrical positions with respect to component insertion holes each electrode is inserted, an electronic component mounted on the substrate wherein With one electronic component
Irrespective of whether it is or the other electronic component,
Long or short electrodes of electronic components mounted on a board
A component insertion hole for an electrode into which one of the electrodes is inserted, and a component insertion hole inserted into the component insertion hole for the electrode of the one electronic component.
That other than the electrode the electrode is the one to be inserted in the electronic component only
A component insertion hole and a component insertion hole for the electrode of the other electronic component.
Dedicated to the other electronic components into which electrodes other than the
A component insertion hole, a component insertion hole dedicated to the one electronic component, and the other electronic component
An electronic component mounting structure , wherein the substrate includes a pattern for electrically connecting a dedicated component insertion hole to the component mounting hole .