CN216391897U - Integrated double-sided heat dissipation structure and electrical module device - Google Patents

Abstract

The utility model relates to the technical field of electronic equipment, in particular to an integrated double-sided heat dissipation structure and an electrical module device. The two opposite sides of the integrated double-sided heat dissipation structure are provided with heat dissipation structures, the integrated double-sided heat dissipation structure is arranged between at least two electric appliance modules, and at least one heat dissipation structure is in contact with a heating device of the electric appliance module. The heat dissipation structure arranged on the two opposite sides of the integrated double-sided heat dissipation structure can realize heat dissipation of a plurality of electrical appliance modules. That is to say, only need adopt single two-sided heat radiation structure of integration, just can realize the heat dissipation of the device that generates heat of a plurality of electrical apparatus modules, reduced the number of radiator, be favorable to reduce cost.

Description

Integrated double-sided heat dissipation structure and electrical module device

Technical Field

The utility model relates to the technical field of electronic equipment, in particular to an integrated double-sided heat dissipation structure and an electrical module device.

Background

With the development of the electronic technology in China, more and more electronic devices have been widely used.

In electronic equipment, a large number of components such as a motherboard, a CPU, a chip, a memory, a power module, a resistor, a capacitor, and the like are generally used, and all of these components generate heat when a circuit operates, and the heat generated by some components is significant, for example, some chips. For this reason, a separate heat sink is generally required on the motherboard to dissipate heat from the portion of the chip.

At present, a single isolated radiator or an integrated single-side radiating structure is adopted, and only one single plate is used for radiating, so that a plurality of radiators are required to be used in the structure with the electric appliance module, and the cost is increased.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an integrated double-sided heat dissipation structure, and aims to provide an integrated double-sided heat dissipation structure which can dissipate heat of heating devices on a plurality of electrical appliance modules simultaneously, so that the number of used radiators is reduced, and the cost is reduced.

In order to achieve the above purpose, the present invention provides an integrated double-sided heat dissipation structure, wherein heat dissipation structures are disposed on two opposite sides of the integrated double-sided heat dissipation structure, the integrated double-sided heat dissipation structure is disposed between at least two electrical modules, and at least one heat dissipation structure is in contact with a heat generating device of the electrical module.

Optionally, two opposite surfaces of the integrated double-sided heat dissipation structure are defined as a first surface and a second surface, and at least one heat dissipation boss is arranged on any one of the first surface and the second surface and forms the heat dissipation structure;

at least one of the first surface, the second surface and the heat dissipation boss is used for contacting a heat generating device on the electrical appliance module.

Optionally, the heat dissipation bosses are made on the first surface and the second surface in an embossing manner;

the integrated double-sided heat dissipation structure is an integrated structure.

Optionally, the heat dissipation boss arranged on the first surface is defined as a first heat dissipation boss, and the heat dissipation boss arranged on the second surface is defined as a second heat dissipation boss;

the first heat dissipation boss protrudes from the first surface to be in contact with the heating device, and the second heat dissipation boss protrudes from the second surface to be in contact with the heating device, so that the first surface and the second surface are located in the center between the at least two electric appliance modules.

Optionally, the number of the first heat dissipation bosses is not equal to that of the second heat dissipation bosses;

and defining the height of the first heat dissipation boss from the first surface as a first height, and defining the height of the second heat dissipation boss from the second surface as a second height, wherein the first height is not equal to the second height.

Optionally, the number of the first heat dissipation bosses is equal to that of the second heat dissipation bosses;

and defining the height of the first heat dissipation boss from the first surface as a first height, and defining the height of the second heat dissipation boss from the second surface as a second height, wherein the first height is not equal to the second height.

Optionally, at least one of the first heat dissipation boss and the second heat dissipation boss is provided with an avoidance groove;

the avoidance groove arranged on the first heat dissipation boss is defined as a first avoidance groove, the avoidance groove arranged on the second heat dissipation boss is defined as a second avoidance groove, and the first avoidance groove and the second avoidance groove are in a trapezoidal structure;

the first avoidance groove is used for accommodating the heating device protruding from the second surface, and the second avoidance groove is used for accommodating the heating device protruding from the first surface.

