CN109152294A - The hot superconducting radiator of liquid-cooled - Google Patents
The hot superconducting radiator of liquid-cooled Download PDFInfo
- Publication number
- CN109152294A CN109152294A CN201811118446.9A CN201811118446A CN109152294A CN 109152294 A CN109152294 A CN 109152294A CN 201811118446 A CN201811118446 A CN 201811118446A CN 109152294 A CN109152294 A CN 109152294A
- Authority
- CN
- China
- Prior art keywords
- plate
- cover plate
- liquid
- heat
- along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 132
- 238000012546 transfer Methods 0.000 claims abstract description 71
- 238000001816 cooling Methods 0.000 claims abstract description 45
- 238000009434 installation Methods 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims description 18
- 238000004080 punching Methods 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 239000000428 dust Substances 0.000 abstract description 4
- 239000003507 refrigerant Substances 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 29
- 230000017525 heat dissipation Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000013021 overheating Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of hot superconducting radiator of liquid-cooled, comprising: hot superconductive plate is formed with interconnected sealed passage in the hot superconductive plate, is filled with heat-transfer working medium in the sealed passage；The hot superconduction plate surface is equipped with heat source installation region；Liquid cooling heat radiator positioned at the surface of the hot superconductive plate, and is located at except the heat source installation region, and fluid passage is formed in the liquid cooling heat radiator, and the liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with the fluid passage.The hot superconducting radiator of liquid-cooled of the invention has the advantages that by hot superconduction plate surface while liquid cooling heat radiator being arranged, the specific heat capacity of refrigerant used in liquid cooling is much larger than air, can be absorbed compared to air-cooled and takes away more heats；Meanwhile using liquid cooling heat radiator forced heat radiation, there is no noises, are also not readily susceptible to the interference of dust.
Description
Technical Field
The invention belongs to the technical field of heat transfer, and particularly relates to a liquid-cooled heat superconducting radiator.
Background
Along with the rapid development of power electronic technology, the requirements of modularization, integration, light weight, low cost and high reliability are higher and higher, the heat generated by the power device during working is larger and larger, if the heat generated by the power device cannot be dissipated rapidly in time, the temperature of a chip in the power device is increased, the efficiency is reduced, the service life is shortened, and the failure of the power device and the burning of the chip are caused. Therefore, solving the problem of heat dissipation of the power device has been one of the core problems troubling manufacturers and users of power device packages. In order to effectively solve the heat dissipation problem of the power device, the power device is usually fixed on a substrate of a heat sink, heat is conducted to heat dissipation fins of the heat sink through the substrate, the contact area of the heat dissipation fins and air is large, and the heat is dissipated to the surrounding environment through the flowing and following heat exchange of the air. At present, aluminum profile radiators of natural convection or forced convection are generally adopted, and comprise aluminum inserting sheet radiators, aluminum shovel sheet radiators, aluminum extruded radiators and aluminum welding fins. Because the heat conductivity coefficient of the aluminum and the aluminum alloy is within 220W/m.K, the fin efficiency of the radiating fin is low, the heat diffusion performance is poor, and the power devices are uniformly distributed on the base plate of the radiator, so that the heat diffusion resistance of the base plate is reduced, and the heat radiating capacity of the radiator is improved. With the improvement of the performance of the power device and the increase of the heat flux density of the device, the conventional aluminum heat radiator can not meet the heat radiation requirement of a high-heat-flux high-power module.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a liquid-cooled superconducting heat sink, which is used to solve the problem that the aluminum heat sink in the prior art cannot meet the heat dissipation requirement of the high heat flux high power module.
To achieve the above and other related objects, the present invention provides a liquid-cooled superconducting heat sink, comprising:
the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is provided with a heat source installation area;
and the liquid cooling radiator is positioned on the surface of the heat superconducting plate and outside the heat source installation area, a liquid channel is formed in the liquid cooling radiator, and a liquid inlet and a liquid outlet which are communicated with the liquid channel are formed in the liquid cooling radiator.
As a preferred scheme of the present invention, the liquid cooling radiator includes a first guide plate and a liquid channel cover plate; an accommodating groove is formed on one surface of the liquid channel cover plate, and the surface of the liquid channel cover plate, on which the accommodating groove is formed, is attached to the surface of the heat superconducting plate, so that a liquid channel cavity is formed between the liquid channel cover plate and the heat superconducting plate; the first guide plate is positioned in the liquid channel cavity and fixed on the surface of the heat superconducting plate, so that the liquid channels communicated with each other are formed among the first guide plate, the heat superconducting plate and the liquid channel cover plate; the liquid inlet and the liquid outlet are both positioned on the liquid channel cover plate.
As a preferred aspect of the present invention, the accommodating groove includes a first accommodating groove and a second accommodating groove, and the first accommodating groove and the second accommodating groove both include a first end and a second end opposite to each other; the number of the first guide plates is two, one first guide plate is respectively positioned in the first accommodating groove, and the other first guide plate is positioned in the second accommodating groove; the liquid inlet is positioned at the first end of the first accommodating groove and communicated with the first accommodating groove, and the liquid outlet is positioned at the first end of the second accommodating groove and communicated with the second accommodating groove; the second end of the first accommodating groove is communicated with the second end of the second accommodating groove.
As a preferable aspect of the present invention, the first baffle includes:
the first guide strips extend in a wavy or square wave shape along a direction perpendicular to the first end of the first containing groove to the second end of the first containing groove, and the first guide strips are arranged in parallel along the direction from the first end of the first containing groove to the second end of the first containing groove;
the first connecting parts are positioned at two ends of the first flow guide strips and are uniformly connected with the first flow guide strips.
As a preferable scheme of the present invention, the first guide plate includes a plurality of first flat guide strips, and the plurality of first guide strips are arranged in parallel at intervals along a direction perpendicular to the first end of the first accommodating groove to the second end of the first accommodating groove.
As a preferable aspect of the present invention, the heat superconducting plate includes: the annular frame, the first cover plate, the second cover plate and the at least one second guide plate; wherein,
the first cover plate is attached to one surface of the annular frame, and the second cover plate is attached to the surface, far away from the first cover plate, of the annular frame, so that a sealed cavity is formed between the first cover plate and the second cover plate;
the second baffle is positioned in the sealed chamber; the second guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealed channel is formed between the second guide plate and the first cover plate as well as between the second guide plate and the second cover plate.
As a preferable aspect of the present invention, the heat superconducting plate includes at least two second deflectors, and a length of the second deflectors is the same as a length of the inside of the annular frame; gaps are reserved between the adjacent second guide plates, so that first balance channels of the heat transfer working medium are formed between the adjacent second guide plates, and the first balance channels extend along the first direction; a gap is formed between the second guide plate adjacent to the annular frame and the annular frame, so that a second balance channel of the heat transfer working medium is formed between the second guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the second guide plate is the same as that of the annular frame.
As a preferable scheme of the present invention, the side walls of the convex portions are provided with a plurality of flow guiding holes, and the flow guiding holes penetrate through the second flow guiding plate along the thickness direction of the second flow guiding plate.
As a preferred scheme of the present invention, at least one reserved gap is provided in the second guide plate; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the second guide plate, and a first mounting through hole which penetrates through the cushion block along the height direction of the cushion block is formed in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.
As a preferred scheme of the present invention, at least one reserved gap is provided in the second guide plate; the first apron perhaps be equipped with an at least punching press boss on the second apron, the punching press boss certainly first apron or the internal surface of second apron is protruding to be located in the predetermined clearance, the height of punching press boss with the height of second guide plate is the same, just be equipped with in the punching press boss along the first installation through-hole that its direction of height link up, the second apron or still be equipped with an at least second installation through-hole that link up along its direction of thickness on the first apron, the second installation through-hole with first installation through-hole corresponds the setting.
As a preferable aspect of the present invention, the heat superconducting plate includes:
a first cover plate;
the second cover plate comprises a cover plate main body and an annular convex edge, and the annular convex edge is integrally connected with the cover plate main body; the first cover plate is attached to the surface, far away from the cover plate main body, of the annular convex edge, so that a sealed cavity is formed between the first cover plate and the cover plate main body;
at least one second baffle located within the sealed chamber; the second guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealed channel is formed between the second guide plate and the first cover plate as well as between the second guide plate and the second cover plate.
