CN209594123U

CN209594123U - The hot superconducting radiator of liquid-cooled

Info

Publication number: CN209594123U
Application number: CN201821551938.2U
Authority: CN
Inventors: 仝爱星; 唐必洪
Original assignee: Zhejiang Karhe Technology Co Ltd
Current assignee: Zhejiang Jiaxi Technology Co.,Ltd.
Priority date: 2018-09-21
Filing date: 2018-09-21
Publication date: 2019-11-05
Anticipated expiration: 2028-09-21

Abstract

The utility model provides a kind of hot superconducting radiator of liquid-cooled, comprising: hot superconductive plate is formed with interconnected sealed passage in the hot superconductive plate, is filled with heat-transfer working medium in the sealed passage；The hot superconduction plate surface is equipped with heat source installation region；Liquid cooling heat radiator positioned at the surface of the hot superconductive plate, and is located at except the heat source installation region, and fluid passage is formed in the liquid cooling heat radiator, and the liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with the fluid passage.The hot superconducting radiator of the liquid-cooled of the utility model has the advantages that by hot superconduction plate surface while liquid cooling heat radiator being arranged, the specific heat capacity of refrigerant used in liquid cooling is much larger than air, can be absorbed compared to air-cooled and takes away more heats；Meanwhile using liquid cooling heat radiator forced heat radiation, there is no noises, are also not readily susceptible to the interference of dust.

Description

The hot superconducting radiator of liquid-cooled

Technical field

The utility model belongs to technical field of heat transfer, more particularly to a kind of hot superconducting radiator of liquid-cooled.

Background technique

It is modularization, integrated, lightweight, cost effective and high reliability with the fast development of power electronic technique It is required that higher and higher, the heat that power device itself generates at work is also increasing, if cannot be in time quickly by power device The heat that part generates removes, and the chip temperature that will lead in power device increases, and gently then efficiency is caused to reduce, shortened the working life, Failure that is heavy then will lead to power device and chip burn bombing.Therefore solving power device heat dissipation problem is always to perplex function Rate device encapsulates manufacturer and one of the key problem using manufacturer.In order to effectively solve the heat dissipation problem of power device, usually will Power component is fixed on the substrate of radiator, is conducted heat on the radiating fin of radiator by substrate, radiating fin Piece large contact area with air exchanges heat with stream by the way that the stream east of air is dynamic, distributes heat in ambient enviroment.It generally adopts at present It is dissipated with the aluminum profile heat radiator of free convection or forced convertion, including aluminium fin-inserted radiator, aluminium shovel gilled radiator, aluminium extruded type Hot device and aluminium welding are finned.Since the thermal coefficient of aluminium and aluminium alloy is within 220W/m.K, the fin efficiency ratio of cooling fin Lower, heat diffusivity can be poor, and power device will be evenly arranged on radiator base plate, it is therefore an objective to reduce substrate diffusion thermal resistance, improve The heat-sinking capability of radiator.With the promotion of power device performance and the increase of device heat flow density, conventional aluminium radiator is not It is able to satisfy the radiating requirements of high heat flux density high power module.

Utility model content

In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of hot superconductions of liquid-cooled to dissipate Hot device, the radiating requirements for not being able to satisfy high heat flux density high power module for solving Aluminium Radiator in the prior art are asked Topic.

In order to achieve the above objects and other related objects, the utility model provides a kind of hot superconducting radiator of liquid-cooled, institute Stating the hot superconducting radiator of liquid-cooled includes:

Hot superconductive plate is formed with interconnected sealed passage in the hot superconductive plate, is filled in the sealed passage Heat-transfer working medium；The hot superconduction plate surface is equipped with heat source installation region；

Liquid cooling heat radiator positioned at the surface of the hot superconductive plate, and is located at except the heat source installation region, the liquid cooling Fluid passage is formed in radiator, the liquid cooling heat radiator is equipped with the inlet being connected with the fluid passage and out liquid Mouthful.

As a kind of preferred embodiment of the utility model, the liquid cooling heat radiator includes the first deflector and fluid passage cover board； One surface of the fluid passage cover board is formed with holding tank, and the surface that the fluid passage cover board is formed with the holding tank adheres on described On the surface of hot superconductive plate, to form fluid passage chamber between the fluid passage cover board and the hot superconductive plate；First water conservancy diversion Plate is located in the fluid passage chamber, and is fixed on the surface of the hot superconductive plate, with super in first deflector and the heat The interconnected fluid passage is formed between guide plate and the fluid passage cover board；The inlet and the liquid outlet are respectively positioned on On the fluid passage cover board.

As a kind of preferred embodiment of the utility model, the holding tank includes the first holding tank and the second holding tank, institute It states the first holding tank and second holding tank includes opposite first end and second end；The quantity of first deflector is Two pieces, first deflector is located at first holding tank, and another first deflector is located at described second and holds It receives in slot；The inlet is located at the first end of first holding tank, is connected with first holding tank, the liquid outlet It is connected positioned at the first end of second holding tank, and with second holding tank；The second end of first holding tank with The second end of second holding tank is connected.

As a kind of preferred embodiment of the utility model, first deflector includes:

Several the first flow guide bars, first flow guide bar is along perpendicular to the first holding tank first end to described first The direction of holding tank second end is wave-shaped or square-wave-shaped extends, and several articles of first flow guide bars are along first holding tank the One end to the first holding tank second end direction parallel arrangement；

First connecting portion, positioned at the both ends of first flow guide bar, and with each equal integrally connected of first flow guide bar.

As a kind of preferred embodiment of the utility model, first deflector includes several flat first water conservancy diversion Item, several first flow guide bars are along perpendicular to the first holding tank first end to the side of the first holding tank second end It arranges to parallel interval.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes: annular peripheral frame, the first cover board, second Cover board and at least one second deflector；Wherein,

First cover board adheres on a surface of the annular peripheral frame, and second cover board adheres on the annular edge On surface of the frame far from first cover board, to form sealed chamber between first cover board and second cover board；

Second deflector is located in the sealed chamber；Second deflector includes several between first direction Every the protrusion arranged and extended in a second direction, wherein the first direction and the second direction are perpendicular, the first party The bottom integrally connected of the upward adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that It obtains and forms the sealed passage between second deflector and first cover board and second cover board.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes at least two pieces of second deflectors, The length of second deflector is identical as the length on the inside of the annular peripheral frame；Between having between adjacent second deflector Gap, to form the first balance channel of the heat-transfer working medium, first balance channel between adjacent second deflector Extend along the first direction；Between second deflector closed on the annular peripheral frame and the annular peripheral frame have Gap, to form the second balance channel of the heat-transfer working medium between second deflector and the annular peripheral frame, described Two balance channels extend along the first direction；The height of second deflector is identical as the height of the annular peripheral frame.

As a kind of preferred embodiment of the utility model, the side wall of the protrusion is equipped with several deflector holes, described to lead Discharge orifice runs through second deflector along the thickness direction of second deflector.

As a kind of preferred embodiment of the utility model, an at least preset clearance is equipped in second deflector；It is described Hot superconductive plate further includes an at least cushion block, and the cushion block is located in the preset clearance；The height of the cushion block and described second The height of deflector is identical, and the first installation through-hole penetrated through along its short transverse is equipped in the cushion block；First cover board On be additionally provided at least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first installation are logical Hole is correspondingly arranged；At least one third installation through-hole along the perforation of its thickness direction, the third are additionally provided on second cover board Installation through-hole is correspondingly arranged with first installation through-hole.

As a kind of preferred embodiment of the utility model, an at least preset clearance is equipped in second deflector；It is described First cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is from first cover board or described the The inner surface of two cover boards is convexly equipped in the prepsetting gap, the height phase of the height of the punching press boss and second deflector Together, and the first installation through-hole penetrated through along its short transverse, second cover board or described first are equipped in the punching press boss At least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole and first peace are additionally provided on cover board Dress through-hole is correspondingly arranged.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes:

First cover board；

Second cover board, including cover plate main body and annular convex edge, the annular convex edge and the cover plate main body integrally connected；Institute It states the first cover board to adhere on surface of the annular convex edge far from the cover plate main body, in first cover board and the lid Sealed chamber is formed between plate main body；

At least one second deflector is located in the sealed chamber；Second deflector includes several along first party To the protrusion for being intervally arranged and extending in a second direction, wherein the first direction and the second direction are perpendicular, and described The bottom integrally connected of the adjacent protrusion on one direction, and there is gap on the inside of the protrusion and between the adjacent protrusion, So that forming the sealed passage between second deflector and first cover board and second cover board.

As a kind of preferred embodiment of the utility model, the hot superconductive plate includes at least two pieces of second deflectors, The length of second deflector is identical as the length on the inside of the annular convex edge；Between having between adjacent second deflector Gap, to form the first balance channel of the heat-transfer working medium, first balance channel between adjacent second deflector Extend along the first direction；Between second deflector closed on the annular convex edge and the annular convex edge have Gap, to form the second balance channel of the heat-transfer working medium between second deflector and the annular convex edge, described Two balance channels extend along the first direction；The height of second deflector is identical as the height of the annular convex edge.

As described above, the hot superconducting radiator of the liquid-cooled of the utility model, has the advantages that

1. the specific heat capacity of refrigerant used in liquid cooling is much larger than sky by the way that liquid cooling heat radiator is arranged simultaneously in hot superconduction plate surface Gas can be absorbed compared to air-cooled and take away more heats；Meanwhile there is no make an uproar using liquid cooling heat radiator forced heat radiation Sound is also not readily susceptible to the interference of dust；

2. the first deflector is arranged in liquid cooling heat radiator, the first deflector increases heat exchange area in addition to enhancing liquid perturbation, from And improve outside heat-sinking capability, the effect of reinforcing rib is also acted as, can reduce the thickness of liquid cooling cover board, to mitigate liquid cooling heat radiator Overall weight；

3. being filled with heat-transfer working medium in hot superconductive plate inner seal chamber body, inhibit by heat-transfer working medium phase-change heat transfer or phase transformation Heat transfer, forms the hot superconducting characteristic of quick conductive, keeps entire hot superconduction plate temperature uniform, reduce the temperature difference between each power device and The maximum temperature of radiator；

4. not limited by low temperature: heat-transfer working medium can be worked normally at subzero 40 DEG C or so, solved conventional water-cooling and existed The failure of the defect for needing heat cycles liquid and heat-pipe radiator under winter low temperature under winter extremely frigid zones low temperature is difficult Topic has better work accommodation performance；

5. being seal cavity inside hot superconductive plate, and be equipped with the second deflector, internal second deflector the first cover board and Second cover board welds together, that is, plays booster action, and two sides cover sheet thickness is thinned, and bearing capacity increases, and intensity improves, and subtracts The weight and thickness of slight fever superconductive plate, and the heat exchange area inside increase, enhance the hot superconduction capacity of heat transmission；

It is posted on a hot superconductive plate 6. multiple power devices can be concentrated, with compact-sized and small in size excellent Point；

Detailed description of the invention

Fig. 1 is shown as the detonation configuration signal of the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one Figure.

Fig. 2 is shown as the stereochemical structure signal of the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one Figure.

Fig. 3 to Fig. 5 is shown as the liquid cooling in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one and dissipates The schematic perspective view of hot device.

Fig. 6 is shown as the quick-fried of the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one Fried structural schematic diagram.

Fig. 7 is shown as the vertical of the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one Body structural schematic diagram.

Fig. 8 to Figure 13 is shown as the hot superconduction in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment one The structural schematic diagram of different exemplary deflectors in plate；Wherein, Fig. 9 is the front view of Fig. 8, and Figure 11 is the front view of Figure 10, figure 13 be the front view of Figure 12.

Figure 14 to Figure 15 is shown as the exemplary hot superconductive radiating of liquid-cooled of difference provided in the utility model embodiment one Partial cross section's structural schematic diagram of device marginal portion.

Figure 16 is shown as having preset clearance in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment two Hot superconductive plate configuration schematic diagram.

Figure 17 is shown as the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment two with block portion Partial cross section's structural schematic diagram.

Figure 18 is shown as having punching press boss in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment two Hot superconductive plate configuration schematic diagram.

Figure 19 is shown as the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment three Configuration schematic diagram.

Figure 20 is shown as in the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment three Deflector be placed in the overlooking structure diagram in annular peripheral frame.

Figure 21 is shown as having preset clearance in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment four And the configuration schematic diagram of the hot superconductive plate of cushion block.

Figure 22 is shown as in the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment four Deflector be placed in the overlooking structure diagram in annular peripheral frame.

Figure 23 is shown as having punching press boss in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment four Hot superconductive plate configuration schematic diagram.

Figure 24 is shown as the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment five Configuration schematic diagram.

Figure 25 is shown as having preset clearance in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment six Hot superconductive plate configuration schematic diagram.

Figure 26 is shown as the hot superconductive plate in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment seven Configuration schematic diagram.

Figure 27 is shown as in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment seven in hot superconductive plate Deflector is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.

Figure 28 is shown as having preset clearance in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment eight And the configuration schematic diagram of the hot superconductive plate of cushion block.

Figure 29 is shown as in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment eight in hot superconductive plate Deflector is located at the overlooking structure diagram on the inside of the annular convex edge of the second cover board.

Figure 30 is shown as having punching press boss in the hot superconducting radiator of the liquid-cooled provided in the utility model embodiment eight Hot superconductive plate configuration schematic diagram.

Component label instructions

10 hot superconductive plates

100 first cover boards

101 second cover boards

1011 cover plate main bodies

1012 annular convex edges

102 annular peripheral frames

1021 filling aperture

103 second deflectors

1031 protrusions

1032 deflector holes

1033 second flow guide bars

1034 second connecting portions

1035 preset clearances

104 first solder layers

105 second solder layers

106 sealed passages

107 first balance channels

108 second balance channels

109 cushion blocks

110 first installation through-holes

111 second installation through-holes

112 third installation through-holes

113 punching press boss

114 filling tubes

115 third solder layers

116 the 4th solder layers

117 heat source installation regions

118 inlet tubes

119 outlet tubes

20 liquid cooling heat radiators

201 first deflectors

2011 first flow guide bars

2012 first connecting portions

202 fluid passage cover boards

2021 first holding tanks

2022 second holding tanks

2023 inlets

2024 liquid outlets

30 power devices

Specific embodiment

The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this Content disclosed by specification understands other advantages and effect of the utility model easily.

Please refer to Fig.1 to Fig.3 0.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., are only used To cooperate the revealed content of specification, so that those skilled in the art understands and reads, it is practical new to be not limited to this The enforceable qualifications of type, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size Adjustment it is practical new should all still to fall in this in the case where not influencing the effect of the utility model can be generated and the purpose that can reach The revealed technology contents of type obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ", The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model Scope.

Embodiment one

Fig. 1 to Fig. 2 is please referred to, the utility model provides a kind of hot superconducting radiator of liquid-cooled, the hot superconduction of liquid-cooled Radiator includes: hot superconductive plate 10, and interconnected sealed passage 106 is formed in the hot superconductive plate 10, and the sealing is logical Heat-transfer working medium 1061 is filled in road 106；10 surface of hot superconductive plate is equipped with heat source installation region 117；Liquid cooling heat radiator 20, The night cold heat sink 20 is located at the surface of the hot superconductive plate 10, and is located at except the heat source installation region 117, the liquid Fluid passage is formed in cold heat sink 20, the liquid cooling heat radiator 20 is equipped with the inlet being connected with the fluid passage 2023 and liquid outlet 2024.By being arranged the liquid cooling heat radiator 20 simultaneously on hot 10 surface of superconductive plate, used in liquid cooling The specific heat capacity of refrigerant (for example water) is much larger than air, can be absorbed compared to air-cooled and takes away more heats；Meanwhile using institute Stating 20 forced heat radiation of liquid cooling heat radiator, there is no noises, are also not readily susceptible to the interference of dust.

As an example, the liquid cooling heat radiator 20 includes the first deflector 201 incorporated by reference to Fig. 1 refering to shown in Fig. 3 to Fig. 5 And fluid passage cover board 202；One surface of the fluid passage cover board 202 is formed with holding tank, and the fluid passage cover board 202 is formed with the appearance Receiving the surface of slot adheres on the surface of the hot superconductive plate 10, in the fluid passage cover board 202 and the hot superconductive plate 10 it Between formed fluid passage chamber；First deflector 201 is located in the fluid passage chamber, and is fixed on the table of the hot superconductive plate 10 Face, to form interconnected institute between first deflector 201 and the hot superconductive plate 10 and the fluid passage cover board 202 State fluid passage；The inlet 2023 and the liquid outlet 2024 are respectively positioned on the fluid passage cover board 202；The inlet 2034 are connected with an inlet tube 118, and the liquid outlet 2024 is connected with an outlet tube 119.The liquid cooling heat radiator 20 setting first deflectors 201, the first deflector 201 increase heat exchange area, dissipate to improve in addition to enhancing liquid perturbation Outside thermal energy power, the effect of reinforcing rib is also acted as, can reduce the thickness of the liquid cooling cover board 202, is dissipated to mitigate the liquid cooling The overall weight of hot device 20.

As an example, the holding tank includes the first holding tank 2021 and the second holding tank 2022, first holding tank 2021 and second holding tank 2022 include opposite first end and second end；The quantity of first deflector 201 is Two pieces, first deflector 201 is located at first holding tank 2021, and another first deflector 201 is located at In second holding tank 2022；The inlet 2023 is located at the first end of first holding tank 2021, with described first Holding tank 2021 is connected, and the liquid outlet 2024 is located at the first end of second holding tank 2022, and holds with described second Slot 2022 of receiving is connected；The second end of first holding tank 2021 is connected with the second end of second holding tank 2022.

In one example, as shown in Figures 3 and 4, first deflector 201 includes: several the first flow guide bars 2011 And first connecting portion 2012, first flow guide bar 2011 is along perpendicular to 2021 first end of the first holding tank to described first The direction of 2021 second end of holding tank is wave-shaped or square-wave-shaped extends, and several first flow guide bars 2011 are along described first 3011 first end of holding tank to 3011 second end of the first holding tank direction parallel arrangement；Specifically, holding with described first Receiving the direction of 2021 first end of slot to 2021 first end of the first holding tank is that the length direction of the fluid passage cover board 202 is Example, several described first flow guide bars 2011 are wave-shaped along the width direction of the fluid passage cover board 202 or square-wave-shaped extends, and Length direction parallel arrangement of several described first flow guide bars 2011 along the fluid passage cover board 202；The first connecting portion 2012 be located at first flow guide bar 2011 both ends, and with the equal integrally connected of each first flow guide bar 2011.

In another example, as shown in figure 5, first deflector 201 includes several flat first flow guide bars 2011, several first flow guide bars 2011 are along perpendicular to 2021 first end of the first holding tank to first holding tank The direction parallel interval of 2021 second ends is arranged；Specifically, being accommodated with 2021 first end of the first holding tank to described first The direction of 2021 first end of slot is several 2011 edges of the first flow guide bar for the length direction of the fluid passage cover board 202 The length direction of the fluid passage cover board 202 extends, and arranges along the width direction parallel interval of the fluid passage cover board 202.

It should be noted that hot super heat conduction includes filling work in closed interconnected micro-channel system Medium realizes the hot pipe technique of hot superconductive heat transfer by the evaporation of working media with condensation phase transformation；And pass through control enclosed system Middle working media micro-architectural state, i.e., in diabatic process, the boiling (or condensation of gaseous medium) of liquid medium is suppressed, and Reach the consistency of working medium micro-structure on this basis, and realizes the phase transformation of efficient heat transfer and inhibit (PCI) heat transfer technology.This implementation In example, the hot superconductive plate can inhibit heat sink for phase transformation, at this point, the heat-transfer working medium in the hot superconductive plate is conducting heat During boil or condensation is suppressed, and reach the consistency of working medium micro-structure on this basis and realize heat transfer.This implementation In example, the hot superconductive plate may be adopting heat pipes for heat transfer plate, at this point, the heat-transfer working medium in the hot superconductive plate was conducting heat It is carried out continuously evaporation endothermic in journey and condenses exothermic phase transformation circulation to realize flash heat transfer.

As an example, the heat-transfer working medium 1061 is fluid, it is preferable that the heat-transfer working medium 1061 can be gas or liquid The mixture of body or gas and liquid, it is further preferable that in the present embodiment, the heat-transfer working medium 1061 is the mixed of liquid and gas Close object.

As an example, as shown in FIG. 6 and 7, the hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the Two cover boards 101 and at least one second deflector 103, wherein first cover board 100 adheres on the one of the annular peripheral frame 102 On surface, second cover board 101 is adhered on surface of the annular peripheral frame 102 far from first cover board 100, in institute It states and forms sealed chamber between the first cover board 100 and second cover board 101；Second deflector 103 is located at the sealing In chamber；Second deflector 103 includes the protrusion that several are intervally arranged along first direction and extend in a second direction 1031, wherein the first direction and the second direction are perpendicular, the bottom of the adjacent protrusion 1031 on the first direction Portion's integrally connected, and there is gap between 1031 inside of the protrusion and the adjacent protrusion 1031, so that described second leads Interconnected sealed passage 106 is formed between flowing plate 103 and first cover board 100 and second cover board 101；It is described close It seals and is filled with heat-transfer working medium 1061 in channel 106.It should be noted that the direction that the arrow a in Fig. 8, Figure 10 and Figure 12 is indicated The as described first direction, the direction that arrow b is indicated is the second direction；The first direction can lead for described second The length direction of flowing plate 103, the second direction is the width direction of second deflector 103, the first direction at this time Or the width direction of second deflector 103, the second direction is the length of second deflector 103 at this time Direction.

It should be noted that due on the inside of the annular peripheral frame 102 be hollow area, first cover board 100 with it is described It, can be in first cover board 100, second cover board after second cover board, 101 note is placed in the upper and lower surface of the annular peripheral frame 102 101 and the annular peripheral frame 102 on the inside of formed an airtight chamber.

The bottom integrally connected of the adjacent protrusion 1031 on the specific first direction, and 1031 lower section of the protrusion And there is gap between the adjacent protrusion 1031, it can thus make second deflector 103 to be in along its length The convex-concave shape of alternate intervals is arranged.

As an example, the hot superconductive plate 10 further includes the first solder layer 104 and the second solder as shown in Figure 14 and Figure 15 Layer 105；Wherein, first solder layer 104 is located at first cover board 100 and leads with the annular peripheral frame 102 and described second Between flowing plate 103, first cover board 100 is welded on one with the annular peripheral frame 102 and second deflector 103 It rises；Second solder layer 105 be located at second cover board 101 and the annular peripheral frame 102 and second deflector 103 it Between, second cover board 101 and the annular peripheral frame 102 and second deflector 103 are welded together.Described first Deflector 201 and the fluid passage cover board 202 can be welded in via third solder layer 115 first cover board 100 surface or The surface of second cover board 101, first deflector 201 can be via the 4th solder layer 116 and the fluid passage cover boards 202 Weld together.

As an example, the height of second deflector 103 is identical as the height of the annular peripheral frame 102.By described The height of two deflectors 103 is set as identical as the height of the annular peripheral frame 102, it can be ensured that second deflector 103 Reach maximum with the bonding area of first solder layer 104 and second solder layer 105, to increase weld strength.

As an example, as shown in fig. 6, the side of the annular peripheral frame 102 is equipped with the filling aperture 1021 through side wall.It is described After first cover board 100, second cover board 101 and the annular peripheral frame 102 and second deflector 103 weld together, The filling aperture 1021 is inserted into one end of one filling tube 114 to fill the heat-transfer working medium into the sealed passage 106 1061.After the populated heat-transfer working medium 1061, the filling aperture 1021 should be enclosed so that the sealed passage 106 is realized Sealing.

In one example, second deflector 103 can be but be not limited only to one piece of plate stamping and form, such as Fig. 8 and Shown in Fig. 9, the length of second deflector 103 is identical as the length of 102 inside of annular peripheral frame, and second water conservancy diversion The width of plate 103 is of same size with 102 inside of annular peripheral frame；The side wall of the protrusion 1031 is equipped with several water conservancy diversion Hole 1032, the deflector hole 1032 run through second deflector 103 along the thickness direction of second deflector 103.Specifically , as can be seen from figures 8 and 9, along the first direction, second deflector 103 can extend in square-wave-shaped, i.e., and described second Deflector 103 includes several along the protrusion 1031 that first direction is intervally arranged, and the adjacent institute along the first direction The bottom for stating protrusion 1031 is connected with each other, and concave between the adjacent protrusion 1031.Certainly, in other examples, described Second deflector 103 wave-shaped can also extend along the first direction, but preferably second deflector 103 is along described First direction extends in square-wave-shaped, may insure the upper surface (top of the i.e. described protrusion 1031 of second deflector 103 in this way Face) and lower surface (bottom surface of the recess portion between the i.e. adjacent protrusion 13) in planar, may insure described second in this way Deflector 103 and the contact area of first solder layer 104 and second solder layer 105 are as big as possible, to improve weldering Connect intensity.First cover board 100, second cover board 101 and the annular peripheral frame 102 and second deflector 103 weld Gap, the protrusion after being connected together, between the protrusion 1031 of second deflector 103 and second solder layer 105 Gap between recess and first solder layer 104 and the deflector hole 1032 between 1031 collectively form the sealing Channel 106.In this example, second deflector 103, i.e., the described protrusion are run through along the second direction in the protrusion 1031 1031 extend through second deflector 103, that is, the length of the protrusion 1031 and described second along the second direction Direction is identical.Several deflector holes 1032 are equipped on each protrusion 1031, described on each protrusion 1031 is led Extending direction of the discharge orifice 1032 along the protrusion 1031 is arranged in uniline or higher order interlace, and the side of each 1031 two sides of the protrusion The deflector hole 1032 is equipped on wall.The deflector hole 1032 on each protrusion 1031 can as shown in Figure 9 one by one It is correspondingly arranged, can also misplace arrangement.Due to the second deflector 103 described in the second direction and first solder layer There is enough gaps, the heat-transfer working medium 1061 is in the second direction between 104 and second solder layer 105 Flowing is very smooth, and the heat-transfer working medium 1061 is along the first direction (direction that the i.e. described protrusion 1031 is intervally arranged) Circulation be obstructed, by the way that the deflector hole 1032 is arranged on the protrusion 1031,1061 edge of heat-transfer working medium can be increased The flowing of the first direction, to increase the heat-transfer effect on the first direction, so that the heat-transfer working medium 1061 exists There is almost the same mobility along the first direction and along the second direction, so that the entire hot each side of superconductive plate To heat dissipation effect having the same so that the temperature of described 10 each region of hot superconductive plate is identical, and then effectively avoid by Mr. Yu's one or more direction heat dissipation effect is bad and causes the generation of the 10 regional area superheating phenomenon of hot superconductive plate.

In another example, as shown in Figures 10 and 11, second deflector 103 includes: several along described second The second flow guide bar 1033 and second connecting portion 1034 of direction parallel arrangement, second flow guide bar 1033 include several along institute State the protrusion 1031 that first direction is intervally arranged；Second flow guide bar 1033 and the annular peripheral frame positioned at two sides 102 inside is in contact；The second connecting portion 1034 is located at the both ends of second flow guide bar 1033, and with described in several Second flow guide bar 1033 is in integrally connected；Side and institute of the second connecting portion 1034 far from second flow guide bar 1033 The inside for stating annular peripheral frame 102 is in contact.In this example, the width of second deflector 103 and the annular peripheral frame 102 Inside it is of same size, the length of second deflector 103 is identical as the length of 102 inside of the annular peripheral frame.Described Two flow guide bars 1033 can prolong along the first direction (length direction of generally described second flow guide bar 1033) in square-wave-shaped It stretches, wave-shaped can also extend, i.e., described second flow guide bar 1033 includes what several were intervally arranged along the first direction The protrusion 1031, the bottom of the adjacent protrusion 1031 is connected with each other along the first direction, and the adjacent protrusion It is concave between 1031.Preferably, in the present embodiment, second flow guide bar 1033 prolongs along the first direction in square-wave-shaped It stretches, may insure that the upper surface and the lower surface of second flow guide bar 1033 is plane in this way, that is, ensure second water conservancy diversion The upper surface (top surface of the i.e. described protrusion 1031) of plate 103 and lower surface (i.e. the surface opposite with the top of the protrusion 1031) In planar, second deflector 103 and first solder layer 104 and second solder layer may insure in this way 105 contact area is as big as possible, to improve weld strength.First cover board 100, second cover board 101 with it is described After annular peripheral frame 102 and second deflector 103 weld together, the protrusion 1031 of second flow guide bar 1033 with it is described The gap between the recess and first solder layer 104 between gap, the protrusion 1031 between second solder layer 105 And the gap between adjacent second flow guide bar 1033 collectively forms the sealed passage 106.

As an example, the protrusion 1031 on adjacent two rows second flow guide bar 1033 can be arranged in a one-to-one correspondence, Institute i.e. along the second direction (i.e. second flow guide bar 1033 arrange direction), on the second flow guide bar 1033 described in each item Protrusion 1031 is stated to be arranged in a one-to-one correspondence.Certainly, in other examples, described convex on adjacent two rows second flow guide bar 1033 Portion 1031 can also shift to install, and the protrusion 1031 on so-called adjacent two rows second flow guide bar 1033, which shifts to install, is Refer to, the side of the protrusion 1031 on adjacent two rows second flow guide bar 1033 is staggered, as shown in Figures 10 and 11；It is adjacent The distance that the protrusion 1031 of two rows of second flow guide bars 1033 misplaces can be less than the width of the protrusion 1031, such as Figure 10 and Shown in Figure 11, the distance that the protrusion 1031 of adjacent two rows second flow guide bar 1033 misplaces can also be equal to the protrusion 1031 Width, at this point, the second flow guide bar described in the protrusion 1031 of the second flow guide bar 1033 described in a row and a row adjacent thereto Recess alignment between 1033 protrusion 1031.It should be noted that the institute on adjacent two rows second flow guide bar 1033 When stating protrusion 1031 and shifting to install, be arranged in a one-to-one correspondence every the protrusion 1031 arranged on second flow guide bar 1033, i.e., it is odd Number arranges the protrusion on the second flow guide bar 1033 described in the protrusion 1031 and even rows on second flow guide bar 1033 1031 shift to install, and the protrusion 1031 on the second flow guide bar 1033 described in each odd row is arranged in a one-to-one correspondence, each even number The protrusion 1031 arranged on second flow guide bar 1033 is also arranged in a one-to-one correspondence.

As an example, as shown in FIG. 12 and 13, the side wall of the protrusion 1031 can be equipped with deflector hole 1032, described Deflector hole 1032 runs through second flow guide bar 1033 along the thickness direction of second flow guide bar 1033.Due to along described second Have between second flow guide bar 1033 and first solder layer 104 and second solder layer 105 on direction enough Gap, the heat-transfer working medium 1061 is very smooth in the flowing in the second direction, and the heat-transfer working medium 1061 is along institute The circulation for stating first direction (direction that i.e. described second flow guide bar 1033 extends) is obstructed, by being arranged on the protrusion 1031 The deflector hole 1032 can increase the heat-transfer working medium 1061 along the flowing of the first direction, to increase along described the Heat-transfer effect on one direction, so that the heat-transfer working medium 1061 has almost along the first direction and along the second direction Identical mobility, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that the heat The temperature of 10 each region of superconductive plate is identical, and then effectively avoids causing since some or multiple directions heat dissipation effect are bad The generation of the 10 regional area superheating phenomenon of hot superconductive plate.

As an example, being equipped on the side wall of each 1031 two sides of protrusion on each second flow guide bar 1033 The deflector hole 1032, the deflector hole on the direction that second flow guide bar 1033 extends, each protrusion 1031 1032 be shown in Fig.12 be arranged in a one-to-one correspondence, can also misplace arrangement.

As an example, the hot superconducting radiator of liquid-cooled further includes power device 30, the function please continue to refer to Fig. 1 Rate device 30 adheres on the surface of the hot superconductive plate 10 and is located in the heat source installation region 117.The power device 30 It can be the device that any one needs to radiate, for example, virtual digit coin digs mine machine and (is specifically as follows but is not limited only to bit coin The devices such as the calculation power plate and calculation power plate control panel of equal virtual digits coin) etc..The virtual digit coin digs the specific structure of mine machine It dawn known to those skilled in the art, is not repeated herein.

Embodiment two

Incorporated by reference to Fig. 1 to Figure 15 refering to fig. 16 to Figure 18, the present embodiment also provides a kind of hot superconducting radiator of liquid-cooled, this The hot superconducting radiator of liquid-cooled described in the structure and embodiment one of the hot superconducting radiator of liquid-cooled as described in the examples Structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: heat described in the present embodiment is super Guide plate 10 had additional in second deflector 103 compared to hot superconductive plate 10 described in embodiment one at least one it is reserved between Gap 1035, meanwhile, the hot superconductive plate 10 further includes an at least cushion block 109 or first cover board 100 or second cover board 101 are equipped with an at least punching press boss 113.Institute in the other structures Yu embodiment one of hot superconductive plate 10 described in the present embodiment The other structures for the hot superconductive plate 10 stated are identical, referring specifically to embodiment one, are not repeated herein.

In one example, as shown in FIG. 16 and 17, it is equipped in second deflector 103 in the hot superconductive plate 10 Several described preset clearances 1035, wherein Figure 16 is to be equipped with 4 preset clearances 1035 in second deflector 103 As an example, the quantity of the preset clearance 1035 is not limited in actual example；If the hot superconductive plate 10 further includes The dry cushion block 109, the quantity of the cushion block 109 is identical as the quantity of the preset clearance 1035, and the cushion block 109 1 One corresponding is set in each preset clearance 1035；The height of the height of the cushion block 109 and second deflector 103 It is identical, and the first installation through-hole 110 along the perforation of its short transverse is equipped in each cushion block 109；First cover board 100 On be additionally provided with several the second installation through-holes 111 penetrated through along the thickness direction of first cover board 100, second installation is logical The quantity in hole 111 is identical as the quantity of first installation through-hole 110, and second installation through-hole 111 and first peace Dress through-hole 110 is arranged in a one-to-one correspondence；Several are additionally provided on second cover board 101 along 101 thickness direction of the second cover board The third installation through-hole 112 of perforation, the quantity phase of the quantity of the third installation through-hole 112 and first installation through-hole 110 Together, and the third installation through-hole 112 is arranged in a one-to-one correspondence with first installation through-hole 110.It should be noted that in order to just In showing the preset clearance 1035, the cushion block 109 is not illustrated in Figure 16, meanwhile, for the ease of showing, in Figure 16 simultaneously First solder layer 104 and second solder layer 105 are not illustrated.Since the surface of the hot superconductive plate 10 needs to install The power device of fixed fever, but the sealed passage 106 in the hot superconductive plate 10 is sealing pipeline, it cannot be in the heat Installation fixation hole is directly beaten in the place of the corresponding sealed passage 106 of superconductive plate 10, to prevent the institute in the sealed passage 106 State the leakage of heat-transfer working medium 1061；The utility model by reserving the preset clearance 1035 in second deflector 103, and The identical cushion block 109 of height of second deflector 103 is set in the preset clearance 1035, in the cushion block It is formed with first installation through-hole 110 in 109, forms second installation through-hole 111 on first cover board 100 in this way And formed after the third installation through-hole 112 on second cover board 101 can be by the fixed device such as bolt Under the premise of will be described using first installation through-hole 110, second installation through-hole 111 and the third installation through-hole 112 Power device 70 is fixed on the hot superconductive plate 10, meanwhile, and may insure that the sealed passage 106 is in sealing state, The heat-transfer working medium 1061 will not be revealed.

In another example, as shown in figure 18, several are equipped in second deflector 103 of the hot superconductive plate 10 The preset clearance 1035, wherein set in Figure 18 using in second deflector 103 there are four the preset clearance 1035 as Example, in actual example, the quantity of the preset clearance 1035 is not limited；First cover board 100 or described second Cover board 101 is equipped with several described punching press boss 113, wherein is equipped with several institutes in Figure 18 with second cover board 101 Punching press boss 113 is stated as example；The punching press boss 113 is from first cover board 100 or the interior table of second cover board 101 Face is convexly equipped in the preset clearance 1035, the height phase of the height of the punching press boss 113 and second deflector 103 Together, the quantity of the punching press boss 113 is identical as the quantity of the preset clearance 1035, a pair of with the preset clearance 1,035 1 It should be arranged, and be equipped with the first installation through-hole 110 penetrated through along its short transverse, second cover board in the punching press boss 113 Be additionally provided on 101 or described first cover boards 100 several along its thickness direction perforation the second installation through-hole 111, described second Installation through-hole 111 is identical as the quantity of first installation through-hole 110, and sets with first installation through-hole 110 one-to-one correspondence It sets.It should be noted that if the punching press boss 113 is set on second cover board 101, then second installation through-hole 111 are located on first cover board 100, as shown in figure 18；If the punching press boss 113 is set on first cover board 100, Then second installation through-hole 111 is located on second cover board 101.It should be further noted that for the ease of display, figure First solder layer 104 and second solder layer 105 are not illustrated in 18.The utility model described second by leading The preset clearance 1035 is reserved in flowing plate 103, and several are set on first cover board 100 or second cover board 12 It is convexly equipped in the preset clearance 1035 punching press boss 113, In interior and identical with the height of second deflector 103 It is equipped with first installation through-hole 110 in the punching press boss 113, in this way, in second cover board 101 or first cover board Described the can be utilized under the premise of device fixed by bolt etc. by being arranged after second installation through-hole 111 on 100 The power device is fixed on the hot superconductive plate by one installation through-hole 110 and second installation through-hole 111, meanwhile, again It may insure that the sealed passage 106 is in sealing state, the heat-transfer working medium 1061 will not be revealed.

It should be noted that Figure 16, into Figure 18, second deflector 103 is Fig. 8 and Fig. 9 in such as embodiment one Shown in the second deflector described in a monolith in second deflector 103 after the setting preset clearance 1035, certainly, In In other examples, second deflector 103 can also lead for shown in Figure 10 to Figure 13 in embodiment one for another example described second The second deflector in flowing plate 103 after the setting preset clearance 1035.

Embodiment three

Incorporated by reference to Fig. 1 to Figure 18 refering to fig. 19 to Figure 20, the present embodiment also provides a kind of hot superconducting radiator of liquid-cooled, this The hot superconducting radiator of liquid-cooled described in the structure and embodiment one of the hot superconducting radiator of liquid-cooled as described in the examples Structure is roughly the same, and the difference of the two is that the structure of the hot superconductive plate 10 is different: hot superconductive plate described in embodiment one The quantity of second deflector 103 described in 10 is one piece, and the quantity of the second deflector 103 described in the present embodiment is at least It is two pieces, and there is gap between adjacent second deflector 103, is formed between adjacent second deflector 103 First balance channel 107 of the heat-transfer working medium 1061, first balance channel 107 extend along the first direction, i.e. institute The extending direction for stating the first balance channel 107 is parallel with the first direction；Described in one closed on the annular peripheral frame 102 Second deflector 103 has gap with the annular peripheral frame 102, in second deflector 103 and the annular peripheral frame 102 Between form the second balance channel 108 of the heat-transfer working medium 1061, second balance channel 108 prolongs along the first direction It stretches, i.e., the extending direction of described second balance channel 108 is parallel with the end face of the protrusion 31；Second deflector 103 Height it is identical as the height of the annular peripheral frame 102.The other structures and implementation of hot superconductive plate 10 described in the present embodiment The other structures of hot superconductive plate 10 described in example one are identical, referring specifically to embodiment one, are not repeated herein.It is described First balance channel 107 can be used as vapor liquid equilibrium channel, to enhance the heat-transfer working medium 1061, the liquid condition of gaseous state The heat-transfer working medium 1061 or gas-liquid mixture phase the heat-transfer working medium 1061 along 103 length direction of the second deflector On flowing；Second balance channel 108 can be used as fluid balance channel, to enhance the heat-transfer working medium of liquid condition 1061 along the first direction flowing.Due in the hot superconductive plate 10 along the second direction be main channel direction, And the flow resistance of the heat-transfer working medium 1061 is larger along the first direction, mobility is poor, by adding described first The heat-transfer working medium 1061 can be enhanced along the flowing of the first direction in balance channel 107 and second balance channel 108 Property, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that the hot superconductive plate 10 is each The temperature in a region is identical, and then effectively avoids causing the hot superconduction since some work multiple directions heat dissipation effect is bad The generation of 10 regional area superheating phenomenon of plate.

Example IV

Incorporated by reference to Fig. 1 to Figure 18 refering to Figure 21 to Figure 23, the present embodiment also provides a kind of hot superconducting radiator of liquid-cooled, this The hot superconducting radiator of liquid-cooled described in the structure and embodiment two of the hot superconducting radiator of liquid-cooled as described in the examples Structure is roughly the same, and the difference of the two is that the structure of the hot superconductive plate 10 is different: hot superconductive plate described in embodiment two The quantity of second deflector 103 described in 10 is one piece, and the quantity of the second deflector 103 described in the present embodiment is at least It is two pieces, and there is gap between adjacent second deflector 103, is formed between adjacent second deflector 103 First balance channel 107 of the heat-transfer working medium 1061, first balance channel 107 extend along the first direction, i.e. institute The extending direction for stating the first balance channel 107 is parallel with the first direction；Described in one closed on the annular peripheral frame 102 Second deflector 103 has gap with the annular peripheral frame 102, in second deflector 103 and the annular peripheral frame 102 Between form the second balance channel 108 of the heat-transfer working medium 1061, second balance channel 108 prolongs along the first direction It stretches, i.e., the extending direction of described second balance channel 108 is parallel with the end face of the protrusion 31；Second deflector 103 Height it is identical as the height of the annular peripheral frame 102.The other structures and implementation of hot superconductive plate 10 described in the present embodiment The other structures of hot superconductive plate 10 described in example two are identical, referring specifically to embodiment two, are not repeated herein.It is described First balance channel 107 can be used as vapor liquid equilibrium channel, to enhance the heat-transfer working medium 1061, the liquid condition of gaseous state The heat-transfer working medium 1061 or gas-liquid mixture phase the heat-transfer working medium 1061 along 103 length direction of the second deflector On flowing；Second balance channel 108 can be used as fluid balance channel, to enhance the heat-transfer working medium of liquid condition 1061 along the first direction flowing.Due in the hot superconductive plate 10 along the second direction be main channel direction, And the flow resistance of the heat-transfer working medium 1061 is larger along the first direction, mobility is poor, by adding described first The heat-transfer working medium 1061 can be enhanced along the flowing of the first direction in balance channel 107 and second balance channel 108 Property, so that entire hot 10 all directions of superconductive plate heat dissipation effect having the same, so that the hot superconductive plate 10 is each The temperature in a region is identical, and then effectively avoids causing the hot superconduction since some work multiple directions heat dissipation effect is bad The generation of 10 regional area superheating phenomenon of plate.

It should be noted that Figure 21 and Figure 22 are shown as having preset clearance 1035 and pad in the hot superconducting radiator of liquid-cooled The structural schematic diagram of the hot superconductive plate 10 of block 109, Figure 23 are shown as in the hot superconducting radiator of liquid-cooled with punching press boss 113 The structural schematic diagram of hot superconductive plate 10.

It should be further noted that the preset clearance formed in the second deflector 103 described in the present embodiment 1035 are located in second deflector 103 closest with second balance channel 108, as shown in Figure 21 to Figure 23.Its In, Figure 21 to Figure 23 is with second deflector 103 in the second deflector 103 shown in Figure 10 and Figure 11 in example 1 Second including several described second flow guide bars 1033 and second connecting portion 1034 after the preset clearance 1035 is arranged is led Flowing plate is as an example, the quantity of second deflector 103 is two, and second deflector 103 further includes the cushion block 109 are used as example；Certainly, in other examples, second deflector 103 can also be Fig. 8 and Fig. 9 in such as embodiment one Or the second deflector in the second deflector 103 shown in Figure 12 and Figure 13 after the setting preset clearance 1035, described the When two deflectors 103 do not include the cushion block 109, it is also provided on first cover board 11 or second cover board 21 described Punching press convex block 113.The quantity of second deflector 103 can be set according to actual needs, be not limited to two.

It should be further noted that the arrangement mode of the preset clearance 1035 can be arranged according to actual needs Cloth, for example, several shown preset clearances 1035 can arrange as shown in Figure 21 to Figure 23 in a word, can also be such as embodiment It is arranged in array shown in Figure 16 and Figure 18 in two.

Embodiment five

Incorporated by reference to Fig. 1 to Figure 15 refering to Figure 24, the utility model also provides a kind of hot superconducting radiator of liquid-cooled, this implementation The hot superconducting radiator of liquid-cooled described in the specific structure and embodiment one of the hot superconducting radiator of liquid-cooled described in example Specific structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: in embodiment one, the heat Superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, wherein institute It states the first cover board 100 to adhere on a surface of the annular peripheral frame 102, second cover board 101 adheres on the annular edge On surface of the frame 102 far from first cover board 100, to be formed between first cover board 100 and second cover board 101 Sealed chamber.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012 and the cover board 1011 integrally connected of main body；First cover board 100 adheres on the annular convex edge 1012 far from the cover plate main body 1011 On surface, to form sealed chamber between first cover board 100 and the cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment one；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment one of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Institute in other structures of the hot superconducting radiator of liquid-cooled described in embodiment other than the hot superconductive plate 10 and embodiment one Corresponding structure is identical in the hot superconducting radiator of the liquid-cooled stated, and is not repeated herein.

In the present embodiment, second cover board 101 can form the cover plate main body 1011 and described by Sheet Metal Forming Technology Annular convex edge 1012 does not need additionally to use annular peripheral frame, to mitigate the weight of the hot superconductive plate 10, reduces cost.

Embodiment six

Incorporated by reference to Fig. 1 to Figure 18 refering to Figure 25, the utility model also provides a kind of hot superconducting radiator of liquid-cooled, this implementation The hot superconducting radiator of liquid-cooled described in the specific structure and embodiment two of the hot superconducting radiator of liquid-cooled described in example Specific structure is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: in embodiment two, the heat Superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, wherein institute It states the first cover board 100 to adhere on a surface of the annular peripheral frame 102, second cover board 101 adheres on the annular edge On surface of the frame 102 far from first cover board 100, to be formed between first cover board 100 and second cover board 101 Sealed chamber.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board 101 and the second deflector 103；Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012 and the cover board 1011 integrally connected of main body；First cover board 100 adheres on the annular convex edge 1012 far from the cover plate main body 1011 On surface, to form sealed chamber between first cover board 100 and the cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment two；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment two of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Institute in other structures of the hot superconducting radiator of liquid-cooled described in embodiment other than the hot superconductive plate 10 and embodiment two Corresponding structure is identical in the hot superconducting radiator of the liquid-cooled stated, and is not repeated herein.

Embodiment seven

Incorporated by reference to Fig. 1 to Figure 20 refering to Figure 26 to Figure 27, the utility model also provides a kind of hot superconducting radiator of liquid-cooled, The hot superconduction of liquid-cooled described in the specific structure and embodiment three of the hot superconducting radiator of liquid-cooled described in the present embodiment dissipates The specific structure of hot device is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: in embodiment three, The hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, Wherein, first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 adheres on described On surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and second cover board 101 it Between form sealed chamber.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board 101 and second Deflector 103；Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012 and institute State 1011 integrally connected of cover plate main body；First cover board 100 adheres on the annular convex edge 1012 far from the cover plate main body On 1011 surface, to form sealed chamber between first cover board 100 and the cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in embodiment three；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and embodiment three of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally Institute in other structures of the hot superconducting radiator of liquid-cooled described in embodiment other than the hot superconductive plate 10 and embodiment three Corresponding structure is identical in the hot superconducting radiator of the liquid-cooled stated, and is not repeated herein.

Embodiment eight

Incorporated by reference to Fig. 1 to Figure 23 refering to Figure 28 to Figure 30, the utility model also provides a kind of hot superconducting radiator of liquid-cooled, The hot superconduction of liquid-cooled described in the specific structure and example IV of the hot superconducting radiator of liquid-cooled described in the present embodiment dissipates The specific structure of hot device is roughly the same, and the difference of the two is that the specific structure of the hot superconductive plate 10 is different: in example IV, The hot superconductive plate 10 includes: annular peripheral frame 102, the first cover board 100, the second cover board 101 and at least one second deflector 103, Wherein, first cover board 100 adheres on a surface of the annular peripheral frame 102, and second cover board 101 adheres on described On surface of the annular peripheral frame 102 far from first cover board 100, in first cover board 100 and second cover board 101 it Between form sealed chamber.And in the present embodiment, the hot superconductive plate 10 includes: the first cover board 100, the second cover board 101 and second Deflector 103；Second cover board 101 includes cover plate main body 1011 and annular convex edge 1012, the annular convex edge 1012 and institute State 1011 integrally connected of cover plate main body；First cover board 100 adheres on the annular convex edge 1012 far from the cover plate main body On 1011 surface, to form sealed chamber between first cover board 100 and the cover plate main body 1011.

It should be noted that in the present embodiment, or first cover board 100 includes cover plate main body and convex annular Edge, and second cover board 101 is identical as the second cover board 101 described in example IV；At this point, 101 note of the second cover board It is placed in the annular convex edge.

In the specific structure and example IV of second deflector 103 in hot superconductive plate 10 described in the present embodiment The specific structure of second deflector 103 in the hot superconductive plate 10 is identical, is not repeated herein.Equally, originally The hot superconducting radiator of liquid-cooled described in embodiment institute in the other structures and example IV other than the hot superconductive plate 10 Corresponding structure is identical in the hot superconducting radiator of the liquid-cooled stated, and is not repeated herein.

In conclusion the utility model provides a kind of hot superconducting radiator of liquid-cooled, the hot superconducting radiator of liquid-cooled Include: hot superconductive plate, interconnected sealed passage is formed in the hot superconductive plate, is filled with heat transfer in the sealed passage Working medium；The hot superconduction plate surface is equipped with heat source installation region；Liquid cooling heat radiator, positioned at the surface of the hot superconductive plate, and position Except the heat source installation region, be formed with fluid passage in the liquid cooling heat radiator, the liquid cooling heat radiator be equipped with The inlet and liquid outlet that the fluid passage is connected.The hot superconducting radiator of the liquid-cooled of the utility model has beneficial below Effect: 1. by being arranged liquid cooling heat radiator in hot superconduction plate surface simultaneously, and the specific heat capacity of refrigerant used in liquid cooling is much larger than air, It can be absorbed compared to air-cooled and take away more heats；Meanwhile using liquid cooling heat radiator forced heat radiation there is no noise, It is not readily susceptible to the interference of dust；2. the first deflector is arranged in liquid cooling heat radiator, the first deflector increases in addition to enhancing liquid perturbation Add heat exchange area, to improve outside heat-sinking capability, also acts as the effect of reinforcing rib, can reduce the thickness of liquid cooling cover board, thus Mitigate the overall weight of liquid cooling heat radiator；3. heat-transfer working medium is filled in hot superconductive plate inner seal chamber body, by heat-transfer working medium Phase-change heat transfer or phase transformation inhibit heat transfer, form the hot superconducting characteristic of quick conductive, keep entire hot superconduction plate temperature uniform, reduce each The maximum temperature of the temperature difference and radiator between power device；4. not limited by low temperature: heat-transfer working medium can be at subzero 40 DEG C or so It works normally, solves the defect that needs heat cycles liquid of the conventional water-cooling under winter extremely frigid zones low temperature, Yi Jire Failure problem of the tube radiator under winter low temperature has better work accommodation performance；5. being seal chamber inside hot superconductive plate Body, and it is equipped with the second deflector, internal second deflector welds together the first cover board and the second cover board, that is, plays reinforcement and make With two sides cover sheet thickness being thinned, bearing capacity increases, and intensity improves, and mitigates the weight and thickness of hot superconductive plate, and in increasing The heat exchange area in portion enhances the hot superconduction capacity of heat transmission；It is posted on a hot superconductive plate 6. multiple power devices can be concentrated, Have the advantages that compact-sized and small in size.

The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.

Claims

1. a kind of hot superconducting radiator of liquid-cooled, which is characterized in that the hot superconducting radiator of liquid-cooled includes:

Hot superconductive plate, is formed with interconnected sealed passage in the hot superconductive plate, filled with heat transfer in the sealed passage Working medium；The hot superconduction plate surface is equipped with heat source installation region；

Liquid cooling heat radiator positioned at the surface of the hot superconductive plate, and is located at except the heat source installation region, the liquid-cooling heat radiation Fluid passage is formed in device, the liquid cooling heat radiator is equipped with the inlet and liquid outlet being connected with the fluid passage.

2. the hot superconducting radiator of liquid-cooled according to claim 1, which is characterized in that the liquid cooling heat radiator includes first Deflector and fluid passage cover board；One surface of the fluid passage cover board is formed with holding tank, and the fluid passage cover board is formed with the receiving The surface of slot adheres on the surface of the hot superconductive plate, to form fluid passage between the fluid passage cover board and the hot superconductive plate Chamber；First deflector is located in the fluid passage chamber, and is fixed on the surface of the hot superconductive plate, in described first The interconnected fluid passage is formed between deflector and the hot superconductive plate and the fluid passage cover board；The inlet and The liquid outlet is respectively positioned on the fluid passage cover board.

3. the hot superconducting radiator of liquid-cooled according to claim 2, which is characterized in that the holding tank includes the first receiving Slot and the second holding tank, first holding tank and second holding tank include opposite first end and second end；It is described The quantity of first deflector is two pieces, and first deflector is located at first holding tank, and another described first leads Flowing plate is located in second holding tank；The inlet is located at the first end of first holding tank, accommodates with described first Slot is connected, and the liquid outlet is located at the first end of second holding tank, and is connected with second holding tank；Described The second end of one holding tank is connected with the second end of second holding tank.

4. the hot superconducting radiator of liquid-cooled according to claim 3, which is characterized in that first deflector includes:

Several the first flow guide bars, first flow guide bar are accommodated along perpendicular to the first holding tank first end to described first The direction of slot second end is wave-shaped or square-wave-shaped extends, and several first flow guide bars are along the first holding tank first end To the direction parallel arrangement of the first holding tank second end；

5. the hot superconducting radiator of liquid-cooled according to claim 3, which is characterized in that first deflector includes several Flat first flow guide bar of item, several articles of first flow guide bars are along perpendicular to the first holding tank first end to described the The direction parallel interval of one holding tank second end is arranged.

6. the hot superconducting radiator of liquid-cooled according to any one of claim 1 to 5, which is characterized in that the hot superconduction Plate includes: annular peripheral frame, the first cover board, the second cover board and at least one second deflector；Wherein,

First cover board adheres on a surface of the annular peripheral frame, and it is remote that second cover board adheres on the annular peripheral frame On surface from first cover board, to form sealed chamber between first cover board and second cover board；

Second deflector is located in the sealed chamber；Second deflector includes that several are arranged along first direction interval Cloth and the protrusion extended in a second direction, wherein the first direction and the second direction are perpendicular, on the first direction The bottom integrally connected of the adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that institute It states and forms the sealed passage between the second deflector and first cover board and second cover board.

7. the hot superconducting radiator of liquid-cooled according to claim 6, which is characterized in that the hot superconductive plate includes at least two The length of second deflector described in block, second deflector is identical as the length on the inside of the annular peripheral frame；Adjacent described There is gap between two deflectors, it is logical with the first balance for forming the heat-transfer working medium between adjacent second deflector Road, first balance channel extend along the first direction；Second deflector that is closed on the annular peripheral frame with The annular peripheral frame has gap, to form the of the heat-transfer working medium between second deflector and the annular peripheral frame Two balance channels, second balance channel extend along the first direction；The height and the annular of second deflector The height of frame is identical.

8. the hot superconducting radiator of liquid-cooled according to claim 6, which is characterized in that if the side wall of the protrusion is equipped with Dry deflector hole, the deflector hole run through second deflector along the thickness direction of second deflector.

9. the hot superconducting radiator of liquid-cooled according to claim 6, which is characterized in that be equipped with extremely in second deflector A few preset clearance；The hot superconductive plate further includes an at least cushion block, and the cushion block is located in the preset clearance；The cushion block Height it is identical as the height of second deflector, and the cushion block in be equipped with along its short transverse penetrate through first installation lead to Hole；At least one the second installation through-hole along the perforation of its thickness direction, second installation through-hole are additionally provided on first cover board It is correspondingly arranged with first installation through-hole；At least one third peace along the perforation of its thickness direction is additionally provided on second cover board Through-hole is filled, the third installation through-hole is correspondingly arranged with first installation through-hole.

10. the hot superconducting radiator of liquid-cooled according to claim 6, which is characterized in that be equipped in second deflector An at least preset clearance；First cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is certainly The inner surface of first cover board or second cover board is convexly equipped in the preset clearance, the height of the punching press boss and institute The height for stating the second deflector is identical, and the first installation through-hole penetrated through along its short transverse, institute are equipped in the punching press boss It states and is additionally provided at least one the second installation through-hole penetrated through along its thickness direction on the second cover board or first cover board, described second Installation through-hole is correspondingly arranged with first installation through-hole.

11. the hot superconducting radiator of liquid-cooled according to any one of claim 1 to 5, which is characterized in that the hot superconduction Plate includes:

First cover board；

Second cover board, including cover plate main body and annular convex edge, the annular convex edge and the cover plate main body integrally connected；Described One cover board adheres on surface of the annular convex edge far from the cover plate main body, in first cover board and the cover board master Sealed chamber is formed between body；

At least one second deflector is located in the sealed chamber；Second deflector includes several between first direction Every the protrusion arranged and extended in a second direction, wherein the first direction and the second direction are perpendicular, the first party The bottom integrally connected of the upward adjacent protrusion, and there is gap on the inside of the protrusion and between the adjacent protrusion, so that It obtains and forms the sealed passage between second deflector and first cover board and second cover board.

12. the hot superconducting radiator of liquid-cooled according to claim 11, which is characterized in that the hot superconductive plate includes at least Two pieces of second deflectors, the length of second deflector are identical as the length on the inside of the annular convex edge；It is adjacent described There is gap between second deflector, it is logical with the first balance for forming the heat-transfer working medium between adjacent second deflector Road, first balance channel extend along the first direction；Second deflector that is closed on the annular convex edge with The annular convex edge has gap, to form the of the heat-transfer working medium between second deflector and the annular convex edge Two balance channels, second balance channel extend along the first direction；The height and the annular of second deflector The height of convex edge is identical.

13. the hot superconducting radiator of liquid-cooled according to claim 11, which is characterized in that the side wall of the protrusion is equipped with Several deflector holes, the deflector hole run through second deflector along the thickness direction of second deflector.

14. the hot superconducting radiator of liquid-cooled according to claim 11, which is characterized in that be equipped in second deflector An at least preset clearance；The hot superconductive plate further includes an at least cushion block, and the cushion block is located in the preset clearance；The pad The height of block is identical as the height of second deflector, and the first installation penetrated through along its short transverse is equipped in the cushion block Through-hole；At least one the second installation through-hole along the perforation of its thickness direction is additionally provided on first cover board, second installation is logical Hole is correspondingly arranged with first installation through-hole；At least one third along the perforation of its thickness direction is additionally provided on second cover board Installation through-hole, the third installation through-hole are correspondingly arranged with first installation through-hole.

15. the hot superconducting radiator of liquid-cooled according to claim 11, which is characterized in that be equipped in second deflector An at least preset clearance；First cover board or second cover board are equipped with an at least punching press boss, and the punching press boss is certainly The inner surface of first cover board or second cover board is convexly equipped in the preset clearance, the height of the punching press boss and institute The height for stating the second deflector is identical, and the first installation through-hole penetrated through along its short transverse, institute are equipped in the punching press boss It states and is additionally provided at least one the second installation through-hole penetrated through along its thickness direction on the second cover board or first cover board, described second Installation through-hole is correspondingly arranged with first installation through-hole.