CN206532224U - CPU phase transformations suppress radiator structure and electronic product - Google Patents
CPU phase transformations suppress radiator structure and electronic product Download PDFInfo
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- CN206532224U CN206532224U CN201621032482.XU CN201621032482U CN206532224U CN 206532224 U CN206532224 U CN 206532224U CN 201621032482 U CN201621032482 U CN 201621032482U CN 206532224 U CN206532224 U CN 206532224U
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Abstract
The utility model provides a kind of CPU phase transformations and suppresses radiator structure and electronic product, and CPU phase transformations, which suppress radiator structure, includes phase transformation suppression heat sink, radiating fin device and CPU；It is composite board type structure that phase transformation, which suppresses heat sink, and phase transformation suppresses heat sink and is internally formed in the Super-conductive conduit road with given shape, Super-conductive conduit road filled with heat-transfer working medium；Phase transformation, which suppresses heat sink, includes first surface and second surface, the first surface and second surface that phase transformation suppresses heat sink are plane, the first surface that phase transformation suppresses heat sink is provided with radiating fin device installation region, and the second surface that phase transformation suppresses heat sink is provided with CPU installation regions；Radiating fin device is fixed in radiating fin device installation region；CPU is fixed in CPU installation regions.The utility model CPU phase transformations suppress the characteristics of radiator structure has high heat conductance, high heat transfer density and good uniform temperature, can reach the accumulated heat on CPU minimum, so as to improve CPU service life.
Description
Technical field
The utility model belongs to phase transformation and suppresses field of heat transfer, and more particularly to a kind of CPU phase transformations suppress radiator structure and electricity
Sub- product.
Background technology
At present, CPU radiators can be divided into air-cooled radiator, heat-pipe radiator and water cooling according to its radiating mode and dissipate
Hot device.
This is current most common fansink-type to air-cooled radiator, including a radiator fan and a fin.It is former
Reason is the heat transfer that produces CPU on fin, is then again taken away heat by fan.Current this radiator is general
The CPU radiating fin used is all aluminium section bar or the radiator of thermophilic of aluminum.The efficient thermal conductivity of this radiator is relatively low, can make
Add up substantial amounts of heat on some powerful CPU, so as to influence CPU service life.
Heat-pipe radiator is a kind of heat transfer element of very high thermal conductivity, and it passes through the liquid in totally enclosed vacuum tube
Evaporation transmits heat with condensing.Most of such fan is " air-cooled+heat pipe " property, the advantage of simultaneous air-cooled and heat pipe, with pole
High thermal diffusivity.Its shortcoming is that cost of manufacture is too high, considers from the economic performance of product, also limits its use scope.
Water-filled radiator is that forced circulation takes away the heat of radiator under the drive of pump using liquid, is had compared with air-cooled
Have a peace and quiet, cooling is stable, it is less to condition depended a little.But its shortcoming safeguards cumbersome when being to use, and temperature is too low
Shi Huiyou condensed waters, can so influence mainboard or CPU life-spans.During to winter, it is also possible to water freezing, cause what pipeline burst
It is dangerous.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is that providing a kind of CPU phase transformations suppresses to dissipate
Heat structure and electronic product, are dissipated for solving electronic product in the prior art using air-cooled radiator, heat-pipe radiator and water cooling
The radiating of hot device and having condensed water when the radiating effect that exists is not good, cost of manufacture is too high, troublesome maintenance, temperature are too low can influence
The problems such as mainboard or CPU life-spans, possible water freezing can cause the danger that pipeline bursts.
In order to achieve the above objects and other related objects, the utility model provides a kind of CPU phase transformations suppression radiator structure, institute
Stating CPU phase transformations suppression radiator structure includes phase transformation suppression heat sink, radiating fin device and CPU；
It is composite board type structure that the phase transformation, which suppresses heat sink, and the phase transformation suppresses heat sink and has been internally formed with specific
The Super-conductive conduit road of shape, the Super-conductive conduit road is that heat-transfer working medium is filled with closing pipe line, the Super-conductive conduit road；It is described
Phase transformation, which suppresses heat sink, includes first surface and the second surface relative with the first surface, and the phase transformation suppresses heat sink
First surface and second surface are plane, and the first surface that the phase transformation suppresses heat sink is provided with radiating fin device installing zone
Domain, the second surface that the phase transformation suppresses heat sink is provided with CPU installation regions；
The radiating fin device is fixed in the radiating fin device installation region；
The CPU is fixed in the CPU installation regions.
Suppress a kind of preferred scheme of radiator structure as CPU phase transformations of the present utility model, the phase transformation suppresses heat sink
Including the first sheet material, the second sheet material and tri-plate；First sheet material, second sheet material and the tri-plate are folded successively
Put, first sheet material and the tri-plate are located at the both sides of second sheet material respectively, and pass through with second sheet material
Rolling process is combined with each other；
The tri-plate includes elevated regions, and the surface of the elevated regions is plane；
The Super-conductive conduit road is located between first sheet material and the tri-plate, and the Super-conductive conduit road is distributed
Region it is corresponding with the elevated regions.
Suppress a kind of preferred scheme of radiator structure as CPU phase transformations of the present utility model, the Super-conductive conduit road includes
Several first conduits, the second conduit and connection through hole；
First conduit is located between first sheet material and second sheet material；
Second conduit is located between second sheet material and the tri-plate；
The connection through hole runs through second sheet material, and adjacent first conduit and second conduit are connected
It is logical；
Second plate surface is formed with the bulge-structure corresponding with first conduit and second conduit.
Suppress a kind of preferred scheme of radiator structure, the first conduit described in adjacent two as CPU phase transformations of the present utility model
And second conduit is isolated described in adjacent two, and first conduit is distributed with the second conduit staggered parallel；
The connection through hole is located between first conduit and second conduit, and by adjacent first conduit
And second conduit is connected.
Suppress a kind of preferred scheme of radiator structure, first conduit and described as CPU phase transformations of the present utility model
The shape of second conduit cross section is trapezoidal, and the shape of first conduit and the second conduit longitudinal section is rectangle；
Being shaped as the connection through hole is circular or oval.
Suppress a kind of preferred scheme of radiator structure, the transverse direction of first conduit as CPU phase transformations of the present utility model
Size is identical with the lateral dimension of second conduit.
Suppress a kind of preferred scheme of radiator structure, first sheet material and described as CPU phase transformations of the present utility model
The outer surface of tri-plate is equipped with anticorrosive coat.
Suppress a kind of preferred scheme of radiator structure, first sheet material and described as CPU phase transformations of the present utility model
At least one of both tri-plates are to include the composite board of at least two material layers.
Suppress a kind of preferred scheme of radiator structure as CPU phase transformations of the present utility model, the composite board is to include
The Copper-Aluminum compound sheet material including the stainless steel bed of material and the stainless Steel-aluminium composite board of layer of aluminum of the copper material bed of material and layer of aluminum
The iron-aluminium composite board material of material including the iron material bed of material and layer of aluminum or the aluminium alloy aluminium including the aluminium alloy material bed of material and layer of aluminum
Composite board；The layer of aluminum in first sheet material and the tri-plate is in contact with second sheet material.
Suppress a kind of preferred scheme of radiator structure, the radiating fin device peace as CPU phase transformations of the present utility model
Dress region is correspondingly arranged with the CPU installation regions.
Suppress a kind of preferred scheme of radiator structure, in addition to fan, the fan as CPU phase transformations of the present utility model
Suppress the side of heat sink first surface positioned at the phase transformation.
Suppress a kind of preferred scheme of radiator structure, the pressure that the fan is produced as CPU phase transformations of the present utility model
The direction of wind flow is parallel with the surface of the radiating fin.
The utility model also provides a kind of electronic product, and the electronic product is included as described in above-mentioned either a program
CPU phase transformations suppress radiator structure.
As described above, CPU phase transformations of the present utility model suppress radiator structure and electronic product, have the advantages that：
The utility model CPU phase transformations are suppressed radiator structure and contacted using phase transformation suppression heat sink with as the CPU of thermal source, are had
The characteristics of having high heat conductance, high heat transfer density and good uniform temperature, its efficient thermal conductivity can make high-power CPU up to 6000W/m.K
On accumulated heat reach it is minimum, so as to improve CPU service life；By setting fan in the side provided with radiating fin device,
Wind-cooling heat dissipating and phase transformation effectively are suppressed into radiating to combine, radiating efficiency is further increased；Meanwhile, it is of the present utility model
CPU phase transformations, which suppress radiator structure, to be had the advantages that easily fabricated, adjustment and safeguards.
The phase transformation, which suppresses at least one of the first sheet material and both tri-plates in heat sink, includes at least two materials
The composite board of layer, the intensity that phase transformation suppresses to correspond in heat sink Super-conductive conduit road part is greatly improved, tensile strength ＞
4MPa；On the premise of enough intensity is ensured, the phase transformation suppresses gross thickness≤1mm of heat sink, can be applied to accurate member
In part, with small volume, the advantages of lightweight；The outer surface that the phase transformation suppresses heat sink is layers of copper, can directly carry out pricker
Weldering or soldering, are easy to operation, and steady quality solves the Welding Problems between phase transformation suppression heat sink and device.
Brief description of the drawings
Fig. 1 to Fig. 2 is shown as the structural representation of the CPU phase transformations suppression radiator structure provided in the utility model embodiment one
Figure.
The phase transformation that CPU phase transformations suppress in radiator structure that Fig. 3 is shown as providing in the utility model embodiment one suppresses to dissipate
The section partial structural diagram of hot plate.
Fig. 4 is shown as the CPU phase transformations that provide in the utility model embodiment one and suppresses to have in radiator structure to correspond to the
The structural representation of first sheet material of the graphite line pattern of one conduit.
The CPU phase transformations that Fig. 5 is shown as providing in the utility model embodiment one suppress have connection through hole in radiator structure
The second sheet material structural representation.
Fig. 6 is shown as the CPU phase transformations that provide in the utility model embodiment one and suppresses to have in radiator structure to correspond to the
The structural representation of the tri-plate of the graphite line pattern of two conduits.
Component label instructions
1 phase transformation suppresses heat sink
11 first sheet materials
111st, 131 first material layer
112nd, 132 second material layer
12 second sheet materials
13 tri-plates
14 Super-conductive conduit roads
141 first conduits
142 second conduits
143 connection through holes
144 correspond to the graphite line pattern of the first conduit
145 correspond to the graphite line pattern of the second conduit
15 filling exits
16 bulge-structures
17 non-pipeline portions
18 radiating fin device installation regions
2 CPU
3 radiating fin devices
31 substrates
32 radiating fins
Embodiment
Illustrate embodiment of the present utility model below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.The utility model can also be by addition
Different embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints with answering
With, without departing from it is of the present utility model spirit under carry out various modifications or alterations.
Fig. 1 to Fig. 6 is referred to, it is necessary to which the diagram provided in explanation, the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though only display is with relevant component in the utility model rather than according to during actual implement in diagram
Component count, shape and size are drawn, and kenel, quantity and the ratio of each component can change for a kind of random during its actual implementation
Become, and its assembly layout kenel may also be increasingly complex.
Embodiment one
Fig. 1 to Fig. 6 is referred to, the utility model provides a kind of CPU phase transformations and suppresses radiator structure, and the CPU phase transformations suppress
Radiator structure includes phase transformation and suppresses heat sink 1, radiating fin device 3 and CPU2；It is composite board type that the phase transformation, which suppresses heat sink 1,
Structure, the phase transformation suppresses heat sink 1 and is internally formed the Super-conductive conduit road 14 with given shape, the Super-conductive conduit road 14
For closing pipe line, the Super-conductive conduit road 14 is interior to be filled with heat-transfer working medium；The phase transformation suppress heat sink 1 include first surface and
The second surface relative with the first surface, the first surface and second surface that the phase transformation suppresses heat sink 1 are plane,
The first surface that the phase transformation suppresses heat sink 1 is provided with radiating fin device installation region 18, and the phase transformation suppresses heat sink 1
Second surface is provided with CPU installation regions (not shown)；The radiating fin device 3 is fixed on the radiating fin device installing zone
In domain 18；The CPU2 is fixed in the CPU installation regions.The utility model CPU phase transformations suppress radiator structure using described
Phase transformation suppresses heat sink 1 and contacted with the CPU2, and the characteristics of with high heat conductance, high heat transfer density and good uniform temperature, its is effective
Thermal conductivity can reach the accumulated heat on the CPU2 minimum up to 6000W/m.K, so as to improve the service life of the CPU2；
By setting the radiating fin device 3, radiating efficiency can be further increased；Meanwhile, CPU phase transformations suppression of the present utility model
Radiator structure processed has the advantages that easily fabricated, adjustment and safeguarded.
As an example, the heat-transfer working medium is fluid, it is preferable that the heat-transfer working medium can be gas or liquid or gas
With the mixture of liquid, it is further preferable that in the present embodiment, the heat-transfer working medium is the mixture of liquid and gas.
As an example, the Super-conductive conduit road 14 is formed by blowing-up technology.
As an example, the radiating fin device installation region 18 and the CPU installation regions can be located at the phase transformation
Suppress the optional position on heat sink 1 surface, it is preferable that in the present embodiment, the radiating fin device installation region 18 with it is described
CPU installation regions are correspondingly arranged.
As an example, the quantity of the radiating fin device installation region 18 and the CPU installation regions can be according to reality
Border needs to set, and the quantity of the radiating fin device installation region 18 and the CPU installation regions can be one, such as scheme
Can also be two or more shown in 1 and Fig. 2.It should be noted that when the radiating fin device installation region 18 and institute
When to state CPU installation regions be one, the quantity of the radiating fin device 3 and the CPU2 can be one, such as Fig. 1 institutes
Show, or two, as shown in Fig. 2 even more.Certainly, in other examples, can also the radiating fin device
Installation region 18 and the CPU installation regions are identical with the quantity of the radiating fin device 3 and the CPU2.
As an example, the radiating fin device 3 includes substrate 31 and several radiating fins 32, the radiating fin 32
Parallel interval is arranged, and is fixed on the substrate by one or more combinations in the fixed forms such as grafting, welding or stickup
31 surface.The radiating fin device 3 is fixed in the radiating fin device installation region 18 by the substrate 31, i.e.,
The surface of the substrate 31 is in contact with the surface of the radiating fin device installation region 18.The substrate 31 can be by viscous
Patch or the mode of welding are fixed in the radiating fin device installation region 18.
As an example, the material of the radiating fin 32 can be but be not limited only to copper, copper alloy, aluminum or aluminum alloy or appoint
Anticipate more than one any combination.
As an example, as shown in figure 3, the phase transformation, which suppresses heat sink 1, includes the first sheet material 11, the second sheet material 12 and the 3rd
Sheet material 13；First sheet material 11, second sheet material 12 and the tri-plate 13 are sequentially stacked, first sheet material 11 and
The tri-plate 13 is located at the both sides of second sheet material 12 respectively, and compound by rolling process with second sheet material 12
Together；The tri-plate 13 includes elevated regions, and the surface of the elevated regions is plane；14, the Super-conductive conduit road
Between first sheet material 11 and the tri-plate 13, and the region and the convex area of the Super-conductive conduit road 14 distribution
Domain is corresponding.Explanation is needed, when the tri-plate 13 includes elevated regions, phase transformation described above suppresses heat sink 1
First surface and second surface be that the meaning of plane is：Suppress heat sink 1 when the elevated regions are located at the phase transformation
During first surface, the region outside the elevated regions and the elevated regions is distributed as plane, when elevated regions position
When the phase transformation suppresses the second surface of heat sink 1, the region outside the elevated regions and the elevated regions is distributed
For plane.
As an example, the Super-conductive conduit road 14 includes several first conduits 141, the second conduit 142 and connection through hole
143；First conduit 141 is located between first sheet material 11 and second sheet material 12；Second conduit 142 is located at
Between second sheet material 12 and the tri-plate 13；The connection through hole 143 runs through second sheet material 12, and will be adjacent
First conduit 141 and second conduit 142 be connected；The surface of second sheet material 12 is formed with and first groove
Road 141 and the corresponding bulge-structure 16 of second conduit 142.
As an example, several described first conduits between first sheet material 11 and second sheet material 12
Do not connect mutually, i.e., be isolated between the first conduit 141 described in adjacent two between 141.
As an example, several described second conduits between second sheet material 12 and the tri-plate 13
Do not connect mutually, i.e., be isolated between the second conduit 142 described in adjacent two between 142.
As an example, first conduit 141 is distributed with the staggered parallel of the second conduit 142.
As an example, the connection through hole 143 is located between first conduit 141 and second conduit 142, and will
Adjacent first conduit 141 and second conduit 142 are connected.
As an example, the shape of cross section of first conduit 141 and second conduit 142 can be but be not limited only to
Trapezoidal, the vertical sectional shape of first conduit 141 and second conduit 142 can be but be not limited only to rectangle.Need
It is bright, the cross section of first conduit 141 and second conduit 142 be along perpendicular to the section of its length direction,
The longitudinal section of first conduit 141 and second conduit 142 is section along its length.
It should be noted that first conduit 141 and second conduit 142 are by present first sheet material 11
And the surface of the tri-plate 13 forms and corresponds to first conduit 141 and the graphite corresponding to second conduit 142
Line pattern, passes through after then first sheet material 11, second sheet material 12 and the tri-plate 13 are combined with each other
Blowing-up technology is formed.
Fig. 4 is the graphite line pattern 144 that CPU phase transformations suppress to have corresponding to first conduit 141 in radiator structure
The first sheet material 11 structural representation, as shown in Figure 4, the vertical sectional shape (i.e. described first of the graphite line pattern 144
Conduit 141) vertical sectional shape be rectangle, and corresponding first conduit 141 of the graphite line pattern 144 is parallel to each other
Distribution；Wherein, the rectangular configuration of parallel shape is between first conduit 141, the rectangular configuration and first sheet material
11 edge is non-pipeline portions 17.It should be noted that because the Super-conductive conduit road 14 is by blowing-up technology preparation
Into so during the Super-conductive conduit road 14 is formed, filling exit 15 is formed with the heat transfer plate structure, i.e., being also to fill
Working medium mouthful.The filling exit 15 can be formed at the surface of first sheet material 11, can also be formed at the tri-plate 13
Surface, in the present embodiment, the filling exit 15 is formed at the surface of first sheet material 11.The filling exit 15 is in the warm
After the shape of superconduction pipeline 14 is preliminarily formed, the filling exit 15 is sealed by welding manner, to realize the Super-conductive conduit
The sealing on road 14 so that the Super-conductive conduit road 14 is not turned on the external world.
It should be noted that first sheet material 11 is to include the composite board of material layer at least twice, Fig. 4 for the ease of
Illustrate, the concrete structure of first sheet material 11 is not shown.
As an example, lateral dimension between several described first conduits 141 can be with identical, can also be different；It is preferred that
In ground, the present embodiment, the lateral dimension between several described first conduits 141 is identical.
As an example, the shape of the connection through hole 143 can be but be not limited only to circular or oval.
Fig. 5 is the structural representation that CPU phase transformations suppress to have the second sheet material 12 of the connection through hole 143 in radiator structure
Figure, as shown in Figure 5, the connection through hole 143 is in array distribution；Wherein, circular configuration is the connection through hole 143, described
Circular configuration corresponds to the intersection region of first conduit 141 and second conduit 142, i.e., first sheet material 11,
When second sheet material 12 and the tri-plate 13 are superimposed together and carry out Rolling compund, the institute in second sheet material 12
State the connection region of through hole 143 and do not form compound with first sheet material 11 and the tri-plate 13, that is to say, that there are graphite linings
Isolate and be layered；Between the circular configuration and edge of second sheet material 12 is non-pipeline portions 17；The connection is logical
Hole 143 corresponds between first conduit 141 and second conduit 142.
Fig. 6 is the graphite line pattern 145 that CPU phase transformations suppress to have corresponding to second conduit 142 in radiator structure
Tri-plate 13 structural representation, it will be appreciated from fig. 6 that the vertical sectional shape (i.e. described second of the graphite line pattern 145
The vertical sectional shape of conduit 142) it is that second conduit 142 in rectangle, and the graphite line pattern 145 is parallel to each other point
Cloth；Wherein, the rectangular configuration of parallel shape is between second conduit 142, the rectangular configuration and the tri-plate 13
Edge be non-pipeline portions 17.
As an example, lateral dimension between several described second conduits 142 can be with identical, can also be different；It is preferred that
In ground, the present embodiment, the lateral dimension positioned at second conduit 142 of both sides is less than positioned at middle second conduit
142 lateral dimension.
As an example, the lateral dimension of the lateral dimension of first conduit 141 and second conduit 142 can phase
Together, can also be different, it is preferable that in the present embodiment, the lateral dimension of first conduit 141 and second conduit 142
Lateral dimension is identical.
As an example, the outer surface of first sheet material 11 and the tri-plate 13 is equipped with anticorrosive coat.
In one example, first sheet material 11, second sheet material 12 and the tri-plate 13 can be individual layer
Plate construction, it is good that the material of first sheet material 11, second sheet material 12 and the tri-plate 13 should be thermal conductivity
Material, it is preferable that in the present embodiment, the material of first sheet material 11, second sheet material 12 and the tri-plate 13 is equal
Can be copper, copper alloy, aluminum or aluminum alloy or any combination more than any one.
In another example, at least one of both described first sheet material 11 and the tri-plate 13 are to include at least two
Plant the composite board of material layer, it is preferable that in the present embodiment, first sheet material 11 and the tri-plate 13 are including extremely
The composite board of few two kinds of material layers；Certainly, in other examples, can also first sheet material 11 and the tri-plate 13
One of be to include the composite board of at least two material layers, it is to include at least to be specifically as follows only described first sheet material 11
The composite board of two kinds of material layers, or the only tri-plate 13 is to include the composite plate of at least two material layers
Material；With first sheet material 11 it is to include first material layer 111 and second material layer 112 in Fig. 3, the tri-plate 13 is bag
First material layer 131 and second material layer 132 are included as example；Certainly, first sheet material 11 and the tri-plate 13 are gone back
It can be to include the composite board of trilaminate material layer, or the composite board including four layers or more layer of material.Will
First sheet material 11 and the tri-plate 13 are set to include the composite board of at least two material layers, can cause described
The intensity that phase transformation suppresses to correspond in heat sink the part of Super-conductive conduit road 14 is greatly improved, tensile strength ＞ 4MPa；Meanwhile,
On the premise of enough intensity is ensured, the phase transformation, which suppresses heat sink, can accomplish thinner, and gross thickness≤1mm can be applied to
In precision element, with small volume, the advantages of lightweight；Heat-transfer working medium is filled with the Super-conductive conduit road 14, and is closed, is constituted
Phase transformation suppresses Thermal Conduction Equipment, with the characteristics of heat conduction rate is fast, samming is good.
As an example, first sheet material 11 and the tri-plate 13 can be to include the copper material bed of material and layer of aluminum
Copper-Aluminum compound sheet material, can also be include the stainless Steel-aluminium composite board material of the stainless steel bed of material and layer of aluminum, can also be bag
The iron material bed of material and the iron-aluminium composite board material of layer of aluminum are included, can also be to include the aluminium alloy material bed of material and the aluminium alloy of layer of aluminum
Aluminum composite plate material；The layer of aluminum in first sheet material 11 and the tri-plate 13 connects with second sheet material 12
Touch, i.e., the second material layer 112 in described first sheet material 11 is described second in layer of aluminum, the tri-plate 13
Material layer 132 is layer of aluminum.The material of second sheet material 12 should be the good material of thermal conductivity；Preferably, the present embodiment
In, the material of second sheet material 12 can be copper, copper alloy, aluminium, aluminium alloy, titanium, titanium alloy or any times above
Meaning combination.Layer of aluminum will be set as positioned at the first material layer 111 and 131 close to the side of the second sheet material 12, when
When first sheet material 11 and the tri-plate 13 are aluminum copper composite plate material, it can be ensured that the copper material bed of material is located at outside,
The outer surface that i.e. described phase transformation suppresses heat sink is layers of copper, can directly carry out soldering or soldering, is easy to operate, steady quality,
Solve the Welding Problems between phase transformation suppression heat sink and device.
As an example, can be described to be formed by least two different material layers progress roll-formings by rolling process
First sheet material 11 and the tri-plate 13, can also be by sputtering technology, evaporation process, electroplating technology etc. in a material layer table
Plate another layer of material to form first sheet material 11 and the tri-plate 13 in face.
As an example, CPU phase transformations described in the utility model, which suppress radiator structure, also includes fan (not shown), the wind
Fan is located at the side that the phase transformation suppresses the first surface of heat sink 1, i.e., suppressing heat sink 1 positioned at the phase transformation is provided with described dissipate
The side of hot fin arrangement 3, that is, the radiating fin device 3 is located at the same of phase transformation suppression heat sink 1 with the fan
Side.
Suppress a kind of preferred scheme of radiator structure, the pressure that the fan is produced as CPU phase transformations of the present utility model
The direction of wind flow is parallel with the surface of the radiating fin 32.By the first surface for suppressing heat sink 1 in the phase transformation
Side sets the fan, wind-cooling heat dissipating and phase transformation effectively can be suppressed into radiating and combined, make full use of both to dissipate
The advantage of hot mode, further increases radiating efficiency.
Embodiment two
The utility model also provides a kind of electronic product, and the electronic product includes the CPU phases as described in embodiment one
Become and suppress radiator structure.The concrete structure that the CPU phase transformations suppress radiator structure refers to embodiment one, is not repeated herein.
In summary, the utility model provides a kind of CPU phase transformations suppression radiator structure and electronic product, the CPU phase transformations
Suppressing radiator structure includes phase transformation suppression heat sink, radiating fin device and CPU；It is composite board type that the phase transformation, which suppresses heat sink,
Structure, the phase transformation suppresses heat sink and is internally formed the Super-conductive conduit road with given shape, and the Super-conductive conduit road is envelope
Heat-transfer working medium is filled with stopped pipe road, the Super-conductive conduit road；The phase transformation suppress heat sink include first surface and with it is described
The relative second surface of first surface, the first surface and second surface that the phase transformation suppresses heat sink are plane, the phase
Become the first surface for suppressing heat sink provided with radiating fin device installation region, the second surface that the phase transformation suppresses heat sink is set
There are CPU installation regions；The radiating fin device is fixed in the radiating fin device installation region；The CPU is fixed on
In the CPU installation regions.The utility model CPU phase transformations suppress radiator structure and suppress heat sink using phase transformation and be used as thermal source
CPU is contacted, the characteristics of with high heat conductance, high heat transfer density and good uniform temperature, and its efficient thermal conductivity, can up to 6000W/m.K
Reach the accumulated heat on high-power CPU minimum, so as to improve CPU service life；By in one provided with radiating fin device
Side sets fan, and wind-cooling heat dissipating and phase transformation effectively are suppressed into radiating combines, and further increases radiating efficiency；Meanwhile,
CPU phase transformations of the present utility model, which suppress radiator structure, to be had the advantages that easily fabricated, adjustment and safeguards.
The phase transformation, which suppresses at least one of the first sheet material and both tri-plates in heat sink, includes at least two materials
The composite board of layer, the intensity that phase transformation suppresses to correspond in heat sink Super-conductive conduit road part is greatly improved, tensile strength ＞
4MPa；On the premise of enough intensity is ensured, the phase transformation suppresses gross thickness≤1mm of heat sink, can be applied to accurate member
In part, with small volume, the advantages of lightweight；The outer surface that the phase transformation suppresses heat sink is layers of copper, can directly carry out pricker
Weldering or soldering, are easy to operation, and steady quality solves the Welding Problems between phase transformation suppression heat sink and device.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art can all be carried out without prejudice under spirit and scope of the present utility model to above-described embodiment
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by claim of the present utility model.
Claims (11)
1. a kind of CPU phase transformations suppress radiator structure, it is characterised in that the CPU phase transformations suppress radiator structure and suppressed including phase transformation
Heat sink, radiating fin device and CPU；
It is composite board type structure that the phase transformation, which suppresses heat sink, and the phase transformation suppresses heat sink and has been internally formed with given shape
Super-conductive conduit road, the Super-conductive conduit road is closing pipe line, filled with heat-transfer working medium in the Super-conductive conduit road；The phase transformation
Suppressing heat sink includes first surface and the second surface relative with the first surface, and the phase transformation suppresses the first of heat sink
Surface and second surface are plane, and the first surface that the phase transformation suppresses heat sink is provided with radiating fin device installation region,
The second surface that the phase transformation suppresses heat sink is provided with CPU installation regions；
The phase transformation, which suppresses heat sink, includes the first sheet material, the second sheet material and tri-plate；First sheet material, second plate
Material and the tri-plate are sequentially stacked, and first sheet material and the tri-plate are located at the two of second sheet material respectively
Side, and be combined with each other with second sheet material by rolling process；The tri-plate includes elevated regions, the convex area
The surface in domain is plane；The Super-conductive conduit road is located between first sheet material and the tri-plate, and the hot superconduction
The region of pipeline distribution is corresponding with the elevated regions；At least one of described first sheet material and both tri-plates are
Include the composite board of at least two material layers；
The radiating fin device is fixed in the radiating fin device installation region；
The CPU is fixed in the CPU installation regions.
2. CPU phase transformations according to claim 1 suppress radiator structure, it is characterised in that：If the Super-conductive conduit road includes
Dry individual first conduit, the second conduit and connection through hole；
First conduit is located between first sheet material and second sheet material；
Second conduit is located between second sheet material and the tri-plate；
The connection through hole runs through second sheet material, and adjacent first conduit and second conduit are connected；
Second plate surface is formed with the bulge-structure corresponding with first conduit and second conduit.
3. CPU phase transformations according to claim 2 suppress radiator structure, it is characterised in that：
Second conduit described in first conduit described in adjacent two and adjacent two is isolated, and first conduit and second groove
Road staggered parallel distribution；
The connection through hole is located between first conduit and second conduit, and by adjacent first conduit and institute
The second conduit is stated to be connected.
4. the CPU phase transformations according to Claims 2 or 3 suppress radiator structure, it is characterised in that：First conduit and described
The shape of second conduit cross section is trapezoidal, and the shape of first conduit and the second conduit longitudinal section is rectangle；
Being shaped as the connection through hole is circular or oval.
5. the CPU phase transformations according to Claims 2 or 3 suppress radiator structure, it is characterised in that：The transverse direction of first conduit
Size is identical with the lateral dimension of second conduit.
6. CPU phase transformations according to claim 1 suppress radiator structure, it is characterised in that：First sheet material and described
The outer surface of tri-plate is equipped with anticorrosive coat.
7. CPU phase transformations according to claim 1 suppress radiator structure, it is characterised in that：The composite board is to include copper
The stainless Steel-aluminium composite board material of the Copper-Aluminum compound sheet material including the stainless steel bed of material and layer of aluminum of material layer and layer of aluminum,
Iron-aluminium composite board material including the iron material bed of material and layer of aluminum or the aluminium alloy aluminium including the aluminium alloy material bed of material and layer of aluminum are multiple
Plywood material；The layer of aluminum in first sheet material and the tri-plate is in contact with second sheet material.
8. CPU phase transformations according to claim 1 suppress radiator structure, it is characterised in that：The radiating fin device is installed
Region is correspondingly arranged with the CPU installation regions.
9. CPU phase transformations according to claim 1 suppress radiator structure, it is characterised in that：Also include fan, the fan position
Suppress the side of heat sink first surface in the phase transformation.
10. CPU phase transformations according to claim 9 suppress radiator structure, it is characterised in that：The pressure wind that the fan is produced
The direction of flowing is parallel with the surface of the radiating fin.
11. a kind of electronic product, it is characterised in that the electronic product is included as any one of claim 1 to 10
CPU phase transformations suppress radiator structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621032482.XU CN206532224U (en) | 2016-08-31 | 2016-08-31 | CPU phase transformations suppress radiator structure and electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621032482.XU CN206532224U (en) | 2016-08-31 | 2016-08-31 | CPU phase transformations suppress radiator structure and electronic product |
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| CN206532224U true CN206532224U (en) | 2017-09-29 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577321A (en) * | 2017-10-26 | 2018-01-12 | 航天特种材料及工艺技术研究所 | A kind of radiator based on phase-change material |
| CN108050870A (en) * | 2018-01-12 | 2018-05-18 | 无锡巨日电子科技有限公司 | Efficient heat transfer radiator |
| CN108075083A (en) * | 2018-01-12 | 2018-05-25 | 无锡巨日电子科技有限公司 | The power battery assembly that can be heated and radiate |
-
2016
- 2016-08-31 CN CN201621032482.XU patent/CN206532224U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577321A (en) * | 2017-10-26 | 2018-01-12 | 航天特种材料及工艺技术研究所 | A kind of radiator based on phase-change material |
| CN107577321B (en) * | 2017-10-26 | 2023-09-29 | 航天特种材料及工艺技术研究所 | Radiator based on phase change material |
| CN108050870A (en) * | 2018-01-12 | 2018-05-18 | 无锡巨日电子科技有限公司 | Efficient heat transfer radiator |
| CN108075083A (en) * | 2018-01-12 | 2018-05-25 | 无锡巨日电子科技有限公司 | The power battery assembly that can be heated and radiate |
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