CN216087354U - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN216087354U CN216087354U CN202121594692.9U CN202121594692U CN216087354U CN 216087354 U CN216087354 U CN 216087354U CN 202121594692 U CN202121594692 U CN 202121594692U CN 216087354 U CN216087354 U CN 216087354U
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- China
- Prior art keywords
- honeycomb structure
- heat sink
- substrate
- heat
- honeycomb
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Abstract
The utility model discloses a radiator, which comprises a substrate and a honeycomb structure vertically fixed on the substrate; the honeycomb structure is provided with a plurality of circulation channels, and the circulation channels transversely penetrate through the honeycomb structure. The radiator adopts the honeycomb structure to radiate heat, the heat radiating space of the honeycomb structure is large, and the heat radiating efficiency is high; and still be equipped with the circulation passageway on the honeycomb for coolant liquid or cooling gas can be followed the honeycomb and transversely circulated, have further improved the radiating efficiency of radiator.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat radiator.
Background
The equipment can produce heat in the operation process, and in order not to influence the normal operation of the equipment, a heat radiator is usually needed to take away the heat produced in the operation process of the equipment, and generally, a heat radiator is mostly adopted. The existing radiator has a complex structure or low heat dissipation efficiency.
In general, a heat sink for a semiconductor device is formed by providing heat radiating fins on a heat conductive metal substrate, and it is difficult to further increase a heat radiating area and a heat radiating efficiency.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to provide a heat sink with simple structure and high heat dissipation efficiency, which overcomes the above-mentioned drawbacks of the prior art.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: a heat sink comprises a substrate and a honeycomb structure vertically fixed on the substrate; the honeycomb structure is provided with a plurality of circulation channels, and the circulation channels transversely penetrate through the honeycomb structure.
Further, the substrate and the honeycomb structure are both made of a metal or alloy material.
Further, the substrate and the honeycomb structure are both made of copper materials.
Further, the substrate and the honeycomb structure are made of different materials.
Furthermore, the honeycomb structure is formed by welding a plurality of corrugated plates in a pairwise buckling manner.
Furthermore, a plurality of circulation holes are formed in the corrugated plate.
Further, the corrugated plate is made by punching a metal flat plate.
Furthermore, a plurality of circulation holes are formed in the metal flat plate.
Further, the heat sink is used for heat dissipation of a semiconductor chip or a semiconductor element; and heat-conducting glue is coated between the base plate and the substrate of the semiconductor chip or the semiconductor element.
Compared with the prior art, the utility model has the advantages that:
the radiator adopts the honeycomb structure to radiate heat, the heat radiating area of the honeycomb structure is large, and the heat radiating efficiency is high; and still be equipped with the circulation passageway on the honeycomb for coolant liquid or cooling gas can transversely run through the honeycomb, have further accelerated the circulation effect of cooling fluid matter, have improved the radiating efficiency of radiator.
Drawings
FIG. 1 is a schematic view of the heat sink of the present invention;
FIG. 2 is a schematic view of one construction of the corrugated board of the present invention;
fig. 3 is a schematic view of an assembly structure of the heat spreader and the semiconductor of the present invention.
Detailed Description
The following non-limiting detailed description of the present invention is provided in connection with the preferred embodiments and accompanying drawings. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length h", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
Referring to fig. 1, a heat sink of the present invention includes a substrate 1 and a honeycomb structure 2 fixed on the substrate 1.
Be equipped with a plurality of flow channel 20 on honeycomb 2, flow channel 20 transversely runs through honeycomb 2 to coolant liquid or cooling gas can transversely run through honeycomb 2, improve the radiating efficiency of radiator.
The substrate 1 and the honeycomb structure 2 are each made of a metal or an alloy material. Preferably, the substrate 1 and the honeycomb structure 2 are made of copper material.
The honeycomb structure 2 is produced as follows:
s1, forming a plurality of circulation holes in a metal flat plate;
s2, stamping the metal flat plate into a corrugated plate shape;
s3, coating soldering paste on the buckling contact positions of the corrugated plates;
s4, buckling and welding every two corrugated plates to form the honeycomb structure 2.
Figure 2 shows a corrugated sheet construction with flow holes made from a flat sheet of metal.
Preferably, the metal honeycomb structure 2 is vertically fixed to the metal base plate 1 by welding.
Referring to fig. 3, in an embodiment of the present invention, the heat sink may be used for heat dissipation of the semiconductor a. The base plate 1 is coated with a heat conductive adhesive B on the surface opposite to the honeycomb structure 2, and the base plate 1 is connected to the substrate of the semiconductor a through the heat conductive adhesive B.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A heat sink, characterized by:
the honeycomb structure comprises a substrate and a honeycomb structure vertically fixed on the substrate;
the honeycomb structure is provided with a plurality of flow channels;
the flow channels extend transversely through the honeycomb structure.
2. The heat sink of claim 1, wherein:
the substrate and the honeycomb structure are both made of metal or alloy material.
3. The heat sink of claim 2, wherein:
the base plate and the honeycomb structure are both made of copper materials.
4. The heat sink of claim 2, wherein:
the substrate and the honeycomb structure are made of different materials.
5. The heat sink of claim 1, wherein:
the honeycomb structure is formed by welding a plurality of corrugated plates in a pairwise buckling manner.
6. The heat sink of claim 5, wherein:
the corrugated plate is provided with a plurality of circulation holes.
7. The heat sink of claim 5, wherein:
the corrugated plate is made by punching a metal flat plate.
8. The heat sink of claim 7, wherein:
the metal flat plate is provided with a plurality of circulation holes.
9. The heat sink of claim 1, wherein:
the radiator is used for radiating heat of the semiconductor chip or the semiconductor element;
and heat-conducting glue is coated between the base plate and the substrate of the semiconductor chip or the semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121594692.9U CN216087354U (en) | 2021-07-13 | 2021-07-13 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121594692.9U CN216087354U (en) | 2021-07-13 | 2021-07-13 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216087354U true CN216087354U (en) | 2022-03-18 |
Family
ID=80665211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121594692.9U Active CN216087354U (en) | 2021-07-13 | 2021-07-13 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216087354U (en) |
-
2021
- 2021-07-13 CN CN202121594692.9U patent/CN216087354U/en active Active
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