Radiator and water heater composite structure
Technical field
The invention belongs to technical field of heat transfer, more particularly to a kind of radiator and water heater composite structure.
Background technique
Block chain is the account book database that one and another data block constantly connects, and the account book is by multiple on network
Node safeguards jointly, cracks difficulty due to Encryption Algorithm and cryptography, guarantees that its data can not be tampered.Bit coin behind
Technology is block chain technology, and the most successful application of block chain at present.
Bit coin is the P2P network based on workload (PoW), is constituted using nodes numerous in entire P2P network distributed
Database confirms and records All Activity behavior, and uses the safety for being designed to ensure that money flow links of cryptography
Property.Bit coin is to be solved by Computing complicated algorithm according to special algorithm, obtaining particular solution (meeting proof of work)
Afterwards, it verifies the newest transaction in the part on bit coin network and is wrapped into deposit new block, then new block can be linked at bit
It is broadcasted on coin long-chain and to whole network, after a number of other nodes confirmation for obtaining whole network, or it is newest as block chain
Block and it is irreversible.Computer owner can obtain bit coin as reward during this, and here it is the distribution of bit coin
Mode, also referred to as digging mine.
The digging mine of bit coin is that have not be that participant can dig, and participant needs faster than whose speed.In bit coin
The early stage of development can be run with the CPU of common PC since participant is less and dig mine software digging mine, but increased when participating in digging mine number
Add, along with equation solution difficulty increases, needs the GPU based on the numerous stream handles of FPGA, and based on ASIC (integrated electricity
Road) profession dig mine chip mine machine, later again developed to concentrates a large amount of mine machines mining site, concentrate network calculation power mine pond.
Digging mine owner will be made of power supply, driving and control panel, calculation power plate and radiator, and one block of calculation power plate is equipped with tens
A profession digs mine chip, consumes a large amount of electric energy at runtime, while generating a large amount of heat, and the temperature of chip and energy consumption at
Direct ratio.Control inter-chip traces temperature is usually required that within 90 DEG C, when chip node temperature is higher than 110 DEG C, Jiu Huijin
Enter self-shield mode and delay machine.By taking the digging mine that 2.7T calculates power calculates power plate as an example, when node temperature is at 80 DEG C, power consumption in 250W,
When node temperature rises to 90 DEG C, power consumption is in 320W, when node temperature rises to 100 DEG C, calculates power and drops to 2T, power consumption rises to
350W。
Therefore it digs mine machine and calculates effective heat dissipation of power plate and the reasonable utilization of waste heat, be block chain technology and digging mine machine hair
One of core key technology of exhibition.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of radiators and water heater to combine
Structure, the heat-sinking capability for solving radiator in the prior art is limited, cannot form effective heat dissipation to high power device, into
And limit the problem of heat that high-power radiator generates rationally utilizes.
In order to achieve the above objects and other related objects, the present invention provides a kind of radiator and water heater composite structure, institute
It states radiator and water heater composite structure includes:
Hot superconductive plate is formed with interconnected sealed passage in the hot superconductive plate, is filled in the sealed passage
Heat-transfer working medium;The hot superconduction plate surface is equipped with heat source installation region;
Liquid cooling heat radiator positioned at the surface of the hot superconductive plate, and is located at except the heat source installation region, the liquid cooling
Fluid passage is formed in radiator, the liquid cooling heat radiator is equipped with the inlet being connected with the fluid passage and out liquid
Mouthful;
Water heater main body, inside are contained with water to be heated;The water heater main body is equipped with and the water heater main body
The water inlet and water outlet that inside is connected;
Heat exchanger is located in the water heater main body;
First circulation pipe, one end are connected with the inlet, and the other end is connected with the heat exchanger;
Second circulation pipe, one end are connected with the liquid outlet, and the other end is connected with the heat exchanger;
Circulating pump is located on the first circulation pipeline or the second circulation pipeline.
As a preferred solution of the present invention, the liquid cooling heat radiator includes the first deflector and fluid passage cover board;It is described
One surface of fluid passage cover board is formed with holding tank, and it is super that the surface that the fluid passage cover board is formed with the holding tank adheres on the heat
On the surface of guide plate, to form fluid passage chamber between the fluid passage cover board and the hot superconductive plate;First deflector position
In in the fluid passage chamber, and it is fixed on the surface of the hot superconductive plate, in first deflector and the hot superconductive plate
And the interconnected fluid passage is formed between the fluid passage cover board;The inlet and the liquid outlet are respectively positioned on described
On fluid passage cover board.
As a preferred solution of the present invention, the holding tank includes the first holding tank and the second holding tank, and described the
One holding tank and second holding tank include opposite first end and second end;The quantity of first deflector is two
Block, first deflector are located at first holding tank, and another first deflector is located at second holding tank
It is interior;The inlet is located at the first end of first holding tank, is connected with first holding tank, the liquid outlet is located at
The first end of second holding tank, and be connected with second holding tank;The second end of first holding tank with it is described
The second end of second holding tank is connected.
As a preferred solution of the present invention, first deflector includes:
Several the first flow guide bars, first flow guide bar is along perpendicular to the first holding tank first end to described first
The direction of holding tank second end is wave-shaped or square-wave-shaped extends, and several articles of first flow guide bars are along first holding tank the
One end to the first holding tank second end direction parallel arrangement;
First connecting portion, positioned at the both ends of first flow guide bar, and with each equal integrally connected of first flow guide bar.
As a preferred solution of the present invention, first deflector includes several flat first flow guide bars,
Several first flow guide bars are along perpendicular to the first holding tank first end to the direction of the first holding tank second end
Parallel interval arrangement.
As a preferred solution of the present invention, the radiator and water heater composite structure further include:
First radiating fin positioned at an at least surface for the hot superconductive plate, and is located at except the heat source installation region,
The first heat dissipation channel of several parallel intervals arrangement is formed in first radiating fin;
Second radiating fin, the surface positioned at the liquid cooling heat radiator far from the hot superconductive plate;Second radiating fin
The second heat dissipation channel of several parallel intervals arrangement, second heat dissipation channel and first heat dissipation channel are formed in piece
It is parallel;
Partition, the partition are placed on the hot superconductive plate, and the hot superconductive plate is divided into first part and
Two parts;Wherein, the first part is located at the top of the partition, and the second part is located at the lower section of the partition;Institute
The surface that the first radiating fin is located at the first part is stated, the liquid cooling heat radiator is located at the surface of the first part;Institute
State the surface that heat source installation region is located at the second part;
Power device, the power device is located at the surface of the hot superconductive plate, and is located in the heat source installation region;
Seal case, the seal case side are formed with opening, and the seal case is placed on institute via the opening
State the periphery of power device and the second part;The width of the opening is less than or equal to the width of the partition, the opening
Length be less than or equal to the partition length.
As a preferred solution of the present invention, the radiator and water heater composite structure further include:
Shell is placed on the hot superconductive plate, the liquid cooling heat radiator, first radiating fin and second heat dissipation
The top and outside of fin, to form air duct between the shell in the hot superconductive plate;
An at least fan is located at first radiating fin one end, and is located at the hull outside, the outlet air of the fan
Facing towards first radiating fin, and it is perpendicular with the extending direction of first heat dissipation channel.
As a preferred solution of the present invention, the power device includes that virtual digit coin digs mine machine calculation power chipset
Plate.
As a preferred solution of the present invention, the radiator and water heater composite structure further include:
Electric heating system, the electric heating system include: heating device and electric connection line, and the heating device is located at described
In water heater main body;Described electric connection line one end is connected with the heating device;
Temperature probe, one end are inserted in the water heater main body.
As a preferred solution of the present invention, the radiator and water heater composite structure further include circulating liquid tank,
Circulating liquid is contained with inside the circulating liquid tank;The described one end of first circulation pipeline far from the inlet is via described
Circulating liquid tank is connected with the heat exchanger.
As a preferred solution of the present invention, the hot superconductive plate includes: annular peripheral frame, the first cover board, the second cover board
And at least one second deflector;Wherein,
First cover board adheres on a surface of the annular peripheral frame, and second cover board adheres on the annular edge
On surface of the frame far from first cover board, to form sealed chamber between first cover board and second cover board;
Second deflector is located in the sealed chamber;Second deflector includes several between first direction
Every the protrusion arranged and extended in a second direction, wherein the first direction and the second direction are perpendicular, the first party
The bottom integrally connected of the upward adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that
It obtains and forms the sealed passage between second deflector and first cover board and second cover board.
As a preferred solution of the present invention, the hot superconductive plate includes at least two pieces of second deflectors, described
The length of second deflector is identical as the length on the inside of the annular peripheral frame;There is gap between adjacent second deflector,
To form the first balance channel of the heat-transfer working medium between adjacent second deflector, first balance channel is along institute
State first direction extension;Second deflector and the annular peripheral frame closed on the annular peripheral frame has gap, with
The second balance channel of the heat-transfer working medium, second balance are formed between second deflector and the annular peripheral frame
Channel extends along the first direction;The height of second deflector is identical as the height of the annular peripheral frame.
As a preferred solution of the present invention, the side wall of the protrusion is equipped with several deflector holes, the deflector hole
Thickness direction along second deflector runs through second deflector.
As a preferred solution of the present invention, an at least preset clearance is equipped in second deflector;The heat is super
Guide plate further includes an at least cushion block, and the cushion block is located in the preset clearance;The height of the cushion block and second water conservancy diversion
The height of plate is identical, and the first installation through-hole penetrated through along its short transverse is equipped in the cushion block;On first cover board also
The second installation through-hole penetrated through equipped at least one along its thickness direction, second installation through-hole and first installation through-hole pair
It should be arranged;At least one third installation through-hole along the perforation of its thickness direction, the third installation are additionally provided on second cover board
Through-hole is correspondingly arranged with first installation through-hole.
As a preferred solution of the present invention, an at least preset clearance is equipped in second deflector;Described first
Cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is covered from first cover board or described second
The inner surface of plate is convexly equipped in the prepsetting gap, and the height of the punching press boss is identical as the height of second deflector,
And the first installation through-hole penetrated through along its short transverse, second cover board or first cover board are equipped in the punching press boss
On be additionally provided at least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first installation are logical
Hole is correspondingly arranged.
As a preferred solution of the present invention, the hot superconductive plate includes:
First cover board;
Second cover board, including cover plate main body and annular convex edge, the annular convex edge and the cover plate main body integrally connected;Institute
It states the first cover board to adhere on surface of the annular convex edge far from the cover plate main body, in first cover board and the lid
Sealed chamber is formed between plate main body;
At least one second deflector is located in the sealed chamber;Second deflector includes several along first party
To the protrusion for being intervally arranged and extending in a second direction, wherein the first direction and the second direction are perpendicular, and described
The bottom integrally connected of the adjacent protrusion on one direction, and there is gap on the inside of the protrusion and between the adjacent protrusion,
So that forming the sealed passage between second deflector and first cover board and second cover board.
As a preferred solution of the present invention, the hot superconductive plate includes at least two pieces of second deflectors, described
The length of second deflector is identical as the length on the inside of the annular convex edge;There is gap between adjacent second deflector,
To form the first balance channel of the heat-transfer working medium between adjacent second deflector, first balance channel is along institute
State first direction extension;Second deflector closed on the annular convex edge and the annular convex edge have gap, with
The second balance channel of the heat-transfer working medium, second balance are formed between second deflector and the annular convex edge
Channel extends along the first direction;The height of second deflector is identical as the height of the annular convex edge.
As a preferred solution of the present invention, the side wall of the protrusion is equipped with several deflector holes, the deflector hole
Thickness direction along second deflector runs through second deflector.
As a preferred solution of the present invention, an at least preset clearance is equipped in second deflector;The heat is super
Guide plate further includes an at least cushion block, and the cushion block is located in the preset clearance;The height of the cushion block and second water conservancy diversion
The height of plate is identical, and the first installation through-hole penetrated through along its short transverse is equipped in the cushion block;On first cover board also
The second installation through-hole penetrated through equipped at least one along its thickness direction, second installation through-hole and first installation through-hole pair
It should be arranged;At least one third installation through-hole along the perforation of its thickness direction, the third installation are additionally provided on second cover board
Through-hole is correspondingly arranged with first installation through-hole.
As a preferred solution of the present invention, an at least preset clearance is equipped in second deflector;Described first
Cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is covered from first cover board or described second
The inner surface of plate is convexly equipped in the prepsetting gap, and the height of the punching press boss is identical as the height of second deflector,
And the first installation through-hole penetrated through along its short transverse, second cover board or first cover board are equipped in the punching press boss
On be additionally provided at least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first installation are logical
Hole is correspondingly arranged.
As described above, radiator and water heater composite structure of the invention, have the advantages that
1. by the surface that power device is adhered on to hot superconductive plate, and the setting of hot superconduction plate surface by circulation pipe with
The liquid cooling heat radiator that circulating liquid tank is connected, and recycle tube portion and be located in water heater main body, it is worked normally in power device
In the case where, hot superconductive plate and liquid cooling heat radiator can rationally utilize the heat that power device generates, and can be used for hot water
Cold water in device main body carries out heating and generates hot water for hot water for life or heating hot water, and energy saving improves quality of the life;
2. power device select virtual digit coin dig mine machine calculate power chipset plate, reasonably by virtual digit coin dig mine machine and
Radiator and water heater composite structure both functions combine, and other than power device needs electric energy, do not need additional
Electric energy heats the intracorporal cold water of water heater master, the case where consuming same electric energy, that is, can produce and digs mine operation generation
Income, and can will dig mine machine and calculate the heat that power chipset plate produces and be used to heat cold water, thus generate for hot water for life or
Heating hot water;
3. the first deflector is arranged in liquid cooling heat radiator, deflector increases heat exchange area, to mention in addition to enhancing liquid perturbation
Outside high heat-sinking capability, the effect of reinforcing rib is also acted as, can reduce the thickness of liquid cooling cover board, to mitigate the entirety weight of radiator
Amount;
4. being filled with heat-transfer working medium in hot superconductive plate inner seal chamber body, inhibit by heat-transfer working medium phase-change heat transfer or phase transformation
Heat transfer, forms the hot superconducting characteristic of quick conductive, and equivalent heat conductivity makes entire hot superconductive plate temperature up to 4000W/m DEG C or more
Degree uniformly, reduces the temperature difference between each power device, improves the radiating efficiency of radiator;
5. it can be radiated using water cooling and air-cooled two kinds of forced heat radiation modes to power device by setting fan,
Hot superconductive plate is thermally conductive fast again, and temperature is uniform, makes total compact, small in size, light-weight under same radiating condition, can be with
Big heat heat exchange is realized under very low wind speed, achievees the purpose that low noise or mute;Meanwhile using air-cooled and liquid cooling two heat dissipations
System, after the intracorporal cold water of water heater master is heated to predetermined temperature, circulating pump stops working, and liquid cooling heat radiator stops dissipating
Heat has higher reliability at this point, starting fan, the radiating mode of power device are switched to air-cooled mode by water cooling naturally;
6. being welded with radiating fin on hot superconductive plate, hot superconductive plate can be conducted the heat come quickly by sky by radiating fin
Gas is taken away and is dissipated, and radiating fin is the heat exchange area increased with air, reduces system thermal resistance, improves heat-sinking capability, again
Play the role of reinforcing hot superconductive plate, to reduce the material thickness of hot superconductive plate, improves intensity, mitigate weight, reduce cost;It adopts
With the mode of welding by both sides radiating fin, it is existing because of radiating fin excessive height, radiating fin to avoid traditional Section Bar Heat Sinks
The low defect of tail end radiating efficiency, improves the radiating efficiency of radiating fin;
7. power device is set to two opposite surfaces of hot superconductive plate, compact-sized, small in size, good heat dissipation effect;
8. partition is arranged on hot superconductive plate, hot superconductive plate is divided into upper and lower first part and second part, position by partition
Power device is set in the second part surface of lower section, and is sealed second part by setting seal case, realizes power device
Totally-enclosed, raising degree of protection and the reliability of part;
9. being seal cavity inside hot superconductive plate, and be equipped with the second deflector, internal second deflector the first cover board and
Second cover board welds together, that is, plays booster action, and two sides cover sheet thickness is thinned, and bearing capacity increases, and intensity improves, and subtracts
The weight and thickness of slight fever superconductive plate, and the heat exchange area inside increase, enhance the hot superconduction capacity of heat transmission;
10. carrying out being heated to one to the intracorporal cold water of water heater master with heat exchanger first by setting electric heating system
After determining temperature, restart higher temperature of the electric heating system by the intracorporal hot water heating of water heater master to setting.Or two sets
Heating system is heating simultaneously, and the intracorporal water of water heater master is made to quickly reach set temperature in a short time, makes in time for user
With.Or when heat exchanger system is in shutdown maintenance, starting electric heating system to guarantee client at any time has hot water use, have compared with
High reliability and using flexible.
Detailed description of the invention
Fig. 1 and Fig. 2 is shown as the stereochemical structure of the radiator provided in the embodiment of the present invention one and water heater composite structure
Schematic diagram.
Fig. 3 is shown as the explosion of part-structure in the radiator provided in the embodiment of the present invention one and water heater composite structure
Structural schematic diagram.
Fig. 4 is shown as the solid of part-structure in the radiator provided in the embodiment of the present invention one and water heater composite structure
Structural schematic diagram.
Fig. 5 to Fig. 7 is shown as the liquid cooling in the radiator provided in the embodiment of the present invention one and water heater composite structure and dissipates
The schematic perspective view of hot device.
Fig. 8 is shown as the quick-fried of the hot superconductive plate in the radiator provided in the embodiment of the present invention one and water heater composite structure
Fried structural schematic diagram.
Fig. 9 is shown as the vertical of the hot superconductive plate in the radiator provided in the embodiment of the present invention one and water heater composite structure
Body structural schematic diagram.
It is super that Figure 10 to Figure 15 is shown as the heat in the radiator provided in the embodiment of the present invention one and water heater composite structure
The structural schematic diagram of different exemplary deflectors in guide plate;Wherein, Figure 11 is the front view of Figure 10, and Figure 13 is facing for Figure 12
Figure, Figure 15 are the front view of Figure 14.
Figure 16 is shown as the part of the radiator provided in the embodiment of the present invention one and water heater composite structure marginal portion
Cross section structure schematic diagram.
Figure 17 to Figure 21 is shown as difference in the radiator provided in the embodiment of the present invention one and water heater composite structure and shows
The schematic perspective view of the radiating fin of example.