As a preferable mode of the present invention, the heat superconducting plate includes at least two second deflectors, and the length of the second deflectors is the same as the length of the inner side of the annular convex edge; gaps are reserved between the adjacent second guide plates, so that first balance channels of the heat transfer working medium are formed between the adjacent second guide plates, and the first balance channels extend along the first direction; a gap is formed between the second guide plate adjacent to the annular convex edge and the annular convex edge, so that a second balance channel of the heat transfer working medium is formed between the second guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the second guide plate is the same as that of the annular convex edge.
As a preferable scheme of the present invention, the side walls of the convex portions are provided with a plurality of flow guiding holes, and the flow guiding holes penetrate through the second flow guiding plate along the thickness direction of the second flow guiding plate.
As a preferred scheme of the present invention, at least one reserved gap is provided in the second guide plate; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the second guide plate, and a first mounting through hole which penetrates through the cushion block along the height direction of the cushion block is formed in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.
As a preferred scheme of the present invention, at least one reserved gap is provided in the second guide plate; the first apron perhaps be equipped with an at least punching press boss on the second apron, the punching press boss certainly first apron or the internal surface of second apron is protruding to be located in the predetermined clearance, the height of punching press boss with the height of second guide plate is the same, just be equipped with in the punching press boss along the first installation through-hole that its direction of height link up, the second apron or still be equipped with an at least second installation through-hole that link up along its direction of thickness on the first apron, the second installation through-hole with first installation through-hole corresponds the setting.
As described above, the liquid-cooled superconducting heat sink of the present invention has the following advantageous effects:
1. the liquid cooling radiators are arranged on the surfaces of the heat superconducting plates at the same time, and the specific heat capacity of a refrigerant used for liquid cooling is far larger than that of air, so that more heat can be absorbed and taken away compared with air cooling; meanwhile, the forced heat dissipation of the liquid cooling radiator does not have noise and is not easily interfered by dust;
2. the liquid cooling radiator is provided with a first guide plate, the first guide plate not only enhances liquid disturbance and increases heat exchange area so as to improve heat dissipation capacity, but also plays a role of a reinforcing rib, the thickness of the liquid cooling cover plate can be reduced, and the overall weight of the liquid cooling radiator is reduced;
3. a heat transfer working medium is filled in a sealed cavity inside the heat superconducting plate, and the heat transfer is inhibited by means of phase change heat transfer or phase change of the heat transfer working medium, so that the heat superconducting characteristic of quick heat conduction is formed, the temperature of the whole heat superconducting plate is uniform, and the temperature difference among power devices and the highest temperature of a radiator are reduced;
4. not limited by low temperature: the heat transfer working medium can normally work at about minus 40 ℃, so that the defects that the circulating liquid needs to be heated in the high and cold regions in winter by conventional water-cooling heat dissipation and the failure problem of the heat pipe radiator in the low temperature in winter are solved, and the heat pipe radiator has better working adaptability;
5. the inside of the heat superconducting plate is a sealed cavity and is provided with a second guide plate, the first cover plate and the second cover plate are welded together by the second guide plate inside, so that the reinforcing effect is achieved, the thickness of the cover plates on two sides is reduced, the bearing capacity is increased, the strength is improved, the weight and the thickness of the heat superconducting plate are reduced, the heat exchange area inside is increased, and the heat conduction capacity of the heat superconducting plate is enhanced;
6. a plurality of power devices can be attached to one heat superconducting plate in a centralized manner, and the heat superconducting plate has the advantages of compact structure and small volume;
drawings
Fig. 1 is a schematic diagram illustrating an exploded structure of a liquid-cooled superconducting heat sink according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view of a liquid-cooled superconducting heat sink according to an embodiment of the present invention.
Fig. 3 to fig. 5 are schematic perspective views illustrating a liquid cooling radiator in a liquid cooling type superconducting radiator according to an embodiment of the present invention.
Fig. 6 is an exploded view of a superconducting plate in a liquid-cooled superconducting heat sink according to an embodiment of the present invention.
Fig. 7 is a schematic perspective view illustrating a heat superconducting plate in a liquid-cooled heat superconducting radiator according to an embodiment of the present invention.
Fig. 8 to 13 are schematic structural diagrams illustrating different exemplary baffles in a heat superconducting plate in a liquid-cooled heat superconducting radiator according to a first embodiment of the present invention; wherein fig. 9 is a front view of fig. 8, fig. 11 is a front view of fig. 10, and fig. 13 is a front view of fig. 12.
Fig. 14 to 15 are schematic partial cross-sectional views illustrating edge portions of liquid-cooled hts radiators according to various embodiments of the present invention.
Fig. 16 is an exploded view of a heat superconducting plate with a gap in a liquid-cooled heat superconducting radiator according to a second embodiment of the present invention.
Fig. 17 is a partial cross-sectional view of a liquid-cooled hts radiator with a pad according to a second embodiment of the present invention.
Fig. 18 is an exploded view of a superconducting plate with a stamped boss in a liquid-cooled superconducting heat radiator according to a second embodiment of the present invention.
Fig. 19 is an exploded view of a heat superconducting plate in a liquid-cooled heat superconducting radiator according to a third embodiment of the present invention.
Fig. 20 is a schematic top view of a heat superconducting plate of a liquid-cooled heat superconducting radiator according to a third embodiment of the present invention, in which a baffle plate is disposed in an annular frame.
Fig. 21 is an exploded view of a heat superconducting plate with a clearance and a spacer in a liquid-cooled heat superconducting radiator according to a fourth embodiment of the present invention.
Fig. 22 is a schematic top view illustrating a structure in which a baffle plate of a heat superconducting plate in a liquid-cooled heat superconducting radiator according to a fourth embodiment of the present invention is disposed in an annular frame.
Fig. 23 is an exploded view of a superconducting plate with a stamped boss in a liquid-cooled superconducting heat radiator according to a fourth embodiment of the present invention.
Fig. 24 is an exploded view of a heat superconducting plate in a liquid-cooled heat superconducting radiator according to a fifth embodiment of the present invention.
Fig. 25 is an exploded view of a heat superconducting plate with a predetermined gap in a liquid-cooled heat superconducting radiator according to a sixth embodiment of the present invention.
Fig. 26 is an exploded view of a heat superconducting plate in a liquid-cooled heat superconducting radiator according to a seventh embodiment of the present invention.
Fig. 27 is a schematic top view showing a structure in which a deflector of a heat superconducting plate in a liquid-cooled superconducting heat radiator according to a seventh embodiment of the present invention is located inside a circular flange of a second cover plate.
Fig. 28 is an exploded view of a heat superconducting plate with a clearance and a spacer in a liquid-cooled heat superconducting radiator according to an eighth embodiment of the present invention.
Fig. 29 is a schematic top view illustrating a structure of a deflector of a heat superconducting plate in a liquid-cooled heat superconducting radiator according to an eighth embodiment of the present invention, the deflector being located inside a circular flange of a second cover plate.
Fig. 30 is an exploded view of a superconducting plate with a stamped boss in a liquid-cooled superconducting heat radiator according to an eighth embodiment of the present invention.
Description of the element reference numerals
10 heat superconducting plate
100 first cover plate
101 second cover plate
1011 cover plate main body
1012 annular convex edge
102 annular frame
1021 filling hole
103 second baffle
1031 convex part
1032 flow guiding hole
1033 second flow guide strip
1034 second connection part
1035 reserved gap
104 first solder layer
105 second solder layer
106 sealing the channel
107 first balance channel
108 second balance channel
109 cushion block
110 first mounting through hole
111 second mounting through hole
112 third mounting through hole
113 stamping boss
114 filling tube
115 third solder layer
116 fourth solder layer
117 heat source installation area
118 liquid inlet pipe
119 liquid outlet pipe
20 liquid cooling radiator
201 first flow guide plate
2011 first guide strip
2012 first connecting part
202 liquid channel cover plate
2021 first holding tank
2022 second holding groove
2023 liquid inlet
2024 liquid outlet
30 power device
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 30. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
Example one
Referring to fig. 1 to 2, the present invention provides a liquid-cooled heat superconducting radiator, including: the heat superconducting plate 10 is provided with mutually communicated sealing channels 106 formed in the heat superconducting plate 10, and heat transfer working media 1061 are filled in the sealing channels 106; a heat source installation region 117 is arranged on the surface of the heat superconducting plate 10; the liquid cooling radiator 20 is located on the surface of the heat superconducting plate 10 and outside the heat source installation region 117, a liquid channel is formed in the liquid cooling radiator 20, and a liquid inlet 2023 and a liquid outlet 2024 which are communicated with the liquid channel are arranged on the liquid cooling radiator 20. By arranging the liquid cooling radiator 20 on the surface of the heat superconducting plate 10 at the same time, the specific heat capacity of a refrigerant (such as water) used for liquid cooling is far greater than that of air, and more heat can be absorbed and taken away compared with air cooling; meanwhile, the liquid cooling radiator 20 is adopted to forcibly radiate heat without noise and is not easily interfered by dust.
As an example, referring to fig. 3 to fig. 5 in conjunction with fig. 1, the liquid-cooled heat sink 20 includes a first baffle 201 and a liquid channel cover plate 202; an accommodating groove is formed on one surface of the liquid channel cover plate 202, and the surface of the liquid channel cover plate 202, on which the accommodating groove is formed, is attached to the surface of the heat superconducting plate 10, so that a liquid channel cavity is formed between the liquid channel cover plate 202 and the heat superconducting plate 10; the first guide plate 201 is located in the liquid channel chamber and fixed on the surface of the heat superconducting plate 10, so that the liquid channels communicated with each other are formed between the first guide plate 201 and the heat superconducting plate 10 as well as between the first guide plate 201 and the liquid channel cover plate 202; the liquid inlet 2023 and the liquid outlet 2024 are both located on the liquid path cover plate 202; the liquid inlet 2034 is connected to a liquid inlet pipe 118, and the liquid outlet 2024 is connected to a liquid outlet pipe 119. The liquid cooling radiator 20 is provided with the first guide plate 201, the first guide plate 201 not only enhances the liquid disturbance and increases the heat exchange area, thereby improving the heat dissipation capacity, but also plays a role of a reinforcing rib, and the thickness of the liquid cooling cover plate 202 can be reduced, thereby reducing the whole weight of the liquid cooling radiator 20.
As an example, the receiving groove includes a first receiving groove 2021 and a second receiving groove 2022, and the first receiving groove 2021 and the second receiving groove 2022 both include a first end and a second end opposite to each other; the number of the first air deflectors 201 is two, one first air deflector 201 is respectively located in the first accommodating groove 2021, and the other first air deflector 201 is located in the second accommodating groove 2022; the liquid inlet 2023 is located at the first end of the first accommodating groove 2021 and is communicated with the first accommodating groove 2021, and the liquid outlet 2024 is located at the first end of the second accommodating groove 2022 and is communicated with the second accommodating groove 2022; the second end of the first receiving groove 2021 is communicated with the second end of the second receiving groove 2022.
In one example, as shown in fig. 3 and 4, the first baffle 201 includes: the first guide strips 2011 extend in a wavy or square wave shape along a direction perpendicular to the first end of the first containing groove 2021 to the second end of the first containing groove 2021, and the first guide strips 2011 are arranged in parallel along a direction from the first end of the first containing groove 3011 to the second end of the first containing groove 3011; specifically, taking the direction from the first end of the first receiving groove 2021 to the first end of the first receiving groove 2021 as the length direction of the liquid channel cover plate 202 as an example, the plurality of first flow guide strips 2011 extend in a wavy or square wave shape along the width direction of the liquid channel cover plate 202, and the plurality of first flow guide strips 2011 are arranged in parallel along the length direction of the liquid channel cover plate 202; the first connecting portion 2012 is located at two ends of the first flow guiding bar 2011 and is integrally connected to the first flow guiding bars 2011.
In another example, as shown in fig. 5, the first baffle 201 includes a plurality of first flow guiding strips 2011 in a flat plate shape, and the plurality of first flow guiding strips 2011 are arranged in parallel and at intervals along a direction perpendicular to the first end of the first receiving groove 2021 to the second end of the first receiving groove 2021; specifically, taking the direction from the first end of the first receiving groove 2021 to the first end of the first receiving groove 2021 as the length direction of the liquid channel cover plate 202 as an example, the plurality of first flow guide strips 2011 extend along the length direction of the liquid channel cover plate 202 and are arranged in parallel and at intervals along the width direction of the liquid channel cover plate 202.
The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the heat superconducting plate may be a phase change suppression heat dissipation plate, and at this time, the heat transfer working medium in the heat superconducting plate is suppressed from boiling or condensing during the heat transfer process, and on this basis, the consistency of the microstructure of the working medium is achieved to achieve heat transfer. In this embodiment, the heat superconducting plate may also be a heat pipe heat transfer plate, and at this time, the heat transfer working medium in the heat superconducting plate continuously performs a phase change cycle of evaporation heat absorption and condensation heat release in the heat transfer process to realize rapid heat transfer.
By way of example, heat transfer medium 1061 is a fluid, and preferably, heat transfer medium 1061 may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in this embodiment, heat transfer medium 1061 is a mixture of a liquid and a gas.
As shown in fig. 6 and 7, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101; the second baffle 103 is located within the sealed chamber; the second diversion plate 103 comprises a plurality of protrusions 1031 arranged at intervals in a first direction and extending in a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of the protrusions 1031 adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the protrusions 1031 and the adjacent protrusions 1031, so that mutually communicated sealed passages 106 are formed between the second diversion plate 103 and the first cover plate 100 and the second cover plate 101; and a heat transfer working medium 1061 is filled in the sealing channel 106. Note that, in fig. 8, 10, and 12, a direction indicated by an arrow a is the first direction, and a direction indicated by an arrow b is the second direction; the first direction may be a longitudinal direction of the second guide plate 103, in which case the second direction is a width direction of the second guide plate 103, or the first direction may be a width direction of the second guide plate 103, in which case the second direction is a longitudinal direction of the second guide plate 103.
It should be noted that, because the inner side of the annular frame 102 is a hollow area, after the first cover plate 100 and the second cover plate 101 are attached to the upper and lower surfaces of the annular frame 102, a sealed chamber is formed inside the first cover plate 100, the second cover plate 101 and the annular frame 102.
Specifically, the bottoms of the adjacent protrusions 1031 in the first direction are integrally connected, and gaps are formed below the protrusions 1031 and between the adjacent protrusions 1031, so that the second baffle 103 is arranged in a convex-concave manner at intervals along the length direction.
As an example, as shown in fig. 14 and 15, the heat superconducting plate 10 further includes a first solder layer 104 and a second solder layer 105; the first solder layer 104 is located between the first cover plate 100 and the annular frame 102 and the second baffle 103, so as to weld the first cover plate 100 and the annular frame 102 and the second baffle 103 together; the second solder layer 105 is located between the second cover plate 101 and the annular rim 102 and the second baffle 103 to solder the second cover plate 101 and the annular rim 102 and the second baffle 103 together. The first flow guiding plate 201 and the liquid channel cover plate 202 may be welded to the surface of the first cover plate 100 or the surface of the second cover plate 101 through a third solder layer 115, and the first flow guiding plate 201 may be welded to the liquid channel cover plate 202 through a fourth solder layer 116.
As an example, the height of the second baffle 103 is the same as the height of the annular rim 102. Setting the height of the second flow guide plate 103 to be the same as the height of the annular frame 102 can ensure that the soldering area of the second flow guide plate 103 with the first solder layer 104 and the second solder layer 105 reaches the maximum, thereby increasing the soldering strength.
As an example, as shown in fig. 6, one side of the annular frame 102 is provided with a filling hole 1021 penetrating through the sidewall. After the first cover plate 100 and the second cover plate 101 are welded with the annular frame 102 and the second guide plate 103, one end of a filling tube 114 is inserted into the filling hole 1021, and the heat transfer working medium 1061 can be filled into the sealed passage 106. After filling heat transfer medium 1061, filling opening 1021 is closed to seal sealing channel 106.
In an example, the second baffle 103 may be, but is not limited to, a stamped plate, as shown in fig. 8 and 9, the length of the second baffle 103 is the same as the length of the inside of the annular frame 102, and the width of the second baffle 103 is the same as the width of the inside of the annular frame 102; the side walls of the protrusions 1031 are provided with a plurality of diversion holes 1032, and the diversion holes 1032 penetrate through the second diversion plate 103 along the thickness direction of the second diversion plate 103. Specifically, as shown in fig. 8 and 9, the second diversion plate 103 may extend in a square wave shape along the first direction, that is, the second diversion plate 103 includes a plurality of protrusions 1031 arranged at intervals along the first direction, bottoms of adjacent protrusions 1031 are connected to each other along the first direction, and adjacent protrusions 1031 are recessed. Of course, in other examples, the second flow guiding plate 103 may also extend in a wave shape along the first direction, but preferably, the second flow guiding plate 103 extends in a square wave shape along the first direction, so that the upper surface (i.e., the top surface of the protruding portion 1031) and the lower surface (i.e., the bottom surface of the concave portion between the adjacent protruding portions 13) of the second flow guiding plate 103 are both ensured to be planar, and thus the contact area between the second flow guiding plate 103 and the first solder layer 104 and the second solder layer 105 is ensured to be as large as possible, thereby improving the soldering strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the second flow guiding plate 103 are welded together, the gap between the protruding portion 1031 of the second flow guiding plate 103 and the second solder layer 105, the gap between the recess between the protruding portion 1031 and the first solder layer 104, and the flow guiding hole 1032 together constitute the sealing channel 106. In this example, the protrusion 1031 penetrates the second baffle 103 in the second direction, i.e. the protrusion 1031 extends through the second baffle 103 in the second direction, i.e. the length of the protrusion 1031 is the same as in the second direction. Each of the protruding portions 1031 is provided with a plurality of flow guiding holes 1032, the flow guiding holes 1032 on each of the protruding portions 1031 are arranged at intervals in a single row or multiple rows along the extending direction of the protruding portions 1031, and the flow guiding holes 1032 are provided on the side walls on both sides of each of the protruding portions 1031. The diversion holes 1032 on each protrusion 1031 may be arranged in a one-to-one correspondence as shown in fig. 9, or may be arranged in a staggered manner. Because there is a sufficient gap between the second diversion plate 103 and the first solder layer 104 and the second solder layer 105 along the second direction, the heat transfer working medium 1061 flows very smoothly along the second direction, and the heat transfer working medium 1061 flows along the first direction (i.e., the direction in which the protrusions 1031 are arranged at intervals) is blocked, so that by providing the diversion holes 1032 on the protrusions 1031, the flow of the heat transfer working medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect along the first direction, so that the heat transfer working medium 1061 has almost the same fluidity along the first direction and along the second direction, so that the entire heat superconducting plate has the same heat dissipation effect in each direction, so that the temperatures of each region of the heat superconducting plate 10 are the same, thereby effectively avoiding the occurrence of overheating in a local region of the heat superconducting plate 10 due to poor heat dissipation effect in one or more directions .
In another example, as shown in fig. 10 and 11, the second baffle 103 includes: a plurality of second flow guide strips 1033 and second connection portions 1034 arranged in parallel along the second direction, wherein the second flow guide strips 1033 include a plurality of convex portions 1031 arranged at intervals along the first direction; the second flow guide strips 1033 at both sides contact with the inner side of the annular frame 102; the second connection portions 1034 are located at two ends of the second flow guide strips 1033, and are integrally connected to the plurality of second flow guide strips 1033; the side of the second connection portion 1034 away from the second diversion bar 1033 contacts the inner side of the annular frame 102. In this example, the width of the second baffle 103 is the same as the width of the inside of the annular rim 102, and the length of the second baffle 103 is the same as the length of the inside of the annular rim 102. The second flow guiding strips 1033 may extend in a square wave shape or in a wave shape along the first direction (generally, the length direction of the second flow guiding strips 1033), that is, the second flow guiding strips 1033 include a plurality of protrusions 1031 arranged at intervals along the first direction, and are adjacent to each other at the bottoms of the protrusions 1031 along the first direction, and are adjacent to each other between the protrusions 1031 in a concave shape. Preferably, in this embodiment, the second flow guiding strips 1033 extend in a square wave shape along the first direction, so as to ensure that both upper and lower surfaces of the second flow guiding strips 1033 are flat, that is, to ensure that both upper and lower surfaces of the second flow guiding plate 103 (i.e., the top surface of the protruding portion 1031) and (i.e., the surface opposite to the top of the protruding portion 1031) are flat, so as to ensure that the contact area between the second flow guiding plate 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the soldering strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the second flow guiding plate 103 are welded together, the gap between the protruding portion 1031 of the second flow guiding strip 1033 and the second solder layer 105, the gap between the recess between the protruding portion 1031 and the first solder layer 104, and the gap between the adjacent second flow guiding strips 1033 jointly constitute the sealing channel 106.
As an example, the protruding portions 1031 on two adjacent rows of the second flow guiding strips 1033 may be arranged in a one-to-one correspondence, that is, the protruding portions 1031 on each second flow guiding strip 1033 are arranged in a one-to-one correspondence along the second direction (i.e., the direction in which the second flow guiding strips 1033 are arranged). Of course, in other examples, the protrusions 1031 on two adjacent rows of the second flow guide strips 1033 may also be arranged in a staggered manner, and the staggered arrangement of the protrusions 1031 on two adjacent rows of the second flow guide strips 1033 means that the sides of the protrusions 1031 on two adjacent rows of the second flow guide strips 1033 are staggered, as shown in fig. 10 and 11; the offset distance of the convex portions 1031 of the two adjacent rows of the second flow guide strips 1033 may be smaller than the width of the convex portions 1031, as shown in fig. 10 and 11, the offset distance of the convex portions 1031 of the two adjacent rows of the second flow guide strips 1033 may also be equal to the width of the convex portions 1031, and at this time, the convex portions 1031 of one row of the second flow guide strips 1033 are aligned with the concave portions between the convex portions 1031 of the adjacent row of the second flow guide strips 1033. It should be noted that when the convex portions 1031 on the second flow guide strips 1033 in two adjacent rows are arranged in a staggered manner, the convex portions 1031 on the second flow guide strips 1033 in every other row are arranged in a one-to-one correspondence manner, that is, the convex portions 1031 on the second flow guide strips 1033 in odd rows are arranged in a staggered manner with the convex portions 1031 on the second flow guide strips 1033 in even rows, the convex portions 1031 on the second flow guide strips 1033 in odd rows are arranged in a one-to-one correspondence manner, and the convex portions 1031 on the second flow guide strips 1033 in even rows are also arranged in a one-to-one correspondence manner.
For example, as shown in fig. 12 and 13, flow guiding holes 1032 may be formed in the sidewalls of the protruding portion 1031, and the flow guiding holes 1032 penetrate through the second flow guiding strips 1033 in the thickness direction of the second flow guiding strips 1033. Since there is a sufficient gap between the second flow guide strips 1033 and the first solder layer 104 and the second solder layer 105 along the second direction, the flow of the heat transfer working medium 1061 along the second direction is very smooth, and the flow of the heat transfer working medium 1061 along the first direction (i.e. the direction in which the second flow guide strips 1033 extend) is blocked, by providing the flow guide holes 1032 on the protruding portions 1031, the flow of the heat transfer working medium 1061 along the first direction can be increased, so as to increase the heat transfer effect along the first direction, so that the heat transfer working medium 1061 has almost the same flow along the first direction and the second direction, so that the heat dissipation effect in each direction of the whole heat superconducting plate 10 is the same, so that the temperature of each region of the heat superconducting plate 10 is the same, and the occurrence of the local overheating phenomenon of the heat superconducting plate 10 due to the poor heat dissipation effect in one or more directions is effectively avoided .
As an example, the side walls on both sides of each protruding portion 1031 on each second flow guide strip 1033 are provided with the flow guide holes 1032, and along the extending direction of the second flow guide strips 1033, the flow guide holes 1032 on each protruding portion 1031 may be arranged in a one-to-one correspondence as shown in fig. 12, or may be arranged in a staggered manner.
As an example, continuing to refer to fig. 1, the liquid-cooled heat superconducting radiator further includes a power device 30, and the power device 30 is attached to the surface of the heat superconducting plate 10 and located in the heat source installation region 117. The power device 30 may be any device that needs heat dissipation, such as a virtual digital coin digging machine (specifically, but not limited to, a computing board and a computing board control board of a virtual digital coin such as a bitcoin, etc.), and so on. The specific structure of the virtual digital coin digging machine is known to those skilled in the art, and will not be described herein.
Example two
Referring to fig. 16 to 18 in conjunction with fig. 1 to 15, the present embodiment further provides a liquid-cooled heat superconducting radiator, and the structure of the liquid-cooled heat superconducting radiator in the present embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the first embodiment, and the difference between the two embodiments is that the specific structure of the heat superconducting plate 10 is different: compared with the heat superconducting plate 10 described in the first embodiment, in the heat superconducting plate 10 described in the first embodiment, at least one reserved gap 1035 is additionally provided in the second guide plate 103, and at the same time, the heat superconducting plate 10 further includes at least one spacer block 109 or at least one stamping boss 113 provided on the first cover plate 100 or the second cover plate 101. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the first embodiment, and specific reference is made to the first embodiment, which will not be described again here.
In an example, as shown in fig. 16 and 17, a plurality of reserved gaps 1035 are provided in the second guide plate 103 in the heat superconducting plate 10, where fig. 16 exemplifies that 4 reserved gaps 1035 are provided in the second guide plate 103, and in a practical example, the number of reserved gaps 1035 is not limited thereto; the heat superconducting plate 10 further includes a plurality of the spacers 109, the number of the spacers 109 is the same as the number of the reserved gaps 1035, and the spacers 109 are correspondingly arranged in each reserved gap 1035 one to one; the height of the cushion blocks 109 is the same as that of the second guide plate 103, and a first mounting through hole 110 penetrating along the height direction of each cushion block 109 is arranged in each cushion block 109; the first cover plate 100 is further provided with a plurality of second mounting through holes 111 penetrating in the thickness direction of the first cover plate 100, the number of the second mounting through holes 111 is the same as that of the first mounting through holes 110, and the second mounting through holes 111 and the first mounting through holes 110 are arranged in a one-to-one correspondence manner; the second cover plate 101 is further provided with a plurality of third mounting through holes 112 which are communicated along the thickness direction of the second cover plate 101, the number of the third mounting through holes 112 is equal to that of the first mounting through holes 110, and the third mounting through holes 112 are in one-to-one correspondence with the first mounting through holes 110. It should be noted that, for the convenience of illustration of the reserved gap 1035, the pad 109 is not illustrated in fig. 16, and for the convenience of illustration, the first solder layer 104 and the second solder layer 105 are not illustrated in fig. 16. Because a heating power device needs to be installed and fixed on the surface of the heat superconducting plate 10, and the sealing channel 106 in the heat superconducting plate 10 is a sealing pipeline, a fixing hole cannot be directly drilled at a position of the heat superconducting plate 10 corresponding to the sealing channel 106, so as to prevent the heat transfer working medium 1061 in the sealing channel 106 from leaking; in the present invention, the reserved gap 1035 is reserved in the second flow guide plate 103, the spacer block 109 with the same height as the second flow guide plate 103 is arranged in the reserved gap 1035, and the first mounting through hole 110 is formed in the spacer block 109, so that the power device 70 can be fixed to the heat superconducting plate 10 by using the first mounting through hole 110, the second mounting through hole 111, and the third mounting through hole 112 on the second cover plate 101 on the premise of fixing devices such as bolts after the second mounting through hole 111 is formed on the first cover plate 100 and the third mounting through hole 112 is formed on the second cover plate 101, and at the same time, the sealed passage 106 can be ensured to be in a sealed state, and the heat transfer working medium 1061 cannot leak.
In another example, as shown in fig. 18, a plurality of reserved gaps 1035 are provided in the second guide plate 103 of the heat superconducting plate 10, where fig. 18 exemplifies that four reserved gaps 1035 are provided in the second guide plate 103, and in a practical example, the number of reserved gaps 1035 is not limited thereto; a plurality of stamping bosses 113 are arranged on the first cover plate 100 or the second cover plate 101, wherein a plurality of stamping bosses 113 are arranged on the second cover plate 101 in fig. 18 as an example; the stamping bosses 113 are protruded from the inner surface of the first cover plate 100 or the second cover plate 101 and arranged in the reserved gaps 1035, the height of the stamping bosses 113 is the same as that of the second guide plate 103, the number of the stamping bosses 113 is the same as that of the reserved gaps 1035, the stamping bosses and the reserved gaps 1035 are arranged in a one-to-one correspondence manner, first installation through holes 110 penetrating along the height direction of the stamping bosses are arranged in the stamping bosses 113, a plurality of second installation through holes 111 penetrating along the thickness direction of the second cover plate 101 or the first cover plate 100 are further arranged on the second cover plate 101 or the first cover plate 100, and the number of the second installation through holes 111 is the same as that of the first installation through holes 110 and the second installation through holes 111 and the first installation through holes 110 are arranged in a one-. It should be noted that, if the stamping boss 113 is disposed on the second cover plate 101, the second mounting through hole 111 is located on the first cover plate 100, as shown in fig. 18; if the stamping boss 113 is disposed on the first cover plate 100, the second mounting through hole 111 is located on the second cover plate 101. It is further noted that, for convenience of illustration, the first solder layer 104 and the second solder layer 105 are not illustrated in fig. 18. In the present invention, the reserved gap 1035 is reserved in the second guide plate 103, the plurality of stamping bosses 113 which are protruded into the reserved gap 1035 and have the same height as the second guide plate 103 are arranged on the first cover plate 100 or the second cover plate 12, and the first mounting through holes 110 are arranged in the stamping bosses 113, so that the power device can be fixed on the heat superconducting plate by using the first mounting through holes 110 and the second mounting through holes 111 on the premise of fixing devices such as bolts after the second mounting through holes 111 are arranged on the second cover plate 101 or the first cover plate 100, and at the same time, the sealing channel 106 can be ensured to be in a sealed state, and the heat transfer working medium 1061 cannot leak.
It should be noted that in fig. 16 to 18, the second guide plate 103 is a whole second guide plate after the reserved gap 1035 is provided in the second guide plate 103 as shown in fig. 8 and 9 in the first embodiment, but in other examples, the second guide plate 103 may also be a second guide plate after the reserved gap 1035 is provided in the second guide plate 103 as shown in fig. 10 to 13 in the first embodiment.
EXAMPLE III
Referring to fig. 19 to 20 in conjunction with fig. 1 to 18, the present embodiment further provides a liquid-cooled heat superconducting radiator, and the structure of the liquid-cooled heat superconducting radiator in the present embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the first embodiment, and the difference between the two embodiments is that the structure of the heat superconducting plate 10 is different: in the first embodiment, the number of the second guide plates 103 in the heat superconducting plate 10 is one, while the number of the second guide plates 103 in this embodiment is at least two, and there is a gap between adjacent second guide plates 103, so as to form a first balance channel 107 of the heat transfer medium 1061 between adjacent second guide plates 103, where the first balance channel 107 extends along the first direction, that is, the extending direction of the first balance channel 107 is parallel to the first direction; a gap is formed between the second guide plate 103 adjacent to the annular frame 102 and the annular frame 102, so that a second balance channel 108 of the heat transfer working medium 1061 is formed between the second guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, namely the extending direction of the second balance channel 108 is parallel to the end surface of the convex part 31; the height of the second baffle 103 is the same as the height of the annular frame 102. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the first embodiment, and specific reference is made to the first embodiment, which will not be described again here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer working medium 1061 in a gas state, the heat transfer working medium 1061 in a liquid state or the heat transfer working medium 1061 in a gas-liquid mixed state along the length direction of the second flow guide plate 103; second balance channel 108 may act as a liquid balance channel to enhance the flow of heat transfer medium 1061 in a liquid state in the first direction. Because the heat superconducting plate 10 is mainly in the channel direction along the second direction, and the heat transfer working medium 1061 has a large flow resistance and a poor fluidity along the first direction, the fluidity of the heat transfer working medium 1061 along the first direction can be enhanced by additionally arranging the first balance channel 107 and the second balance channel 108, so that the whole heat superconducting plate 10 has the same heat dissipation effect in each direction, the temperature of each region of the heat superconducting plate 10 is the same, and the occurrence of the local region overheating phenomenon of the heat superconducting plate 10 due to the poor heat dissipation effect of one movable multi-direction can be effectively avoided.
Example four
Referring to fig. 21 to 23 in conjunction with fig. 1 to 18, the present embodiment further provides a liquid-cooled heat superconducting radiator, and the structure of the liquid-cooled heat superconducting radiator in the present embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the second embodiment, and the difference between the two embodiments is that the structure of the heat superconducting plate 10 is different: in the second embodiment of the heat superconducting plate 10, the number of the second guide plates 103 is one, while in the present embodiment, the number of the second guide plates 103 is at least two, and there is a gap between adjacent second guide plates 103, so as to form a first balance channel 107 of the heat transfer medium 1061 between adjacent second guide plates 103, where the first balance channel 107 extends along the first direction, that is, the extending direction of the first balance channel 107 is parallel to the first direction; a gap is formed between the second guide plate 103 adjacent to the annular frame 102 and the annular frame 102, so that a second balance channel 108 of the heat transfer working medium 1061 is formed between the second guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, namely the extending direction of the second balance channel 108 is parallel to the end surface of the convex part 31; the height of the second baffle 103 is the same as the height of the annular frame 102. Other structures of the heat superconducting plate 10 described in this embodiment are completely the same as those of the heat superconducting plate 10 described in the second embodiment, and specific reference is made to the second embodiment, which will not be described again here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer working medium 1061 in a gas state, the heat transfer working medium 1061 in a liquid state or the heat transfer working medium 1061 in a gas-liquid mixed state along the length direction of the second flow guide plate 103; second balance channel 108 may act as a liquid balance channel to enhance the flow of heat transfer medium 1061 in a liquid state in the first direction. Because the heat superconducting plate 10 is mainly in the channel direction along the second direction, and the heat transfer working medium 1061 has a large flow resistance and a poor fluidity along the first direction, the fluidity of the heat transfer working medium 1061 along the first direction can be enhanced by additionally arranging the first balance channel 107 and the second balance channel 108, so that the whole heat superconducting plate 10 has the same heat dissipation effect in each direction, the temperature of each region of the heat superconducting plate 10 is the same, and the occurrence of the local region overheating phenomenon of the heat superconducting plate 10 due to the poor heat dissipation effect of one movable multi-direction can be effectively avoided.
Fig. 21 and 22 are schematic structural views of heat superconducting plate 10 having clearance 1035 and spacers 109 in the liquid-cooled heat superconducting radiator, and fig. 23 is a schematic structural view of heat superconducting plate 10 having stamped bosses 113 in the liquid-cooled heat superconducting radiator.
It should be further noted that the reserved gap 1035 formed in the second baffle 103 in the embodiment is located in the second baffle 103 closest to the second balance channel 108, as shown in fig. 21 to 23. Fig. 21 to 23 illustrate the second baffle 103 as a second baffle including a plurality of second baffle bars 1033 and second connection portions 1034 after the second baffle 103 is provided with the reserved gaps 1035 in the second baffle 103 shown in fig. 10 and 11 in the first embodiment, the number of the second baffles 103 is two, and the second baffles 103 further include the spacers 109 as an example; of course, in other examples, the second flow guide plate 103 may also be a second flow guide plate after the reserved gap 1035 is provided in the second flow guide plate 103 shown in fig. 8 and 9 or fig. 12 and 13 in the first embodiment, and when the second flow guide plate 103 does not include the spacer block 109, the first cover plate 11 or the second cover plate 21 may also be provided with the stamping protrusion 113. The number of the second baffles 103 can be set according to actual needs, and is not limited to two.
It should be further noted that the reserved gaps 1035 may be arranged according to actual needs, for example, a plurality of reserved gaps 1035 may be arranged in a line as shown in fig. 21 to 23, or may be arranged in an array as shown in fig. 16 and 18 in the second embodiment.
EXAMPLE five
Referring to fig. 24 in conjunction with fig. 1 to fig. 15, the present invention further provides a liquid-cooled heat superconducting radiator, and the specific structure of the liquid-cooled heat superconducting radiator in this embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the first embodiment, and the difference between the two embodiments is that the specific structure of the heat superconducting plate 10 is different: in one embodiment, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.
In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the first embodiment; at this time, the second cover plate 101 is attached to the annular flange.
The specific structure of the second current collector 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the second current collector 103 in the heat superconducting plate 10 described in the first embodiment, and will not be described in detail here. Also, the structure of the liquid-cooled superconducting heat sink in this embodiment other than the heat superconducting plate 10 is identical to the corresponding structure of the liquid-cooled superconducting heat sink in the first embodiment, and will not be described in detail herein.
In this embodiment, the second cover plate 101 may be formed by a stamping process to form the cover plate main body 1011 and the annular convex edge 1012, without using an additional annular frame, so as to reduce the weight of the heat superconducting plate 10 and reduce the cost.
EXAMPLE six
Referring to fig. 25 in conjunction with fig. 1 to 18, the present invention further provides a liquid-cooled heat superconducting radiator, the specific structure of the liquid-cooled heat superconducting radiator in this embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the second embodiment, and the difference between the two embodiments is that the specific structure of the heat superconducting plate 10 is different: in the second embodiment, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.
In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the second embodiment; at this time, the second cover plate 101 is attached to the annular flange.
The specific structure of the second current collector 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the second current collector 103 in the heat superconducting plate 10 described in the second embodiment, and will not be described in detail here. Also, the structure of the liquid-cooled superconducting heat sink in this embodiment other than the heat superconducting plate 10 is identical to the corresponding structure of the liquid-cooled superconducting heat sink in the second embodiment, and will not be described again here.
In this embodiment, the second cover plate 101 may be formed by a stamping process to form the cover plate main body 1011 and the annular convex edge 1012, without using an additional annular frame, so as to reduce the weight of the heat superconducting plate 10 and reduce the cost.
EXAMPLE seven
Referring to fig. 26 to 27 in conjunction with fig. 1 to 20, the present invention further provides a liquid-cooled heat superconducting radiator, wherein the specific structure of the liquid-cooled heat superconducting radiator in the present embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the third embodiment, and the difference between the specific structure of the heat superconducting plate 10 is different: in the third embodiment, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.
In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the third embodiment; at this time, the second cover plate 101 is attached to the annular flange.
The specific structure of the second current collector 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the second current collector 103 in the heat superconducting plate 10 described in the third embodiment, and will not be described in detail here. Also, the structure of the liquid-cooled superconducting heat sink in this embodiment other than the heat superconducting plate 10 is identical to the corresponding structure of the liquid-cooled superconducting heat sink in the third embodiment, and will not be described again here.
In this embodiment, the second cover plate 101 may be formed by a stamping process to form the cover plate main body 1011 and the annular convex edge 1012, without using an additional annular frame, so as to reduce the weight of the heat superconducting plate 10 and reduce the cost.
Example eight
Referring to fig. 28 to 30 in conjunction with fig. 1 to 23, the present invention further provides a liquid-cooled heat superconducting radiator, wherein the specific structure of the liquid-cooled heat superconducting radiator in the present embodiment is substantially the same as that of the liquid-cooled heat superconducting radiator in the fourth embodiment, and the difference between the specific structure of the heat superconducting plate 10 is different: in the fourth embodiment, the heat superconducting plate 10 includes: the air-tight structure comprises an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to one surface of the annular frame 102, and the second cover plate 101 is attached to the surface of the annular frame 102 far away from the first cover plate 100, so that a sealed chamber is formed between the first cover plate 100 and the second cover plate 101. In the present embodiment, the heat superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 comprises a cover plate main body 1011 and an annular convex edge 1012, wherein the annular convex edge 1012 is integrally connected with the cover plate main body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.
In this embodiment, the first cover plate 100 may include a cover plate main body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the fourth embodiment; at this time, the second cover plate 101 is attached to the annular flange.
The specific structure of the second current collector 103 in the heat superconducting plate 10 described in this embodiment is exactly the same as the specific structure of the second current collector 103 in the heat superconducting plate 10 described in the fourth embodiment, and will not be described in detail here. Also, the structure of the liquid-cooled superconducting heat sink in this embodiment other than the heat superconducting plate 10 is identical to the corresponding structure of the liquid-cooled superconducting heat sink in the fourth embodiment, and will not be described in detail here.
In this embodiment, the second cover plate 101 may be formed by a stamping process to form the cover plate main body 1011 and the annular convex edge 1012, without using an additional annular frame, so as to reduce the weight of the heat superconducting plate 10 and reduce the cost.
In summary, the present invention provides a liquid-cooled heat superconducting radiator, which includes: the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is provided with a heat source installation area; and the liquid cooling radiator is positioned on the surface of the heat superconducting plate and outside the heat source installation area, a liquid channel is formed in the liquid cooling radiator, and a liquid inlet and a liquid outlet which are communicated with the liquid channel are formed in the liquid cooling radiator. The liquid-cooled heat superconducting radiator has the following beneficial effects: 1. the liquid cooling radiators are arranged on the surfaces of the heat superconducting plates at the same time, and the specific heat capacity of a refrigerant used for liquid cooling is far larger than that of air, so that more heat can be absorbed and taken away compared with air cooling; meanwhile, the forced heat dissipation of the liquid cooling radiator does not have noise and is not easily interfered by dust; 2. the liquid cooling radiator is provided with a first guide plate, the first guide plate not only enhances liquid disturbance and increases heat exchange area so as to improve heat dissipation capacity, but also plays a role of a reinforcing rib, the thickness of the liquid cooling cover plate can be reduced, and the overall weight of the liquid cooling radiator is reduced; 3. a heat transfer working medium is filled in a sealed cavity inside the heat superconducting plate, and the heat transfer is inhibited by means of phase change heat transfer or phase change of the heat transfer working medium, so that the heat superconducting characteristic of quick heat conduction is formed, the temperature of the whole heat superconducting plate is uniform, and the temperature difference among power devices and the highest temperature of a radiator are reduced; 4. not limited by low temperature: the heat transfer working medium can normally work at about minus 40 ℃, so that the defects that the circulating liquid needs to be heated in the high and cold regions in winter by conventional water-cooling heat dissipation and the failure problem of the heat pipe radiator in the low temperature in winter are solved, and the heat pipe radiator has better working adaptability; 5. the inside of the heat superconducting plate is a sealed cavity and is provided with a second guide plate, the first cover plate and the second cover plate are welded together by the second guide plate inside, so that the reinforcing effect is achieved, the thickness of the cover plates on two sides is reduced, the bearing capacity is increased, the strength is improved, the weight and the thickness of the heat superconducting plate are reduced, the heat exchange area inside is increased, and the heat conduction capacity of the heat superconducting plate is enhanced; 6. a plurality of power devices can be attached to one heat superconducting plate in a centralized manner, and the heat superconducting plate has the advantages of compact structure and small size.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (15)
1. A liquid-cooled superconducting heat sink, comprising:
the heat superconducting plate is internally provided with mutually communicated sealing channels, and the sealing channels are filled with heat transfer working mediums; the surface of the heat superconducting plate is provided with a heat source installation area;
and the liquid cooling radiator is positioned on the surface of the heat superconducting plate and outside the heat source installation area, a liquid channel is formed in the liquid cooling radiator, and a liquid inlet and a liquid outlet which are communicated with the liquid channel are formed in the liquid cooling radiator.
2. The liquid-cooled thermosonic radiator of claim 1, wherein the liquid-cooled radiator includes a first baffle and a liquid passage cover plate; an accommodating groove is formed on one surface of the liquid channel cover plate, and the surface of the liquid channel cover plate, on which the accommodating groove is formed, is attached to the surface of the heat superconducting plate, so that a liquid channel cavity is formed between the liquid channel cover plate and the heat superconducting plate; the first guide plate is positioned in the liquid channel cavity and fixed on the surface of the heat superconducting plate, so that the liquid channels communicated with each other are formed among the first guide plate, the heat superconducting plate and the liquid channel cover plate; the liquid inlet and the liquid outlet are both positioned on the liquid channel cover plate.
3. The liquid-cooled hts heat sink of claim 2 wherein the receiving slot comprises a first receiving slot and a second receiving slot, each comprising opposing first and second ends; the number of the first guide plates is two, one first guide plate is respectively positioned in the first accommodating groove, and the other first guide plate is positioned in the second accommodating groove; the liquid inlet is positioned at the first end of the first accommodating groove and communicated with the first accommodating groove, and the liquid outlet is positioned at the first end of the second accommodating groove and communicated with the second accommodating groove; the second end of the first accommodating groove is communicated with the second end of the second accommodating groove.
4. The liquid-cooled thermosonic heat spreader of claim 3, wherein the first baffle comprises:
the first guide strips extend in a wavy or square wave shape along a direction perpendicular to the first end of the first containing groove to the second end of the first containing groove, and the first guide strips are arranged in parallel along the direction from the first end of the first containing groove to the second end of the first containing groove;
the first connecting parts are positioned at two ends of the first flow guide strips and are uniformly connected with the first flow guide strips.
5. The liquid-cooled hts heat sink of claim 3, wherein the first deflector comprises a plurality of first flow-guiding strips in the form of flat plates, and the plurality of first flow-guiding strips are arranged in parallel and spaced apart along the direction perpendicular to the first end of the first receiving tank to the second end of the first receiving tank.
6. The liquid-cooled heat superconducting radiator according to any one of claims 1 to 5, wherein the heat superconducting plate comprises: the annular frame, the first cover plate, the second cover plate and the at least one second guide plate; wherein,
the first cover plate is attached to one surface of the annular frame, and the second cover plate is attached to the surface, far away from the first cover plate, of the annular frame, so that a sealed cavity is formed between the first cover plate and the second cover plate;
the second baffle is positioned in the sealed chamber; the second guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealed channel is formed between the second guide plate and the first cover plate as well as between the second guide plate and the second cover plate.
7. The liquid-cooled hts heat sink of claim 6 wherein the hts plate comprises at least two of the second baffles, the length of the second baffles being the same as the length inside the annular rim; gaps are reserved between the adjacent second guide plates, so that first balance channels of the heat transfer working medium are formed between the adjacent second guide plates, and the first balance channels extend along the first direction; a gap is formed between the second guide plate adjacent to the annular frame and the annular frame, so that a second balance channel of the heat transfer working medium is formed between the second guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the second guide plate is the same as that of the annular frame.
8. The liquid-cooled hts radiator of claim 6 wherein the sidewalls of the protrusions are each provided with a plurality of guiding holes, and the guiding holes penetrate the second guiding plate along the thickness direction of the second guiding plate.
9. The liquid-cooled thermosonic heat spreader according to claim 6, wherein the second baffle has at least one clearance gap; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the second guide plate, and a first mounting through hole which penetrates through the cushion block along the height direction of the cushion block is formed in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.
10. The liquid-cooled thermosonic heat spreader according to claim 6, wherein the second baffle has at least one clearance gap; the first apron perhaps be equipped with an at least punching press boss on the second apron, the punching press boss certainly first apron or the internal surface of second apron is protruding to be located in the predetermined clearance, the height of punching press boss with the height of second guide plate is the same, just be equipped with in the punching press boss along the first installation through-hole that its direction of height link up, the second apron or still be equipped with an at least second installation through-hole that link up along its direction of thickness on the first apron, the second installation through-hole with first installation through-hole corresponds the setting.
11. The liquid-cooled heat superconducting radiator according to any one of claims 1 to 5, wherein the heat superconducting plate comprises:
a first cover plate;
the second cover plate comprises a cover plate main body and an annular convex edge, and the annular convex edge is integrally connected with the cover plate main body; the first cover plate is attached to the surface, far away from the cover plate main body, of the annular convex edge, so that a sealed cavity is formed between the first cover plate and the cover plate main body;
at least one second baffle located within the sealed chamber; the second guide plate comprises a plurality of convex parts which are arranged at intervals along a first direction and extend along a second direction, wherein the first direction is vertical to the second direction, the bottoms of the convex parts which are adjacent to each other in the first direction are integrally connected, and gaps are formed between the inner sides of the convex parts and the adjacent convex parts, so that the sealed channel is formed between the second guide plate and the first cover plate as well as between the second guide plate and the second cover plate.
12. The liquid-cooled hts heat sink of claim 11 wherein the hts plate comprises at least two of the second baffles, the length of the second baffles being the same as the length of the inside of the annular ledge; gaps are reserved between the adjacent second guide plates, so that first balance channels of the heat transfer working medium are formed between the adjacent second guide plates, and the first balance channels extend along the first direction; a gap is formed between the second guide plate adjacent to the annular convex edge and the annular convex edge, so that a second balance channel of the heat transfer working medium is formed between the second guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the second guide plate is the same as that of the annular convex edge.
13. The liquid-cooled hts radiator of claim 11 wherein the sidewalls of the protrusions are each provided with a plurality of guiding holes, and the guiding holes penetrate the second guiding plate along the thickness direction of the second guiding plate.
14. The liquid-cooled hts heat sink of claim 11 wherein the second baffle has at least one pre-gap inside it; the heat superconducting plate also comprises at least one cushion block, and the cushion block is positioned in the reserved gap; the height of the cushion block is the same as that of the second guide plate, and a first mounting through hole which penetrates through the cushion block along the height direction of the cushion block is formed in the cushion block; the first cover plate is also provided with at least one second mounting through hole which is penetrated through along the thickness direction of the first cover plate, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole penetrating along the thickness direction of the second cover plate, and the third mounting through hole corresponds to the first mounting through hole.
15. The liquid-cooled hts heat sink of claim 11 wherein the second baffle has at least one pre-gap inside it; the first apron perhaps be equipped with an at least punching press boss on the second apron, the punching press boss certainly first apron or the internal surface of second apron is protruding to be located in the predetermined clearance, the height of punching press boss with the height of second guide plate is the same, just be equipped with in the punching press boss along the first installation through-hole that its direction of height link up, the second apron or still be equipped with an at least second installation through-hole that link up along its direction of thickness on the first apron, the second installation through-hole with first installation through-hole corresponds the setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811118446.9A CN109152294B (en) | 2018-09-21 | 2018-09-21 | Liquid cooling type heat superconducting radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811118446.9A CN109152294B (en) | 2018-09-21 | 2018-09-21 | Liquid cooling type heat superconducting radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109152294A true CN109152294A (en) | 2019-01-04 |
| CN109152294B CN109152294B (en) | 2024-07-05 |
Family
ID=64823765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811118446.9A Active CN109152294B (en) | 2018-09-21 | 2018-09-21 | Liquid cooling type heat superconducting radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109152294B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110230936A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Heat exchanger based on hot superconduction heat exchange plate |
| CN110230937A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Hot superconduction heat exchange plate |
| CN110345561A (en) * | 2019-07-08 | 2019-10-18 | 上海嘉熙科技有限公司 | Air conditioner indoor unit |
| CN110430724A (en) * | 2019-07-22 | 2019-11-08 | 浙江嘉熙科技有限公司 | Hot superconductive plate and hot superconducting radiator |
| WO2020057201A1 (en) * | 2018-09-21 | 2020-03-26 | 浙江嘉熙科技有限公司 | Thermal superconducting plate and manufacturing method therefor |
| CN112187016A (en) * | 2019-07-01 | 2021-01-05 | 中国石油化工股份有限公司 | Isolation device for power electronic device |
| CN112187065A (en) * | 2019-07-01 | 2021-01-05 | 中国石油化工股份有限公司 | Rectifying unit, device and system |
| CN113606970A (en) * | 2021-07-27 | 2021-11-05 | 华南理工大学 | Ultrathin soaking plate and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
| CN204187722U (en) * | 2014-10-21 | 2015-03-04 | 兰州陇星沃尔凯采暖设备制造集团有限公司 | Based on the heating radiator of new heat transfer technology |
| CN105091638A (en) * | 2015-08-26 | 2015-11-25 | 浙江嘉熙光电设备制造有限公司 | Integrated coiled type heat exchanger |
| CN106981462A (en) * | 2016-01-19 | 2017-07-25 | 讯凯国际股份有限公司 | Liquid-cooling heat radiator |
| CN107359146A (en) * | 2017-06-30 | 2017-11-17 | 上海嘉熙科技有限公司 | Surface is provided with the hot superconductive plate gilled radiator of fin |
| CN209594123U (en) * | 2018-09-21 | 2019-11-05 | 浙江嘉熙科技有限公司 | The hot superconducting radiator of liquid-cooled |
-
2018
- 2018-09-21 CN CN201811118446.9A patent/CN109152294B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
| CN204187722U (en) * | 2014-10-21 | 2015-03-04 | 兰州陇星沃尔凯采暖设备制造集团有限公司 | Based on the heating radiator of new heat transfer technology |
| CN105091638A (en) * | 2015-08-26 | 2015-11-25 | 浙江嘉熙光电设备制造有限公司 | Integrated coiled type heat exchanger |
| CN106981462A (en) * | 2016-01-19 | 2017-07-25 | 讯凯国际股份有限公司 | Liquid-cooling heat radiator |
| CN107359146A (en) * | 2017-06-30 | 2017-11-17 | 上海嘉熙科技有限公司 | Surface is provided with the hot superconductive plate gilled radiator of fin |
| CN209594123U (en) * | 2018-09-21 | 2019-11-05 | 浙江嘉熙科技有限公司 | The hot superconducting radiator of liquid-cooled |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020057201A1 (en) * | 2018-09-21 | 2020-03-26 | 浙江嘉熙科技有限公司 | Thermal superconducting plate and manufacturing method therefor |
| CN112187016A (en) * | 2019-07-01 | 2021-01-05 | 中国石油化工股份有限公司 | Isolation device for power electronic device |
| CN112187065A (en) * | 2019-07-01 | 2021-01-05 | 中国石油化工股份有限公司 | Rectifying unit, device and system |
| CN112187065B (en) * | 2019-07-01 | 2022-05-03 | 中国石油化工股份有限公司 | Rectifying unit, device and system |
| CN112187016B (en) * | 2019-07-01 | 2022-05-03 | 中国石油化工股份有限公司 | Isolation device for power electronic device |
| CN110230936A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Heat exchanger based on hot superconduction heat exchange plate |
| CN110230937A (en) * | 2019-07-08 | 2019-09-13 | 浙江嘉熙科技有限公司 | Hot superconduction heat exchange plate |
| CN110345561A (en) * | 2019-07-08 | 2019-10-18 | 上海嘉熙科技有限公司 | Air conditioner indoor unit |
| CN110430724A (en) * | 2019-07-22 | 2019-11-08 | 浙江嘉熙科技有限公司 | Hot superconductive plate and hot superconducting radiator |
| CN113606970A (en) * | 2021-07-27 | 2021-11-05 | 华南理工大学 | Ultrathin soaking plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109152294B (en) | 2024-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109152294A (en) | The hot superconducting radiator of liquid-cooled | |
| CN109192711B (en) | Air-cooled and liquid-cooled combined heat superconducting plate type radiator | |
| CN107979962B (en) | Water-cooled circuit board heat abstractor | |
| CN109287095A (en) | Air-cooled hot superconduction panel radiator | |
| CN209298105U (en) | The air-cooled hot superconduction panel radiator of liquid-cooling combined type | |
| CN109244050B (en) | High-power heat superconducting plate-fin combined radiator | |
| CN209930821U (en) | Liquid-cooled heat conduction block and water-cooled radiator | |
| CN209119079U (en) | High-power hot superconductive plate wing combined radiator | |
| CN110366358B (en) | Thermal superconducting plate and thermal superconducting radiator | |
| CN109246984A (en) | The high-power hot superconductive plate wing combined radiator of rail traffic | |
| CN210112491U (en) | Self-cooling heat superconducting plate fin radiator | |
| CN209594123U (en) | The hot superconducting radiator of liquid-cooled | |
| CN109271004A (en) | Radiator and water heater composite structure | |
| CN109526183A (en) | The hot superconductive plate fin radiator of self-cooled | |
| CN109282340A (en) | Electric heater | |
| CN109218641A (en) | Block chain digs mine television set | |
| CN209594122U (en) | Air-cooled hot superconduction panel radiator | |
| CN210537197U (en) | Heat superconducting plate and heat superconducting radiator | |
| CN209297238U (en) | Radiator and water heater composite structure | |
| CN211210330U (en) | Electronic equipment with air-cooled phase-change heat dissipation function | |
| WO2020057306A1 (en) | High-power thermal superconducting plate-fin combined radiator | |
| CN220188941U (en) | Three-dimensional radiator for CPU | |
| CN214798168U (en) | Plate-fin combined radiator | |
| CN221352905U (en) | Radiator | |
| CN210537198U (en) | Heat superconducting plate and heat superconducting radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190409 Address after: 314117 No. 1 Workshop, 188 Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Applicant after: ZHEJIANG JIAXI TECHNOLOGY Co.,Ltd. Address before: Bottom Floor of Lane 9, 4999, Hongmei South Road, Minhang District, Shanghai, 200241 Applicant before: HEZHEN ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 311100 Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Applicant after: Zhejiang Jiaxi Technology Co.,Ltd. Address before: 314117 No. 1 Workshop, 188 Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Applicant before: ZHEJIANG JIAXI TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |