CN216960312U - Flexible PCB (printed circuit board) for ultrathin water-cooled radiator - Google Patents

Flexible PCB (printed circuit board) for ultrathin water-cooled radiator Download PDF

Info

Publication number
CN216960312U
CN216960312U CN202220450887.4U CN202220450887U CN216960312U CN 216960312 U CN216960312 U CN 216960312U CN 202220450887 U CN202220450887 U CN 202220450887U CN 216960312 U CN216960312 U CN 216960312U
Authority
CN
China
Prior art keywords
water pump
coil
fan
water
driving circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220450887.4U
Other languages
Chinese (zh)
Inventor
贾自周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Hongying Electronic Technology Co ltd
Original Assignee
Dongguan Hongying Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Hongying Electronic Technology Co ltd filed Critical Dongguan Hongying Electronic Technology Co ltd
Priority to CN202220450887.4U priority Critical patent/CN216960312U/en
Application granted granted Critical
Publication of CN216960312U publication Critical patent/CN216960312U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a flexible PCB (printed circuit board) for an ultrathin water-cooled radiator, which comprises a PCB body, wherein one side of the PCB body is provided with a plurality of water pump driving coils, the other side of the PCB body is provided with a plurality of fan driving coils, the outer side of each water pump driving coil is provided with a first coil contact, and each water pump driving coil is electrically connected with the first coil contact; the outer side of the fan driving coil is provided with a second coil contact, and the fan driving coil is electrically connected with the second coil contact; a water pump driving circuit is arranged on the outer side of the first coil contact and is electrically connected with the first coil contact; the fan driving circuit is arranged on the outer side of the second coil contact and is electrically connected with the second coil contact.

