CN215269254U - Novel high heat conduction metal sheet - Google Patents
Novel high heat conduction metal sheet Download PDFInfo
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- CN215269254U CN215269254U CN202121173239.0U CN202121173239U CN215269254U CN 215269254 U CN215269254 U CN 215269254U CN 202121173239 U CN202121173239 U CN 202121173239U CN 215269254 U CN215269254 U CN 215269254U
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Abstract
The utility model relates to the technical field of heat transfer, and discloses a novel high-heat-conductivity metal plate, which comprises a first metal substrate, wherein a second metal substrate is arranged on the first metal substrate; a cavity is formed in the second metal substrate, and metal heat conducting plates are arranged on two inner walls of the metal substrate; a plurality of metal heat conducting wires are arranged between the two metal heat conducting plates; and a plurality of heat dissipation plates are arranged on the two outer walls of the metal substrate. This neotype high heat conduction metal sheet, through being linear array form joint respectively in a plurality of logical inslots of second metal substrate with a plurality of heating panels, respectively in the mutual adhesion of two-layer metal heat-conducting plate, and the heating panel is certain angle setting, makes the metal sheet at the radiating process, the air of multiple orientation circulation all is convenient for flow through from the surface of a plurality of heating panels, has improved the metal sheet in the interactive speed of air heating power greatly, has strengthened heat conduction, radiating efficiency.
Description
Technical Field
The utility model relates to a heat transfer technology field specifically is a novel high heat conduction metal sheet.
Background
With the development of light, thin, small, high-density and multifunctional electronic products, the assembly density and the integration level of components on a circuit board are higher and higher, the power consumption is higher and higher, the requirement on the heat dissipation performance of the circuit board (PCB substrate) is more and more urgent, if the heat dissipation performance of the circuit board is not good or poor, components on the printed circuit board are overheated due to light, and the reliability of the whole system or device is reduced.
Chinese authorized utility model publication No.: CN211378646U discloses a novel high thermal conductive metal plate, which is provided with a first metal substrate, a second metal substrate, two metal thermal conductive plates, a metal thermal conductive wire, and two sets of annular heat dissipation plates, and is matched with each other, so as to improve the thermal conductivity and heat dissipation performance of the thermal conductive metal plate.
However, in the structural design of the prior art, when heat is dissipated, heat can be transferred to the annular heat dissipation plate plates, but because the annular heat dissipation plates are coaxially distributed, the air which is subjected to thermal interaction with other annular heat dissipation plates can only circulate through a plurality of air vents except the outermost annular heat dissipation plate, and the heat dissipation efficiency is poor.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
To the not enough of prior art in the above-mentioned background art, the utility model provides a novel high heat conduction metal sheet to overcome the current novel high heat conduction metal sheet that proposes in the above-mentioned background art, when dispelling the heat, the heat can convey on a plurality of annular radiating plate boards, nevertheless because a plurality of annular radiating plate distribute with the axle center, make except outermost annular radiating plate, the air that carries out the thermal interaction with other a plurality of annular radiating plates can only circulate through several air vents, make the relatively poor shortcoming of radiating efficiency.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a novel high-heat-conductivity metal plate comprises a first metal substrate, wherein a second metal substrate is arranged on the first metal substrate; a cavity is formed in the second metal substrate, and metal heat conducting plates are arranged on two inner walls of the metal substrate; a plurality of metal heat conducting wires are arranged between the two metal heat conducting plates; a plurality of heat dissipation plates are arranged on the two outer walls of the metal substrate;
each heat dissipation plate is internally provided with a cavity, and the cavity of each heat dissipation plate is filled with cooling liquid.
As an optimal technical solution of the utility model: it is a plurality of the heating panel is linear array form respectively and sets up on two outer walls of second metal substrate, and every the heating panel all is certain angle setting for the contact surface of a plurality of heating panels and air increases, and the air circulates more between a plurality of heating panels.
As an optimal technical solution of the utility model: every the cavity of heating panel all is filled with the coolant liquid, makes the coolant liquid can absorb the partial heat that gives off, has improved the heat conduction effect.
Furthermore, a groove matched with one end of the second metal substrate is formed in the side wall of the first metal substrate, the second metal substrate is clamped in the groove of the first metal substrate, and the first metal substrate and the second metal substrate are adhered to each other through thermal insulation glue.
Furthermore, the lower ends of the plurality of metal heat conducting wires penetrate through the first metal substrate, and two sides of the plurality of metal heat conducting wires are respectively adhered to the two layers of metal heat conducting plates through thermal insulation glue.
Furthermore, through grooves matched with the plurality of heat dissipation plates are formed in two side walls of the second metal substrate, the plurality of heat dissipation plates are clamped in the through grooves of the second metal substrate respectively, and the plurality of heat dissipation plates are adhered to the two layers of metal heat conduction plates through thermal insulation glue respectively.
(III) advantageous effects
The utility model provides a novel high heat conduction metal sheet possesses following beneficial effect:
(1) this neotype high heat conduction metal sheet, through being linear array form respectively the joint at a plurality of logical inslots of second metal substrate with a plurality of heating panels, respectively in two-layer metal heat-conducting plate mutual adhesion, and the heating panel is certain angle setting, makes the metal sheet in the radiating process, the air of multiple orientation circulation all is convenient for flow through from the surface of a plurality of heating panels, has improved the metal sheet in the interactive speed of air heating power greatly, has strengthened heat conduction, radiating efficiency.
(2) This neotype high heat conduction metal sheet through all having seted up the cavity in every heating panel, all fills in every cavity has the coolant liquid for the heating panel that is equipped with the coolant liquid can absorb more heats when dispelling the heat, further reinforcing the heat conduction effect.
Drawings
Fig. 1 is a schematic structural view of a high thermal conductivity metal plate according to the present invention;
fig. 2 is a front view of the high thermal conductivity metal plate of the present invention;
fig. 3 is a cross-sectional view of the high thermal conductivity metal plate of the present invention;
fig. 4 is a partial sectional view of the high thermal conductivity metal plate of the present invention.
In the figure: the heat dissipation plate comprises a first metal substrate 1, a second metal substrate 2, a metal heat conduction plate 3, a metal heat conducting wire 4 and a heat dissipation plate 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, the present invention provides a novel metal plate with high thermal conductivity; the device comprises a first metal substrate 1, wherein a second metal substrate 2 is arranged on the first metal substrate 1; a cavity is arranged in the second metal substrate 2, and metal heat-conducting plates 3 are arranged on two inner walls of the metal substrate 2; a plurality of metal heat conducting wires 4 are arranged between the two metal heat conducting plates 3; a plurality of heat dissipation plates 5 are arranged on the two outer walls of the metal substrate 2; a cavity is formed in each heat dissipation plate 5, and cooling liquid is filled in the cavity of each heat dissipation plate 5;
as shown in fig. 3, a groove adapted to one end of the second metal substrate 2 is formed on the side wall of the first metal substrate 1, the second metal substrate 2 is clamped in the groove of the first metal substrate 1, and the first metal substrate 1 and the second metal substrate 2 are adhered to each other by a thermal insulation adhesive; the lower ends of the plurality of metal heat conducting wires 4 penetrate through the first metal substrate 1, and two sides of the plurality of metal heat conducting wires 4 are respectively adhered to the two layers of metal heat conducting plates 3 through heat insulating glue;
as shown in fig. 3 and 4, through grooves adapted to the plurality of heat dissipation plates 5 are formed on both side walls of the second metal substrate 2, the plurality of heat dissipation plates 5 are respectively clamped in the plurality of through grooves of the second metal substrate 2, and the plurality of heat dissipation plates 5 are respectively adhered to the two layers of metal heat conduction plates 3 through a thermal insulation adhesive;
as shown in fig. 1 and 2, a preferred embodiment of the present invention is: the plurality of heat dissipation plates 5 are respectively arranged on the two outer walls of the second metal substrate 2 in a linear array shape, and each heat dissipation plate 5 is arranged at a certain angle, so that the contact surfaces of the plurality of heat dissipation plates 5 and air are increased, and the air is more circulated among the plurality of heat dissipation plates 5;
as shown in fig. 4, a preferred embodiment of the present invention is: the cavity of each heat dissipation plate 5 is filled with cooling liquid, so that the cooling liquid can absorb partial heat emitted, and the heat conduction effect is improved.
It should be noted that, in the present invention, unless explicitly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "fixed" are to be understood in a broad sense, and may be, for example, either fixedly or detachably connected; or indirectly through an intermediary. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A novel high-heat-conductivity metal plate comprises a first metal substrate (1), and is characterized in that a second metal substrate (2) is arranged on the first metal substrate (1); a cavity is formed in the second metal substrate (2), and metal heat-conducting plates (3) are arranged on two inner walls of the metal substrate (2); a plurality of metal heat conducting wires (4) are arranged between the two metal heat conducting plates (3); a plurality of heat dissipation plates (5) are arranged on the two outer walls of the metal substrate (2);
each heat dissipation plate (5) is internally provided with a cavity, and the cavity of each heat dissipation plate (5) is filled with cooling liquid.
2. The novel metal plate with high thermal conductivity according to claim 1, wherein a groove adapted to one end of the second metal substrate (2) is formed on a side wall of the first metal substrate (1), the second metal substrate (2) is clamped in the groove of the first metal substrate (1), and the first metal substrate (1) and the second metal substrate (2) are adhered to each other by a thermal insulation adhesive.
3. The novel metal plate with high thermal conductivity according to claim 1, wherein the lower ends of a plurality of the metal thermal wires (4) all penetrate through the first metal substrate (1), and two sides of the plurality of the metal thermal wires (4) are respectively adhered to the two metal heat-conducting plates (3) through a thermal insulation adhesive.
4. The novel metal plate with high thermal conductivity according to claim 1, wherein through grooves adapted to the plurality of heat dissipation plates (5) are formed on both side walls of the second metal substrate (2), the plurality of heat dissipation plates (5) are respectively clamped in the plurality of through grooves of the second metal substrate (2), and the plurality of heat dissipation plates (5) are respectively adhered to the two layers of metal heat conduction plates (3) through thermal insulation glue.
5. The novel metal plate with high thermal conductivity according to claim 1, wherein a plurality of the heat dissipation plates (5) are respectively disposed on two outer walls of the second metal substrate (2) in a linear array, and each of the heat dissipation plates (5) is disposed at an angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121173239.0U CN215269254U (en) | 2021-05-28 | 2021-05-28 | Novel high heat conduction metal sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121173239.0U CN215269254U (en) | 2021-05-28 | 2021-05-28 | Novel high heat conduction metal sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215269254U true CN215269254U (en) | 2021-12-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121173239.0U Active CN215269254U (en) | 2021-05-28 | 2021-05-28 | Novel high heat conduction metal sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215269254U (en) |
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2021
- 2021-05-28 CN CN202121173239.0U patent/CN215269254U/en active Active
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