CN211128377U - High-thermal-conductivity 5G mixed metal substrate - Google Patents
High-thermal-conductivity 5G mixed metal substrate Download PDFInfo
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- CN211128377U CN211128377U CN201921834509.0U CN201921834509U CN211128377U CN 211128377 U CN211128377 U CN 211128377U CN 201921834509 U CN201921834509 U CN 201921834509U CN 211128377 U CN211128377 U CN 211128377U
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Abstract
The utility model discloses a high heat conduction 5G mixed metal substrate, including top layer base plate and copper foil layer, the top layer base plate from top to bottom is equipped with top layer base plate, bottom base plate and heat dissipation bottom metal sheet in proper order, has seted up the heat conduction through-hole under the electronic component, the heat conduction through-hole vertically runs through copper foil layer, top layer base plate, bottom base plate and heat dissipation bottom metal sheet, special-shaped heat conduction piece has sunk in the heat conduction through-hole inner wall, the bottom of special-shaped heat conduction piece is equipped with the round heat conduction ring, the heat conduction ring card is established the pressfitting and is established in the card and is established the inner ring groove, the card is established the inner ring groove and is seted up between the intermediate layer of heat dissipation bottom metal sheet and top layer base plate, the bottom surface of heat; the utility model discloses a with multiple metal cooperation substrate pressfitting together, dispel the heat fast through the multiple heat dissipation form of metal contact conduction and circulation of air heat, improved the heat-sinking capability of electronic component itself greatly, improve electronic component's high-efficient long-term operation state.
Description
Technical Field
The utility model particularly relates to a heat dissipation base plate specifically is a mixed metal substrate of 5G of high heat conduction.
Background
The base plate is the basic material for manufacturing PCB, generally, the base plate is the copper clad laminate, the single-sided and double-sided printed boards are manufactured on the base plate material-copper clad laminate, hole processing, chemical copper plating, copper electroplating, etching and the like are selectively carried out, the required circuit pattern is obtained, the circuit board is lack of an active heat dissipation function, the circuit board or high-heat-generating components are mostly subjected to auxiliary heat dissipation through an external heat dissipation device, but the heat dissipation of the components is carried out by the common circuit board, no matter air cooling or water cooling or contact transfer type heat conduction, most of the heat is concentrated on the surfaces of the electronic components, the heat between the bottom of the electronic components and the circuit board is difficult to dissipate, and the overall heat dissipation efficiency of the electronic components is low.
Although some circuit boards in the existing market have some heat dissipation holes, the pertinence is poor, the circuit boards are generally arranged on the sides, the pertinence is poor, and fixed-point efficient heat dissipation cannot be performed on high-temperature electronic components, so that a circuit board substrate capable of dissipating heat at high speed is needed to solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mixed metal substrate of 5G of high heat conduction to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a high-heat-conductivity 5G mixed metal substrate comprises a top substrate and a copper foil layer, wherein the copper foil layer is pressed on the top of the top substrate, a plurality of element welding areas used for patch welding are reserved on the surface of the copper foil layer through etching separation, electronic elements are welded on the element welding areas, the top substrate is sequentially provided with the top substrate, a bottom substrate and a heat dissipation bottom metal plate from top to bottom, a heat conduction through hole is formed right below each electronic element and vertically penetrates through the copper foil layer, the top substrate, the bottom substrate and the heat dissipation bottom metal plate, a special-shaped heat conduction block is sunk in the inner wall of each heat conduction through hole, the outer side wall of each special-shaped heat conduction block is attached and fixed in the inner wall of each heat conduction through hole, the top end of each special-shaped heat conduction block is connected with the bottom surface of each electronic element, the bottom of each special-shaped heat conduction block is provided with, the clamping inner ring groove is formed between the heat dissipation bottom metal plate and the interlayer of the top substrate, and the bottom surface of the heat conduction ring is fixedly connected with the top surface of the heat dissipation bottom metal plate.
As a further aspect of the present invention: the special-shaped heat conducting block is in a cap shape, and the bottom of the special-shaped heat conducting block is provided with a groove communicated with the heat conducting through hole.
As a further aspect of the present invention: the special-shaped heat conducting block is made of a copper plate.
As a further aspect of the present invention: the height of the inner top surface of the groove is higher than that of the top surface of the top substrate.
As a further aspect of the present invention: the base substrate and the top substrate are made of a synthetic resin manufactured by neutralizing propylene.
As a further aspect of the present invention: the heat dissipation bottom metal plate is made of a metal aluminum plate.
As a further aspect of the present invention: the bottom of the heat dissipation bottom metal plate is provided with a plurality of rows of grooves convenient for heat dissipation.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a with multiple metal cooperation base plate pressfitting together, set up the heat conduction through-hole bottom the electronic component who produces the high heat easily, dispel the heat fast through the radiating multiple heat dissipation form of metal contact conduction and circulation of air, improved the heat-sinking capability of electronic component itself greatly, improve electronic component's high-efficient long-term operation state.
Drawings
Fig. 1 is a schematic structural view of a highly thermally conductive mixed-metal substrate.
In the figure: the heat dissipation structure comprises a heat dissipation bottom metal plate 1, a bottom substrate 2, a top substrate 3, a copper foil layer 4, an electronic element 5, a special-shaped heat conduction block 6, a heat conduction through hole 7, a clamping inner ring groove 8 and a heat conduction ring 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1, in an embodiment of the present invention, a high thermal conductivity 5G hybrid metal substrate includes a top substrate 3 and a copper foil layer 4, the top of the top substrate 3 is pressed with the copper foil layer 4, the surface of the copper foil layer 4 is etched to separate a plurality of component welding areas for surface mount welding, the component welding areas are welded with an electronic component 5, the top substrate 3 is sequentially provided with the top substrate 3, a bottom substrate 2 and a bottom heat dissipation metal plate 1 from top to bottom, a thermal via 7 is disposed right below the electronic component 5, the thermal via 7 vertically penetrates through the copper foil layer 4, the top substrate 3, the bottom substrate 2 and the bottom heat dissipation metal plate 1, a special-shaped thermal conductive block 6 is deposited in an inner wall of the thermal via 7, an outer sidewall of the special-shaped thermal block 6 is attached and fixed in the inner wall of the thermal via 7, a top end of the special-shaped thermal block 6 is connected with a bottom surface of, the bottom of the special-shaped heat conducting block 6 is provided with a circle of heat conducting ring 9, the heat conducting ring 9 is clamped and pressed in the clamping inner ring groove 8, the clamping inner ring groove 8 is arranged between the heat dissipation bottom metal plate 1 and the interlayer of the top substrate 3, and the bottom surface of the heat conducting ring 9 is connected and fixed with the top surface of the heat dissipation bottom metal plate 1.
The special-shaped heat conducting block 6 is in a cap shape, the bottom of the special-shaped heat conducting block 6 is provided with a groove communicated with the heat conducting through hole 7, the arranged groove enables heat at the top of the special-shaped heat conducting block 6 to be transmitted to the outside through the groove and the heat conducting through hole 7 when the heat is conducted downwards through the side wall of the special-shaped heat conducting block 6, and the special-shaped heat conducting block is formed by punching a copper plate.
The base substrate 2 and the top substrate 3 are made of a synthetic resin manufactured by neutralizing propylene.
The heat dissipation bottom metal plate 1 is made of a metal aluminum plate, and the aluminum plate is low in cost and high in heat dissipation efficiency.
The utility model discloses a theory of operation is: firstly, a heat conduction through hole 7 is arranged on a heat dissipation bottom metal plate 1, a bottom substrate 2, a top substrate 3 and a copper foil layer 4, a special-shaped heat conduction block 6 penetrates into the heat conduction through hole 7, a heat conduction ring 9 of the special-shaped heat conduction block 6 is clamped into a clamping inner ring groove 8, the heat dissipation bottom metal plate 1, the bottom substrate 2, the top substrate 3 and the copper foil layer 4 are integrally pressed to form a mixed metal substrate main body, when an electronic element 5 is welded on the four circles above the heat conduction through hole 7, the bottom surface of the electronic element 5 is connected with the top surface of the special-shaped heat conduction block 6, heat generated by the work of the electronic element 5 is transmitted to the heat dissipation bottom metal plate 1 through the side wall of the special-shaped heat conduction block 6 and the heat conduction ring 9 to carry out rapid heat dissipation, meanwhile, the heat received by the top of the special-shaped heat conduction block 6 is rapidly contacted with the outside air through the groove of, the bottom of the electronic element 5 which is easy to generate high heat is provided with the heat conduction through hole 7, and the heat is quickly dissipated through various heat dissipation modes of metal contact conduction and air circulation heat dissipation, so that the heat dissipation capability of the electronic element 5 is greatly improved, and the efficient long-term operation state of the electronic element 5 is improved.
Example 2
This example differs from example 1 in that:
the height of the inner top surface of the groove is positioned on the top surface of the top substrate 3, the top of the special-shaped heat conducting block 6 is mainly kept to receive a large amount of heat, the heat is distributed along with the groove and the heat conducting through holes 7, the speed and the effective heat exchange space are reduced, meanwhile, the contact between the side wall of the special-shaped heat conducting block 6 and the bottom substrate 2 and the top substrate 3 is reduced, the heat is prevented from being transmitted to other electronic components through the bottom substrate 2 and the top substrate 3, and the interference of interaction is reduced.
The bottom of the heat dissipation bottom metal plate 1 is provided with a plurality of rows of grooves convenient for heat dissipation, so that heat of the heat dissipation bottom metal plate 1 can be quickly dissipated.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A high-thermal-conductivity 5G mixed metal substrate comprises a top substrate (3) and a copper foil layer (4), wherein the copper foil layer (4) is pressed on the top of the top substrate (3), a plurality of element welding areas for patch welding are reserved on the surface of the copper foil layer (4) through etching and separation, and an electronic element (5) is welded on each element welding area;
the heat dissipation device is characterized in that the top substrate (3) is sequentially provided with a top substrate (3), a bottom substrate (2) and a heat dissipation bottom metal plate (1) from top to bottom, a heat conduction through hole (7) is formed right below an electronic element (5), the heat conduction through hole (7) vertically penetrates through a copper foil layer (4), the top substrate (3), the bottom substrate (2) and the heat dissipation bottom metal plate (1), a special-shaped heat conduction block (6) is deposited in the inner wall of the heat conduction through hole (7), the outer side wall of the special-shaped heat conduction block (6) is attached and fixed in the inner wall of the heat conduction through hole (7), the top end of the special-shaped heat conduction block (6) is connected with the bottom surface of the electronic element (5), the bottom of the special-shaped heat conduction block (6) is provided with a circle of heat conduction ring (9), the heat conduction ring (9) is clamped and pressed in an inner clamping ring groove (8), the inner clamping ring groove (8) is arranged between the heat dissipation bottom, the bottom surface of the heat conduction ring (9) is connected and fixed with the top surface of the heat dissipation bottom metal plate (1).
2. The 5G mixed metal substrate with high heat conductivity as claimed in claim 1, wherein the shaped heat conducting block (6) is cap-shaped, and the bottom of the shaped heat conducting block (6) is provided with a groove communicating with the heat conducting through hole (7).
3. A highly thermally conductive 5G mixed metal substrate as claimed in claim 2, wherein the shaped heat-conducting block (6) is made of copper plate.
4. A highly thermally conductive 5G hybrid metal substrate according to claim 2, wherein the height of the top surface in the recess is above the top surface of the top substrate (3).
5. A highly thermally conductive 5G mixed metal substrate as claimed in claim 1, wherein the bottom substrate (2) and the top substrate (3) are made of synthetic resin made by neutralizing propylene.
6. A high thermal conductivity 5G mixed metal substrate according to claim 1, wherein the heat sink bottom metal plate (1) is made of metal aluminum plate.
7. A high thermal conductivity 5G mixed metal substrate as claimed in claim 1, wherein the bottom of the heat sink bottom metal plate (1) is provided with a plurality of rows of grooves for heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921834509.0U CN211128377U (en) | 2019-10-29 | 2019-10-29 | High-thermal-conductivity 5G mixed metal substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921834509.0U CN211128377U (en) | 2019-10-29 | 2019-10-29 | High-thermal-conductivity 5G mixed metal substrate |
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| CN211128377U true CN211128377U (en) | 2020-07-28 |
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| CN201921834509.0U Active CN211128377U (en) | 2019-10-29 | 2019-10-29 | High-thermal-conductivity 5G mixed metal substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672490A (en) * | 2020-12-01 | 2021-04-16 | 吉安满坤科技股份有限公司 | Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof |
-
2019
- 2019-10-29 CN CN201921834509.0U patent/CN211128377U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672490A (en) * | 2020-12-01 | 2021-04-16 | 吉安满坤科技股份有限公司 | Preparation method of multilayer circuit board for 5G terminal network card and 5G network card thereof |
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