Description

Flexible PCB (printed circuit board) for ultrathin water-cooled radiator
Technical Field
The utility model relates to the technical field of water-cooled radiators, in particular to a flexible PCB for an ultrathin water-cooled radiator.
Background
The existing water-cooling radiator is generally provided with a water pump and a fan, the water pump and the fan are controlled by two independent PCBs (printed circuit boards), specifically, a first PCB for controlling the rotation of the water pump is arranged in the water pump, and a second PCB for controlling the rotation of the fan is arranged in the fan; the first PCB is integrated with a stator core of the water pump and is placed in the water pump; the second PCB board and the stator core of the fan are integrated together and placed in the fan.
Therefore, the water pump and the fan are large in size, so that the water-cooling radiator is large in size and is not beneficial to being placed in a miniature electronic product with a small space; secondly, first PCB board is placed in the water pump, need be qualified for the next round of competitions the design to carry out waterproof through processes such as dip coating, coating film, increased manufacturing cost like this, components and parts on the first PCB board can not effectual waterproof or waterproof grade is low, still can increase the height of axle core simultaneously, make flabellum resistance grow, do work efficiency step-down, the first PCB board of coating film is not only with high costs, can not effectually again with IC's heat diffusion, thereby reduced IC's life.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provides a flexible PCB for an ultrathin water-cooling radiator; the height and the volume of the water pump and the fan can be respectively reduced, so that the volume of the water-cooling radiator is reduced, the work efficiency can be increased, the flexible PCB is fully cooled, and the service life is prolonged.
In order to achieve the purpose, the utility model provides a flexible PCB for an ultrathin water-cooling radiator, which comprises a PCB body, wherein one side of the PCB body is provided with a plurality of water pump driving coils, the other side of the PCB body is provided with a plurality of fan driving coils, the outer side of each water pump driving coil is provided with a first coil contact, and the water pump driving coils are electrically connected with the first coil contacts; the outer side of the fan driving coil is provided with a second coil contact, and the fan driving coil is electrically connected with the second coil contact; a water pump driving circuit is arranged on the outer side of the first coil contact and is electrically connected with the first coil contact; and a fan driving circuit is arranged on the outer side of the second coil contact and is electrically connected with the second coil contact.
Preferably, the water pump driving circuit and the fan driving circuit are arranged adjacently; the adjacent arrangement is beneficial to circuit design and centralized heat dissipation; or not adjacently arranged, and can be adjusted according to actual conditions.
Preferably, a connection port is arranged on one side of the PCB body and used for connecting an external power supply or a control signal, and the connection port is connected with the PCB body through an FPC (flexible printed circuit), so that the FPC can be folded conveniently to reduce the connection space and can be connected with a mobile electronic device conveniently.
Preferably, the water pump driving coil and the fan driving coil are regular triangle hollow annular coils, and the hollow part can be filled with a material member for increasing the magnetism of the coils.
Preferably, the water pump driving circuit includes a second driving IC; the fan driving circuit comprises a first driving IC; different electrical elements can be added according to other requirements.
Preferably, the surfaces of the water pump driving coil, the fan driving coil, the water pump driving circuit and the fan driving circuit are coated with a layer of sealing adhesive layer, the PCB body is sealed through the sealing adhesive layer, circulating water is prevented from flowing in and corroding, and a sealing mode in the prior art is changed, so that the sealing cost of the PCB body can be reduced, the difficulty of a sealing process is reduced, the production cost is reduced, and the sealing precision of the PCB body is improved; further, the sealant layer is preferably a heat-conducting adhesive material member; utilize the heat conduction characteristic of heat-conducting glue, come out the heat transfer that water pump drive coil, fan drive coil, water pump drive circuit and fan drive circuit produced, recycle circulating water takes away the heat, is favorable to heat dissipation and increase of service life.
Preferably, the water pump driving coil and the fan driving coil are installed inside the circulating water flow channel, and the water pump driving circuit and the fan driving circuit are installed at the lower part of the circulating water flow channel; the heat that water pump drive coil, fan drive coil, water pump drive circuit and fan drive circuit produced is taken away in the flow of make full use of circulating water for can fully dispel the heat, increase of service life to PCB board body.
Preferably, the second driving IC and the first driving IC are mounted on the back of the PCB body, and the second driving IC and the first driving IC are closely attached to the heat sink base, and the heat sink base is made of a heat-conducting metal material member; the heat generated by the second drive IC and the first drive IC is effectively and quickly diffused by utilizing the large-plane heat dissipation effect of the heat radiator base without additionally increasing heat dissipation fins, so that the service lives of the second drive IC and the first drive IC and the service life of the water-cooled heat radiator are effectively prolonged.