Figure 22 is shown as having preset clearance in the radiator provided in the embodiment of the present invention two and water heater composite structure
Hot superconductive plate configuration schematic diagram.
Figure 23, which is shown as the radiator provided in the embodiment of the present invention two and water heater composite structure, has block portion
Partial cross section's structural schematic diagram.
Figure 24 is shown as having punching press boss in the radiator provided in the embodiment of the present invention two and water heater composite structure
Hot superconductive plate configuration schematic diagram.
Figure 25 is shown as the hot superconductive plate in the radiator provided in the embodiment of the present invention three and water heater composite structure
Configuration schematic diagram.
Figure 26 is shown as in the hot superconductive plate in the radiator provided in the embodiment of the present invention three and water heater composite structure
Deflector be placed in the overlooking structure diagram in annular peripheral frame.
Figure 27 is shown as having preset clearance in the radiator provided in the embodiment of the present invention four and water heater composite structure
And the configuration schematic diagram of the hot superconductive plate of cushion block.
Figure 28 is shown as in the hot superconductive plate in the radiator provided in the embodiment of the present invention four and water heater composite structure
Deflector be placed in the overlooking structure diagram in annular peripheral frame.
Figure 29 is shown as having punching press boss in the radiator provided in the embodiment of the present invention four and water heater composite structure
Hot superconductive plate configuration schematic diagram.
Figure 30 is shown as the hot superconductive plate in the radiator provided in the embodiment of the present invention five and water heater composite structure
Configuration schematic diagram.
Figure 31 is shown as having preset clearance in the radiator provided in the embodiment of the present invention six and water heater composite structure
Hot superconductive plate configuration schematic diagram.
Figure 32 is shown as the hot superconductive plate in the radiator provided in the embodiment of the present invention seven and water heater composite structure
Configuration schematic diagram.
Figure 33 is shown as in the radiator provided in the embodiment of the present invention seven and water heater composite structure in hot superconductive plate
Deflector is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.
Figure 34 is shown as having preset clearance in the radiator provided in the embodiment of the present invention eight and water heater composite structure
And the configuration schematic diagram of the hot superconductive plate of cushion block.
Figure 35 is shown as in the radiator provided in the embodiment of the present invention eight and water heater composite structure in hot superconductive plate
Deflector is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.
Figure 36 is shown as having punching press boss in the radiator provided in the embodiment of the present invention eight and water heater composite structure
Hot superconductive plate configuration schematic diagram.
Component label instructions
10 hot superconductive plates
100 first cover boards
101 second cover boards
1011 cover plate main bodies
1012 annular convex edges
102 annular peripheral frames
1021 filling aperture
103 second deflectors
1031 protrusions
1032 deflector holes
1033 second flow guide bars
1034 second connecting portions
1035 preset clearances
104 first solder layers
105 second solder layers
106 sealed passages
1061 heat-transfer working mediums
107 first balance channels
108 second balance channels
109 cushion blocks
110 first installation through-holes
111 second installation through-holes
112 third installation through-holes
113 punching press boss
114 filling tubes
115 third solder layers
116 the 4th solder layers
117 first parts
118 second parts
119 heat source installation regions
20 first radiating fins
201 first heat dissipation channels
202 L shape fins
203 stiffeners
204 heat sink strips
30 liquid cooling heat radiators
301 first deflectors
3011 first flow guide bars
3012 first connecting portions
302 fluid passage cover boards
3021 first holding tanks
3022 second holding tanks
3023 inlets
3024 liquid outlets
401 fans
402 shells
403 partitions
404 power devices
405 seal cases
50 second radiating fins
501 second heat dissipation channels
60 water heater main bodys
601 water outlets
602 water
701 heat exchangers
702 first circulation pipes
703 second circulation pipes
704 circulating pumps
705 circulating liquid tanks
706 circulating liquids
801 electric heater units
802 electric connection lines
803 temperature probes
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Please refer to Fig.1 to Fig.3 6.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., are only used
To cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can
The qualifications of implementation, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill
Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and
The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness
It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
Embodiment one
Please refer to Fig. 1 to Figure 15, the present invention provides a kind of radiator and water heater composite structure, the radiator and hot water
Device composite structure includes: hot superconductive plate 10, and interconnected sealed passage 106 is formed in the hot superconductive plate 10, described close
It seals and is filled with heat-transfer working medium 1061 in channel 106;10 surface of hot superconductive plate is equipped with heat source installation region 119;Liquid cooling dissipates
Hot device 30, the night cold heat sink 30 are located at the surface of the hot superconductive plate 10, and be located at the heat source installation region 119 it
Outside, fluid passage is formed in the liquid cooling heat radiator 30, the liquid cooling heat radiator 30 is equipped with to be connected with the fluid passage
Logical inlet 3023 and liquid outlet 3024;Water heater main body 60 is contained with water to be heated inside the water heater main body 60
602;The water heater main body 60 is equipped with and the water inlet (not shown) and water outlet that are connected inside the water heater main body 60
Mouth 601;Heat exchanger 701, the heat exchanger 701 are located in the water heater main body 60;First circulation pipe 702, described
One circulation line, 702 one end is connected with the inlet 3023, and the other end is connected with the heat exchanger 701;Second follows
Endless tube 703, described 703 one end of second circulation pipe are connected with the liquid outlet 3024, the other end and 701 phase of heat exchanger
Connection;Circulating pump 704, the circulating pump 704 are located on the first circulation pipeline 702 or the second circulation pipeline 703.
It should be noted that hot super heat conduction includes filling work in closed interconnected micro-channel system
Medium realizes the hot pipe technique of hot superconductive heat transfer by the evaporation of working media with condensation phase transformation;And pass through control enclosed system
Middle working media micro-architectural state, i.e., in diabatic process, the boiling (or condensation of gaseous medium) of liquid medium is suppressed, and
Reach the consistency of working medium micro-structure on this basis, and realizes the phase transformation of efficient heat transfer and inhibit (PCI) heat transfer technology.This implementation
In example, the hot superconductive plate can inhibit heat sink for phase transformation, at this point, the heat-transfer working medium in the hot superconductive plate is conducting heat
During boil or condensation is suppressed, and reach the consistency of working medium micro-structure on this basis and realize heat transfer.This implementation
In example, the hot superconductive plate may be adopting heat pipes for heat transfer plate, at this point, the heat-transfer working medium in the hot superconductive plate was conducting heat
It is carried out continuously evaporation endothermic in journey and condenses exothermic phase transformation circulation to realize flash heat transfer.
As an example, the heat-transfer working medium 1061 is fluid, it is preferable that the heat-transfer working medium 1061 can be gas or liquid
The mixture of body or gas and liquid, it is further preferable that in the present embodiment, the heat-transfer working medium 1061 is the mixed of liquid and gas
Close object.
As an example, the liquid cooling heat radiator 30 includes the first deflector incorporated by reference to Fig. 1 with continued reference to shown in Fig. 5 to Fig. 7
301 and fluid passage cover board 302;One surface of the fluid passage cover board 302 is formed with holding tank, and the fluid passage cover board 302 is formed
The surface for stating holding tank adheres on the surface of the hot superconductive plate 10, in the fluid passage cover board 302 and the hot superconductive plate
Fluid passage chamber is formed between 10;First deflector 301 is located in the fluid passage chamber, and is fixed on the hot superconductive plate 10
Surface, between first deflector 301 and the hot superconductive plate 10 and the fluid passage cover board 302 formed be interconnected
The fluid passage;The inlet 3023 and the liquid outlet 3024 are respectively positioned on the fluid passage cover board 302;The feed liquor
Mouth 2034 is connected with an inlet tube 119, and the liquid outlet 3024 is connected with an outlet tube 120.
As an example, the holding tank includes the first holding tank 3021 and the second holding tank 3022, first holding tank
3021 and second holding tank 3022 include opposite first end and second end;The quantity of first deflector 301 is
Two pieces, first deflector 301 is located at first holding tank 3021, and another first deflector 301 is located at
In second holding tank 3022;The inlet 3023 is located at the first end of first holding tank 3021, with described first
Holding tank 3021 is connected, and the liquid outlet 3024 is located at the first end of second holding tank 3022, and holds with described second
Slot 3022 of receiving is connected;The second end of first holding tank 3021 is connected with the second end of second holding tank 3022.
In one example, as shown in Figures 5 and 6, first deflector 301 includes: several the first flow guide bars 3011
And first connecting portion 3012, first flow guide bar 3011 is along perpendicular to 3021 first end of the first holding tank to described first
The direction of 3021 second end of holding tank is wave-shaped or square-wave-shaped extends, and several first flow guide bars 3011 are along described first
3011 first end of holding tank to 3011 second end of the first holding tank direction parallel arrangement;Specifically, holding with described first
Receiving the direction of 3021 first end of slot to 3021 first end of the first holding tank is that the length direction of the fluid passage cover board 302 is
Example, several described first flow guide bars 3011 are wave-shaped along the width direction of the fluid passage cover board 302 or square-wave-shaped extends, and
Length direction parallel arrangement of several described first flow guide bars 3011 along the fluid passage cover board 302;The first connecting portion
3012 be located at first flow guide bar 3011 both ends, and with the equal integrally connected of each first flow guide bar 3011.
In another example, as shown in fig. 7, first deflector 301 includes several flat first flow guide bars
3011, several first flow guide bars 3011 are along perpendicular to 3021 first end of the first holding tank to first holding tank
The direction parallel interval of 3021 second ends is arranged;Specifically, being accommodated with 3021 first end of the first holding tank to described first
The direction of 3021 first end of slot is several 3011 edges of the first flow guide bar for the length direction of the fluid passage cover board 302
The length direction of the fluid passage cover board 302 extends, and arranges along the width direction parallel interval of the fluid passage cover board 302.
As an example, as can be seen from figures 8 and 9, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100,
Two cover boards 101 and at least one second deflector 103, wherein first cover board 100 adheres on the one of the annular peripheral frame 102
On surface, second cover board 101 is adhered on surface of the annular peripheral frame 102 far from first cover board 100, in institute
It states and forms sealed chamber between the first cover board 100 and second cover board 101;Second deflector 103 is located at the sealing
In chamber;Second deflector 103 includes the protrusion that several are intervally arranged along first direction and extend in a second direction
1031, wherein the first direction and the second direction are perpendicular, the bottom of the adjacent protrusion 1031 on the first direction
Portion's integrally connected, and there is gap between 1031 inside of the protrusion and the adjacent protrusion 1031, so that described second leads
Interconnected sealed passage 106 is formed between flowing plate 103 and first cover board 100 and second cover board 101;It is described close
It seals and is filled with heat-transfer working medium 1061 in channel 106.It should be noted that the direction that the arrow a in Figure 10, Figure 12 and Figure 14 is indicated
The as described first direction, the direction that arrow b is indicated is the second direction;The first direction can lead for described second
The length direction of flowing plate 103, the second direction is the width direction of second deflector 103, the first direction at this time
Or the width direction of second deflector 103, the second direction is the length of second deflector 103 at this time
Direction.
It should be noted that due on the inside of the annular peripheral frame 102 be hollow area, first cover board 100 with it is described
It, can be in first cover board 100, second cover board after second cover board, 101 note is placed in the upper and lower surface of the annular peripheral frame 102
101 and the annular peripheral frame 102 on the inside of formed an airtight chamber.
The bottom integrally connected of the adjacent protrusion 1031 on the specific first direction, and 1031 lower section of the protrusion
And there is gap between the adjacent protrusion 1031, it can thus make second deflector 103 to be in along its length
The convex-concave shape of alternate intervals is arranged.
As an example, as shown in figure 16, the hot superconductive plate 10 further includes the first solder layer 104 and the second solder layer 105;
Wherein, first solder layer 104 is located at first cover board 100 and the annular peripheral frame 102 and second deflector 103
Between, first cover board 100 and the annular peripheral frame 102 and second deflector 103 are welded together;Described
Two solder layers 105 are between second cover board 101 and the annular peripheral frame 102 and second deflector 103, by institute
The second cover board 101 is stated to weld together with the annular peripheral frame 102 and second deflector 103.
As an example, the height of second deflector 103 is identical as the height of the annular peripheral frame 102.By described
The height of two deflectors 103 is set as identical as the height of the annular peripheral frame 102, it can be ensured that second deflector 103
Reach maximum with the bonding area of first solder layer 104 and second solder layer 105, to increase weld strength.
As an example, as shown in figure 8, the side of the annular peripheral frame 102 is equipped with the filling aperture 1021 through side wall.It is described
After first cover board 100, second cover board 101 and the annular peripheral frame 102 and second deflector 103 weld together,
The filling aperture 1021 is inserted into one end of one filling tube 114 to fill the heat-transfer working medium into the sealed passage 106
1061.After the populated heat-transfer working medium 1061, the filling aperture 1021 should be enclosed so that the sealed passage 106 is realized
Sealing.
In one example, second deflector 103 can be but be not limited only to one piece of plate stamping and form, such as Fig. 8 and
Shown in Figure 10, the length of second deflector 103 is identical as the length of 102 inside of annular peripheral frame, and described second leads
The width of flowing plate 103 is of same size with 102 inside of annular peripheral frame;The side wall of the protrusion 1031 is equipped with several and leads
Discharge orifice 1032, the deflector hole 1032 run through second deflector 103 along the thickness direction of second deflector 103.Tool
Body, as shown in Figures 10 and 11, along the first direction, second deflector 103 can extend in square-wave-shaped, i.e., described
Second deflector 103 includes several along the protrusion 1031 that first direction is intervally arranged, and the phase along the first direction
The bottom of the adjacent protrusion 1031 is connected with each other, and concave between the adjacent protrusion 1031.Certainly, in other examples,
Second deflector 103 wave-shaped can also extend along the first direction, but preferably described second deflector, 103 edge
The first direction extends in square-wave-shaped, may insure upper surface (the i.e. described protrusion 1031 of second deflector 103 in this way
Top surface) and lower surface (bottom surface of the recess portion between the i.e. adjacent protrusion 13) in planar, may insure so described
The contact area of second deflector 103 and first solder layer 104 and second solder layer 105 is as big as possible, to mention
High weld strength.First cover board 100, second cover board 101 and the annular peripheral frame 102 and second deflector
It is gap between the protrusion 1031 of second deflector 103 and second solder layer 105, described after 103 weld together
Gap between recess and first solder layer 104 and the deflector hole 1032 between protrusion 1031 collectively form described
Sealed passage 106.In this example, second deflector 103 is run through along the second direction in the protrusion 1031, i.e., described
Protrusion 1031 extends through second deflector 103 along the second direction, that is, the length of the protrusion 1031 with it is described
Second direction is identical.Several deflector holes 1032, the institute on each protrusion 1031 are equipped on each protrusion 1031
It states extending direction of the deflector hole 1032 along the protrusion 1031 to arrange in uniline or higher order interlace, and each 1031 two sides of the protrusion
Side wall on be equipped with the deflector hole 1032.The deflector hole 1032 on each protrusion 1031 can be as shown in Figure 10
It is arranged in a one-to-one correspondence, can also misplace arrangement.Due to the second deflector 103 described in the second direction and first weldering
There is enough gaps, the heat-transfer working medium 1061 is along the second direction between the bed of material 104 and second solder layer 105
On flowing it is very smooth, and the heat-transfer working medium 1061 is along the first direction (side that the i.e. described protrusion 1031 is intervally arranged
To) on circulation be obstructed, by the way that the deflector hole 1032 is arranged on the protrusion 1031, the heat-transfer working medium can be increased
1061 along the first direction flowing, to increase heat-transfer effect on the first direction, so that the heat-transfer working medium
1061 have almost the same mobility along the first direction and along the second direction, so that the entire hot superconductive plate
All directions heat dissipation effect having the same, so that the temperature of described 10 each region of hot superconductive plate is identical, and then effectively
It avoids causing the hair of the 10 regional area superheating phenomenon of hot superconductive plate since some or multiple directions heat dissipation effect are bad
It is raw.
In another example, as shown in FIG. 12 and 13, second deflector 103 includes: several along described second
The second flow guide bar 1033 and second connecting portion 1034 of direction parallel arrangement, second flow guide bar 1033 include several along institute
State the protrusion 1031 that first direction is intervally arranged;Second flow guide bar 1033 and the annular peripheral frame positioned at two sides
102 inside is in contact;The second connecting portion 1034 is located at the both ends of second flow guide bar 1033, and with described in several
Second flow guide bar 1033 is in integrally connected;Side and institute of the second connecting portion 1034 far from second flow guide bar 1033
The inside for stating annular peripheral frame 102 is in contact.In this example, the width of second deflector 103 and the annular peripheral frame 102
Inside it is of same size, the length of second deflector 103 is identical as the length of 102 inside of the annular peripheral frame.Described
Two flow guide bars 1033 can prolong along the first direction (length direction of generally described second flow guide bar 1033) in square-wave-shaped
It stretches, wave-shaped can also extend, i.e., described second flow guide bar 1033 includes what several were intervally arranged along the first direction
The protrusion 1031, the bottom of the adjacent protrusion 1031 is connected with each other along the first direction, and the adjacent protrusion
It is concave between 1031.Preferably, in the present embodiment, second flow guide bar 1033 prolongs along the first direction in square-wave-shaped
It stretches, may insure that the upper surface and the lower surface of second flow guide bar 1033 is plane in this way, that is, ensure second water conservancy diversion
The upper surface (top surface of the i.e. described protrusion 1031) of plate 103 and lower surface (i.e. the surface opposite with the top of the protrusion 1031)
In planar, second deflector 103 and first solder layer 104 and second solder layer may insure in this way
105 contact area is as big as possible, to improve weld strength.First cover board 100, second cover board 101 with it is described
After annular peripheral frame 102 and second deflector 103 weld together, the protrusion 1031 of second flow guide bar 1033 with it is described
The gap between the recess and first solder layer 104 between gap, the protrusion 1031 between second solder layer 105
And the gap between adjacent second flow guide bar 1033 collectively forms the sealed passage 106.
As an example, the protrusion 1031 on adjacent two rows second flow guide bar 1033 can be arranged in a one-to-one correspondence,
Institute i.e. along the second direction (i.e. second flow guide bar 1033 arrange direction), on the second flow guide bar 1033 described in each item
Protrusion 1031 is stated to be arranged in a one-to-one correspondence.Certainly, in other examples, described convex on adjacent two rows second flow guide bar 1033
Portion 1031 can also shift to install, and the protrusion 1031 on so-called adjacent two rows second flow guide bar 1033, which shifts to install, is
Refer to, the side of the protrusion 1031 on adjacent two rows second flow guide bar 1033 is staggered, as shown in FIG. 12 and 13;It is adjacent
The distance that the protrusion 1031 of two rows of second flow guide bars 1033 misplaces can be less than the width of the protrusion 1031, such as Figure 12 and
Shown in Figure 13, the distance that the protrusion 1031 of adjacent two rows second flow guide bar 1033 misplaces can also be equal to the protrusion 1031
Width, at this point, the second flow guide bar described in the protrusion 1031 of the second flow guide bar 1033 described in a row and a row adjacent thereto
Recess alignment between 1033 protrusion 1031.It should be noted that the institute on adjacent two rows second flow guide bar 1033
When stating protrusion 1031 and shifting to install, be arranged in a one-to-one correspondence every the protrusion 1031 arranged on second flow guide bar 1033, i.e., it is odd
Number arranges the protrusion on the second flow guide bar 1033 described in the protrusion 1031 and even rows on second flow guide bar 1033
1031 shift to install, and the protrusion 1031 on the second flow guide bar 1033 described in each odd row is arranged in a one-to-one correspondence, each even number
The protrusion 1031 arranged on second flow guide bar 1033 is also arranged in a one-to-one correspondence.
As an example, the side wall of the protrusion 1031 can be equipped with deflector hole 1032, described as shown in Figure 14 and Figure 15
Deflector hole 1032 runs through second flow guide bar 1033 along the thickness direction of second flow guide bar 1033.Due to along described second
Have between second flow guide bar 1033 and first solder layer 104 and second solder layer 105 on direction enough
Gap, the heat-transfer working medium 1061 is very smooth in the flowing in the second direction, and the heat-transfer working medium 1061 is along institute
The circulation for stating first direction (direction that i.e. described second flow guide bar 1033 extends) is obstructed, by being arranged on the protrusion 1031
The deflector hole 1032 can increase the heat-transfer working medium 1061 along the flowing of the first direction, to increase along described the
Heat-transfer effect on one direction, so that the heat-transfer working medium 1061 has almost along the first direction and along the second direction
Identical mobility, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that the heat
The temperature of 10 each region of superconductive plate is identical, and then effectively avoids causing since some or multiple directions heat dissipation effect are bad
The generation of the 10 regional area superheating phenomenon of hot superconductive plate.
As an example, being equipped on the side wall of each 1031 two sides of protrusion on each second flow guide bar 1033
The deflector hole 1032, the deflector hole on the direction that second flow guide bar 1033 extends, each protrusion 1031
1032 as shown in figure 14 can be arranged in a one-to-one correspondence, and can also misplace arrangement.
As an example, please continue to refer to Fig. 1 to Fig. 4, the radiator and water heater composite structure further include: the first heat dissipation
Fin 20, first radiating fin 20 is located at an at least surface for the hot superconductive plate 10, and is located at the heat source installing zone
Except domain 119, the first heat dissipation channel 201 of several parallel intervals arrangement is formed in first radiating fin 20;Second
Radiating fin 50, second radiating fin 50 are located at surface of the liquid cooling heat radiator 30 far from the hot superconductive plate 10;Institute
State the second heat dissipation channel 501 that the arrangement of several parallel intervals is formed in the second radiating fin 50, second heat dissipation channel
501 is parallel with first heat dissipation channel 201;Partition 403, the partition 403 are placed on the hot superconductive plate 10, will
The hot superconductive plate 10 is divided into first part 117 and second part 118;Wherein, the first part 117 is located at the partition
403 top, the second part 118 are located at the lower section of the partition 403;First radiating fin 20 is located at described first
The surface of part 117, first radiating fin 20 can be only located at the surface of the first part 117, can also distinguish position
In two opposite surfaces of the first part 117, at this point, being located at first radiating fin on hot 10 1 surface of superconductive plate
20 can be simultaneously positioned at the surface of the first part 117 and the surface of the second part 118;The liquid cooling heat radiator 30
In the surface of the first part 117;The heat source installation region 119 is located at the surface of the second part 118;Power device
404, the power device 404 is located at the surface of the hot superconductive plate 10, and is located in the heat source installation region 119;Sealing
Cabinet 405,405 side of seal case are formed with opening, and the seal case 405 is placed on the function via the opening
The periphery of rate device 404 and the second part 117;The width of the opening is less than or equal to the width of the partition 403, described
The length of opening is less than or equal to the length of the partition 403, it is preferable that in the present embodiment, the width of the opening in it is described every
The width of plate 403, the length of the opening are equal to the length of the partition 403.It should be noted that for the ease of aobvious in Fig. 3
Show, the seal case 405 is not placed on the periphery of the power device 404 and the second part 118, but specially moves
To the lower section of the second part 118.
In one example, first radiating fin 20 can be wave-shaped in the horizontal direction (as shown in figure 17), can also
To be in the horizontal direction in that square-wave-shaped extends (as shown in figure 18).First radiating fin 20 is wave-shaped or square in the horizontal direction
Wavy extension, can in a limited space in increase by the surface area of first radiating fin 20 to the maximum extent, to increase
Heat dissipation effect.
In another example, first radiating fin 20 along the vertical direction equally can wave-shaped or square-wave-shaped prolong
It stretches, wherein Figure 19 extends so that first radiating fin 20 is wave-shaped along the vertical direction as example.First radiating fin
Extension wave-shaped or square wave dress extend piece 20 along the vertical direction, can further increase the surface of first radiating fin 20
Product.
In another example, first radiating fin 20 can also include several tabular fins, also may include
Parallel interval is arranged in the horizontal direction for several L shape fins 202, several described tabular fins or the L shape fin 202,
As shown in figure 20.It should be noted that first radiating fin 20 further includes several stiffeners 203, the reinforcement at this time
Item 203 extends along the direction that the tabular fin or the L shape fin 202 are arranged, by each tabular fin or L shape
The concatenation of fin 202 is fixed, its mechanical strength is increased.
In another example, first radiating fin 20 can also include the heat sink strip of several parallel intervals arrangement
204, the equal integrally connected in end of each heat sink strip 204, as shown in figure 21.
As an example, as shown in figure 16, first radiating fin 20 can be via third solder layer 115 and solder layer
116 are fixedly welded on two opposite surfaces of the hot superconductive plate 10.Certainly, in other examples, first radiating fin 20
A surface of the hot superconductive plate 10 can also be only located at.
As an example, the specific structure of second radiating fin 50 can be with the specific knot of first radiating fin 20
Structure is identical, is not repeated herein.
As an example, the radiator and water heater composite structure further include: shell 402 and at least a fan 401, it is described
Shell 402 is placed on the hot superconductive plate 10, the liquid cooling heat radiator 30, first radiating fin 20 and second heat dissipation
The top and outside of fin 50, to form air duct between the shell 402 in the hot superconductive plate 10;401, the fan
In described first radiating fin, 20 one end, and it is located at 402 outside of the shell, the outlet air surface of the fan 401 is towards described the
One radiating fin 20, and it is perpendicular with the extending direction of first heat dissipation channel 201.It should be noted that the shell 402
Bottom and the shell 402 it is perpendicular with first heat dissipation channel 201 both ends of the surface it is opening-like, to ensure the shell
Body 402 can be placed on the top and outside of the hot superconductive plate 10 and first radiating fin 20, and ensure the shell
402 will not influence the air blast cooling heat dissipation of the radiator and water heater composite structure.
As an example, the quantity of the fan 401 can be set according to actual needs, Fig. 1 is into Fig. 3 with the wind
The quantity of fan 401 is two as an example, being not limited thereto in actual example.
As an example, the power device 404 may include that virtual digit coin digs mine machine and calculates power chipset plate, for example bit
Coin digs mine machine and calculates power chipset plate, certainly, is not limited in bit coin in actual example and digs mine machine calculation power chipset plate, arbitrarily
It is a kind of for obtain virtual digit coin digging mine machine calculate the hardened structure of power chipset should be included in it is interior.The power device 404 is (i.e.
The virtual digit coin digs mine machine and calculates power chipset plate) it may include calculating power plate control panel and calculation power plate;The calculation power plate posts
In the surface of the hot superconductive plate 10;The power plate control panel of calculating adheres on the surface of the hot superconductive plate 10, and with the calculation
Power plate is connected.The calculation power plate may include that several calculate power board chip, and the calculation power board chip can be used for according to specific
Algorithm solves, obtain the particular solution for meeting proof of work, and obtain corresponding secret key etc., the calculation power plate control panel is for controlling
Make the normal work for calculating power plate.It is art technology that the virtual digit coin, which digs mine machine and calculates the specific structure of power chipset plate,
Personnel are known, and the calculation power plate and the calculation power plate control panel also dawn known to those skilled in the art, no longer tired herein
It states.The hot superconductive plate 10 is adhered on by the way that virtual digit coin is dug mine machine calculation power chipset plate as the power device 404
Surface, the virtual digit coin, which is dug when mine machine calculates the work of the devices such as calculation power board chip of power chipset plate, can generate a large amount of heat
Amount, combined in this way by what the two was knocked at the door, it can generate dig mine operation generate income, and can will it is described virtually
Digital currency digs mine machine and calculates heat that power chipset plate generates rationally using heating the cold water in the water heater main body 60, thus
Hot water is generated for hot water for life or heating hot water.
It should be noted that when the power device 404 is that virtual digit coin digs mine machine calculation power chipset plate, the electricity
Warmer further includes network function module (not shown), after the power device 404 and the network function module power on,
The network function module can connect to cloud server, and the secret key that the calculation power plate calculates is sent to the cloud in real time
Server.Realize that specific structure and the working principle of the network function module of above-mentioned function are known to those skilled in the art
It dawn, is not repeated herein.
In one example, as shown in Fig. 1 and Fig. 4, two opposite surfaces of the hot superconductive plate 10 are equipped with the heat source peace
Region 117 is filled, the power device 404 is located at the opposite two sides of the hot superconductive plate 10;The radiating fin 20 is located at described
The opposite two sides of hot superconductive plate 10.
In another example, as shown in Figures 2 and 3, a surface of the hot superconductive plate 10 is equipped with the heat source installing zone
In domain 117, the power device 404 is located at the side of the hot superconductive plate 10;The radiating fin 20 is located at the hot superconduction
The opposite two sides of plate 10.The power device 404 is set to the side of the hot superconductive plate 10, the power device 404 wraps
When including the calculation power plate and the calculation power plate control panel, it can be can be realized by one piece of calculation power plate control panel to all institutes
The control for calculating power plate is stated, one piece of calculation power plate control panel can be saved.
As an example, the radiator and water heater composite structure further include electric heating system please continue to refer to Fig. 1 and Fig. 2
System, the electric heating system includes: heating device 801 and electric connection line 802, and the heating device 801 is located at the water heater
In main body 60;Described 802 one end of electric connection line is connected with the heating device 801.The other end of the electric connection line 802 with
Power electric connection, after the heating device 801 is electrically connected to a power source by the electric connection line 802, the heating device 801 is
Water 602 in the water heater main body 60 is heated.The heating device 802 may include but be not limited only to thermocouple etc.
Deng.By the way that the electric heating system is arranged, two jacket heating system of the heat exchanger 701 and the electric heating system can be used
Cold water in the water heater main body 60 is heated, when one of break down, another can replace work, tool
There is higher reliability.It should be noted that the electric heater unit 801 in Fig. 2 does not show that.
As an example, the radiator and water heater composite structure further include temperature probe please continue to refer to Fig. 1 and Fig. 2
803, one end of the temperature probe 803 is inserted in the water heater main body 60, for water heater main body described in real-time detection
The temperature of water 602 in 60.
In one example, what the liquid cooling heat radiator 30 was used to radiate to the heat that the hot superconductive plate 10 transmits follows
Ring liquid can be closed in the first circulation pipe 702, the heat exchanger 701 and the second circulation pipe 703, in institute
Under the driving for stating circulating pump 74, the circulating liquid loopy moving, to realize heat exchange, as shown in Figure 1.
In another example, the radiator and water heater composite structure further include circulating liquid tank 705, the circulation fluid
Circulating liquid 706 is contained with inside body tank 705;The one end of the first circulation pipeline 702 far from the inlet 3023 via
The circulating liquid tank 705 is connected with the heat exchanger 701, i.e., described 702 one end of first circulation pipeline and the feed liquor
Mouth 3023 is connected, and the other end is connected with the circulating liquid tank 705.At this point, described in the circulating liquid tank 705 follows
Ring liquid 706 can be in the first circulation pipeline 702, the fluid passage, described second under the driving of the circulating pump 704
It is recycled between circulation line 703, the heat exchanger 701 and the circulating liquid tank 705, to realize heat dissipation heat exchange.
The working principle of radiator and water heater composite structure of the invention are as follows: when the power device 404 work, institute
Hot 10 local heating of superconductive plate is stated, heat is quickly transferred to the entire hot superconductive plate 10 via the heat-transfer working medium 1061, then
It is conducted by heat-conducting mode to first radiating fin 20, while also conducted to the liquid cooling heat radiator 30;When the heat
When 602 temperature of water in water machine body 60 is lower, the circulating pump 704 works, drive the circulating liquid 706 via it is described into
Liquid mouth 3023 enters in the liquid cooling heat radiator 30, takes away heat after flowing through first deflector 301 and heats up, after heating
Circulating liquid 706 via the liquid outlet 3024 flow out enter the water heater main body 60 in heat exchanger 701 in carry out
Heat exchange and heat the water in the water heater main body 60, coolant-temperature gage in the water heater main body 60 increases, the circulation fluid
The temperature of body 706 reduces, and continues cycling through flowing using the first circulation pipeline 702 and the first circulation pipeline 703, this
The heat that the power device 404 generates can be used to heat the cold water in the water heater main body 60 by sample.When the heat
After the temperature of water in water machine body 60 reaches predetermined temperature, the circulating pump 704 stops working, meanwhile, the fan 401 opens
It is dynamic, cold wind flowed through under the driving of the fan 401 first radiating fin 20 surface and second radiating fin 50
Surface, i.e. cold wind flows through first heat dissipation channel 201 and second radiator 50 in first radiating fin 20
Interior second heat dissipation channel 501, is taken away heat by convection type, and hot-air distributes heat in ambient enviroment,
Hot wind winter can blow to it is indoor come for heating indoor heating, summer is then exhausted directly to outdoor.
Embodiment two
Incorporated by reference to Fig. 1 to Figure 21 refering to Figure 22 to Figure 24, the present embodiment also provides a kind of radiator and water heater combination knot
Radiator and hot water described in the structure and embodiment one of structure, radiator described in the present embodiment and water heater composite structure
The structure of device composite structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: the present embodiment
Described in hot superconductive plate 10 had additional in second deflector 103 compared to hot superconductive plate 10 described in embodiment one
An at least preset clearance 1035, meanwhile, the hot superconductive plate 10 further include an at least cushion block 109 or first cover board 100 or
Second cover board 101 is equipped with an at least punching press boss 113.The other structures of hot superconductive plate 10 described in the present embodiment with
The other structures of hot superconductive plate 10 described in embodiment one are identical, referring specifically to embodiment one, are not repeated herein.
In one example, as shown in FIG. 22 and 23, it is equipped in second deflector 103 in the hot superconductive plate 10
Several described preset clearances 1035, wherein Figure 22 is to be equipped with 4 preset clearances 1035 in second deflector 103
As an example, the quantity of the preset clearance 1035 is not limited in actual example;If the hot superconductive plate 10 further includes
The dry cushion block 109, the quantity of the cushion block 109 is identical as the quantity of the preset clearance 1035, and the cushion block 109 1
One corresponding is set in each preset clearance 1035;The height of the height of the cushion block 109 and second deflector 103
It is identical, and the first installation through-hole 110 along the perforation of its short transverse is equipped in each cushion block 109;First cover board 100
On be additionally provided with several the second installation through-holes 111 penetrated through along the thickness direction of first cover board 100, second installation is logical
The quantity in hole 111 is identical as the quantity of first installation through-hole 110, and second installation through-hole 111 and first peace
Dress through-hole 110 is arranged in a one-to-one correspondence;Several are additionally provided on second cover board 101 along 101 thickness direction of the second cover board
The third installation through-hole 112 of perforation, the quantity phase of the quantity of the third installation through-hole 112 and first installation through-hole 110
Together, and the third installation through-hole 112 is arranged in a one-to-one correspondence with first installation through-hole 110.It should be noted that in order to just
In showing the preset clearance 1035, the cushion block 109 is not illustrated in Figure 22, meanwhile, for the ease of showing, in Figure 22 simultaneously
First solder layer 104 and second solder layer 105 are not illustrated.Since the surface of the hot superconductive plate 10 needs to install
The power device of fixed fever, but the sealed passage 106 in the hot superconductive plate 10 is sealing pipeline, it cannot be in the heat
Installation fixation hole is directly beaten in the place of the corresponding sealed passage 106 of superconductive plate 10, to prevent the institute in the sealed passage 106
State the leakage of heat-transfer working medium 1061;The present invention in second deflector 103 by reserving the preset clearance 1035, and in institute
The identical cushion block 109 of height that second deflector 103 is set in preset clearance 1035 is stated, in the cushion block 109
It is inside formed with first installation through-hole 110, forms second installation through-hole 111 on first cover board 100 simultaneously in this way
Being formed after the third installation through-hole 112 on second cover board 101 can be before by the fixed device such as bolt
It puts and utilizes first installation through-hole 110, second installation through-hole 111 and the third installation through-hole 112 by the function
Rate device 404 is fixed on the hot superconductive plate 10, meanwhile, and may insure that the sealed passage 106 is in sealing state, institute
Stating heat-transfer working medium 1061 will not reveal.
In another example, as shown in figure 24, several are equipped in second deflector 103 of the hot superconductive plate 10
The preset clearance 1035, wherein set in Figure 24 using in second deflector 103 there are four the preset clearance 1035 as
Example, in actual example, the quantity of the preset clearance 1035 is not limited;First cover board 100 or described second
Cover board 101 is equipped with several described punching press boss 113, wherein is equipped with several institutes in Figure 24 with second cover board 101
Punching press boss 113 is stated as example;The punching press boss 113 is from first cover board 100 or the interior table of second cover board 101
Face is convexly equipped in the preset clearance 1035, the height phase of the height of the punching press boss 113 and second deflector 103
Together, the quantity of the punching press boss 113 is identical as the quantity of the preset clearance 1035, a pair of with the preset clearance 1,035 1
It should be arranged, and be equipped with the first installation through-hole 110 penetrated through along its short transverse, second cover board in the punching press boss 113
Be additionally provided on 101 or described first cover boards 100 several along its thickness direction perforation the second installation through-hole 111, described second
Installation through-hole 111 is identical as the quantity of first installation through-hole 110, and sets with first installation through-hole 110 one-to-one correspondence
It sets.It should be noted that if the punching press boss 113 is set on second cover board 101, then second installation through-hole
111 are located on first cover board 100, as shown in figure 24;If the punching press boss 113 is set on first cover board 100,
Then second installation through-hole 111 is located on second cover board 101.It should be further noted that for the ease of display, figure
First solder layer 104 and second solder layer 105 are not illustrated in 24.The present invention passes through in second deflector
The preset clearance 1035 is reserved in 103, and several projections are set on first cover board 100 or second cover board 12
In in the preset clearance 1035 and the punching press boss 113 identical with the height of second deflector 103, described
First installation through-hole 110 is equipped in punching press boss 113, in this way, in second cover board 101 or first cover board 100
First peace can be utilized after upper setting second installation through-hole 111 under the premise of device fixed by bolt etc.
The power device is fixed on the hot superconductive plate by dress through-hole 110 and second installation through-hole 111, meanwhile, and can be with
Ensure that the sealed passage 106 is in sealing state, the heat-transfer working medium 1061 will not be revealed.
It should be noted that Figure 22, into Figure 24, second deflector 103 is Figure 10 and figure in such as embodiment one
Second deflector described in a monolith in second deflector 103 shown in 11 after the setting preset clearance 1035, certainly,
In other examples, second deflector 103 can also be Figure 12 to shown in figure 15 described second in embodiment one for another example
The second deflector in deflector 103 after the setting preset clearance 1035.
Embodiment three
Incorporated by reference to Fig. 1 to Figure 21 refering to Figure 25 to Figure 26, the present embodiment also provides a kind of radiator and water heater combination knot
Radiator and hot water described in the structure and embodiment one of structure, radiator described in the present embodiment and water heater composite structure
The structure of device composite structure is roughly the same, and the difference of the two is that the structure of the hot superconductive plate 10 is different: institute in embodiment one
The quantity of second deflector 103 described in the hot superconductive plate 10 stated is one piece, and the second deflector described in the present embodiment
103 quantity is at least two pieces, and has gap between adjacent second deflector 103, in adjacent second water conservancy diversion
The first balance channel 107 of the heat-transfer working medium 1061 is formed between plate 103, first balance channel 107 is along described first
Direction extends, i.e., the extending direction of described first balance channel 107 is parallel with the first direction;With the annular peripheral frame
102 second deflectors 103 closed on have gap with the annular peripheral frame 102, in second deflector 103 with
The second balance channel 108 of the heat-transfer working medium 1061, second balance channel 108 are formed between the annular peripheral frame 102
Extend along the first direction, i.e., the extending direction of described second balance channel 108 is parallel with the end face of the protrusion 31;Institute
The height for stating the second deflector 103 is identical as the height of the annular peripheral frame 102.Hot superconductive plate 10 described in the present embodiment
Other structures are identical with the other structures of hot superconductive plate 10 described in embodiment one, referring specifically to embodiment one, this
Place is not repeated.First balance channel 107 can be used as vapor liquid equilibrium channel, to enhance the heat transfer work of gaseous state
The heat-transfer working medium 1061 of matter 1061, the heat-transfer working medium 1061 of liquid condition or gas-liquid mixture phase is led along described second
Flowing on 103 length direction of flowing plate;Second balance channel 108 can be used as fluid balance channel, liquid to enhance
Flowing of the heat-transfer working medium 1061 of state along the first direction.Due to being along the second direction in the hot superconductive plate 10
Main channel direction, and the flow resistance of the heat-transfer working medium 1061 is larger along the first direction, mobility is poor, leads to
It crosses and adds first balance channel 107 and second balance channel 108, the heat-transfer working medium 1061 can be enhanced along described
The mobility of first direction, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that institute
The temperature for stating hot 10 each region of superconductive plate is identical, so effectively avoid due to some live multiple directions heat dissipation effect it is bad and
Cause the generation of the 10 regional area superheating phenomenon of hot superconductive plate.
Example IV
Incorporated by reference to Fig. 1 to Figure 24 refering to Figure 27 to Figure 29, the present embodiment also provides a kind of radiator and water heater combination knot
Radiator and hot water described in the structure and embodiment two of structure, radiator described in the present embodiment and water heater composite structure
The structure of device composite structure is roughly the same, and the difference of the two is that the structure of the hot superconductive plate 10 is different: institute in embodiment two
The quantity of second deflector 103 described in the hot superconductive plate 10 stated is one piece, and the second deflector described in the present embodiment
103 quantity is at least two pieces, and has gap between adjacent second deflector 103, in adjacent second water conservancy diversion
The first balance channel 107 of the heat-transfer working medium 1061 is formed between plate 103, first balance channel 107 is along described first
Direction extends, i.e., the extending direction of described first balance channel 107 is parallel with the first direction;With the annular peripheral frame
102 second deflectors 103 closed on have gap with the annular peripheral frame 102, in second deflector 103 with
The second balance channel 108 of the heat-transfer working medium 1061, second balance channel 108 are formed between the annular peripheral frame 102
Extend along the first direction, i.e., the extending direction of described second balance channel 108 is parallel with the end face of the protrusion 31;Institute
The height for stating the second deflector 103 is identical as the height of the annular peripheral frame 102.Hot superconductive plate 10 described in the present embodiment
Other structures are identical with the other structures of hot superconductive plate 10 described in embodiment two, referring specifically to embodiment two, this
Place is not repeated.First balance channel 107 can be used as vapor liquid equilibrium channel, to enhance the heat transfer work of gaseous state
The heat-transfer working medium 1061 of matter 1061, the heat-transfer working medium 1061 of liquid condition or gas-liquid mixture phase is led along described second
Flowing on 103 length direction of flowing plate;Second balance channel 108 can be used as fluid balance channel, liquid to enhance
Flowing of the heat-transfer working medium 1061 of state along the first direction.Due to being along the second direction in the hot superconductive plate 10
Main channel direction, and the flow resistance of the heat-transfer working medium 1061 is larger along the first direction, mobility is poor, leads to
It crosses and adds first balance channel 107 and second balance channel 108, the heat-transfer working medium 1061 can be enhanced along described
The mobility of first direction, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that institute
The temperature for stating hot 10 each region of superconductive plate is identical, so effectively avoid due to some live multiple directions heat dissipation effect it is bad and
Cause the generation of the 10 regional area superheating phenomenon of hot superconductive plate.
It should be noted that Figure 27 and Figure 28 are shown as having preset clearance 1035 in radiator and water heater composite structure
And the structural schematic diagram of the hot superconductive plate 10 of cushion block 109, Figure 29 are shown as having punching press in radiator and water heater composite structure
The structural schematic diagram of the hot superconductive plate 10 of boss 113.
It should be further noted that the preset clearance formed in the second deflector 103 described in the present embodiment
1035 are located in second deflector 103 closest with second balance channel 108, as shown in Figure 27 to Figure 29.Its
In, Figure 27 to Figure 29 is with second deflector 103 in the second deflector 103 shown in Figure 12 and Figure 13 in example 1
Second including several described second flow guide bars 1033 and second connecting portion 1034 after the preset clearance 1035 is arranged is led
Flowing plate is as an example, the quantity of second deflector 103 is two, and second deflector 103 further includes the cushion block
109 are used as example;Certainly, in other examples, second deflector 103 can also be Figure 10 and figure in such as embodiment one
The second deflector after the preset clearance 1035 is set in 11 or Figure 14 and the second deflector shown in figure 15 103, described
When second deflector 103 does not include the cushion block 109, institute is also provided on first cover board 11 or second cover board 21
State punching press convex block 113.The quantity of second deflector 103 can be set according to actual needs, be not limited to two.
It should be further noted that the arrangement mode of the preset clearance 1035 can be arranged according to actual needs
Cloth, for example, several shown preset clearances 1035 can arrange as shown in Figure 27 to Figure 29 in a word, can also be such as embodiment
It is arranged in array shown in Figure 22 and Figure 24 in two.
Embodiment five
Incorporated by reference to Fig. 1 to Figure 21 refering to Figure 30, the present invention also provides a kind of radiator and water heater composite structure, this implementations
Radiator and water heater group described in the specific structure and embodiment one of radiator and water heater composite structure described in example
The specific structure for closing structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: embodiment one
In, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector
103, wherein first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 adheres on
On surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and second cover board
Sealed chamber is formed between 101.And in the present embodiment, the hot superconductive plate 10 include: the first cover board 100, the second cover board 101 and
Second deflector 103;Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012
With 1011 integrally connected of cover plate main body;First cover board 100 adheres on the annular convex edge 1012 far from the cover board
On the surface of main body 1011, to form sealed chamber between first cover board 100 and the cover plate main body 1011.
It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular
Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment one;At this point, 101 note of the second cover board
It is placed in the annular convex edge.
In the specific structure and embodiment one of second deflector 103 in hot superconductive plate 10 described in the present embodiment
The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally
The other structures of radiator described in embodiment and water heater composite structure other than the hot superconductive plate 10 and embodiment one
Described in radiator and water heater composite structure in corresponding structure it is identical, be not repeated herein.
In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology
Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.
Embodiment six
Incorporated by reference to Fig. 1 to Figure 24 refering to Figure 31, the present invention also provides a kind of radiator and water heater composite structure, this implementations
Radiator and water heater group described in the specific structure and embodiment two of radiator and water heater composite structure described in example
The specific structure for closing structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: embodiment two
In, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector
103, wherein first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 adheres on
On surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and second cover board
Sealed chamber is formed between 101.And in the present embodiment, the hot superconductive plate 10 include: the first cover board 100, the second cover board 101 and
Second deflector 103;Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012
With 1011 integrally connected of cover plate main body;First cover board 100 adheres on the annular convex edge 1012 far from the cover board
On the surface of main body 1011, to form sealed chamber between first cover board 100 and the cover plate main body 1011.
It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular
Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment two;At this point, 101 note of the second cover board
It is placed in the annular convex edge.
In the specific structure and embodiment two of second deflector 103 in hot superconductive plate 10 described in the present embodiment
The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally
The other structures of radiator described in embodiment and water heater composite structure other than the hot superconductive plate 10 and embodiment two
Described in radiator and water heater composite structure in corresponding structure it is identical, be not repeated herein.
In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology
Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.
Embodiment seven
Incorporated by reference to Fig. 1 to Figure 26 refering to Figure 32 to Figure 33, the present invention also provides a kind of radiator and water heater composite structure,
Radiator and heat described in radiator described in the present embodiment and the specific structure of water heater composite structure and embodiment three
The specific structure of hydrophone composite structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: real
It applies in example three, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least 1 second leads
Flowing plate 103, wherein first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 pastes
It is placed on surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and described second
Sealed chamber is formed between cover board 101.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board
101 and second deflector 103;Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge
1012 with 1011 integrally connected of cover plate main body;First cover board 100 adheres on the annular convex edge 1012 far from described
On the surface of cover plate main body 1011, to form sealed chamber between first cover board 100 and the cover plate main body 1011.
It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular
Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment three;At this point, 101 note of the second cover board
It is placed in the annular convex edge.
In the specific structure and embodiment three of second deflector 103 in hot superconductive plate 10 described in the present embodiment
The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally
The other structures of radiator described in embodiment and water heater composite structure other than the hot superconductive plate 10 and embodiment three
Described in radiator and water heater composite structure in corresponding structure it is identical, be not repeated herein.
In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology
Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.
Embodiment eight
Incorporated by reference to Fig. 1 to Figure 29 refering to Figure 34 to Figure 36, the present invention also provides a kind of radiator and water heater composite structure,
Radiator and heat described in the specific structure and example IV of radiator described in the present embodiment and water heater composite structure
The specific structure of hydrophone composite structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: real
It applies in example four, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least 1 second leads
Flowing plate 103, wherein first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 pastes
It is placed on surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and described second
Sealed chamber is formed between cover board 101.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board
101 and second deflector 103;Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge
1012 with 1011 integrally connected of cover plate main body;First cover board 100 adheres on the annular convex edge 1012 far from described
On the surface of cover plate main body 1011, to form sealed chamber between first cover board 100 and the cover plate main body 1011.
It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular
Edge, and second cover board 101 is identical as the second cover board 101 described in example IV;At this point, 101 note of the second cover board
It is placed in the annular convex edge.
In the specific structure and example IV of second deflector 103 in hot superconductive plate 10 described in the present embodiment
The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally
The other structures and example IV of radiator described in embodiment and water heater composite structure other than the hot superconductive plate 10
Described in radiator and water heater composite structure in corresponding structure it is identical, be not repeated herein.
In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology
Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.
In conclusion the present invention provides a kind of radiator and water heater composite structure, the radiator and water heater combination
Structure includes: hot superconductive plate, and interconnected sealed passage is formed in the hot superconductive plate, is filled in the sealed passage
Heat-transfer working medium;The hot superconduction plate surface is equipped with heat source installation region;Liquid cooling heat radiator, positioned at the table of the hot superconductive plate
Face, and be located at except the heat source installation region, fluid passage is formed in the liquid cooling heat radiator, on the liquid cooling heat radiator
Equipped with the inlet and liquid outlet being connected with the fluid passage;Water heater main body, inside are contained with water to be heated;It is described
Water heater main body is equipped with the water inlet and water outlet being connected with the water heater body interior;Heat exchanger is located at described
In water heater main body;First circulation pipe, one end are connected with the inlet, and the other end is connected with the heat exchanger;The
Two circulation pipes, one end are connected with the liquid outlet, and the other end is connected with the heat exchanger;Circulating pump is located at described the
On one circulation line or the second circulation pipeline.Radiator and water heater composite structure of the invention has below beneficial to effect
Fruit: 1. by the way that power device to be adhered on to the surface of hot superconductive plate, and passes through circulation pipe and circulation in the setting of hot superconduction plate surface
The liquid cooling heat radiator that liquid tank is connected, and recycle tube portion and be located in water heater main body, in the feelings that power device works normally
Under condition, hot superconductive plate and liquid cooling heat radiator can rationally be utilized the heat that power device generates, and can be used for water heater master
Cold water in body carries out heating and generates hot water for hot water for life or heating hot water, and energy saving improves quality of the life;2. function
Rate device selects virtual digit coin to dig mine machine and calculates power chipset plate, and virtual digit coin is reasonably dug mine machine and radiator and hot water
Both functions of device composite structure combine, and other than power device needs electric energy, do not need additional electric energy to water heater
It leads intracorporal cold water to be heated, the case where consuming same electric energy, that is, can produce and dig mine operation generation income, and can incite somebody to action
It digs the heat that mine machine calculation power chipset plate produces to be used to heat cold water, to generate hot water for hot water for life or heating heat
Water;3. the first deflector is arranged in liquid cooling heat radiator, deflector increases heat exchange area, dissipates to improve in addition to enhancing liquid perturbation
Outside thermal energy power, the effect of reinforcing rib is also acted as, can reduce the thickness of liquid cooling cover board, to mitigate the overall weight of radiator;
4. being filled with heat-transfer working medium in hot superconductive plate inner seal chamber body, inhibit heat transfer, shape by heat-transfer working medium phase-change heat transfer or phase transformation
At the hot superconducting characteristic of quick conductive, equivalent heat conductivity keeps entire hot superconduction plate temperature uniform up to 4000W/m DEG C or more,
Reduce the temperature difference between each power device, improves the heat-sinking capability of radiator;5. water cooling and wind can be used by setting fan
Cold two kinds of forced heat radiation modes radiate to power device, and hot superconductive plate is thermally conductive fast, and temperature is uniform, in same radiating condition
It is lower that big heat heat exchange can be realized under very low wind speed so that total is compact, small in size, light-weight, reach low noise or
Mute purpose;Meanwhile using air-cooled and two cooling systems of liquid cooling, when the intracorporal cold water of water heater master is heated to make a reservation for
After temperature, circulating pump stops working, and liquid cooling heat radiator stops heat dissipation, at this point, starting fan, the radiating mode of power device is by water
It is cold to be switched to air-cooled mode naturally, there is higher reliability;6. being welded with radiating fin, radiating fin on hot superconductive plate
The heat that the conduction of hot superconductive plate comes quickly is taken away by air and is dissipated, radiating fin is the heat-transfer surface increased with air
Product reduces system thermal resistance, improves heat-sinking capability, and plays the role of reinforcing hot superconductive plate, thick with the material for reducing hot superconductive plate
Degree improves intensity, mitigates weight, reduces cost;By the way of welding by both sides radiating fin, avoids traditional Section Bar Heat Sinks and deposit
Because of radiating fin excessive height, the low defect of radiating fin tail end radiating efficiency improves the radiating efficiency of radiating fin;
7. power device is set to two opposite surfaces of hot superconductive plate, compact-sized, small in size, good heat dissipation effect;8. in hot superconductive plate
Hot superconductive plate is divided into upper and lower first part and second part, underlying second part surface by upper setting partition, partition
Power device is set, and is sealed second part by setting seal case, realizes the totally-enclosed of power device, improves protection etc.
Grade and reliability;9. being seal cavity inside hot superconductive plate, and it is equipped with the second deflector, internal second deflector is the first cover board
And second cover board weld together, that is, play booster action, apply two sides cover sheet thickness be thinned, bearing capacity increase, intensity improve,
Mitigate the weight and thickness of hot superconductive plate, and the heat exchange area inside increase, enhances the hot superconduction capacity of heat transmission;10. passing through setting
Electric heating system first carries out after being heated to certain temperature the intracorporal cold water of water heater master with heat exchanger, restarts electricity and adds
Hot systems by the intracorporal hot water heating of water heater master to setting higher temperature.Or two jacket heating system simultaneously heating,
So that the intracorporal water of water heater master is quickly reached set temperature in a short time, is timely used for user.Or work as heat exchanger system
System starts electric heating system in shutdown maintenance to guarantee client at any time and have hot water use, reliability with higher and use spirit
Activity.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.