CN217406796U - Copper-clad foil convenient for electronic device connection - Google Patents
Copper-clad foil convenient for electronic device connection Download PDFInfo
- Publication number
- CN217406796U CN217406796U CN202220905013.3U CN202220905013U CN217406796U CN 217406796 U CN217406796 U CN 217406796U CN 202220905013 U CN202220905013 U CN 202220905013U CN 217406796 U CN217406796 U CN 217406796U
- Authority
- CN
- China
- Prior art keywords
- copper
- heat dissipation
- copper sheet
- resin main
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a copper clad foil convenient for connecting electronic devices in the field of copper clad foil, which comprises a copper foil body, wherein the copper foil body consists of a resin main body, a power connection copper sheet and a heat dissipation copper sheet, the power connection copper sheet and the heat dissipation copper sheet are respectively attached at two ends of the resin main body, an insulating adhesive layer is sprayed around the resin main body, one side of the power connection copper sheet away from the resin main body is provided with a plurality of power connection grooves, the plurality of power connection grooves are distributed in a rectangular array, a soldering tin block is all arranged in the plurality of power connection grooves, a plurality of heat dissipation cavities for connecting the power connection copper sheet and the heat dissipation copper sheet are separated in the resin main body through a reticular separation plate, heat conduction silicone grease is filled in the heat dissipation cavities, and the reticular separation plate is provided with heat conduction through holes for connecting the heat dissipation cavities, when the soldering tin bar is used, external electrical equipment can be welded with the electric copper sheet through the soldering tin block without using an external soldering tin bar, so that the purpose of conveniently connecting the electronic device is achieved.
Description
Technical Field
The utility model relates to a cover copper foil field, concretely relates to cover copper foil convenient to electronic device connects.
Background
The circuit board of the electronic equipment can generate heat during working, so that the internal temperature of the equipment can rise rapidly, if the heat is not dissipated in time, the equipment can be heated continuously, and the service life and the reliability of the electronic element can be reduced due to overheating. Therefore, it is important to perform a heat dissipation process on a Printed Circuit Board (PCB). The direct reason for causing the temperature rise of the PCB is that due to the existence of circuit power consumption devices, power consumption exists in various degrees in all electronic devices, the heating intensity changes along with the power consumption, the PCB medium temperature rise phenomenon comprises local temperature rise or large-area temperature rise, and short-time temperature rise or long-time temperature rise, the heat dissipation problem of the PCB is solved, and the heat dissipation of the PCB is mainly realized by optimizing the heat dissipation of the components, reducing the power consumption of the components, optimizing the layout of the circuit and the components, adopting a radiator, strengthening air cooling or water cooling and the like.
Chinese patent publication No. CN213280206U discloses a copper-clad laminate with improved local heat dissipation, wherein a plurality of through holes are formed in the copper-clad laminate, heat dissipation rings are disposed in the through holes, heat conductive silica gel is filled in gaps between the heat dissipation rings and the through holes, and a plurality of heat dissipation fins are disposed on the inner wall of the heat dissipation rings; the utility model discloses a copper foil clad plate of local thermal diffusivity improvement can be rapidly with heat conduction to fin and heat dissipation through the cooling ring, has improved the radiating efficiency, has better radiating effect, can find out its position that needs the primary definite locating hole from this, and the unable fine adaptation increases suddenly's circuit power consumption device, and leads to the unable reasonable solution of heat dissipation problem, can't make things convenient for and is connected with electronic device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the above defect, providing the copper clad laminate that the electronic device of being convenient for is connected, it can conveniently dispel the heat, can conveniently be connected with electronic device.
The utility model aims at realizing through the following modes:
copper foil that covers convenient to electron device connects, including the copper foil body, the copper foil body comprises resin main part, connects electric copper sheet and heat dissipation copper sheet and laminates respectively at the both ends of resin main part, and the spraying all around of resin main part has insulating glue film, connects one side that the resin main part was kept away from to the electric copper sheet to be equipped with a plurality of and connects the electrobath, and a plurality of connects the electrobath to be the rectangular array and distributes, and a plurality of connects and all installs the soldering tin piece in the electrobath.