Preferably, a plurality of first through holes for installing fixing bolts are formed in the PCB body, a second through hole for installing a water pump blade is formed in the water pump driving coil, a third through hole for installing a fan blade is formed in the fan driving coil, and specifically, the fixing bolts fix the PCB body on the heat sink base through the first through holes.
Preferably, the PCB body is provided with a mark symbol for identifying the model; the mark symbol is used for marking the specification and the model of the tool, the purpose or other information.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the first PCB in the water pump and the second PCB in the fan are integrated into a PCB body, the water pump driving coil and the fan driving coil are separated from the water pump driving circuit and the fan driving circuit, the water pump driving coil and the fan driving coil are still respectively arranged inside the water pump and the fan, and the water pump driving circuit and the fan driving circuit are arranged outside the water pump and the fan, so that the axial heights of the water pump and the fan can be effectively reduced, the volumes of the water pump and the fan are reduced, and the effects of reducing the axial size and the volume of the water-cooling radiator are achieved.
2. According to the utility model, the water pump driving circuit is arranged on one side of the water pump driving coil, and the fan driving circuit is arranged on one side of the fan driving coil, so that the driving circuit is separated from the driving coil, more windings can be added in the space left by the water pump driving circuit and the fan driving circuit, the work of the water pump driving coil and the fan driving coil is improved, the driving effect is further improved, the work efficiency is increased, and meanwhile, the volumes of the water pump and the fan can be further reduced, so that the volume of the water-cooling radiator is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic front view of a first PCB mounted in a water pump according to the prior art;
FIG. 2 is a schematic rear view of a first PCB mounted in a water pump according to the prior art;
FIG. 3 is a schematic front view of a second PCB mounted in a fan in the prior art;
FIG. 4 is a schematic rear view of a second PCB mounted in a fan according to the prior art;
FIG. 5 is a schematic structural diagram of a flexible PCB for an ultra-thin water-cooled heat sink according to the present invention;
fig. 6 is a schematic cross-sectional view of a water-cooled heat sink according to the present invention.
The figure comprises the following components:
1. a PCB body; 21. a water pump drive coil; 31. a fan drive coil; 22. a first coil contact; 32. a second coil contact; 23. a water pump drive circuit; 33. a fan drive circuit; 4. a connection port; 5. sealing the adhesive layer; 81. a first through hole; 82. a second through hole; 83. a third through hole; 6. marking a symbol; 7. a heat sink base.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are one embodiment of the present invention, and not all embodiments of the present invention. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Referring to fig. 5 and 6, the present invention provides a flexible PCB for an ultra-thin water-cooled heat sink.
As shown in fig. 5, the flexible PCB for the ultra-thin water-cooled heat sink includes a PCB body 1, and the PCB body 1 integrates a first PCB (specifically, as shown in fig. 1 and 2) in the water pump and a second PCB (specifically, as shown in fig. 3 and 4) in the fan, so that the distance between the water pump and the fan can be shortened, and the volume of the whole water-cooled heat sink is reduced.
As shown in fig. 5, the PCB body 1 has a plurality of water pump driving coils 21 on the left side and a plurality of fan driving coils 31 on the right side, and specifically, the number of the water pump driving coils 21 and the number of the fan driving coils 31 are six and are uniformly arranged along the circumferential direction.
As shown in fig. 5, the six water pump driving coils 21 are internally provided with second through holes 82 for installing water pump blades, and the six fan driving coils 31 are internally provided with third through holes 83 for installing fan blades; still be equipped with a plurality of first through-hole 81 that is used for installing fixing bolt around the PCB board body 1, fixing bolt fixes PCB board body 1 on radiator base 7 through first through-hole 81.
As shown in fig. 5, a first coil contact 22 is installed on the outer side of the water pump driving coil 21, and the first coil contact 22 includes a U-phase power contact, a V-phase power contact, a W-phase power contact, and a COM-phase power contact; the water pump driving coil 21 is electrically connected with the first coil contact 22; and fixedly connected by soldering.
Similarly, a plurality of second coil contacts 32 are arranged on the outer side of the fan driving coil 31, and the second coil contacts 32 are a U-phase power supply contact, a V-phase power supply contact, a W-phase power supply contact and a COM-phase power supply contact; the fan driving coil 31 is electrically connected with the second coil contact 32; and fixedly connected by soldering.
As shown in fig. 5, a water pump driving circuit 23 is disposed on the right side of the first coil contact 22, specifically, the water pump driving circuit 23 and the first coil contact 22 are independent from each other and are not integrated together, but the water pump driving circuit 23 is electrically connected to the first coil contact 22 through an internal circuit of the PCB body 1; similarly, a fan driving circuit 33 is installed below the second coil contact 32, the fan driving circuit 33 and the second coil contact 32 are also independent and not integrated, but the fan driving circuit 33 is electrically connected with the second coil contact 32 through the internal circuit of the PCB board body 1.
Furthermore, in the ultra-thin water-cooling radiator, the water pump driving coil 21 and the fan driving coil 31 are still respectively placed inside the water pump and the fan, and the water pump driving circuit 23 and the fan driving circuit 33 are placed outside the water pump and the fan, so that the water pump driving coil 21 and the fan driving coil 31 are separated from the water pump driving circuit 23 and the fan driving circuit 33, that is, the space of the water pump driving circuit 23 is reduced in the water pump, and the space of the fan driving circuit 33 is reduced in the fan, so that the axial heights of the water pump and the fan can be respectively and effectively reduced, and further the volumes of the water pump and the fan are reduced, and the effect of reducing the axial size and the volume of the water-cooling radiator is achieved.
Furthermore, because more are reserved in the inside space of water pump and fan, can increase more wire windings with the space of reserving to promote the acting of water pump drive coil 21 and fan drive coil 31, and then promote the drive effect, increase the efficiency of acting, the volume of water pump and fan can further reduce simultaneously, with the volume that reduces water-cooling radiator.
As shown in fig. 5, in the present embodiment, the water pump driving circuit 23 and the fan driving circuit 33 are disposed adjacent to each other; the adjacent arrangement is beneficial to the circuit design and the centralized heat dissipation, and in other embodiments, the water pump driving circuit 23 and the fan driving circuit 33 may not be arranged adjacently, and may be adjusted according to the actual situation.
As shown in fig. 5, a connection port 4 is arranged on the lower side of the PCB body 1, the connection port 4 is used for connecting an external power supply or a control signal, and further, the connection port 4 is connected with the PCB body 1 through an FPC flexible printed circuit board, so that the FPC flexible printed circuit board can be conveniently folded to reduce a connection space and can also be conveniently connected with a mobile electronic device.
As shown in fig. 5, in the present embodiment, the water pump driving coil 21 and the fan driving coil 31 are both regular triangle hollow ring coils; in other embodiments, the water pump driving coil 21 and the fan driving coil 31 may also be regular hexagonal hollow annular coils; further, the hollow part may be filled with a material member for increasing the magnetic property of the coil.
As shown in fig. 5, in the present embodiment, the water pump driving circuit 23 includes a second driving IC; the fan driving circuit 33 includes a first driving IC; further, the water pump driving circuit 23 further includes a second capacitor, a fourth capacitor, and a second resistor; the fan driving circuit 33 further includes a first capacitor, a third capacitor, and a first resistor; furthermore, in other embodiments, different electrical elements may be added according to other requirements.
As shown in fig. 6, a sealing adhesive layer 5 is coated on the surface of the PCB body 1, specifically, a sealing adhesive layer 5 is coated on the surfaces of the water pump driving coil 21, the fan driving coil 31, the water pump driving circuit 23 and the fan driving circuit 33, the PCB body 1 is sealed by the sealing adhesive layer 5, so as to prevent the inflow and erosion of circulating water, and change the sealing manner in the prior art, thereby reducing the sealing cost of the PCB body 1, reducing the difficulty of the sealing process, reducing the production cost, and improving the sealing accuracy of the PCB body 1; further, the sealant layer 5 is preferably a heat-conducting adhesive material member; utilize the heat conduction characteristic of heat-conducting glue, come out the heat transfer that water pump drive coil 21, fan drive coil 31, water pump drive circuit 23 and fan drive circuit 33 produced, recycle the circulating water and take away the heat, be favorable to heat dissipation and increase of service life.
As shown in fig. 5, the water pump driving coil 21 and the fan driving coil 31 are installed inside the circulating water flow passage, and the water pump driving circuit 23 and the fan driving circuit 33 are installed at the lower part of the circulating water flow passage; the heat that the flow of make full use of circulating water produced water pump drive coil 21, fan drive coil 31, water pump drive circuit 23 and fan drive circuit 33 is taken away for can fully dispel the heat, increase of service life to PCB board body 1.
As shown in fig. 5, in other embodiments, the second driving IC and the first driving IC are mounted on the back of the PCB board body 1, and the second driving IC and the first driving IC are closely attached to the heat sink base 7, wherein the heat sink base 7 is made of a heat conductive metal material member; by utilizing the large plane heat dissipation effect of the heat radiator base 7, the heat generated by the second drive IC and the first drive IC is effectively and quickly diffused without adding additional heat radiating fins, so that the service lives of the second drive IC and the first drive IC and the service life of the water-cooled heat radiator are effectively prolonged.
As shown in fig. 5, a mark symbol 6 for identifying the model is arranged in the middle of the right side of the PCB body 1; the mark symbol 6 is used for marking the specification and model number, the purpose or other information of the tool.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

Claims (10)

1. The utility model provides a flexible PCB board for ultra-thin water-cooling radiator which characterized in that: the PCB comprises a PCB body (1), wherein one side of the PCB body (1) is provided with a plurality of water pump driving coils (21), the other side of the PCB body is provided with a plurality of fan driving coils (31), the outer side of each water pump driving coil (21) is provided with a first coil contact (22), and each water pump driving coil (21) is electrically connected with the first coil contact (22); a second coil contact (32) is arranged on the outer side of the fan driving coil (31), and the fan driving coil (31) is electrically connected with the second coil contact (32); a water pump driving circuit (23) is arranged on the outer side of the first coil contact (22), and the water pump driving circuit (23) is electrically connected with the first coil contact (22); and a fan driving circuit (33) is arranged on the outer side of the second coil contact (32), and the fan driving circuit (33) is electrically connected with the second coil contact (32).
2. The flexible PCB board for an ultra-thin water-cooled heat sink as recited in claim 1, wherein: the water pump driving circuit (23) and the fan driving circuit (33) are arranged adjacently.
3. The flexible PCB board for an ultra-thin water-cooled heat sink as recited in claim 1, wherein: the PCB is characterized in that a connecting port (4) is formed in one side of the PCB body (1), and the connecting port (4) is connected with the PCB body (1) through an FPC (flexible printed circuit).
4. The flexible PCB for the ultra-thin water-cooled heat sink of claim 1, wherein: the water pump driving coil (21) and the fan driving coil (31) are regular-triangle hollow annular coils.
5. The flexible PCB board for an ultra-thin water-cooled heat sink as recited in claim 1, wherein: the water pump driving circuit (23) comprises a second driving IC; the fan drive circuit (33) includes a first drive IC.
6. The flexible PCB for the ultra-thin water-cooled heat sink of claim 1, wherein: the surface of the water pump driving coil (21), the surface of the fan driving coil (31), the surface of the water pump driving circuit (23) and the surface of the fan driving circuit (33) are coated with a sealing adhesive layer (5), and the sealing adhesive layer (5) is a heat-conducting adhesive material component.
7. The flexible PCB for the ultra-thin water-cooled heat sink of claim 1, wherein: the water pump driving coil (21) and the fan driving coil (31) are arranged inside the circulating water flow channel, and the water pump driving circuit (23) and the fan driving circuit (33) are arranged on the lower portion of the circulating water flow channel.
8. The flexible PCB board for the ultra-thin water-cooled heat sink as recited in claim 5, wherein: the second drive IC and the first drive IC are arranged on the back face of the PCB body (1), the second drive IC and the first drive IC are tightly attached to the heat radiator base (7), and the heat radiator base (7) is made of a heat-conducting metal material component.
9. The flexible PCB board for an ultra-thin water-cooled heat sink as recited in claim 1, wherein: the PCB board is characterized in that a plurality of first through holes (81) used for installing fixing bolts are formed in the PCB board body (1), second through holes (82) used for installing water pump blades are formed in the water pump driving coil (21), and third through holes (83) used for installing fan blades are formed in the fan driving coil (31).
10. The flexible PCB board for an ultra-thin water-cooled heat sink as recited in claim 1, wherein: the PCB board body (1) is provided with a mark symbol (6) for identifying the model.
CN202220450887.4U 2022-03-02 2022-03-02 Flexible PCB (printed circuit board) for ultrathin water-cooled radiator Active CN216960312U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220450887.4U CN216960312U (en) 2022-03-02 2022-03-02 Flexible PCB (printed circuit board) for ultrathin water-cooled radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220450887.4U CN216960312U (en) 2022-03-02 2022-03-02 Flexible PCB (printed circuit board) for ultrathin water-cooled radiator

Publications (1)

Publication Number Publication Date
CN216960312U true CN216960312U (en) 2022-07-12

Family

ID=82292735

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220450887.4U Active CN216960312U (en) 2022-03-02 2022-03-02 Flexible PCB (printed circuit board) for ultrathin water-cooled radiator

Country Status (1)

Country Link
CN (1) CN216960312U (en)

Similar Documents

Publication Publication Date Title
CN108076617B (en) Heat dissipation structure for vehicle-mounted charger or voltage converter
CN102595768A (en) Circuit board
CN110475422B (en) Heat radiation structure of printed circuit board
CN205069616U (en) Power module and vehicle that has it
CN106684076B (en) Encapsulating structure and its manufacturing method
CN115103507A (en) Embedded components and parts heat dissipation printing board device
CN217283820U (en) Power supply with air cooling and liquid cooling device
CN216960312U (en) Flexible PCB (printed circuit board) for ultrathin water-cooled radiator
CN210050054U (en) Automobile electronic water pump based on cooling circulation water path and automobile
CN211808354U (en) Refrigerating device for solder paste printing machine
CN208317104U (en) The two-sided PCB circuit board radiator structure of multi-layered high-density
EP3905491B1 (en) Electric machine
CN218277263U (en) PCB heat dissipation device
CN217336035U (en) Ceramic-based PCB structure with embedded components
CN210325773U (en) Power module
CN216982186U (en) PCB substrate and metal-based printed circuit board
CN218735137U (en) PCB (printed circuit board) for fine-pore-diameter precision instrument
CN211128383U (en) Anti-interference heat dissipation type circuit board
CN218888756U (en) Circuit board with good heat dissipation effect
CN214046132U (en) Multilayer printed PCB circuit board capable of rapidly radiating
CN210075701U (en) High-speed PCB with excellent heat dissipation performance
CN217563847U (en) High-efficient heat conduction base plate
CN217406796U (en) Copper-clad foil convenient for electronic device connection
CN210640792U (en) Controller assembly of external rotor motor for automobile cooling fan
CN207118212U (en) Driver radiator structure, driver and motor

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant