CN209298105U

CN209298105U - The air-cooled hot superconduction panel radiator of liquid-cooling combined type

Info

Publication number: CN209298105U
Application number: CN201821552725.1U
Authority: CN
Inventors: 仝爱星; 唐必洪
Original assignee: Zhejiang Karhe Technology Co Ltd
Current assignee: Zhejiang Jiaxi Technology Co.,Ltd.
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2019-08-23
Anticipated expiration: 2028-09-21

Abstract

The utility model provides a kind of hot superconduction panel radiator of air-cooled liquid-cooling combined type, comprising: hot superconductive plate is formed with interconnected sealed passage in hot superconductive plate, is filled with heat-transfer working medium in sealed passage；Liquid cooling heat radiator is formed with fluid passage positioned at the surface of hot superconductive plate in liquid cooling heat radiator, liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with fluid passage；First radiating fin is formed with the first heat dissipation channel of several parallel intervals arrangement positioned at an at least surface for hot superconductive plate in the first radiating fin；An at least fan, is located at first radiating fin one end, and the outlet air surface of fan is and perpendicular with the extending direction of the first heat dissipation channel towards the first radiating fin.The utility model has the following beneficial effects: forced heat radiation mode is flexible, heat-sinking capability significantly increases, and forced heat abstractor can be carried out using another device when any device of air-cooled or liquid cooling breaks down, do not influence heat dissipation effect, reliability with higher.

Description

The air-cooled hot superconduction panel radiator of liquid-cooling combined type

Technical field

The utility model belongs to technical field of heat transfer, more particularly to a kind of air-cooled hot superconduction plate type radiator of liquid-cooling combined type Device.

Background technique

It is modularization, integrated, lightweight, cost effective and high reliability with the fast development of power electronic technique It is required that higher and higher, the heat that power device itself generates at work is also increasing, if cannot be in time quickly by power device The heat that part generates removes, and the chip temperature that will lead in power device increases, and gently then efficiency is caused to reduce, shortened the working life, Failure that is heavy then will lead to power device and chip burn bombing.Therefore solving power device heat dissipation problem is always to perplex function Rate device encapsulates manufacturer and one of the key problem using manufacturer.In order to effectively solve the heat dissipation problem of power device, usually will Power component is fixed on the substrate of radiator, is conducted heat on the radiating fin of radiator by substrate, radiating fin Piece large contact area with air exchanges heat with stream by the way that the stream east of air is dynamic, distributes heat in ambient enviroment.It generally adopts at present It is dissipated with the aluminum profile heat radiator of free convection or forced convertion, including aluminium fin-inserted radiator, aluminium shovel gilled radiator, aluminium extruded type Hot device and aluminium welding are finned.Since the thermal coefficient of aluminium and aluminium alloy is within 220W/m.K, the fin efficiency ratio of cooling fin Lower, heat diffusivity can be poor, and power device will be evenly arranged on radiator base plate, it is therefore an objective to reduce substrate diffusion thermal resistance, improve The heat-sinking capability of radiator.With the promotion of power device performance and the increase of device heat flow density, conventional aluminium radiator is not It is able to satisfy the radiating requirements of high heat flux density high power module.

Utility model content

In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of air-cooled liquid-cooling combined types Hot superconduction panel radiator is not able to satisfy high heat flux density high power module for solving Aluminium Radiator in the prior art The problem of radiating requirements.

In order to achieve the above objects and other related objects, the utility model provides a kind of hot superconductive plate of air-cooled liquid-cooling combined type Formula radiator, the air-cooled hot superconduction panel radiator of liquid-cooling combined type include:

Hot superconductive plate is formed with interconnected sealed passage in the hot superconductive plate, is filled in the sealed passage Heat-transfer working medium；

Liquid cooling heat radiator is formed with fluid passage in the liquid cooling heat radiator positioned at the surface of the hot superconductive plate, described Liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with the fluid passage；

First radiating fin, positioned at an at least surface for the hot superconductive plate, if being formed in first radiating fin First heat dissipation channel of dry parallel interval arrangement；

An at least fan, is located at first radiating fin one end, and the outlet air surface of the fan radiates towards described first Fin, and it is perpendicular with the extending direction of first heat dissipation channel.

As a kind of preferred embodiment of the utility model, the liquid cooling heat radiator includes the first deflector and fluid passage cover board； One surface of the fluid passage cover board is formed with holding tank, and the surface that the fluid passage cover board is formed with the holding tank adheres on described On the surface of hot superconductive plate, to form fluid passage chamber between the fluid passage cover board and the hot superconductive plate；First water conservancy diversion Plate is located in the fluid passage chamber, and is fixed on the surface of the hot superconductive plate, with super in first deflector and the heat The interconnected fluid passage is formed between guide plate and the fluid passage cover board；The inlet and the liquid outlet are respectively positioned on On the fluid passage cover board.

As a kind of preferred embodiment of the utility model, the holding tank includes the first holding tank and the second holding tank, institute It states the first holding tank and second holding tank includes opposite first end and second end；The quantity of first deflector is Two pieces, one of first deflector is located at first holding tank, and another piece of first deflector is located at described the In two holding tanks；The inlet is located at the first end of first holding tank, is connected with first holding tank, it is described go out Liquid mouth is located at the first end of second holding tank, and is connected with second holding tank；The second of first holding tank End is connected with the second end of second holding tank.

As a kind of preferred embodiment of the utility model, first deflector includes:

Several the first flow guide bars, first flow guide bar is along perpendicular to the first holding tank first end to described first The direction of holding tank second end is wave-shaped or square-wave-shaped extends, and several articles of first flow guide bars are along first holding tank the One end to the first holding tank second end direction parallel arrangement；

First connecting portion, positioned at the both ends of first flow guide bar, and with each equal integrally connected of first flow guide bar.

As a kind of preferred embodiment of the utility model, first deflector includes several flat first water conservancy diversion Item, several first flow guide bars are along perpendicular to the first holding tank first end to the side of the first holding tank second end It arranges to parallel interval.

As a kind of preferred embodiment of the utility model, the air-cooled hot superconduction panel radiator of liquid-cooling combined type further includes Second radiating fin, second radiating fin are located at surface of the liquid cooling heat radiator far from the hot superconductive plate；Described The second heat dissipation channel of several parallel intervals arrangement, second heat dissipation channel and described first are formed in two radiating fins Heat dissipation channel is parallel.

As a kind of preferred embodiment of the utility model, the air-cooled hot superconduction panel radiator of liquid-cooling combined type is also wrapped It includes:

Shell is placed on the hot superconductive plate, the liquid cooling heat radiator, first radiating fin and second heat dissipation The top and outside of fin, to form air duct between the shell in the hot superconductive plate；

Partition, the partition are placed on the hot superconductive plate, and the hot superconductive plate is divided into first part and Two parts；Wherein, the first part is located at the top of the partition, and the second part is located at the lower section of the partition；Institute The surface that the first radiating fin is located at the first part is stated, the liquid cooling heat radiator is located at the surface of the first part；

Power device, the power device are located at the surface of the hot superconductive plate；

Seal case, the seal case side are formed with opening, and the seal case is placed on institute via the opening State the periphery of power device and the second part；The width of the opening is less than or equal to the width of the partition, the opening Length be less than or equal to the partition length.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes: annular peripheral frame, the first cover board, second Cover board and at least one second deflector；Wherein,

First cover board adheres on a surface of the annular peripheral frame, and second cover board adheres on the annular edge On surface of the frame far from first cover board, to form sealed chamber between first cover board and second cover board；

Second deflector is located in the sealed chamber；Second deflector includes several between first direction Every the protrusion arranged and extended in a second direction, wherein the first direction and the second direction are perpendicular, the first party The bottom integrally connected of the upward adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that It obtains and forms the sealed passage between second deflector and first cover board and second cover board.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes at least two pieces of second deflectors, The length of second deflector is identical as the length on the inside of the annular peripheral frame；Between having between adjacent second deflector Gap, to form the first balance channel of the heat-transfer working medium, first balance channel between adjacent second deflector Extend along the first direction；Between second deflector closed on the annular peripheral frame and the annular peripheral frame have Gap, to form the second balance channel of the heat-transfer working medium between second deflector and the annular peripheral frame, described Two balance channels extend along the first direction；The height of second deflector is identical as the height of the annular peripheral frame.

As a kind of preferred embodiment of the utility model, the side wall of the protrusion is equipped with several deflector holes, described to lead Discharge orifice runs through second deflector along the thickness direction of second deflector.

As a kind of preferred embodiment of the utility model, an at least preset clearance is equipped in second deflector；It is described Hot superconductive plate further includes an at least cushion block, and the cushion block is located in the preset clearance；The height of the cushion block and described second The height of deflector is identical, and the first installation through-hole penetrated through along its short transverse is equipped in the cushion block；First cover board On be additionally provided at least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first installation are logical Hole is correspondingly arranged；At least one third installation through-hole along the perforation of its thickness direction, the third are additionally provided on second cover board Installation through-hole is correspondingly arranged with first installation through-hole.

As a kind of preferred embodiment of the utility model, an at least preset clearance is equipped in second deflector；It is described First cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is from first cover board or described the The inner surface of two cover boards is convexly equipped in the prepsetting gap, the height phase of the height of the punching press boss and second deflector Together, and the first installation through-hole penetrated through along its short transverse, second cover board or described first are equipped in the punching press boss At least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first peace are additionally provided on cover board Dress through-hole is correspondingly arranged.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes:

First cover board；

Second cover board, including cover plate main body and annular convex edge, the annular convex edge and the cover plate main body integrally connected；Institute It states the first cover board to adhere on surface of the annular convex edge far from the cover plate main body, in first cover board and the lid Sealed chamber is formed between plate main body；

At least one second deflector is located in the sealed chamber；Second deflector includes several along first party To the protrusion for being intervally arranged and extending in a second direction, wherein the first direction and the second direction are perpendicular, and described The bottom integrally connected of the adjacent protrusion on one direction, and there is gap on the inside of the protrusion and between the adjacent protrusion, So that forming the sealed passage between second deflector and first cover board and second cover board.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes at least two pieces of second deflectors, The length of second deflector is identical as the length on the inside of the annular convex edge；Between having between adjacent second deflector Gap, to form the first balance channel of the heat-transfer working medium, first balance channel between adjacent second deflector Extend along the first direction；Between second deflector closed on the annular convex edge and the annular convex edge have Gap, to form the second balance channel of the heat-transfer working medium between second deflector and the annular convex edge, described Two balance channels extend along the first direction；The height of second deflector is identical as the height of the annular convex edge.

As described above, the hot superconduction panel radiator of the air-cooled liquid-cooling combined type of the utility model, has the advantages that

1. wind can be used by the way that liquid cooling heat radiator and the first radiating fin and fan is arranged simultaneously in hot superconduction plate surface Cold mode carries out forced heat radiation to hot superconductive plate, can also carry out forced heat radiation to hot superconductive plate using liquid cooling mode, can be with Forced heat radiation is carried out to hot superconductive plate in such a way that air-cooled liquid cooling combines, forced heat radiation mode is flexible, and heat-sinking capability is significant Enhance, and forced heat abstractor can be carried out using another device when any device of air-cooled or liquid cooling breaks down, not shadow Ring heat dissipation effect, it can be ensured that radiator is run steadily in the long term, reliability with higher；2.

2. the first deflector is arranged in liquid cooling heat radiator, deflector increases heat exchange area, to mention in addition to enhancing liquid perturbation Outside high heat-sinking capability, the effect of reinforcing rib is also acted as, can reduce the thickness of liquid cooling cover board, to mitigate the entirety weight of radiator Amount；

3. being filled with heat-transfer working medium in hot superconductive plate inner seal chamber body, inhibit by heat-transfer working medium phase-change heat transfer or phase transformation Heat transfer, forms the hot superconducting characteristic of quick conductive, keeps entire hot superconduction plate temperature uniform, reduce the temperature difference between each power device and The maximum temperature of radiator；

4. heat transfer efficiency is high: traditional Section Bar Heat Sinks majority is made of aluminum or aluminum alloy material, and thermal coefficient exists Within 220W/m.K, heat transfer efficiency is relatively low, and heat diffusivity can be poor, and hot superconduction gilled radiator passes through internal heat transfer working medium Quick conductive characteristic, equivalent heat conductivity is up to 4000W/m DEG C or more；

5. being welded with radiating fin on hot superconductive plate, hot superconductive plate can be conducted the heat come quickly by sky by radiating fin Gas is taken away and is dissipated, and radiating fin is the heat exchange area increased with air, reduces system thermal resistance, improves heat-sinking capability, again Play the role of reinforcing hot superconductive plate, to reduce the material thickness of hot superconductive plate, improves intensity, mitigate weight, reduce cost；It adopts With the mode of welding by both sides radiating fin, it is existing because of radiating fin excessive height, radiating fin to avoid traditional Section Bar Heat Sinks The low defect of tail end radiating efficiency, improves the radiating efficiency of radiating fin；

6. not limited by low temperature: heat-transfer working medium can be worked normally at subzero 40 DEG C or so, solved conventional water-cooling and existed The failure of the defect for needing heat cycles liquid and heat-pipe radiator under winter low temperature under winter extremely frigid zones low temperature is difficult Topic has better work accommodation performance；

7. partition is arranged on hot superconductive plate, hot superconductive plate is divided into upper and lower first part and second part, position by partition Power device is set in the second part surface of lower section, and is sealed second part by setting seal case, realizes power device Totally-enclosed, raising degree of protection and the reliability of part；

8. being seal cavity inside hot superconductive plate, and be equipped with the second deflector, internal second deflector the first cover board and Second cover board welds together, that is, plays booster action, applies two sides cover sheet thickness and is thinned, and bearing capacity increases, and intensity improves, and subtracts The weight and thickness of slight fever superconductive plate, and the heat exchange area inside increase, enhance the hot superconduction capacity of heat transmission.

Detailed description of the invention

Fig. 1 is shown as the quick-fried of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one Fried structural schematic diagram.

Fig. 2 is shown as the vertical of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one Body structural schematic diagram.

Fig. 3 is shown as in the middle part of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one The schematic perspective view of separation structure.

Fig. 4 to fig. 6 is shown as the hot superconduction plate type radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one The schematic perspective view of liquid cooling heat radiator in device.

Fig. 7 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one The configuration schematic diagram of hot superconductive plate.

Fig. 8 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one The schematic perspective view of hot superconductive plate.

Fig. 9 to Figure 14 is shown as the hot superconduction plate type radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment one The structural schematic diagram of different exemplary deflectors in hot superconductive plate in device；Wherein, Figure 10 is the front view of Fig. 9, and Figure 12 is figure 11 front view, Figure 14 are the front view of Figure 13.

Figure 15 is shown as the board-like radiator side of the hot superconduction of air-cooled liquid-cooling combined type provided in the utility model embodiment one Partial cross section's structural schematic diagram of edge point.

It is board-like scattered that Figure 16 to Figure 20 is shown as the hot superconduction of air-cooled liquid-cooling combined type provided in the utility model embodiment one The schematic perspective view of different exemplary radiating fins in hot device.

Figure 21 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment two The configuration schematic diagram of hot superconductive plate with preset clearance.

Figure 22 is shown as the hot superconduction panel radiator tool of the air-cooled liquid-cooling combined type provided in the utility model embodiment two There is partial cross section's structural schematic diagram of block portion.

Figure 23 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment two The configuration schematic diagram of hot superconductive plate with punching press boss.

Figure 24 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment three Hot superconductive plate configuration schematic diagram.

Figure 25 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment three Hot superconductive plate in deflector be placed in the overlooking structure diagram in annular peripheral frame.

Figure 26 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment four The configuration schematic diagram of hot superconductive plate with preset clearance and cushion block.

Figure 27 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment four Hot superconductive plate in deflector be placed in the overlooking structure diagram in annular peripheral frame.

Figure 28 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment four The configuration schematic diagram of hot superconductive plate with punching press boss.

Figure 29 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment five Hot superconductive plate configuration schematic diagram.

Figure 30 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment six The configuration schematic diagram of hot superconductive plate with preset clearance.

Figure 31 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment seven Hot superconductive plate configuration schematic diagram.

Figure 32 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment seven Deflector in hot superconductive plate is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.

Figure 33 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment eight The configuration schematic diagram of hot superconductive plate with preset clearance and cushion block.

Figure 34 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment eight Deflector in hot superconductive plate is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.

Figure 35 is shown as in the hot superconduction panel radiator of the air-cooled liquid-cooling combined type provided in the utility model embodiment eight The configuration schematic diagram of hot superconductive plate with punching press boss.

Component label instructions

10 hot superconductive plates

100 first cover boards

101 second cover boards

1011 cover plate main bodies

1012 annular convex edges

102 annular peripheral frames

1021 filling aperture

103 second deflectors

1031 protrusions

1032 deflector holes

1033 second flow guide bars

1034 second connecting portions

1035 preset clearances

104 first solder layers

105 second solder layers

106 sealed passages

107 first balance channels

108 second balance channels

109 cushion blocks

110 first installation through-holes

111 second installation through-holes

112 third installation through-holes

113 punching press boss

114 filling tubes

115 third solder layers

116 the 4th solder layers

117 first parts

118 second parts

119 inlet tubes

120 outlet tubes

20 first radiating fins

201 first heat dissipation channels

202 L shape fins

203 stiffeners

204 heat sink strips

30 liquid cooling heat radiators

301 first deflectors

3011 first flow guide bars

3012 first connecting portions

302 fluid passage cover boards

3021 first holding tanks

3022 second holding tanks

3023 inlets

3024 liquid outlets

40 fans

50 shells

60 partitions

70 power devices

80 seal cases

90 second radiating fins

901 second heat dissipation channels

Specific embodiment

The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this Content disclosed by specification understands other advantages and effect of the utility model easily.

Please refer to Fig.1 to Fig.3 5.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., are only used To cooperate the revealed content of specification, so that those skilled in the art understands and reads, it is practical new to be not limited to this The enforceable qualifications of type, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size Adjustment it is practical new should all still to fall in this in the case where not influencing the effect of the utility model can be generated and the purpose that can reach The revealed technology contents of type obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ", The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model Scope.

Embodiment one

Fig. 1 to Figure 12 is please referred to, the utility model provides a kind of hot superconduction panel radiator of air-cooled liquid-cooling combined type, described The air-cooled hot superconduction panel radiator of liquid-cooling combined type includes: hot superconductive plate 10, is formed in the hot superconductive plate 10 interconnected Sealed passage 106, be filled with heat-transfer working medium 1061 in the sealed passage 106；Liquid cooling heat radiator 30, the liquid cooling heat radiator 30 are located at the surface of the hot superconductive plate 10, are formed with fluid passage, the liquid cooling heat radiator 30 in the liquid cooling heat radiator 30 It is equipped with the inlet 3023 and liquid outlet 3024 being connected with the fluid passage；First radiating fin 20, described first dissipates Hot fin 20 is located at an at least surface for the hot superconductive plate 10, be formed in first radiating fin 20 several it is parallel between Every the first heat dissipation channel 201 of arrangement；An at least fan 40, the fan 40 are located at described first radiating fin, 20 one end, institute The outlet air surface of fan 40 is stated towards first radiating fin 20, and mutually hang down with the extending direction of first heat dissipation channel 201 Directly.

As an example, the liquid cooling heat radiator 30 includes the first deflector incorporated by reference to Fig. 1 with continued reference to shown in fig. 4 to fig. 6 301 and fluid passage cover board 302；One surface of the fluid passage cover board 302 is formed with holding tank, and the fluid passage cover board 302 is formed The surface for stating holding tank adheres on the surface of the hot superconductive plate 10, in the fluid passage cover board 302 and the hot superconductive plate Fluid passage chamber is formed between 10；First deflector 301 is located in the fluid passage chamber, and is fixed on the hot superconductive plate 10 Surface, between first deflector 10 and the hot superconductive plate 10 and the fluid passage cover board 302 formed be interconnected The fluid passage；The inlet 3023 and the liquid outlet 2034 are respectively positioned on the fluid passage cover board 302；The feed liquor Mouth 2034 is connected with an inlet tube 119, and the liquid outlet 2034 is connected with an outlet tube 120.

As an example, the holding tank includes the first holding tank 3021 and the second holding tank 3022, first holding tank 3021 and second holding tank 3022 include opposite first end and second end；The quantity of first deflector 301 is Two pieces, one of first deflector 301 is located at first holding tank 3021, another piece of first deflector 301 In second holding tank 3022；The inlet 3023 is located at the first end of first holding tank 3021, and described First holding tank 3021 is connected, and the liquid outlet 3024 is located at the first end of second holding tank 3022, and with described Two holding tanks 3022 are connected；The second end of first holding tank 3021 is connected with the second end of second holding tank 3022 It is logical.

In one example, as shown in Figures 4 and 5, first deflector 301 includes: several the first flow guide bars 3011 And first connecting portion 3012, first flow guide bar 3011 is along perpendicular to 3021 first end of the first holding tank to described first The direction of 3021 second end of holding tank is wave-shaped or square-wave-shaped extends, and several first flow guide bars 3011 are along described first 3011 first end of holding tank to 3011 second end of the first holding tank direction parallel arrangement；Specifically, holding with described first Receiving the direction of 3021 first end of slot to 3021 first end of the first holding tank is that the length direction of the fluid passage cover board 302 is Example, several described first flow guide bars 3011 are wave-shaped along the width direction of the fluid passage cover board 302 or square-wave-shaped extends, and Length direction parallel arrangement of several described first flow guide bars 3011 along the fluid passage cover board 302；The first connecting portion 3012 be located at first flow guide bar 3011 both ends, and with the equal integrally connected of each first flow guide bar 3011.

In another example, as shown in fig. 6, first deflector 301 includes several flat first flow guide bars 3011, several first flow guide bars 3011 are along perpendicular to 3021 first end of the first holding tank to first holding tank The direction parallel interval of 3021 second ends is arranged；Specifically, being accommodated with 3021 first end of the first holding tank to described first The direction of 3021 first end of slot is several 3011 edges of the first flow guide bar for the length direction of the fluid passage cover board 302 The length direction of the fluid passage cover board 302 extends, and arranges along the width direction parallel interval of the fluid passage cover board 302.

It should be noted that hot super heat conduction includes filling work in closed interconnected micro-channel system Medium realizes the hot pipe technique of hot superconductive heat transfer by the evaporation of working media with condensation phase transformation；And pass through control enclosed system Middle working media micro-architectural state, i.e., in diabatic process, the boiling (or condensation of gaseous medium) of liquid medium is suppressed, and Reach the consistency of working medium micro-structure on this basis, and realizes the phase transformation of efficient heat transfer and inhibit (PCI) heat transfer technology.This implementation In example, the hot superconductive plate can inhibit heat sink for phase transformation, at this point, the heat-transfer working medium in the hot superconductive plate is conducting heat During boil or condensation is suppressed, and reach the consistency of working medium micro-structure on this basis and realize heat transfer.This implementation In example, the hot superconductive plate may be adopting heat pipes for heat transfer plate, at this point, the heat-transfer working medium in the hot superconductive plate was conducting heat It is carried out continuously evaporation endothermic in journey and condenses exothermic phase transformation circulation to realize flash heat transfer.

As an example, the heat-transfer working medium 1061 is fluid, it is preferable that the heat-transfer working medium 1061 can be gas or liquid The mixture of body or gas and liquid, it is further preferable that in the present embodiment, the heat-transfer working medium 1061 is the mixed of liquid and gas Close object.

As an example, as shown in Figures 7 and 8, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the Two cover boards 101 and at least one second deflector 103, wherein first cover board 100 adheres on the one of the annular peripheral frame 102 On surface, second cover board 101 is adhered on surface of the annular peripheral frame 102 far from first cover board 100, in institute It states and forms sealed chamber between the first cover board 100 and second cover board 101；Second deflector 103 is located at the sealing In chamber；Second deflector 103 includes the protrusion that several are intervally arranged along first direction and extend in a second direction 1031, wherein the first direction and the second direction are perpendicular, the adjacent protrusion 1031 on the first direction Bottom integrally connected, and there is gap between 1031 inside of the protrusion and the adjacent protrusion 1031, so that described second Interconnected sealed passage 106 is formed between deflector 103 and first cover board 100 and second cover board 101；It is described Heat-transfer working medium 1061 is filled in sealed passage 106.It should be noted that the side that the arrow a in Fig. 9, Figure 11 and Figure 13 is indicated To the as described first direction, the direction that arrow b is indicated is the second direction；The first direction can be described second The length direction of deflector 103, the second direction is the width direction of second deflector 103, the first party at this time To the width direction that may be second deflector 103, the second direction is second deflector 103 at this time Length direction.

It should be noted that due on the inside of the annular peripheral frame 102 be hollow area, first cover board 100 with it is described It, can be in first cover board 100, second cover board after second cover board, 101 note is placed in the upper and lower surface of the annular peripheral frame 102 101 and the annular peripheral frame 102 on the inside of formed an airtight chamber.

The bottom integrally connected of the adjacent protrusion 1031 on the specific first direction, and 1031 lower section of the protrusion And there is gap between the adjacent protrusion 1031, it can thus make second deflector 103 to be in along its length The convex-concave shape of alternate intervals is arranged.

As an example, as shown in figure 15, the hot superconductive plate 10 further includes the first solder layer 104 and the second solder layer 105； Wherein, first solder layer 104 is located at first cover board 100 and the annular peripheral frame 102 and second deflector 103 Between, first cover board 100 and the annular peripheral frame 102 and second deflector 103 are welded together；Described Two solder layers 105 are between second cover board 101 and the annular peripheral frame 102 and second deflector 103, by institute The second cover board 101 is stated to weld together with the annular peripheral frame 102 and second deflector 103.

As an example, the height of second deflector 103 is identical as the height of the annular peripheral frame 102.By described The height of two deflectors 103 is set as identical as the height of the annular peripheral frame 102, it can be ensured that second deflector 103 Reach maximum with the bonding area of first solder layer 104 and second solder layer 105, to increase weld strength.

As an example, as shown in fig. 7, the side of the annular peripheral frame 102 is equipped with the filling aperture 1021 through side wall.It is described After first cover board 100, second cover board 101 and the annular peripheral frame 102 and second deflector 103 weld together, The filling aperture 1021 is inserted into one end of one filling tube 114 to fill the heat-transfer working medium into the sealed passage 106 1061.After the populated heat-transfer working medium 1061, the filling aperture 1021 should be enclosed so that the sealed passage 106 is realized Sealing.

In one example, second deflector 103 can be but be not limited only to one piece of plate stamping and form, such as Fig. 7 and Shown in Fig. 9, the length of second deflector 103 is identical as the length of 102 inside of annular peripheral frame, and described second leads The width of flowing plate 103 is of same size with 102 inside of annular peripheral frame；The side wall of the protrusion 1031 is equipped with several Deflector hole 1032, the deflector hole 1032 run through second deflector 103 along the thickness direction of second deflector 103. Specifically, as shown in FIG. 9 and 10, along the first direction, second deflector 103 can extend in square-wave-shaped, i.e. institute Stating the second deflector 103 includes several along the protrusion 1031 that first direction is intervally arranged, and along the first direction The bottom of the adjacent protrusion 1031 is connected with each other, and concave between the adjacent protrusion 1031.Certainly, in other examples In, second deflector 103 wave-shaped can also extend along the first direction, but preferably described second deflector 103 extend along the first direction in square-wave-shaped, may insure that the upper surface of second deflector 103 is (i.e. described convex in this way The top surface in portion 1031) and lower surface (bottom surface of the recess portion between the i.e. adjacent protrusion 13) in planar, in this way can be true The contact area for protecting second deflector 103 and first solder layer 104 and second solder layer 105 is as big as possible, To improve weld strength.First cover board 100, second cover board 101 and the annular peripheral frame 102 and described second are led After flowing plate 103 welds together, between the protrusion 1031 of second deflector 103 and second solder layer 105 between Gap between recess and first solder layer 104 and the deflector hole 1032 between gap, the protrusion 1031 is common Constitute the sealed passage 106.In this example, second deflector is run through along the second direction in the protrusion 1031 103, i.e., the described protrusion 1031 extends through second deflector 103 along the second direction, that is, the protrusion 1031 Length is identical as the second direction.Several deflector holes 1032, each protrusion are equipped on each protrusion 1031 Extending direction of the deflector hole 1032 along the protrusion 1031 on 1031 is arranged in uniline or higher order interlace, and each described convex The deflector hole 1032 is equipped on the side wall of 1031 two sides of portion.The deflector hole 1032 on each protrusion 1031 can be as Shown in Fig. 9 to be arranged in a one-to-one correspondence, can also misplace arrangement.Due to described in the second direction the second deflector 103 with There is enough gaps, the heat-transfer working medium 1061 is along institute between first solder layer 104 and second solder layer 105 The flowing stated in second direction is very smooth, and the heat-transfer working medium 1061 is along the first direction (between the i.e. described protrusion 1031 Every the direction of arrangement) on circulation be obstructed, by the way that the deflector hole 1032 is arranged on the protrusion 1031, can increase described Heat-transfer working medium 1061 along the first direction flowing, to increase heat-transfer effect on the first direction, so that described Heat-transfer working medium 1061 has almost the same mobility along the first direction and along the second direction, so that entire institute Hot superconductive plate all directions heat dissipation effect having the same is stated, so that the temperature phase of described 10 each region of hot superconductive plate Together, it and then effectively avoids causing the 10 regional area mistake of hot superconductive plate since some or multiple directions heat dissipation effect are bad The generation of thermal phenomenon.

In another example, as shown in FIG. 11 and 12, second deflector 103 includes: several along described second The second flow guide bar 1033 and second connecting portion 1034 of direction parallel arrangement, second flow guide bar 1033 include several along institute State the protrusion 1031 that first direction is intervally arranged；Second flow guide bar 1033 and the annular peripheral frame positioned at two sides 102 inside is in contact；The second connecting portion 1034 is located at the both ends of second flow guide bar 1033, and with several institutes The second flow guide bar 1033 is stated in integrally connected；Side of the second connecting portion 1034 far from second flow guide bar 1033 with The inside of the annular peripheral frame 102 is in contact.In this example, the width of second deflector 103 and the annular peripheral frame Of same size on the inside of 102, the length of second deflector 103 is identical as the length of 102 inside of annular peripheral frame.Institute It can be in square wave that the second flow guide bar 1033, which is stated, along the first direction (length direction of generally described second flow guide bar 1033) Shape extends, and wave-shaped can also extend, i.e., described second flow guide bar 1033 includes that several are arranged along the first direction interval The protrusion 1031 of cloth, the bottom of the adjacent protrusion 1031 is connected with each other along the first direction, and adjacent described convex It is concave between portion 1031.Preferably, in the present embodiment, second flow guide bar 1033 is in square-wave-shaped along the first direction Extend, may insure that the upper surface and the lower surface of second flow guide bar 1033 is plane in this way, that is, ensure that described second leads The upper surface (top surface of the i.e. described protrusion 1031) of flowing plate 103 and lower surface (the i.e. table opposite with the top of the protrusion 1031 Face) in planar, it may insure second deflector 103 and first solder layer 104 and second solder in this way The contact area of layer 105 is as big as possible, to improve weld strength.First cover board 100, second cover board 101 and institute State annular peripheral frame 102 and after second deflector 103 welds together, the protrusion 1031 of second flow guide bar 1033 and institute Between stating between gap between the second solder layer 105, recess and first solder layer 104 between the protrusion 1031 Gap between gap and adjacent second flow guide bar 1033 collectively forms the sealed passage 106.

As an example, the protrusion 1031 on adjacent two rows second flow guide bar 1033 can be arranged in a one-to-one correspondence, Institute i.e. along the second direction (i.e. second flow guide bar 1033 arrange direction), on the second flow guide bar 1033 described in each item Protrusion 1031 is stated to be arranged in a one-to-one correspondence.Certainly, in other examples, described convex on adjacent two rows second flow guide bar 1033 Portion 1031 can also shift to install, and the protrusion 1031 on so-called adjacent two rows second flow guide bar 1033, which shifts to install, is Refer to, the side of the protrusion 1031 on adjacent two rows second flow guide bar 1033 is staggered, as shown in FIG. 11 and 12；It is adjacent The distance that the protrusion 1031 of two rows of second flow guide bars 1033 misplaces can be less than the width of the protrusion 1031, such as Figure 11 And shown in Figure 12, the distance that the protrusion 1031 of adjacent two rows second flow guide bar 1033 misplaces can also be equal to the protrusion 1031 width, at this point, the second water conservancy diversion described in the protrusion 1031 of the second flow guide bar 1033 described in a row and a row adjacent thereto Recess alignment between the protrusion 1031 of item 1033.It should be noted that on adjacent two rows second flow guide bar 1033 When the protrusion 1031 shifts to install, it is arranged in a one-to-one correspondence every the protrusion 1031 arranged on second flow guide bar 1033, i.e., The protrusion 1031 on second flow guide bar 1033 described in odd row with it is described convex on the second flow guide bar 1033 described in even rows Portion 1031 shifts to install, and the protrusion 1031 on the second flow guide bar 1033 described in each odd row is arranged in a one-to-one correspondence, each idol The protrusion 1031 that number is arranged on second flow guide bar 1033 is also arranged in a one-to-one correspondence.

As an example, as shown in FIG. 13 and 14, the side wall of the protrusion 1031 can be equipped with deflector hole 1032, described Deflector hole 1032 runs through second flow guide bar 1033 along the thickness direction of second flow guide bar 1033.Due to along described second Have between second flow guide bar 1033 and first solder layer 104 and second solder layer 105 on direction enough Gap, the heat-transfer working medium 1061 is very smooth in the flowing in the second direction, and the heat-transfer working medium 1061 is along institute The circulation for stating first direction (direction that i.e. described second flow guide bar 1033 extends) is obstructed, by being arranged on the protrusion 1031 The deflector hole 1032 can increase the heat-transfer working medium 1061 along the flowing of the first direction, to increase along described the Heat-transfer effect on one direction, so that the heat-transfer working medium 1061 has almost along the first direction and along the second direction Identical mobility, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that the heat The temperature of 10 each region of superconductive plate is identical, and then effectively avoids causing since some or multiple directions heat dissipation effect are bad The generation of the 10 regional area superheating phenomenon of hot superconductive plate.

As an example, being equipped on the side wall of each 1031 two sides of protrusion on each second flow guide bar 1033 The deflector hole 1032, the deflector hole on the direction that second flow guide bar 1033 extends, each protrusion 1031 1032 can be arranged in a one-to-one correspondence as shown in fig. 13 that, and can also misplace arrangement.

In one example, first radiating fin 20 can be along liquid square to wave-shaped (as shown in figure 16), can also To extend (as shown in figure 17) in square-wave-shaped along liquid square.First radiating fin 20 is along liquid square to wave-shaped or square Wavy extension, can in a limited space in increase by the surface area of first radiating fin 20 to the maximum extent, to increase Heat dissipation effect.

In another example, first radiating fin 20 along the vertical direction equally can wave-shaped or square-wave-shaped prolong It stretches, wherein Figure 18 extends so that first radiating fin 20 is wave-shaped along the vertical direction as example.First radiating fin Extension wave-shaped or square wave dress extend piece 20 along the vertical direction, can further increase the surface of first radiating fin 20 Product.

In another example, first radiating fin 20 can also include several tabular fins, also may include Several L shape fins 202, several described tabular fins or the L shape fin 202 are arranged along liquid square to parallel interval, As shown in figure 19.It should be noted that first radiating fin 20 further includes several stiffeners 203, the reinforcement at this time Item 203 extends along the direction that the tabular fin or the L shape fin 202 are arranged, by each tabular fin or L The concatenation of shape fin 202 is fixed, its mechanical strength is increased.

In another example, first radiating fin 20 can also include the heat sink strip of several parallel intervals arrangement 204, the equal integrally connected in end of each heat sink strip 204, as shown in figure 20.

As an example, as shown in figure 15, first radiating fin 20 can be via third solder layer 115 and solder layer 116 are fixedly welded on two opposite surfaces of the hot superconductive plate 10.Certainly, in other examples, first radiating fin 20 A surface of the hot superconductive plate 10 can also be only located at.

As an example, the quantity of the fan 40 can be set according to actual needs, Fig. 1 is into Fig. 3 with the wind The quantity of fan 40 is two as an example, being not limited thereto in actual example.

As an example, as shown in Figures 1 and 3, the air-cooled hot superconduction panel radiator of liquid-cooling combined type further includes second Radiating fin 90, second radiating fin 90 are located at surface of the liquid cooling heat radiator 30 far from the hot superconductive plate 10；Institute State the second heat dissipation channel 901 that the arrangement of several parallel intervals is formed in the second radiating fin 90, second heat dissipation channel 901 is parallel with first heat dissipation channel 201.

As an example, the specific structure of second radiating fin 90 can be with the specific knot of first radiating fin 20 Structure is identical, is not repeated herein.

As an example, as shown in Figure 1 to Figure 3, the air-cooled hot superconduction panel radiator of liquid-cooling combined type further includes shell 50, partition 60, power device 70 and seal case 80；Wherein, the shell 50 is placed on the hot superconductive plate 10 and described The top and outside of one radiating fin 20, to form air duct between the hot superconductive plate 10 and the shell 50.It needs to illustrate , the bottom of the shell 50 and the shell 50 and the perpendicular both ends of the surface of first heat dissipation channel 201 are in opening Shape, to ensure that the shell 50 can be placed on the top and outside of the hot superconductive plate 10 and first radiating fin 20, And ensure that the shell 50 will not influence the air blast cooling heat dissipation of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type；It is described Partition 60 is placed on the hot superconductive plate 10, and the hot superconductive plate 10 is divided into first part 117 and second part 118；Wherein, the first part 117 is located at the top of the partition 60, and the second part 118 is located at the partition 60 Lower section；First radiating fin 20 can be only located at the surface of the first part 117, and the liquid cooling heat radiator 30 is located at institute State the surface of first part 117；When first radiating fin 20 is located at two opposite surface of the hot superconductive plate 10, The surface of the first part 117 can be located at simultaneously positioned at first radiating fin 20 on hot 10 1 surface of superconductive plate And the surface of the second part 118；80 side of seal case is formed with opening, and the seal case 80 is opened via described Muzzle is placed in the periphery of the power device 70 and the second part 118；The width of the opening is less than or equal to the partition 60 width, the length of the opening are less than or equal to the length of the partition 60, it is preferable that in the present embodiment, the opening For width in the width of the partition 60, the length of the opening is equal to the length of the partition 60.It should be noted that in Fig. 2 For the ease of display, the seal case 80 is not placed on the periphery of the power device 70 and the second part 118, and It is the lower section for specially moving to the second part 118.

Embodiment two

Incorporated by reference to Fig. 1 to Figure 20 refering to Figure 21 to Figure 23, the present embodiment also provides a kind of hot superconduction of air-cooled liquid-cooling combined type Panel radiator, institute in the structure Yu embodiment one of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment The structure of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type stated is roughly the same, and the difference of the two is the hot superconductive plate 10 Specific structure it is different: hot superconductive plate 10 is compared to hot superconductive plate 10 described in embodiment one in institute described in the present embodiment It states and has additional an at least preset clearance 1035 in the second deflector 103, meanwhile, the hot superconductive plate 10 further includes an at least cushion block 109 or described first cover boards 100 or second cover board 101 are equipped with an at least punching press boss 113.Described in the present embodiment The other structures of hot superconductive plate 10 are identical with the other structures of hot superconductive plate 10 described in embodiment one, referring specifically to Embodiment one, is not repeated herein.

In one example, it as shown in Figure 21 and Figure 22, is equipped in second deflector 103 in the hot superconductive plate 10 Several described preset clearances 1035, wherein Figure 21 is to be equipped with 4 preset clearances 1035 in second deflector 103 As an example, the quantity of the preset clearance 1035 is not limited in actual example；If the hot superconductive plate 10 further includes The dry cushion block 109, the quantity of the cushion block 109 is identical as the quantity of the preset clearance 1035, and the cushion block 109 It is set in each preset clearance 1035 correspondingly；The height of the height of the cushion block 109 and second deflector 103 Spend it is identical, and be equipped in each cushion block 109 along its short transverse perforation the first installation through-hole 110；First cover board Several the second installation through-holes 111 penetrated through along the thickness direction of first cover board 100, second peace are additionally provided on 100 The quantity for filling through-hole 111 is identical with the quantity of first installation through-hole 110, and second installation through-hole 111 and described the One installation through-hole 110 is arranged in a one-to-one correspondence；Several are additionally provided on second cover board 101 along 101 thickness of the second cover board The third installation through-hole 112 of direction perforation, the number of the quantity of the third installation through-hole 112 and first installation through-hole 110 Measure identical, and the third installation through-hole 112 is arranged in a one-to-one correspondence with first installation through-hole 110.It should be noted that being Convenient for showing the preset clearance 1035, the cushion block 109 is not illustrated in Figure 21, meanwhile, for the ease of display, figure First solder layer 104 and second solder layer 105 are not illustrated in 21.Since the surface of the hot superconductive plate 10 needs The power device of fixed fever is installed, and the sealed passage 106 in the hot superconductive plate 10 is sealing pipeline, Bu Neng Installation fixation hole is directly beaten in the place of the corresponding sealed passage 106 of the hot superconductive plate 10, to prevent the sealed passage 106 The interior heat-transfer working medium 1061 is revealed；The utility model is by reserving the preset clearance in second deflector 103 1035, and it is set in the preset clearance 1035 the identical cushion block 109 of height of second deflector 103, It is formed with first installation through-hole 110 in the cushion block 109, forms second peace on first cover board 100 in this way Dress through-hole 111 and formed after the third installation through-hole 112 on second cover board 101 can be solid by bolt etc. Determine to utilize first installation through-hole 110, second installation through-hole 111 and the third installation through-hole under the premise of device 112 are fixed on the power device 70 on the hot superconductive plate 10, meanwhile, and may insure that the sealed passage 106 is in Sealing state, the heat-transfer working medium 1061 will not be revealed.

In another example, as shown in figure 23, several are equipped in second deflector 103 of the hot superconductive plate 10 The preset clearance 1035, wherein set in Figure 23 using in second deflector 103 there are four the preset clearance 1035 as Example, in actual example, the quantity of the preset clearance 1035 is not limited；First cover board 100 or described second Cover board 101 is equipped with several described punching press boss 113, wherein is equipped with several institutes in Figure 23 with second cover board 101 Punching press boss 113 is stated as example；The punching press boss 113 is from first cover board 100 or the interior table of second cover board 101 Face is convexly equipped in the preset clearance 1035, the height phase of the height of the punching press boss 113 and second deflector 103 Together, the quantity of the punching press boss 113 is identical as the quantity of the preset clearance 1035, a pair of with the preset clearance 1,035 1 It should be arranged, and be equipped with the first installation through-hole 110 penetrated through along its short transverse, second cover board in the punching press boss 113 Be additionally provided on 101 or described first cover boards 100 several along its thickness direction perforation the second installation through-hole 111, described second Installation through-hole 111 is identical as the quantity of first installation through-hole 110, and sets with first installation through-hole 110 one-to-one correspondence It sets.It should be noted that if the punching press boss 113 is set on second cover board 101, then second installation through-hole 111 are located on first cover board 100, as shown in figure 23；If the punching press boss 113 is set to first cover board 100 On, then second installation through-hole 111 is located on second cover board 101.It should be further noted that for the ease of aobvious Show, first solder layer 104 and second solder layer 105 are not illustrated in Figure 23.The utility model passes through described The preset clearance 1035 is reserved in second deflector 103, and is set on first cover board 100 or second cover board 12 Set that several are convexly equipped in the preset clearance 1035 and the punching press identical with the height of second deflector 103 is convex Platform 113 is equipped with first installation through-hole 110 in the punching press boss 113, in this way, in second cover board 101 or described Second installation through-hole 111 is arranged on first cover board 100 later can be sharp under the premise of device fixed by bolt etc. The power device is fixed on the hot superconductive plate with first installation through-hole 110 and second installation through-hole 111, Meanwhile and may insure that the sealed passage 106 is in sealing state, the heat-transfer working medium 1061 will not be revealed.

It should be noted that Figure 21, into Figure 23, second deflector 103 is Fig. 9 and figure in such as embodiment one Second deflector described in a monolith in second deflector 103 shown in 10 after the setting preset clearance 1035, when So, in other examples, second deflector 103 can also be shown in Figure 11 to Figure 14 in embodiment one for another example described the The second deflector in two deflectors 103 after the setting preset clearance 1035.

Embodiment three

Incorporated by reference to Fig. 1 to Figure 20 refering to Figure 24 to Figure 25, the present embodiment also provides a kind of hot superconduction of air-cooled liquid-cooling combined type Panel radiator, institute in the structure Yu embodiment one of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment The structure of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type stated is roughly the same, and the difference of the two is the hot superconductive plate 10 Structure it is different: the quantity of the second deflector 103 described in hot superconductive plate 10 described in embodiment one is one piece, and this reality The quantity for applying the second deflector 103 described in example is at least two pieces, and between having between adjacent second deflector 103 Gap, to form the first balance channel 107 of the heat-transfer working medium 1061 between adjacent second deflector 103, described One balance channel 107 extends along the first direction, i.e., the extending direction of described first balance channel 107 and the first party To parallel；Second deflector 103 closed on the annular peripheral frame 102 has gap with the annular peripheral frame 102, To form the second balance channel of the heat-transfer working medium 1061 between second deflector 103 and the annular peripheral frame 102 108, second balance channel 108 extends along the first direction, i.e., the extending direction of described second balance channel 108 and institute The end face for stating protrusion 31 is parallel；The height of second deflector 103 is identical as the height of the annular peripheral frame 102.This reality Apply the complete phase of other structures of the other structures of hot superconductive plate 10 described in example with hot superconductive plate 10 described in embodiment one Together, it referring specifically to embodiment one, is not repeated herein.First balance channel 107 can be used as vapor liquid equilibrium channel, with Enhance the described of the heat-transfer working medium 1061 of gaseous state, the heat-transfer working medium 1061 of liquid condition or gas-liquid mixture phase Flowing of the heat-transfer working medium 1061 on 103 length direction of the second deflector；Second balance channel 108 can be used as Fluid balance channel, to enhance flowing of the heat-transfer working medium 1061 along the first direction of liquid condition.Due to the heat It along the second direction is main channel direction, and the heat-transfer working medium 1061 along the first direction in superconductive plate 10 Flow resistance is larger, and mobility is poor, can be with by adding first balance channel 107 and second balance channel 108 Enhance the heat-transfer working medium 1061 along the mobility of the first direction, so that entire hot 10 all directions of superconductive plate have Identical heat dissipation effect, so that the temperature of described 10 each region of hot superconductive plate is identical, and then effectively avoids due to a certain A multiple directions heat dissipation effect living is bad and causes the generation of the 10 regional area superheating phenomenon of hot superconductive plate.

Example IV

Incorporated by reference to Fig. 1 to Figure 23 refering to Figure 26 to Figure 28, the present embodiment also provides a kind of hot superconduction of air-cooled liquid-cooling combined type Panel radiator, institute in the structure Yu embodiment two of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment The structure of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type stated is roughly the same, and the difference of the two is the hot superconductive plate 10 Structure it is different: the quantity of the second deflector 103 described in hot superconductive plate 10 described in embodiment two is one piece, and this reality The quantity for applying the second deflector 103 described in example is at least two pieces, and between having between adjacent second deflector 103 Gap, to form the first balance channel 107 of the heat-transfer working medium 1061 between adjacent second deflector 103, described One balance channel 107 extends along the first direction, i.e., the extending direction of described first balance channel 107 and the first party To parallel；Second deflector 103 closed on the annular peripheral frame 102 has gap with the annular peripheral frame 102, To form the second balance channel of the heat-transfer working medium 1061 between second deflector 103 and the annular peripheral frame 102 108, second balance channel 108 extends along the first direction, i.e., the extending direction of described second balance channel 108 and institute The end face for stating protrusion 31 is parallel；The height of second deflector 103 is identical as the height of the annular peripheral frame 102.This reality Apply the complete phase of other structures of the other structures of hot superconductive plate 10 described in example with hot superconductive plate 10 described in embodiment two Together, it referring specifically to embodiment two, is not repeated herein.First balance channel 107 can be used as vapor liquid equilibrium channel, with Enhance the described of the heat-transfer working medium 1061 of gaseous state, the heat-transfer working medium 1061 of liquid condition or gas-liquid mixture phase Flowing of the heat-transfer working medium 1061 on 103 length direction of the second deflector；Second balance channel 108 can be used as Fluid balance channel, to enhance flowing of the heat-transfer working medium 1061 along the first direction of liquid condition.Due to the heat It along the second direction is main channel direction, and the heat-transfer working medium 1061 along the first direction in superconductive plate 10 Flow resistance is larger, and mobility is poor, can be with by adding first balance channel 107 and second balance channel 108 Enhance the heat-transfer working medium 1061 along the mobility of the first direction, so that entire hot 10 all directions of superconductive plate have Identical heat dissipation effect, so that the temperature of described 10 each region of hot superconductive plate is identical, and then effectively avoids due to a certain A multiple directions heat dissipation effect living is bad and causes the generation of the 10 regional area superheating phenomenon of hot superconductive plate.

It is reserved it should be noted that Figure 26 and Figure 27 are shown as having in the hot superconduction panel radiator of air-cooled liquid-cooling combined type The structural schematic diagram of the hot superconductive plate 10 of gap 1035 and cushion block 109, it is board-like that Figure 28 is shown as the hot superconduction of air-cooled liquid-cooling combined type The structural schematic diagram of hot superconductive plate 10 in radiator with punching press boss 113.

It should be further noted that the preset clearance formed in the second deflector 103 described in the present embodiment 1035 are located in second deflector 103 closest with second balance channel 108, as shown in Figure 26 to Figure 28.Its In, Figure 26 to Figure 28 is with second deflector 103 in the second deflector 103 shown in Figure 11 and Figure 12 in example 1 Second including several described second flow guide bars 1033 and second connecting portion 1034 after the preset clearance 1035 is arranged is led Flowing plate is as an example, the quantity of second deflector 103 is two, and second deflector 103 further includes the cushion block 109 are used as example；Certainly, in other examples, second deflector 103 can also be Fig. 9 and figure in such as embodiment one The second deflector in second deflector 103 shown in 10 or Figure 13 and Figure 14 after the setting preset clearance 1035, described When second deflector 103 does not include the cushion block 109, institute is also provided on first cover board 11 or second cover board 21 State punching press convex block 113.The quantity of second deflector 103 can be set according to actual needs, be not limited to two.

It should be further noted that the arrangement mode of the preset clearance 1035 can be arranged according to actual needs Cloth, for example, several shown preset clearances 1035 can arrange as shown in Figure 26 to Figure 28 in a word, can also be such as embodiment It is arranged in array shown in Figure 21 and Figure 23 in two.

Embodiment five

Incorporated by reference to Fig. 1 to Figure 20 refering to Figure 29, it is board-like that the utility model also provides a kind of hot superconduction of air-cooled liquid-cooling combined type Institute in radiator, the specific structure of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment and embodiment one The specific structure of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type stated is roughly the same, and the difference of the two is the hot superconduction The specific structure of plate 10 is different: in embodiment one, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, second Cover board 101 and at least one second deflector 103, wherein first cover board 100 adheres on a table of the annular peripheral frame 102 On face, second cover board 101 is adhered on surface of the annular peripheral frame 102 far from first cover board 100, in described Sealed chamber is formed between first cover board 100 and second cover board 101.And in the present embodiment, the hot superconductive plate 10 includes: First cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover plate main body 1011 and annular Convex edge 1012, the annular convex edge 1012 and 1011 integrally connected of cover plate main body；First cover board 100 adheres on described On surface of the annular convex edge 1012 far from the cover plate main body 1011, in first cover board 100 and the cover plate main body Sealed chamber is formed between 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment one；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment one of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Other structures of the air-cooled hot superconduction panel radiator of liquid-cooling combined type other than the hot superconductive plate 10 described in embodiment with Corresponding structure is identical in the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in embodiment one, no longer tired herein It states.

In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.

Embodiment six

Incorporated by reference to Fig. 1 to Figure 23 refering to Figure 30, it is board-like that the utility model also provides a kind of hot superconduction of air-cooled liquid-cooling combined type Institute in radiator, the specific structure of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment and embodiment two The specific structure of the hot superconduction panel radiator of the air-cooled liquid-cooling combined type stated is roughly the same, and the difference of the two is the hot superconduction The specific structure of plate 10 is different: in embodiment two, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, second Cover board 101 and at least one second deflector 103, wherein first cover board 100 adheres on a table of the annular peripheral frame 102 On face, second cover board 101 is adhered on surface of the annular peripheral frame 102 far from first cover board 100, in described Sealed chamber is formed between first cover board 100 and second cover board 101.And in the present embodiment, the hot superconductive plate 10 includes: First cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover plate main body 1011 and annular Convex edge 1012, the annular convex edge 1012 and 1011 integrally connected of cover plate main body；First cover board 100 adheres on described On surface of the annular convex edge 1012 far from the cover plate main body 1011, in first cover board 100 and the cover plate main body Sealed chamber is formed between 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment two；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment two of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Other structures of the air-cooled hot superconduction panel radiator of liquid-cooling combined type other than the hot superconductive plate 10 described in embodiment with Corresponding structure is identical in the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in embodiment two, no longer tired herein It states.

Embodiment seven

Incorporated by reference to Fig. 1 to Figure 25 refering to Figure 31 to Figure 32, it is super that the utility model also provides a kind of air-cooled liquid-cooling combined type heat Guide-plate type radiator, the specific structure and embodiment of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment The specific structure of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in three is roughly the same, and the difference of the two is described The specific structure of hot superconductive plate 10 is different: in embodiment three, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, wherein first cover board 100 adheres on the annular peripheral frame On 102 surface, second cover board 101 adheres on surface of the annular peripheral frame 102 far from first cover board 100 On, to form sealed chamber between first cover board 100 and second cover board 101.And in the present embodiment, the heat is super Guide plate 10 includes: the first cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012 and 1011 integrally connected of cover plate main body；First cover board 100 adhere on surface of the annular convex edge 1012 far from the cover plate main body 1011, in first cover board 100 and institute It states and forms sealed chamber between cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment three；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment three of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Other structures of the air-cooled hot superconduction panel radiator of liquid-cooling combined type other than the hot superconductive plate 10 described in embodiment with Corresponding structure is identical in the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in embodiment three, no longer tired herein It states.

Embodiment eight

Incorporated by reference to Fig. 1 to Figure 28 refering to Figure 33 to Figure 35, it is super that the utility model also provides a kind of air-cooled liquid-cooling combined type heat Guide-plate type radiator, the specific structure and embodiment of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in the present embodiment The specific structure of the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in four is roughly the same, and the difference of the two is described The specific structure of hot superconductive plate 10 is different: in example IV, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, wherein first cover board 100 adheres on the annular peripheral frame On 102 surface, second cover board 101 adheres on surface of the annular peripheral frame 102 far from first cover board 100 On, to form sealed chamber between first cover board 100 and second cover board 101.And in the present embodiment, the heat is super Guide plate 10 includes: the first cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover board master Body 1011 and annular convex edge 1012, the annular convex edge 1012 and 1011 integrally connected of cover plate main body；First cover board 100 adhere on surface of the annular convex edge 1012 far from the cover plate main body 1011, in first cover board 100 and institute It states and forms sealed chamber between cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in example IV；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and example IV of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Other structures of the air-cooled hot superconduction panel radiator of liquid-cooling combined type other than the hot superconductive plate 10 described in embodiment with Corresponding structure is identical in the air-cooled hot superconduction panel radiator of liquid-cooling combined type described in example IV, no longer tired herein It states.

In conclusion the utility model provides a kind of hot superconduction panel radiator of air-cooled liquid-cooling combined type, the air-cooled liquid Cold combined hot superconduction panel radiator includes: hot superconductive plate, is formed with interconnected sealed passage in the hot superconductive plate, Heat-transfer working medium is filled in the sealed passage；Liquid cooling heat radiator, positioned at the surface of the hot superconductive plate, the liquid cooling heat radiator It is inside formed with fluid passage, the liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with the fluid passage；The One radiating fin, positioned at an at least surface for the hot superconductive plate, be formed in first radiating fin several it is parallel between Every the first heat dissipation channel of arrangement；An at least fan is located at first radiating fin one end, the outlet air surface direction of the fan First radiating fin, and it is perpendicular with the extending direction of first heat dissipation channel.The air-cooled liquid cooling group of the utility model Box-like hot superconduction panel radiator have the advantages that 1. by hot superconduction plate surface and meanwhile be arranged liquid cooling heat radiator and First radiating fin and fan can carry out forced heat radiation to hot superconductive plate using air cooling way, can also use liquid cooling mode Forced heat radiation is carried out to hot superconductive plate, forced heat radiation can also be carried out to hot superconductive plate in such a way that air-cooled liquid cooling combines, Forced heat radiation mode is flexible, and heat-sinking capability significantly increases, and can use when any device of air-cooled or liquid cooling breaks down Another device carries out forced heat abstractor, does not influence heat dissipation effect, it can be ensured that radiator is run steadily in the long term, with higher Reliability；2. the first deflector is arranged in liquid cooling heat radiator, deflector increases heat exchange area, to mention in addition to enhancing liquid perturbation Outside high heat-sinking capability, the effect of reinforcing rib is also acted as, can reduce the thickness of liquid cooling cover board, to mitigate the entirety weight of radiator Amount；3. being filled with heat-transfer working medium in hot superconductive plate inner seal chamber body, inhibit heat transfer by heat-transfer working medium phase-change heat transfer or phase transformation, The hot superconducting characteristic for forming quick conductive keeps entire hot superconduction plate temperature uniform, reduces the temperature difference and heat dissipation between each power device The maximum temperature of device；4. heat transfer efficiency is high: traditional Section Bar Heat Sinks majority is made of aluminum or aluminum alloy material, thermal coefficient Within 220W/m.K, heat transfer efficiency is relatively low, and heat diffusivity can be poor, and hot superconduction gilled radiator passes through internal heat transfer working medium Quick conductive characteristic, equivalent heat conductivity is up to 4000W/m DEG C or more；5. being welded with radiating fin on hot superconductive plate, dissipate Hot superconductive plate can be conducted the heat come and quickly be taken away and dissipated by air by hot fin, and radiating fin increases and air Heat exchange area, reduce system thermal resistance, improve heat-sinking capability, and play the role of reinforcing hot superconductive plate, to reduce hot superconductive plate Material thickness, improve intensity, mitigate weight, reduce cost；By the way of welding by both sides radiating fin, traditional profile is avoided Radiator is existing because of radiating fin excessive height, and the low defect of radiating fin tail end radiating efficiency improves radiating fin Radiating efficiency；6. not limited by low temperature: heat-transfer working medium can be worked normally at subzero 40 DEG C or so, solved conventional water-cooling and existed The failure of the defect for needing heat cycles liquid and heat-pipe radiator under winter low temperature under winter extremely frigid zones low temperature is difficult Topic has better work accommodation performance；7. partition is arranged on hot superconductive plate, hot superconductive plate is divided into upper and lower first by partition Power device is arranged in part and second part, underlying second part surface, and by setting seal case by second Divide sealing, realize the totally-enclosed of power device, improves degree of protection and reliability；8. it is seal cavity inside hot superconductive plate, and Equipped with the second deflector, internal second deflector welds together the first cover board and the second cover board, that is, plays booster action, apply Two sides cover sheet thickness is thinned, and bearing capacity increases, and intensity improves, and mitigates the weight and thickness of hot superconductive plate, and inside increase Heat exchange area enhances the hot superconduction capacity of heat transmission.

The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.

Claims

1. a kind of hot superconduction panel radiator of air-cooled liquid-cooling combined type, which is characterized in that the air-cooled hot superconduction of liquid-cooling combined type Panel radiator includes:

Hot superconductive plate, is formed with interconnected sealed passage in the hot superconductive plate, filled with heat transfer in the sealed passage Working medium；

Liquid cooling heat radiator is formed with fluid passage, the liquid cooling positioned at the surface of the hot superconductive plate in the liquid cooling heat radiator Radiator is equipped with the inlet and liquid outlet being connected with the fluid passage；

First radiating fin is formed with several in first radiating fin positioned at an at least surface for the hot superconductive plate First heat dissipation channel of parallel interval arrangement；

An at least fan, is located at first radiating fin one end, the outlet air surface of the fan towards first radiating fin, And it is perpendicular with the extending direction of first heat dissipation channel.

2. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 1, which is characterized in that the liquid cooling dissipates Hot device includes the first deflector and fluid passage cover board；One surface of the fluid passage cover board is formed with holding tank, the fluid passage cover board shape On the surface for adhering on the hot superconductive plate at the surface for having the holding tank, in the fluid passage cover board and the hot superconductive plate Between formed fluid passage chamber；First deflector is located in the fluid passage chamber, and is fixed on the surface of the hot superconductive plate, To form the interconnected fluid passage between first deflector and the hot superconductive plate and the fluid passage cover board； The inlet and the liquid outlet are respectively positioned on the fluid passage cover board.

3. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 2, which is characterized in that the holding tank Including the first holding tank and the second holding tank, first holding tank and second holding tank include opposite first end and Second end；The quantity of first deflector is two pieces, and one of first deflector is located at first holding tank, separately One piece of first deflector is located in second holding tank；The inlet is located at the first end of first holding tank, It is connected with first holding tank, the liquid outlet is located at the first end of second holding tank, and accommodates with described second Slot is connected；The second end of first holding tank is connected with the second end of second holding tank.

4. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 3, which is characterized in that described first leads Flowing plate includes:

Several the first flow guide bars, first flow guide bar are accommodated along perpendicular to the first holding tank first end to described first The direction of slot second end is wave-shaped or square-wave-shaped extends, and several first flow guide bars are along the first holding tank first end To the direction parallel arrangement of the first holding tank second end；

5. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 3, which is characterized in that described first leads Flowing plate includes several flat first flow guide bars, and several articles of first flow guide bars are along perpendicular to first holding tank the The direction parallel interval of one end to the first holding tank second end is arranged.

6. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 1, which is characterized in that the air-cooled liquid Cold combined hot superconduction panel radiator further includes the second radiating fin, and second radiating fin is located at the liquid cooling heat radiator Surface far from the hot superconductive plate；The second heat dissipation that the arrangement of several parallel intervals is formed in second radiating fin is logical Road, second heat dissipation channel are parallel with first heat dissipation channel.

7. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 6, which is characterized in that the air-cooled liquid Cold combined hot superconduction panel radiator further include:

Shell is placed on the hot superconductive plate, the liquid cooling heat radiator, first radiating fin and second radiating fin Top and outside, to form air duct between the shell in the hot superconductive plate；

Partition, the partition are placed on the hot superconductive plate, and the hot superconductive plate is divided into first part and second Point；Wherein, the first part is located at the top of the partition, and the second part is located at the lower section of the partition；Described One radiating fin is located at the surface of the first part, and the liquid cooling heat radiator is located at the surface of the first part；

Seal case, the seal case side are formed with opening, and the seal case is placed on the function via the opening The periphery of rate device and the second part；The width of the opening is less than or equal to the width of the partition, the length of the opening Degree is less than or equal to the length of the partition.

8. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to any one of claim 1 to 7, feature exist In the hot superconductive plate includes: annular peripheral frame, the first cover board, the second cover board and at least one second deflector；Wherein,

First cover board adheres on a surface of the annular peripheral frame, and it is remote that second cover board adheres on the annular peripheral frame On surface from first cover board, to form sealed chamber between first cover board and second cover board；

Second deflector is located in the sealed chamber；Second deflector includes that several are arranged along first direction interval Cloth and the protrusion extended in a second direction, wherein the first direction and the second direction are perpendicular, on the first direction The bottom integrally connected of the adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that institute It states and forms the sealed passage between the second deflector and first cover board and second cover board.

9. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 8, which is characterized in that the hot superconduction Plate includes at least two pieces of second deflectors, length and the length phase on the inside of the annular peripheral frame of second deflector Together；There is gap, to form the heat-transfer working medium between adjacent second deflector between adjacent second deflector The first balance channel, first balance channel extends along the first direction；Described in one closed on the annular peripheral frame Second deflector and the annular peripheral frame have gap, described in being formed between second deflector and the annular peripheral frame Second balance channel of heat-transfer working medium, second balance channel extend along the first direction；The height of second deflector It spends identical as the height of the annular peripheral frame.

10. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 8, which is characterized in that the protrusion Side wall be equipped with several deflector holes, the deflector hole runs through second water conservancy diversion along the thickness direction of second deflector Plate.

11. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 8, which is characterized in that described second An at least preset clearance is equipped in deflector；The hot superconductive plate further includes an at least cushion block, and the cushion block is located at described reserved In gap；The height of the cushion block is identical as the height of second deflector, and is equipped in the cushion block along its short transverse First installation through-hole of perforation；At least one the second installation through-hole along the perforation of its thickness direction is additionally provided on first cover board, Second installation through-hole is correspondingly arranged with first installation through-hole；At least one is additionally provided on second cover board along its thickness The third installation through-hole of direction perforation, the third installation through-hole are correspondingly arranged with first installation through-hole.

12. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 8, which is characterized in that described second An at least preset clearance is equipped in deflector；First cover board or second cover board are equipped with an at least punching press boss, institute The inner surface for stating punching press boss from first cover board or second cover board is convexly equipped in the preset clearance, and the punching press is convex The height of platform is identical as the height of second deflector, and first penetrated through along its short transverse is equipped in the punching press boss It is additionally provided at least one on installation through-hole, second cover board or first cover board and is installed along the second of the perforation of its thickness direction and leads to Hole, second installation through-hole are correspondingly arranged with first installation through-hole.

13. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to any one of claim 1 to 7, feature exist In the hot superconductive plate includes:

First cover board；

Second cover board, including cover plate main body and annular convex edge, the annular convex edge and the cover plate main body integrally connected；Described One cover board adheres on surface of the annular convex edge far from the cover plate main body, in first cover board and the cover board master Sealed chamber is formed between body；

At least one second deflector is located in the sealed chamber；Second deflector includes several between first direction Every the protrusion arranged and extended in a second direction, wherein the first direction and the second direction are perpendicular, the first party The bottom integrally connected of the upward adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that It obtains and forms the sealed passage between second deflector and first cover board and second cover board.

14. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 13, which is characterized in that the heat is super Guide plate includes at least two pieces of second deflectors, length and the length phase on the inside of the annular convex edge of second deflector Together；There is gap, to form the heat-transfer working medium between adjacent second deflector between adjacent second deflector The first balance channel, first balance channel extends along the first direction；Described in one closed on the annular convex edge Second deflector and the annular convex edge have gap, described in being formed between second deflector and the annular convex edge Second balance channel of heat-transfer working medium, second balance channel extend along the first direction；The height of second deflector It spends identical as the height of the annular convex edge.

15. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 13, which is characterized in that the protrusion Side wall be equipped with several deflector holes, the deflector hole runs through second water conservancy diversion along the thickness direction of second deflector Plate.

16. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 13, which is characterized in that described second An at least preset clearance is equipped in deflector；The hot superconductive plate further includes an at least cushion block, and the cushion block is located at described reserved In gap；The height of the cushion block is identical as the height of second deflector, and is equipped in the cushion block along its short transverse First installation through-hole of perforation；At least one the second installation through-hole along the perforation of its thickness direction is additionally provided on first cover board, Second installation through-hole is correspondingly arranged with first installation through-hole；At least one is additionally provided on second cover board along its thickness The third installation through-hole of direction perforation, the third installation through-hole are correspondingly arranged with first installation through-hole.

17. the hot superconduction panel radiator of air-cooled liquid-cooling combined type according to claim 13, which is characterized in that described second An at least preset clearance is equipped in deflector；First cover board or second cover board are equipped with an at least punching press boss, institute The inner surface for stating punching press boss from first cover board or second cover board is convexly equipped in the preset clearance, and the punching press is convex The height of platform is identical as the height of second deflector, and first penetrated through along its short transverse is equipped in the punching press boss It is additionally provided at least one on installation through-hole, second cover board or first cover board and is installed along the second of the perforation of its thickness direction and leads to Hole, second installation through-hole are correspondingly arranged with first installation through-hole.