CN218277263U - PCB heat dissipation device - Google Patents
PCB heat dissipation device Download PDFInfo
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- CN218277263U CN218277263U CN202220054209.6U CN202220054209U CN218277263U CN 218277263 U CN218277263 U CN 218277263U CN 202220054209 U CN202220054209 U CN 202220054209U CN 218277263 U CN218277263 U CN 218277263U
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- heat dissipation
- pcb
- dissipation strip
- heat
- strip
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Abstract
The utility model relates to a circuit board technical field discloses a PCB heat abstractor, including the heat dissipation strip, the shape of heat dissipation strip is the same with PCB board electric current wiring shape to the laminating is at the electric current wiring position of PCB board, the material of heat dissipation strip is red copper, the heat dissipation strip is formed by at least one first radiating element and at least one second radiating element concatenation. The utility model provides a PCB heat abstractor, through setting up the heat dissipation strip the same with PCB board electric current wiring shape to with the laminating of heat dissipation strip at the electric current wiring position of PCB board, not only increased the sectional area and reduced the resistance, also increased the current-carrying capacity, reduced the consumption, thereby improved PCB's heat dissipation rate, heat dissipation strip self also has the radiating effect moreover, thereby has increased the cooling surface, further improved the radiating effect, thereby the reliability and the life-span of components and parts on PCB and the PCB board have been guaranteed. The utility model discloses simple structure, excellent in use effect easily uses widely.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a PCB heat abstractor.
Background
PCB (Printed Circuit Board), the name of chinese, is an important electronic component, and is an electrical support and carrier for electronic components. The main sources of heat in the PCB are three, heat generation of electronic components, PCB heat generation and heat conduction from other components. With the development of microelectronic technology, the miniaturization and the increasing function of electronic component devices are achieved, and the power consumption of a single electronic component is gradually increased, which all result in the sharp increase of the heat flow density. In order to maintain the reliable operation of the device under the environmental conditions of the device, a heat dissipation design needs to be performed on the PCB. The existing PCB heat dissipation technology has two modes of active and passive, wherein the active mode is air cooling, liquid cooling and conduction commonly used, and the heat is dissipated passively through a heating component. However, in the current design of a high-power small-volume switching power supply, liquid cooling and air cooling are not suitable due to the limitation of space, and the limitation of heat conduction on the opening of the shell is not ideal due to the requirement of electromagnetic compatibility, so that the reliability and the service life of a PCB and components are reduced. Because the PCB design ensures that the heat dissipation devices are irregularly distributed on the premise of reliability and performance, heat is transferred to the shell through heat dissipation in a common conduction mode by adhering a heat conduction gasket and encapsulating heat conduction glue, and the structural part design can be more complicated and the processing cost is increased.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a PCB heat abstractor improves PCB's heat dissipation rate, guarantees the reliability and the life-span of PCB and components and parts, simplifies structural design.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a PCB heat abstractor, includes the heat dissipation strip, the shape of heat dissipation strip is the same with PCB board electric current wiring shape to the laminating is at the electric current wiring position of PCB board, the material of heat dissipation strip is red copper, the heat dissipation strip is formed by at least one first radiating element and at least one second radiating element concatenation.
Preferably, the width W of the heat sink strip is determined by the formula W = a/d, and a is determined according to I = K · T 0.44 ·A 0.75 Obtaining;
wherein: i is the passing current (A);
k is a correction coefficient: the inner layer is 0.024, and the outer layer is 0.048;
t is the maximum temperature rise (. Degree. C.);
a is the cross section area (mil) of the heat dissipation strip 2 )；
d is the heat sink strip thickness (mil).
Preferably, the surface of the heat dissipation strip is plated with a nickel layer.
Preferably, the cross section of the first heat dissipation unit is a right trapezoid, and the cross section of the second heat dissipation unit is an isosceles trapezoid.
Preferably, an included angle between a hypotenuse of the cross section of the first heat dissipation unit and the lower bottom is a, and a is 45 degrees.
Preferably, the included angle between the waist and the lower bottom of the cross section of the second heat dissipation unit is b, and b is 45 degrees.
Preferably, the heat dissipation strip is soldered to the PCB board.
The utility model discloses PCB heat abstractor compares with prior art, its beneficial effect lies in: through setting up the heat dissipation strip the same with PCB board electric current wiring shape to with the laminating of heat dissipation strip at the electric current wiring position of PCB board, not only increased the sectional area and reduced the resistance, also increased the current-carrying capacity, reduced the consumption, thereby improved PCB's radiating rate, heat dissipation strip self also has the radiating effect moreover, thereby has increased the cooling surface, has further improved the radiating effect, thereby has guaranteed the reliability and the life-span of components and parts on PCB and the PCB board. The utility model discloses simple structure, excellent in use effect easily uses widely.
Drawings
Fig. 1 is a schematic structural view of a shape of the heat dissipation strip of the present invention.
Fig. 2 is a schematic structural view of another two shapes of the heat dissipation strip of the present invention.
Fig. 3 is a schematic structural diagram of the first heat dissipation unit of the present invention.
Fig. 4 is a schematic structural diagram of the second heat dissipation unit of the present invention.
Wherein: 1-a first heat dissipation unit, 2-a second heat dissipation unit, and 3-a heat dissipation strip.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, the utility model provides a PCB heat abstractor of preferred embodiment, including heat dissipation strip 3, the shape of heat dissipation strip 3 is the same with PCB board electric current wiring shape to the laminating is at the electric current wiring position of PCB board, preferably, heat dissipation strip 3 with the PCB board welding, specifically, will heat dissipation strip 3 is as the device of paster encapsulation, uses the welding bench welding through brushing tin cream paster. Meanwhile, in order to facilitate welding, a nickel layer is electroplated on the surface of the heat dissipation strip 3. The material of heat dissipation strip 3 is red copper, heat dissipation strip 3 is formed by the concatenation of at least one first radiating element 1 and at least one second radiating element 2, conveniently splices into different shapes.
PCB heat abstractor based on above-mentioned technical characteristic is through setting up the heat dissipation strip 3 the same with PCB board electric current wiring line shape to with the laminating of heat dissipation strip 3 at the electric current wiring position of PCB board, not only increased the sectional area and reduced the resistance, also increased the current-carrying capacity, reduced the consumption, thereby improved PCB's radiating rate, heat dissipation strip 3 self also has the radiating effect moreover, thereby increased the cooling surface, further improved the radiating effect, thereby guaranteed the reliability and the life-span of components and parts on PCB and the PCB board. The utility model discloses simple structure, excellent in use effect easily uses widely.
In this embodiment, in order to achieve a better heat dissipation effect, it is ensured that the installation space is sufficient to facilitate installation. The width W of the heat sink strip 3 is determined by the formula W = a/d, and a is determined by I = K · T 0.44 ·A 0.75 Obtaining;
wherein: i is the passing current (A);
k is a correction coefficient: the inner layer is 0.024, and the outer layer is 0.048;
t is the maximum temperature rise (. Degree. C.);
a is the cross section area (mil) of the heat dissipation strip 2 )；
d is the heat sink strip thickness (mil).
For example, the trace width is required for the PCB to pass 60A current, the copper-clad thickness of the power board is generally selected from d =2.756mil, K =0.048, and temperature rise T =30 ℃, and is substituted into the formula (1) and the formula (2), and W ≈ 664.289mil ≈ 16.873mm is obtained.
In this embodiment, the cross section of the first heat dissipation unit 1 is a right trapezoid, and the cross section of the second heat dissipation unit 2 is an isosceles trapezoid. Meanwhile, the included angle between the oblique side of the cross section of the first heat dissipation unit 1 and the lower bottom is a, and a is 45 degrees. The included angle between the waist and the lower bottom of the cross section of the second heat dissipation unit 2 is b, and b is 45 degrees. And splicing according to the PCB wiring image during splicing. Although the PCB wiring is generally at a right or obtuse angle, various types of copper strips (see fig. 1-2) can be spliced on the PCB by these 2 types of copper strips with different lengths.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (5)
1. The PCB heat abstractor which characterized in that: the PCB comprises a heat dissipation strip, wherein the shape of the heat dissipation strip is the same as that of a PCB current wiring line, the heat dissipation strip is attached to a current wiring part of the PCB and made of red copper, and the heat dissipation strip is formed by splicing at least one first heat dissipation unit and at least one second heat dissipation unit;
the cross section of the first heat dissipation unit is a right trapezoid, and the cross section of the second heat dissipation unit is an isosceles trapezoid.
2. The PCB heat sink of claim 1, wherein: the surface of the heat dissipation strip is plated with a nickel layer.
3. The PCB heat sink of claim 1, wherein: the included angle between the oblique edge of the cross section of the first heat dissipation unit and the lower bottom is a, and a is 45 degrees.
4. The PCB heat sink of claim 1, wherein: the included angle between the waist and the lower bottom of the cross section of the second heat dissipation unit is b, and b is 45 degrees.
5. The PCB heat sink of claim 1, wherein: and the heat dissipation strip is welded with the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220054209.6U CN218277263U (en) | 2022-01-10 | 2022-01-10 | PCB heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220054209.6U CN218277263U (en) | 2022-01-10 | 2022-01-10 | PCB heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218277263U true CN218277263U (en) | 2023-01-10 |
Family
ID=84707987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220054209.6U Active CN218277263U (en) | 2022-01-10 | 2022-01-10 | PCB heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218277263U (en) |
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2022
- 2022-01-10 CN CN202220054209.6U patent/CN218277263U/en active Active
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