CN218920813U - Heat abstractor for be used for circuit board electrical component - Google Patents

Abstract

The utility model discloses a heat dissipation device for an electrical component of a circuit board. Wherein the device includes: a heat conductive plate, a heat conductive medium, and a fixing member; the heat conducting plate is fixedly connected with the circuit board; the heat conducting plate comprises a plurality of heat conducting surfaces with different heights, the heat conducting surfaces with different heights are contacted with the surfaces of the high-heat-consumption electric elements with different heights through the heat conducting medium, and the surfaces of the heat conducting plate are contacted with the shell through the heat conducting medium, so that heat of the high-heat-consumption electric elements is conducted to the shell through the heat conducting medium. According to the utility model, the heat conducting plates are correspondingly arranged to be the special-shaped heat conducting plates with different heights according to different heights of the electrical elements, so that the utilization rate of the heat radiating device is improved.

Description

Heat abstractor for be used for circuit board electrical component

Technical Field

The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device for an electrical component of a circuit board.

Background

When the circuit board works, the electric elements on the circuit board can continuously generate heat, so that the internal temperature of the equipment is rapidly increased, and if the heat is not timely discharged, the equipment is continuously heated, so that the performance of the equipment is reduced and even the electric elements are invalid.

At present, heat dissipation of a circuit board mainly comprises natural cooling and forced air cooling. The self-heating cooling structure is simple, but the heat dissipation efficiency is low, and the self-heating cooling structure is suitable for equipment with small heat productivity; forced air cooling radiating efficiency is high, but the cost of parts such as fans, mounting brackets and the like is required to be increased, and meanwhile, the structural design difficulty of the internal space of the equipment is also increased.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides the heat dissipation device for the electric element of the circuit board, and compared with a natural cooling mode, the heat dissipation device provided by the utility model has the advantage that the heat dissipation efficiency is remarkably improved; compared with a forced air cooling mode, the air cooling device has the advantages of being capable of reducing structural complexity and expenditure cost, efficient, reliable and low in cost.

The utility model provides a heat dissipating device for electric elements of a circuit board, which comprises a heat conducting plate and a heat conducting medium;

the heat conducting plate is fixedly connected with the circuit board;

the heat conducting plate comprises a plurality of heat conducting surfaces with different heights, and the heat conducting surfaces with different heights are in contact with the surfaces of the plurality of high-heat-consumption electric elements with different heights through the heat conducting medium, so that heat of the high-heat-consumption electric elements is dissipated to the external environment through the heat conducting plate.

Optionally, the device further comprises a housing;

the surface of the heat conducting plate is contacted with the shell through the heat conducting medium, so that heat of the high-heat-consumption electric element is conducted to the shell through the heat conducting medium to dissipate heat.

Optionally, the apparatus further comprises: and the heat conducting plate is fixedly connected with the circuit board through the fixing piece.

Optionally, the fixing piece is a support column or a fastening bolt.

Optionally, the plurality of thermally conductive surfaces of different heights includes: the heat conduction main board, the first heat conduction board and the second heat conduction board;

the heat conduction main board is contacted with the high heat consumption electric element with the corresponding height through the heat conduction medium;

the first heat conducting plate is L-shaped and is arranged on the side edge of the heat conducting main board, and is contacted with the high-heat-consumption electric element with the corresponding height through the heat conducting medium; the second heat conducting plate is arranged at a certain height above the heat conducting main plate and is contacted with the shell through the heat conducting medium.

The utility model has the beneficial effects that:

the utility model provides a new circuit board heat dissipation scheme, which can meet the heat dissipation requirements of electronic components with different heights by correspondingly arranging the heat conduction plates into the special-shaped heat conduction plates with different heights according to different heights of the electric components, and improves the utilization rate of the heat dissipation device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments of the present utility model, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the contents of the embodiments of the present utility model and these drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic structural diagram of a heat dissipating device for an electrical component of a circuit board according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of a heat conducting plate according to an embodiment of the present utility model;

1-a heat-conducting plate; 2-fixing parts; 3-a heat conducting medium; 4-high heat consumption electronic components; 5-a housing; 11-a heat conduction main board; 12-a first heat-conducting plate; 13-a second heat-conducting plate.

Detailed Description

In order to make the technical problems solved by the present utility model, the technical solutions adopted and the technical effects achieved more clear, the technical solutions of the embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

Referring to fig. 1 and 2, an embodiment of the present utility model provides a heat dissipating device for an electrical component of a circuit board, including: a heat conducting plate 1, a fixing member 2, a heat conducting medium 3 and a shell 5.

The heat conducting plate 1 is fixedly connected with the circuit board, and specifically, the heat conducting plate 1 can be fixedly connected with the circuit board through the fixing piece 2. The fixing member 2 in this embodiment may be a member such as a support column or a fastening bolt, or may be an adhesive member for fixing the heat conductive plate 1 to the circuit board. Furthermore, a gap between the heat-conducting plate 1 and the electrical element can be defined by the fixing member 2.

As an alternative embodiment, the heat conducting plate 1 includes a plurality of heat conducting surfaces with different heights, and the plurality of heat conducting surfaces with different heights are contacted with the surfaces of the plurality of high heat consumption electric elements 4 corresponding to the heat conducting medium 3, so that heat in the high heat consumption electric elements 4 is conducted to the heat conducting plate 1, and dissipated to the environment through the surface of the heat conducting plate 1, so as to improve the heat dissipation capability of the system.

As another alternative embodiment, the heat conducting plate 1 may also contact with the corresponding housing 5 through the heat conducting medium 3, specifically, the special-shaped surface on the heat conducting plate 1 contacts with the housing 5 through the heat conducting medium 3, so as to conduct the heat of the electrical element 4 with high heat consumption to the housing 5, and the housing 5 emits into the environment through its own surface, thereby greatly improving the heat dissipation capability of the system.

In this embodiment, the heat of the high-heat-consumption electrical component 4 is conducted to the heat conducting plate 1 through the heat conducting medium 3, the heat conducting plate 1 conducts the heat to the housing 5 through the heat conducting medium 3, and finally the heat is dissipated to the external environment through the housing 5, so as to dissipate the heat of the high-heat-consumption electrical component. Because of the different heights of the high heat consumption electrical components 4 in the circuit board, the heat conducting plate 1 in the embodiment is processed into a plurality of planes with different heights through bending, deep drawing, welding and other processes.

As an alternative implementation, the plurality of heat conducting surfaces of different heights in this embodiment may include: a heat conductive main plate 11, a first heat conductive plate 12 and a second heat conductive plate 13. The heat conducting main board is fixedly connected with the circuit board through the fixing piece 2, and is contacted with the high heat consumption electric element 4 with the corresponding height through the heat conducting medium 3. The first heat conducting plate 12 is L-shaped, and is disposed at a side of the heat conducting main board 11, and is used for contacting with an electrical element with a lower height through the heat conducting medium 3; the second heat conducting plate 13 is disposed at a certain height above the heat conducting main plate 11 for contact with the housing 5 through the heat conducting medium 3.

The arrangement of the heat conducting plate is only an example, and the shape and the position of the heat conducting plate can be correspondingly arranged according to different application scenes so as to meet the heat dissipation requirements of different circuit board electric elements.

Further, the heat conducting plate in the application is made of metal materials such as steel, aluminum alloy or copper with higher heat conductivity coefficient, and the heat conducting medium in the application comprises materials such as heat conducting silica gel pad, heat conducting silicone grease and heat conducting glue.

Note that the above is only a preferred embodiment of the present utility model and the technical principle applied. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, while the utility model has been described in connection with the above embodiments, the utility model is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the utility model, which is set forth in the following claims.

Claims (4)

1. The heat dissipating device for the electric element of the circuit board is characterized by comprising a heat conducting plate, a heat conducting medium and a fixing piece;

the heat conducting plate is fixedly connected with the circuit board through the fixing piece;

the heat conducting plate comprises a plurality of heat conducting surfaces with different heights, and the heat conducting surfaces with different heights are in contact with the surfaces of the plurality of high-heat-consumption electric elements with different heights through the heat conducting medium, so that heat of the high-heat-consumption electric elements is dissipated to the external environment through the heat conducting plate.

2. The apparatus of claim 1, wherein the apparatus further comprises: a housing;

the surface of the heat conducting plate is contacted with the shell through the heat conducting medium, so that heat of the high-heat-consumption electric element is conducted to the shell through the heat conducting medium to dissipate heat.

3. The device of claim 1, wherein the securing member is a support post or a fastening bolt.

4. The apparatus of claim 2, wherein the plurality of thermally conductive surfaces of different heights comprises: the heat conduction main board, the first heat conduction board and the second heat conduction board;

the heat conduction main board is contacted with the high heat consumption electric element with the corresponding height through the heat conduction medium;

the first heat conducting plate is L-shaped and is arranged on the side edge of the heat conducting main board, and is contacted with the high-heat-consumption electric element with the corresponding height through the heat conducting medium; the second heat conducting plate is arranged at a certain height above the heat conducting main plate and is contacted with the shell through the heat conducting medium.

Images