In the above description, the resin main body is partitioned by the mesh partition plates into a plurality of heat dissipation cavities for connecting the power connection copper sheets and the heat dissipation copper sheets, heat on the power connection copper sheets is conducted to the heat dissipation copper sheets through the heat dissipation cavities, and the mesh partition plates are used for ensuring stability of the whole structure.
Further in the above description, the heat dissipation cavity is divided into thirty so as to ensure the heat dissipation capability.
In the above description, the heat dissipation cavity is filled with heat conductive silicone grease, which can ensure the stability of heat dissipation without affecting the normal power connection of the power connection copper sheet.
Further, in the above description, the mesh partition plate is provided with a heat conducting through hole for connecting the heat dissipation cavities, so as to conduct each heat dissipation cavity and share the heat dissipation work of the local area.
In the above description, further, the distance between two adjacent electricity-connecting grooves is 8-14 mm.
The utility model has the advantages that: when the soldering tin bar is used, external electrical equipment can be welded with the electric copper sheet through the soldering tin block without using an external soldering tin bar, so that the purpose of conveniently connecting the electronic device is achieved.
Drawings
FIG. 1 is a perspective view of a copper clad laminate for facilitating connection of electronic devices according to the present invention;
FIG. 2 is a front view of the copper clad laminate for facilitating the connection of electronic devices according to the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 2;
FIG. 5 is a top view of a copper clad laminate for facilitating the connection of electronic devices according to the present invention;
FIG. 6 is a cross-sectional view taken along line C-C of FIG. 5;
the reference numbers in the figures are respectively: the manufacturing method comprises the following steps of 1-a resin main body, 101-a reticular separation plate, 102-a heat dissipation cavity, 103-a heat conduction through hole, 2-an electric connection copper sheet, 201-an electric connection groove, 3-a heat dissipation copper sheet, 4-an insulating glue layer, 5-a soldering tin block and 6-heat conduction silicone grease.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In this embodiment, referring to fig. 1 to 6, a copper clad foil which is specifically implemented and facilitates connection of an electronic device includes a copper foil body, the copper foil body is composed of a resin main body 1, an electrical connection copper sheet 2 and a heat dissipation copper sheet 3, the electrical connection copper sheet 2 and the heat dissipation copper sheet 3 are respectively attached to two ends of the resin main body 1, an insulating adhesive layer 4 is sprayed around the resin main body 1, one side of the electrical connection copper sheet 2, which is far away from the resin main body 1, is provided with one hundred and ninety electrical connection slots 201, the one hundred and ninety electrical connection slots 201 are distributed in a rectangular array, solder blocks 5 are respectively installed in the one hundred and ninety electrical connection slots 201, and a distance between two adjacent electrical connection slots 201 is 8 to 14 millimeters.
In this embodiment, thirty heat dissipation cavities 102 for connecting the power connection copper sheet 2 and the heat dissipation copper sheet 3 are separated by the mesh partition plate 101 in the resin main body 1 to ensure heat dissipation capability, heat on the power connection copper sheet 2 is conducted to the heat dissipation copper sheet 3 through the heat dissipation cavities 102, the mesh partition plate 101 is used for ensuring stability of the overall structure, the heat dissipation cavities 102 are filled with the heat conduction silicone grease 6, the heat conduction silicone grease 6 can ensure stability of heat dissipation without affecting normal power connection of the power connection copper sheet 2, the mesh partition plate 101 is provided with heat conduction through holes 103 for connecting the heat dissipation cavities 102, and the heat conduction through holes 103 are used for conducting the heat dissipation cavities 102 to share heat dissipation work of local areas.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and although the present invention is disclosed in the above description in terms of preferred embodiments, it is not intended to limit the present invention, and any person skilled in the art will be able to make any changes or modifications to equivalent embodiments without departing from the scope of the present invention, and all the technical solutions of the present invention are within the scope of the present invention.