Optionally, the integrated double-sided heat dissipation structure is made of a heat conduction material;

and the first surface and/or the second surface of the integrated double-sided heat dissipation structure are/is provided with a heat dissipation layer.

Optionally, the heat dissipation layer is made of a graphite sheet, a graphene sheet, or a heat conducting gel, and the integrated double-sided heat dissipation structure is made of a metal material.

The utility model further provides an electrical module device which comprises an integrated double-sided heat dissipation structure.

According to the technical scheme, the integrated double-sided heat dissipation structure is arranged, so that heat dissipation points on the plurality of electrical appliance modules are dissipated. The integrated double-sided heat dissipation structure is arranged between the at least two electric appliance modules, and at least one heat dissipation structure is in contact with the heating device of the electric appliance modules. The heat dissipation structure arranged on the two opposite sides of the integrated double-sided heat dissipation structure can realize heat dissipation of a plurality of electrical appliance modules. That is to say, only need adopt single two-sided heat radiation structure of integration, just can realize the heat dissipation of the device that generates heat of a plurality of electrical apparatus modules, reduced the number of radiator, be favorable to reduce cost.

Wherein the heat dissipation point is formed by heat generated by a heating device on the electrical module. Furthermore, two opposite surfaces of the integrated double-sided heat dissipation structure are defined as a first surface and a second surface, the first surface and the second surface face the electrical appliance module, and at least one heat dissipation boss is arranged on any one of the first surface and the second surface and used for forming the heat dissipation structure. At least one of the first surface, the second surface and the heat dissipation boss is used for contacting a heat dissipation point on the electrical module. Because the device size that generates heat on the electrical apparatus module is not of uniform size, some device that generates heat probably are far away from first surface or second surface distance, be difficult to direct contact to first surface or second surface, then reduce the distance between device and first surface or the second surface that generates heat through setting up the heat dissipation boss, make the device that generates heat can direct contact to first surface or second surface, be used for the heat transfer that will generate heat the device and give off through first surface or second surface distributes away, improve electrical apparatus module's radiating efficiency. Meanwhile, the heat dissipation of a plurality of heating devices on the electric appliance module can be realized only by adopting a single integrated double-sided heat dissipation structure, so that the number of radiators is reduced, and the cost is reduced.

And, through setting up the different height of heat dissipation boss for the effective contact of heat dissipation boss generates heat the device, be convenient for with the first surface of two-sided heat radiation structure of integration with the second surface sets up the central point between at least two electrical apparatus modules and puts, so, thereby guarantees heat dissipation and soaking effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of an integrated double-sided heat dissipation structure according to the present invention;

fig. 2 is a schematic structural view of the integrated double-sided heat dissipation structure in fig. 1;

fig. 3 is a schematic structural diagram of another embodiment of a heat sink.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The present invention provides an integrated double-sided heat dissipation structure 100, and fig. 1 and fig. 2 are schematic structural views of an embodiment.

Fig. 3 is a schematic structural diagram of a heat sink of an original design of the present application, which has the following drawbacks.

Because a plurality of electrical appliance modules 30 are needed in the electronic device, the electrical appliance modules 30 generate heat in the working process, so that the temperature of the whole electronic device is increased, if the heat cannot be effectively dissipated, the service life of the electronic device is influenced, and the bad phenomenon of scrapping is seriously caused. Based on this, heat dissipation of the appliance module 30 is crucial. In fig. 3, a heat sink is shown, which is a stand alone heat sink 50, one stand alone heat sink 50 being able to dissipate heat only for one heat generating device 31 on the electrical module 30. Therefore, the isolated heat sinks 50 need to be arranged on a plurality of heating devices 31 on one electric appliance module 30, the number of the heat sinks is greatly increased, and the cost is increased. Moreover, each isolated heat sink 50 needs to be individually fixed to be in fixed contact with the heat generating device 31, and the number of the isolated heat sinks 50 is so large that the work efficiency is greatly reduced by the fixing work. Therefore, the heat dissipation of the electrical module 30 in the manner of fig. 3 is high in cost and workload.

In view of the above problems, the present application proposes a solution, and fig. 1 and 2 are schematic structural diagrams of an embodiment of the solution. The integrated double-sided heat dissipation structure 100 is used for heat dissipation of the electrical module 30, heat dissipation structures are arranged on two opposite sides of the integrated double-sided heat dissipation structure 100, the integrated double-sided heat dissipation structure 100 is arranged between at least two electrical modules 30, and at least one heat dissipation structure is in contact with the heating device 31 of the electrical module 30. So that the heat dissipation of the plurality of electrical modules 30 can be realized by the heat dissipation structure provided on the opposite sides of the integrated double-sided heat dissipation structure 100. That is, only by adopting the single integrated double-sided heat dissipation structure 100, the heat dissipation of the heat generating devices 31 of the plurality of electrical appliance modules 30 can be realized, the number of heat sinks is reduced, and the cost is reduced.

Further, the two opposite surfaces of the integrated double-sided heat dissipation structure 100 are defined as a first surface 11 and a second surface 13, that is, the integrated double-sided heat dissipation structure 100 is provided with the first surface 11 and the second surface 13 which are opposite to each other, and at least one heat dissipation boss is provided on any one of the first surface 11 and the second surface 13, wherein the first surface 11 and the second surface 13 do not include a surface formed by the heat dissipation boss, that is, do not include a slope portion where the boss is connected to the boss, and the heat dissipation boss is used to form the heat dissipation structure. At least one of the first surface 11, the second surface 13 and the heat dissipation boss is used for contacting the heat generating device 31 on the electrical module 30.

By arranging the integrated double-sided heat dissipation structure 100, heat dissipation of a plurality of heat dissipation points on the electrical module 30 is realized. Wherein the heat dissipation point is formed by heat generated by the heat generating device 31 on the appliance module 30. The integrated double-sided heat dissipation structure 100 is provided with a first surface 11 and a second surface 13 which are opposite to each other, the first surface 11 and the second surface 13 face the electrical module 30, so that both sides of the integrated double-sided heat dissipation structure 100 can dissipate heat, any one of the first surface 11 and the second surface 13 is provided with at least one heat dissipation boss, the heat dissipation bosses are used for contacting with the heat-generating devices 31, that is, the first surface 11 and the second surface 13 are provided with the heat dissipation bosses, at least one heat dissipation boss is arranged on the first surface 11, at least one heat dissipation boss is arranged on the second surface 13, the heat-generating devices 31 on both sides of the first surface 11 and the second surface 13 are adapted to contact with the integrated double-sided heat dissipation structure 100, and heat dissipation is facilitated. At least one of the first surface 11, the second surface 13, and the heat dissipation boss is used to contact a heat dissipation point on the electrical module, that is, the first surface 11 contacts the heat generating device 31, the second surface 13 contacts the heat generating device 31, the heat dissipation boss contacts the heat generating device 31, or the three contact the heat generating device 31 at the same time, and can be selected arbitrarily to select a suitable heat dissipation point as required.

Because the sizes of the heat generating devices 31 on the electrical module 30 are different, some heat generating devices 31 may be far away from the first surface 11 or the second surface 13, and are difficult to directly contact with the first surface 11 or the second surface 13, the distance between the heat generating devices 31 and the first surface 11 or the second surface 13 is reduced by arranging the heat dissipation bosses, so that the heat generating devices 31 can directly contact with the first surface 11 or the second surface 13, the heat generated by the heat generating devices 31 is transferred to the outside through the first surface 11 or the second surface 13, and the heat dissipation efficiency of the electrical module 30 is improved. Meanwhile, the heat dissipation of the plurality of heating devices 31 on the electrical module 30 can be realized only by adopting the single integrated double-sided heat dissipation structure 100, so that the number of radiators is reduced, and the cost is reduced. Moreover, the single integrated double-sided heat dissipation structure 100 replaces a plurality of isolated heat sinks 50, and the workload is reduced during installation. And because the electrical module 30 is a device with compact structural arrangement, the single integrated double-sided heat dissipation structure 100 has few fixing points, does not occupy too much fixing and mounting space of the electrical module 30, is beneficial to arranging the integrated double-sided heat dissipation structure 100 on the electrical module 30, and is beneficial to improving the universality of the integrated double-sided heat dissipation structure 100.

Further, the heat dissipation bosses are embossed on the first surface 11 and the second surface 13. It can be understood that the stamping process is to stamp and stretch the plate on the initial flat plate, so as to form the heat dissipation boss, and the operation process of the stamping process is simple and convenient, which is beneficial to reducing the manufacturing cost of the integrated double-sided heat dissipation structure 100. Meanwhile, the integrated double-sided heat dissipation structure 100 is an integrated structure, so that the integrated double-sided heat dissipation structure is convenient to produce and process, and can be installed in the actual heat dissipation process.

Further, a heat dissipation boss arranged on the first surface 11 is defined as a first heat dissipation boss 111, and a heat dissipation boss arranged on the second surface 13 is defined as a second heat dissipation boss 131;

the first heat dissipation projection 111 protrudes from the first surface 11 to contact the heat generating device 31, and the second heat dissipation projection 131 protrudes from the second surface 13 to contact the heat generating device 31, so that the first surface 11 and the second surface 13 are located at a central position between at least two electrical modules 30. For example, in one embodiment, the integrated double-sided heat dissipation structure 100 is disposed between two PCBs, and the first surface 11 and the second surface 13 of the integrated double-sided heat dissipation structure 100 are disposed at an intermediate position between parallel planes of the two PCBs, such that the integrated double-sided heat dissipation structure 100 is disposed at a central position between the two electrical modules 30.

In order to avoid uneven heat dissipation due to unequal distances between the integrated double-sided heat dissipation structure 100 and the electrical modules 30 on the two sides of the integrated double-sided heat dissipation structure, one side of the integrated double-sided heat dissipation structure may have an excessively high temperature. To solve this problem, the first surface 11 and the second surface 13 of the integrated double-sided heat dissipation structure 100 are disposed at a central position between at least two electrical modules 30.

Particularly, through setting up the different heights of heat dissipation boss for the effective contact of heat dissipation boss generates heat the device, be convenient for with the first surface 11 of the two-sided heat radiation structure 100 of integration with second surface 13 sets up the central point between at least two electrical apparatus modules 30 and puts, so, thereby guarantees heat dissipation and soaking effect.

As shown in fig. 1, a first heat dissipating protrusion 111 is disposed on the first surface 11, a second heat dissipating protrusion 131 is disposed on the second surface 13, and the first heat dissipating protrusion 111 and the second heat dissipating protrusion 131 are used for contacting the heat generating device 31 of the electrical module 30. That is to say, the first heat dissipating bosses 111 and the second heat dissipating bosses 131 are both used for contacting the heat generating devices 31 on the electrical module 30, so that when the heat generating devices 31 face the first surface 11 and the second surface 13, the first surface 11 and the second surface 13 can simultaneously and effectively dissipate heat of the plurality of heat generating devices 31.

When the integrated double-sided heat dissipation structure 100 is used for dissipating heat of two electrical modules 30, the integrated double-sided heat dissipation structure 100 is disposed between the two electrical modules 30, since the first surface 11 and the second surface 13 are both provided with heat dissipation bosses, the first heat dissipation boss 111 can contact the electrical module 30 on one side of the integrated double-sided heat dissipation structure 100, the second heat dissipation boss 131 can contact the electrical module 30 on the other side of the integrated double-sided heat dissipation structure 100, and the heat generating devices 31 on the electrical modules 30 on both sides can contact the integrated double-sided heat dissipation structure 100 through the arrangement of the heat dissipation bosses on both sides of the integrated double-sided heat dissipation structure 100, so as to dissipate heat of two electrical modules 30 by one integrated double-sided heat dissipation structure 100, thereby facilitating the arrangement of the electrical modules 30 with compact structure and the integrated double-sided heat dissipation structure 100, and ensuring that the heat capacity of the heat dissipater is not changed, the distance between the electric appliance modules 30 can be made closer, and the miniaturization requirement of electronic device products is supported.

Meanwhile, because the integrated double-sided heat dissipation structure 100 has a simple structure and is easy to form an automatic assembly scheme, the integrated double-sided heat dissipation structure 100 is automatically installed by a machine device and is fixedly installed between the two electrical appliance modules 30. The manual operation intensity is reduced.

Further, the number of the first heat dissipation bosses 111 is not equal to that of the second heat dissipation bosses 131. As shown in fig. 2, the number of the first heat dissipating bosses 111 is not equal to that of the second heat dissipating bosses 131, so that the integrated double-sided heat dissipating structure 100 can effectively adapt to a situation that more heat generating devices 31 are arranged on one side and fewer heat generating devices 31 are arranged on the other side, and the space is reasonably utilized, so that the structure of the integrated double-sided heat dissipating structure 100 can be reasonably utilized. The height of the first heat dissipation projection 111 from the first surface 11 is defined as a first height, and the height of the second heat dissipation projection 131 from the second surface 13 is defined as a second height, and the first height and the second height are not equal. As shown in fig. 2, the first height is not equal to the second height, so as to adapt to the scene that the distances between different heat generating devices 31 and the integrated double-sided heat dissipating structure 100 are different. The heat generating device 31 is effectively contacted with the integrated double-sided heat dissipation structure 100 to dissipate heat. Thereby realizing that the integrated double-sided heat dissipation structure 100 is disposed at a central position between at least two electrical appliance modules 30, and thus, heat dissipation and heat soaking effects are ensured.

Further, in another embodiment, the number of the first heat dissipation bosses 111 is equal to that of the second heat dissipation bosses 131. The application scene that the number of the heating devices 31 on the two sides of the integrated double-sided heat dissipation structure 100 is the same is met, and the structure of the integrated double-sided heat dissipation structure 100 can be reasonably utilized.

Further, in another embodiment, the height of the first heat dissipation projection 111 from the first surface 11 is defined as a first height, and the height of the second heat dissipation projection 131 from the second surface 13 is defined as a second height, and the first height and the second height are equal. The application scene when the distance between the heating device 31 and the two sides of the integrated double-sided heat dissipation structure 100 is equal is provided, the universality of the application of the integrated double-sided heat dissipation structure 100 is improved, and the application scene can be selected according to specific requirements in practical application. Thereby realizing that the integrated double-sided heat dissipation structure 100 is disposed at a central position between at least two electrical appliance modules 30, and thus, heat dissipation and heat soaking effects are ensured.

Further, as shown in fig. 2, at least one of the first heat dissipation boss 111 and the second heat dissipation boss 131 is provided with an escape groove. That is to say, when the size of the heat generating device 31 exceeds the first surface 11 or the second surface 13, in order to avoid the interference of the integrated double-sided heat dissipation structure 100 to the heat generating device 31, the interference problem is effectively solved by accommodating the heat generating device 31 in the avoiding groove.

Further, as shown in fig. 2, the avoidance groove disposed on the first heat dissipation boss 111 is defined as a first avoidance groove 113, the avoidance groove disposed on the second heat dissipation boss 131 is defined as a second avoidance groove 133, and the first avoidance groove 113 and the second avoidance groove 133 are in a trapezoidal structure.

It can be understood that the first surface 11 is provided with a second avoiding groove 133 recessed toward the second surface 13, and the second avoiding groove 133 protrudes from the second surface 13 to form the second heat dissipating projection 131. The second surface 13 is provided with a first avoiding groove 113 recessed towards the first surface 11, and the first avoiding groove 113 protrudes from the first surface 11 to form a first heat dissipation boss 111.

In this way, although the first heat dissipation boss 111 is formed on the first surface 11 and the first heat dissipation boss 111 is formed on the second surface 13, due to the arrangement of the first avoiding groove 113 and the second avoiding groove 133 and the arrangement of the first avoiding groove and the second avoiding groove as a trapezoid structure, under the condition of the same height, since the inclined side of the trapezoid structure is helpful to form a larger contact area than the vertical side of the square structure, the thickness formed by the first heat dissipation boss 111 and the first heat dissipation boss 111 is smaller, and a larger contact area is formed with air, which is beneficial to heat dissipation.

Further, the first avoiding groove 113 is used for accommodating the heat generating device 31 protruding from the second surface 13, and the second avoiding groove 133 is used for accommodating the heat generating device 31 protruding from the first surface 11. Since the heat generating devices 31 on both sides of the first surface 11 and the second surface 13 may exceed the first surface 11 and the second surface 13 due to the height dimension being larger than the distance between the electrical module 30 and the first surface 11 or the second surface 13, in order to solve this problem, the heat generating devices 31 having the height dimension exceeding the first surface 11 and the second surface 13 are accommodated by the avoidance grooves formed on the first surface 11 and the second surface 13.

Further, the groove bottoms of the first avoidance groove 113 and the second avoidance groove 133 can be parallel to the first surface 11 or the second surface 13, so that when the first avoidance groove 113 and the second avoidance groove 133 contact the heating device 31, the parallel groove bottoms are beneficial to being attached and contacted with the heating device 31, the contact area is increased, and the rapid heat dissipation of the heating device 31 is facilitated.

Further, as shown in fig. 2, the first avoidance groove 113 and the second avoidance groove 133 have different sizes, so that the heat generating device 31 adaptable to different sizes is accommodated in a suitable avoidance groove.

Further, at least one of the first surface 11, the second surface 13, the first avoidance groove 113, the first heat dissipation projection 111, the second avoidance groove 133, and the second heat dissipation projection 131 contacts the heat generating device 31.

Because the size of the heating device 31 disposed on the electrical module 30 may be different, the first surface 11, the second surface 13, the first avoiding groove 113, the first heat dissipating boss 111, the second avoiding groove 133, and the second heat dissipating boss 131 can all contact the heating device 31 on the electrical module 30, so that the integrated double-sided heat dissipating structure 100 can effectively contact the heating device 31 as a whole, the first heat dissipating boss 111 and the second heat dissipating boss 131 protrude outwards from the first surface 11 and the second surface 13, the distance between the first heat dissipating boss and the heating device 31 can be reduced, and the heating device 31 far away from the integrated double-sided heat dissipating structure 100 can contact the integrated double-sided heat dissipating structure 100. Meanwhile, the first avoidance groove 113 and the second avoidance groove 133 can form an avoidance space, when the size of the heating device 31 exceeds the plane of the integrated double-sided heat dissipation structure 100, the heating device 31 can be accommodated in the first avoidance groove 113 and the second avoidance groove 133 to form avoidance, so that the integrated double-sided heat dissipation structure 100 is effectively installed and arranged, and interference on the whole structure of the electrical module 30 is avoided.

Further, the first avoidance groove 113 and the second avoidance groove 133 are embossed grooves formed by embossing the first surface 11 and the second surface 13.

The stamping is to place the integrated double-sided heat dissipation structure 100 of the plate between the upper die and the lower die, and the thickness of the material is changed under the action of pressure, so that the material structure is deformed. By adopting the stamping method, a plurality of first avoidance grooves 113 and second avoidance grooves 133 can be stamped on a whole plate, so that the integrated double-sided heat dissipation structure 100 is integrally formed. In addition, the depths of the first avoiding groove 113 and the second avoiding groove 133 can be determined as required to adapt to the contact with the heat generating device 31 on the electrical module 30. And the processing method of the stamping is simple and the processing cost is low.

Further, the material of the integrated double-sided heat dissipation structure 100 is a heat conductive material, so that heat can be quickly dissipated in the heat conduction process. The first surface 11 and/or the second surface 13 of the integrated double-sided heat dissipation structure 100 are provided with heat dissipation layers. In order to improve the heat dissipation efficiency, a heat dissipation layer may be disposed on the first surface 11 and/or the second surface 13 of the integrated double-sided heat dissipation structure 100.

Further, the heat dissipation layer is made of a graphite sheet, a graphene sheet, or a heat conductive gel, and the integrated double-sided heat dissipation structure 100 is made of a metal material.

The material of the heat dissipation layer is a graphite sheet, or a graphene sheet, or heat conduction gel. The materials have good heat-conducting property, can accelerate the diffusion rate of heat and improve the heat dissipation efficiency. Further, the integrated double-sided heat dissipation structure 100 is made of a metal material. The metal has good thermal conductivity, and the metal is favorable for heat dissipation.

Further, the present application also provides an electrical module device, which includes an integrated double-sided heat dissipation structure 100. Since the electrical module device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.

The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the specification and the drawings, or any other related technical fields directly/indirectly using the inventive concept are included in the scope of the present invention.

Claims (10)

1. The utility model provides an integration double-sided heat radiation structure for the heat dissipation of electrical apparatus module, its characterized in that, the relative both sides of integration double-sided heat radiation structure all are equipped with heat radiation structure, integration double-sided heat radiation structure locates between at least two electrical apparatus modules (30), at least one heat radiation structure with the device (31) that generates heat of electrical apparatus module (30) contact.

2. The integrated double-sided heat dissipation structure of claim 1, wherein the opposite sides of the integrated double-sided heat dissipation structure are defined as a first surface (11) and a second surface (13), and at least one heat dissipation boss is arranged on any one of the first surface (11) and the second surface (13) and forms the heat dissipation structure;

at least one of the first surface (11), the second surface (13) and the heat dissipation boss is used for contacting a heat generating device (31) on the electrical module (30).

3. The integrated double-sided heat dissipation structure of claim 2, wherein the heat dissipation bosses are made in an embossed manner on the first surface (11) and the second surface (13);

the integrated double-sided heat dissipation structure is an integrated structure.

4. The integrated double-sided heat dissipation structure of claim 3, wherein the heat dissipation boss disposed on the first surface (11) is defined as a first heat dissipation boss (111), and the heat dissipation boss disposed on the second surface (13) is defined as a second heat dissipation boss (131);

the first heat dissipation boss (111) protrudes from the first surface (11) to contact the heat generating device (31), and the second heat dissipation boss (131) protrudes from the second surface (13) to contact the heat generating device (31), so that the first surface (11) and the second surface (13) are located at a central position between the at least two electric appliance modules (30).

5. The integrated double-sided heat dissipation structure of claim 4, wherein the number of the first heat dissipation bosses (111) is not equal to that of the second heat dissipation bosses (131);

the height of the first heat dissipation boss (111) from the first surface (11) is defined as a first height, the height of the second heat dissipation boss (131) from the second surface (13) is defined as a second height, and the first height and the second height are not equal.

6. The integrated double-sided heat dissipation structure of claim 4, wherein the number of the first heat dissipation bosses (111) is equal to the number of the second heat dissipation bosses (131);

the height of the first heat dissipation boss (111) from the first surface (11) is defined as a first height, the height of the second heat dissipation boss (131) from the second surface (13) is defined as a second height, and the first height and the second height are not equal.

7. The integrated double-sided heat dissipation structure of claim 4, wherein at least one of the first heat dissipation boss (111) and the second heat dissipation boss (131) is provided with an avoidance groove;

an avoidance groove arranged on the first heat dissipation boss (111) is defined as a first avoidance groove (113), an avoidance groove arranged on the second heat dissipation boss (131) is defined as a second avoidance groove (133), and the first avoidance groove (113) and the second avoidance groove (133) are in a trapezoidal structure;

the first avoidance groove (113) is used for accommodating the heat generating device (31) which is convexly arranged on the second surface (13), and the second avoidance groove (133) is used for accommodating the heat generating device (31) which is convexly arranged on the first surface (11).

8. The integrated double-sided heat dissipation structure of any one of claims 1 to 7, wherein the integrated double-sided heat dissipation structure is made of a heat conductive material;

and the first surface (11) and/or the second surface (13) of the integrated double-sided heat dissipation structure are/is provided with a heat dissipation layer.

9. The integrated double-sided heat dissipation structure of claim 8, wherein the heat dissipation layer is made of a graphite sheet, a graphene sheet, or a heat conductive gel, and the integrated double-sided heat dissipation structure is made of a metal material.

10. An electrical modular device, characterized in that it comprises an integrated double-sided heat dissipation structure according to any one of claims 1 to 9.

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