CN216431822U

CN216431822U - Circuit board for electromagnetic heating and electromagnetic heating cooking utensil

Info

Publication number: CN216431822U
Application number: CN202120778300.8U
Authority: CN
Inventors: 朱泽春; 谢伟峰; 寿东升; 徐胜
Original assignee: Joyoung Co Ltd
Current assignee: Joyoung Co Ltd
Priority date: 2021-04-15
Filing date: 2021-04-15
Publication date: 2022-05-03
Anticipated expiration: 2031-04-15

Abstract

The utility model provides a circuit board for electromagnetic heating and an electromagnetic heating cooking utensil, which comprise a PCB (printed Circuit Board), a radiator and an IGBT (insulated gate bipolar translator), wherein the radiator is fixed on the PCB, the IGBT is attached to the radiator, the radiator is provided with a vertical surface vertical to the PCB, the IGBT is attached to the vertical surface, and an isolation seat is arranged between the IGBT and the PCB. The direct contact between the IGBT and the PCB is avoided through the isolation seat, and the heat transfer of the PCB to the IGBT is reduced.

Description

Circuit board for electromagnetic heating and electromagnetic heating cooking utensil

[ technical field ] A method for producing a semiconductor device

The utility model relates to a kitchen cooking appliance, in particular to a circuit board for electromagnetic heating and an electromagnetic heating cooking appliance.

[ background of the utility model ]

The electromagnetic heating technology has been widely applied to kitchen cooking appliances because of the characteristics of energy saving and high efficiency, and generally, an electromagnetic heating cooking appliance is provided with a circuit board for electromagnetic heating, and an Insulated Gate Bipolar Transistor (IGBT for short) is arranged on the circuit board. When the IGBT is conducted, the resonant circuit is charged; when the IGBT is turned off, the resonance circuit discharges electricity to generate an alternating magnetic field, and the alternating magnetic field cuts a pot placed on the electromagnetic wire coil to heat the pot. In order to reduce the temperature of the IGBT, a heat sink is generally disposed on the circuit board to dissipate heat of the IGBT, but the heat dissipation effect of the existing IGBT layout method still needs to be improved.

[ Utility model ] content

The utility model provides a circuit board for electromagnetic heating and an electromagnetic heating cooking utensil to overcome the defects of the prior art and improve the heat dissipation effect of the circuit board.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a circuit board for electromagnetic heating, includes PCB board, radiator and IGBT, the radiator is fixed on the PCB board, the IGBT laminating is in on the radiator, the radiator has the perpendicular to the perpendicular of PCB board, the IGBT laminating the perpendicular, the IGBT with be equipped with the separation seat between the PCB board.

In an embodiment of the utility model, the PCB board has a through hole, and the pin of the IGBT is soldered to the PCB board through the through hole.

In an embodiment of the utility model, the isolation seat is an insulating member.

In an embodiment of the utility model, the device further comprises a rectifier bridge stack, the rectifier bridge stack is attached to the vertical surface, and the isolation seat is arranged between the rectifier bridge stack and the PCB.

In an embodiment of the utility model, a gap is formed between the IGBT and the bridge rectifier, and the isolation seat is attached to the vertical surface at the gap.

In an embodiment of the present invention, the heat sink has heat dissipation fins thereon, and the heat dissipation fins are perpendicular to the vertical surface.

In an embodiment of the utility model, an avoiding notch is formed in the PCB, and the heat dissipation fin corresponds to the avoiding notch.

In an embodiment of the present invention, the heat dissipation fin includes a plurality arranged in parallel.

In an embodiment of the utility model, a mounting gap is formed between two adjacent heat dissipation fins, the heat sink is fixed on the PCB by screws, and the screws penetrate through the PCB and the mounting gap to fix the heat sink.

The utility model also provides an electromagnetic heating cooking appliance which comprises a shell, wherein the circuit board for electromagnetic heating is arranged in the shell.

The utility model has the following beneficial effects:

1. according to the utility model, the isolation seat is arranged between the IGBT and the PCB, so that the direct contact between the IGBT and the PCB is avoided, the heat transfer of the PCB to the IGBT is reduced, and the heat radiator is attached to the vertical surface of the heat radiator, so that the heat radiator can efficiently radiate the IGBT. The arrangement of the isolation seat can also reduce the interference of the PCB board to the IGBT.

2. Because the isolation seat is arranged between the IGBT and the PCB, when pins of the IGBT are welded on the PCB, the IGBT is not damaged by high temperature in the welding process, and the reject ratio in the process of production is reduced.

3. The PCB is provided with a through hole, and the pin of the IGBT penetrates through the through hole to be welded on the PCB. The IGBT is located one side of PCB board, and its pin passes the PCB board and extends to another side and carries out the welding and fix, makes things convenient for the welding process in the manufacturing process to handle.

4. An avoiding notch is formed in the PCB, and the heat dissipation fin corresponds to the avoiding notch. The heat dissipation effect of the radiator is conveniently improved by avoiding the corresponding heat dissipation fins of the notches.

These features and advantages of the present invention will be disclosed in more detail in the following detailed description and the accompanying drawings.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

FIG. 1 is a first schematic diagram of a circuit board for electromagnetic heating according to the present invention;

FIG. 2 is a second schematic diagram of a circuit board for electromagnetic heating according to the present invention;

fig. 3 is an exploded view of the circuit board for electromagnetic heating of the present invention.

Reference numerals:

the structure comprises a PCB (printed circuit board) 1, a through hole 11, an avoiding notch 12, a radiator 2, a radiating fin 21, a mounting gap 22, an IGBT3, an isolation seat 4, an inner concave section 41, a rectifier bridge stack 5, a screw 6 and a bridging piece 7.

[ detailed description ] embodiments

The utility model provides a circuit board for electromagnetic heating, which comprises a PCB (printed circuit board), a radiator and an IGBT (insulated gate bipolar transistor), wherein the radiator is fixed on the PCB, the IGBT is attached to the radiator, the radiator is provided with a vertical surface perpendicular to the PCB, the IGBT is attached to the vertical surface, and an isolation seat is arranged between the IGBT and the PCB. The utility model can improve the heat dissipation effect of the circuit board. The utility model also provides an electromagnetic heating cooking utensil with the circuit board for electromagnetic heating.

Example one

Referring to fig. 1 to 3, the present embodiment provides a circuit board for electromagnetic heating, including a PCB 1, a heat sink 2, and an IGBT3, where the heat sink 2 is fixed on the PCB 1, the IGBT3 is attached to the heat sink 2, the heat sink 2 has a vertical surface perpendicular to the PCB 1, the IGBT3 is attached to the vertical surface, and an isolation seat 4 is disposed between the IGBT3 and the PCB 1. The IGBT is used as an electrical element of the electromagnetic heating circuit board, the temperature resistance is low, in order to ensure the long-term use of the IGBT, the radiator 2 is arranged on the PCB board 1, the radiator 2 is generally made of aluminum, the temperature of the radiator 2 is lower than that of the PCB board 1, and the IGBT is attached to the radiator 2, so that the temperature of the IGBT can be effectively reduced, and the service life of the IGBT is prolonged. In this embodiment, set up the IGBT on radiator 2 with PCB board 1 vertically perpendicular on, so the PCB board is kept away from to the one end of IGBT, and other one end can be close to PCB board 1, and this can influence the cooling effect of IGBT, so, in this embodiment at IGBT3 with be equipped with isolation seat 4 between PCB board 1, can reduce PCB board 1 through isolation seat 4 and give IGBT3 with heat transfer to reach good radiating effect, improve IGBT's life. It can be understood that the PCB board 1 is further provided with electrical components such as capacitors, resistors, inductors, and the like. The electrical component is located one side of PCB board 1, and the pin of electrical component passes through PCB board 1 and welds in the other side of PCB board, realizes the intercommunication of circuit. The heat sink 2 and the IGBT3 in this embodiment are also located on this side of the electrical components.

In the present embodiment, referring to fig. 2, the PCB board 1 has a through hole 11, and the pin of the IGBT3 is soldered to the PCB board 1 through the through hole 11. The IGBT3 is soldered to the other side of the PCB board 1 by providing the through hole 11. Because the isolation seat 4 is arranged between the IGBT3 and the PCB 1, when pins of the IGBT are welded on the PCB 1, the IGBT is not damaged by high temperature in the welding process, and the reject ratio in the process of technological production is reduced. Preferably, the isolation seat 4 is an insulating member, so that the pins of the IGBT are prevented from being electrically conducted with the isolation seat 4 when passing through the isolation seat 4, and the use effect of the IGBT is prevented from being affected.

In this embodiment, referring to fig. 1 and 3, the circuit board further includes a rectifier bridge stack 5, the rectifier bridge stack 5 is attached to the vertical surface, and the isolation seat 4 is disposed between the rectifier bridge stack 5 and the PCB board 1. The heat transfer of the PCB board 1 to the rectifier bridge stack 5 can be reduced through the isolation seat 4, so that a good heat dissipation effect is achieved, and the service life of the rectifier bridge stack 5 is prolonged. Moreover, the IGBT3 and the rectifier bridge stack 5 can share one isolation seat 4, so that the isolation seat 4 is convenient to mount and fix. The IBGT3 and the rectifier bridge stack 5 in the embodiment are both fixed on the radiator 2 through screws, and the isolation seat 4 is arranged, so that the IBGT3 or the rectifier bridge stack 5 can be prevented from rotating when the screws are arranged, and the reliability of the process is ensured.

In this embodiment, referring to fig. 2, a gap is formed between the IGBT3 and the bridge rectifier 5, and the isolation seat 4 is attached to the vertical surface at the gap. The isolation seat 4 is provided with an inner concave section 41 at the gap, the inner concave section 41 is attached to the radiator 2, and due to the arrangement of the inner concave section 41, the installation positions of the IBGT3 and the bridge rectifier 5 can be limited, and the IBGT3 and the bridge rectifier 5 have enough gap. When installed, either the IGBT3 or the bridge stack 5 may be secured while the other is secured by the recessed section 41.

In the present embodiment, the heat sink 2 has heat dissipation fins 21 thereon, and the heat dissipation fins 21 are perpendicular to the vertical plane. The flow of the cooling wind can be promoted by the heat dissipation fins 21, so that the heat sink 2 can be kept at a low temperature. When the circuit board is placed in an electromagnetic heating cooking appliance for use, a heat dissipation fan is generally arranged in the cooking appliance, and the heat dissipation fan is arranged corresponding to the heat dissipation fins 21, so that the heat dissipation function of the heat sink 2 is effectively exerted.

In this embodiment, the PCB board 1 is provided with an avoiding gap 12, and the heat dissipation fin 21 corresponds to the avoiding gap 12. Through avoiding the arrangement of the gap 12, cooling air can pass through the PCB 1 and blow to the radiating fins 21, so that the radiator 2 is maintained at a lower temperature, and efficient heat dissipation is further performed on the IGBT3 and the rectifier bridge stack 5.

In the present embodiment, the heat dissipation fins 21 are disposed in parallel, so that the material of the heat sink can be saved, and the heat dissipation of the heat sink is also facilitated.

In the present embodiment, a mounting gap 22 is formed between two adjacent heat dissipation fins 21, the heat sink 2 is fixed on the PCB by screws, and the screws 6 penetrate the PCB 1 and the mounting gap 22 to fix the heat sink 2. The heat dissipation fins 21 form the mounting gaps 22, and the mounting gaps 22 are used for fixing the screws 6, so that screw holes can be avoided in the heat sink 2, and the manufacturing process of the heat sink 2 is simplified.

During assembly, the IGBT3 and the rectifier bridge stack 5 can be fixed to the heat sink 2 by screws, the pins of the IGBT3 and the rectifier bridge stack 5 pass through the isolation seat 4 and are welded to the PCB board 1, the heat sink 2 and the PCB board 1 are fixed by screws to form a circuit board, and then the circuit board is connected with a circuit of a cooking appliance through a wiring terminal on the circuit board.

In this embodiment, for flexible layout of the circuit board, the PCB board 1 is further provided with a bridge member 7, the bridge member 7 is a conductive member and is located on the side of the electrical component on the PCB board 1, two ends of the bridge member 7 are provided with two pins, and the pins penetrate through the PCB board 1 and are welded on the other side of the PCB board, so as to implement remote electrical connection on the PCB board 1. The general PCB 1 has a conductive circuit on the side of soldering, which causes inconvenient connection between the preferential connection power on the side of soldering due to the layout of the electrical components, and the present embodiment forms a conductive circuit on the other side of the PCB 1 by the bridge 7, which facilitates flexible layout of the PCB 1.

The embodiment also provides a circuit board for electromagnetic heating, which comprises a shell, wherein the circuit board for electromagnetic heating is arranged in the shell. It can be understood that a heat dissipation fan is further disposed in the housing, and the heat dissipation fan is disposed corresponding to the circuit board, and more specifically, the heat dissipation fan is disposed corresponding to a heat sink on the circuit board.

While the utility model has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that the utility model is not limited thereto, and may be embodied in many different forms without departing from the spirit and scope of the utility model as set forth in the following claims. Any modification which does not depart from the functional and structural principles of the present invention is intended to be included within the scope of the claims.

Claims

1. The utility model provides a circuit board for electromagnetic heating, includes PCB board, radiator and IGBT, the radiator is fixed on the PCB board, the IGBT laminating is in on the radiator, its characterized in that, the radiator has the perpendicular to the perpendicular of PCB board, the IGBT laminating the perpendicular, the IGBT with be equipped with the isolation seat between the PCB board.

2. The circuit board for electromagnetic heating of claim 1, wherein said PCB board has a through hole therein, and wherein the pin of said IGBT is soldered to the PCB board through said through hole.

3. A circuit board for electromagnetic heating according to claim 2, wherein said insulating base is an insulating member.

4. The circuit board for electromagnetic heating of claim 1, further comprising a rectifier bridge stack, wherein the rectifier bridge stack is attached to the vertical surface, and the isolation seat is disposed between the rectifier bridge stack and the PCB.

5. The circuit board for electromagnetic heating according to claim 4, wherein a gap is provided between said IGBT and said bridge rectifier, and said spacer is fitted to said vertical surface at said gap.

6. A circuit board for electromagnetic heating according to claim 1, wherein said heat sink has heat dissipation fins thereon, said heat dissipation fins being perpendicular to said vertical surface.

7. The circuit board for electromagnetic heating of claim 6, wherein an avoiding notch is provided on the PCB board, and the heat dissipating fin corresponds to the avoiding notch.

8. A circuit board for electromagnetic heating according to claim 6, wherein said heat dissipating fin comprises a plurality arranged in parallel.

9. The circuit board for electromagnetic heating of claim 8, wherein a mounting gap is formed between adjacent two of the heat dissipating fins, and the heat sink is fixed to the PCB by screws passing through the PCB and the mounting gap to fix the heat sink.

10. An electromagnetic heating cooking appliance comprising a housing, wherein a circuit board for electromagnetic heating according to any one of claims 1 to 9 is provided in the housing.