Claims (6)
1. Copper clad laminate convenient to electronic device connects, including the copper foil body, its characterized in that: the copper foil body comprises resin main part, connects electric copper sheet and heat dissipation copper sheet and laminates respectively at the both ends of resin main part, and the spraying has insulating glue layer around the resin main part, connects one side that the resin main part was kept away from to the electric copper sheet to be equipped with a plurality of and connects the electricity groove, and a plurality of connects the electricity groove to be the distribution of rectangle array, and the soldering tin piece is all installed to a plurality of in connecting the electricity groove.
2. The copper-clad foil for facilitating electronic device connection according to claim 1, wherein: and a plurality of heat dissipation cavities for connecting the power connection copper sheets and the heat dissipation copper sheets are separated in the resin main body through the reticular separation plates.
3. The copper-clad foil for facilitating electronic device connection according to claim 2, wherein: the heat dissipation cavity is divided into thirty.
4. The copper-clad foil for facilitating electronic device connection according to claim 2, wherein: and heat-conducting silicone grease is filled in the heat dissipation cavity.
5. The copper-clad foil for facilitating electronic device connection according to claim 3, wherein: and the reticular separation plate is provided with a heat conduction through hole for connecting the heat dissipation cavity.
6. The copper-clad foil for facilitating electronic device connection according to claim 1, wherein: the distance between two adjacent electricity-connecting grooves is 8-14 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220905013.3U CN217406796U (en) | 2022-04-19 | 2022-04-19 | Copper-clad foil convenient for electronic device connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220905013.3U CN217406796U (en) | 2022-04-19 | 2022-04-19 | Copper-clad foil convenient for electronic device connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217406796U true CN217406796U (en) | 2022-09-09 |
Family
ID=83140291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220905013.3U Active CN217406796U (en) | 2022-04-19 | 2022-04-19 | Copper-clad foil convenient for electronic device connection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217406796U (en) |
-
2022
- 2022-04-19 CN CN202220905013.3U patent/CN217406796U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4798432B2 (en) | Surface lighting device | |
| US20070217202A1 (en) | Spread illuminating apparatus | |
| CN107896421B (en) | PCB capable of fast radiating | |
| CN108617082B (en) | Heat dissipation assembly and electronic device | |
| CN213847398U (en) | Circuit board heat radiation structure and electrical equipment | |
| TW201524278A (en) | DC/DC power module and DC/DC power system assembly | |
| CN212517183U (en) | High-efficient heat radiation structure of IGBT module | |
| CN217406796U (en) | Copper-clad foil convenient for electronic device connection | |
| CN217470363U (en) | Multilayer circuit board with high aspect ratio blind hole | |
| CN211352604U (en) | Heat dissipation optimization structure of circuit board | |
| CN217406795U (en) | Copper clad foil for supporting printed circuit board | |
| CN211606913U (en) | Easy radiating circuit board | |
| CN210537020U (en) | Special FPC device of wireless charger of cell-phone | |
| CN113727515A (en) | Metal copper-clad plate | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN211792222U (en) | High-heat-conductivity aluminum-based circuit board | |
| CN213280203U (en) | Copper-clad laminate with enhanced heat dissipation and optimized electric conduction | |
| CN218483006U (en) | Multi-layer PCB with chip protection structure | |
| CN215269254U (en) | Novel high heat conduction metal sheet | |
| CN211457519U (en) | PCB capable of efficiently dissipating heat | |
| CN213028694U (en) | Metal substrate with good heat conductivity | |
| CN213280206U (en) | Copper-clad laminate with improved local heat dissipation | |
| CN213280205U (en) | Copper-clad laminate with high heat conduction and enhanced heat dissipation | |
| CN219107776U (en) | Heat dissipation circuit board | |
| CN216790122U (en) | Lamp panel and spotlight |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |