CN107359146B - Heat superconducting plate fin type radiator with fins on surface - Google Patents
Heat superconducting plate fin type radiator with fins on surface Download PDFInfo
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- CN107359146B CN107359146B CN201710520570.7A CN201710520570A CN107359146B CN 107359146 B CN107359146 B CN 107359146B CN 201710520570 A CN201710520570 A CN 201710520570A CN 107359146 B CN107359146 B CN 107359146B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat superconducting plate finned radiator with fins on the surface, which comprises: a heat sink substrate; the plurality of thermal superconducting heat dissipation plates are inserted on the surface of the heat radiator substrate in parallel at intervals; a heat superconducting pipeline is formed in the heat superconducting heat dissipation plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline; the heat dissipation fin structure is positioned on at least one surface of the thermal superconducting heat dissipation plate; the heat dissipation fin structure comprises at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the thermal superconducting heat dissipation plate. The heat superconducting plate finned radiator with the fins on the surface has the advantages of high fin efficiency, large heat exchange area per unit volume, strong heat dissipation capability, small volume, light weight, flexible and various appearance structures, low cost and small radiator base plate, can compactly arrange high-power devices together, is suitable for being used in cold regions in winter at low temperature, and solves the anti-freezing problem of heat pipes and water-cooled radiators.
Description
Technical Field
The invention belongs to the technical field of heat transfer, and particularly relates to a heat superconducting plate fin type radiator with fins on the surface.
Background
With the rapid development of power electronics technology, the requirements for modularization, integration, light weight, low cost, and high reliability are increasing, and therefore power devices such as mos fets (metal oxide semiconductor field effect transistors), diodes, IGBTs (insulated gate bipolar transistors) are commonly used in power equipment such as solar inverters, Uninterruptible Power Supplies (UPS), charging piles, Power Converters (PCS), Active Power Filters (APF), static var compensators (SVG), and frequency converters. Because the integration level of the power components is higher and higher, the power density is higher and higher, the heat generated by the power components is higher and higher during working, the heat flow density is higher and higher, if the heat generated by the power components cannot be led out and dissipated quickly in time, the temperature of a chip in the power components is increased, the efficiency is reduced, the service life is shortened, and the failure of the power components and the burning of the chip are caused. Therefore, solving the problem of high heat flux density heat dissipation of the high-power device is one of the core problems which plague the packaging manufacturers and the using manufacturers of the high-power device.
At present, natural convection or forced convection aluminum radiators are generally adopted for heat dissipation, but with the improvement of the performance of high-power devices, the heat flux density of a single device is increased, and the requirements on small volume and light weight are improved, and the conventional aluminum radiators cannot meet the heat dissipation requirements of high-heat-density high-power modules. Therefore, it is urgently needed to develop a technology capable of rapidly and efficiently conducting heat.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a finned heat spreader of a superconducting plate with fins on the surface thereof, which is used to solve the problem that the aluminum heat spreader in the prior art cannot meet the heat dissipation requirement of a high heat flux density high power module.
To achieve the above and other related objects, the present invention provides a finned heat radiator of a heat superconducting plate with fins on a surface thereof, comprising:
a heat sink substrate;
the plurality of thermal superconducting heat dissipation plates are inserted on the surface of the heat radiator substrate in parallel at intervals; a heat superconducting pipeline is formed in the heat superconducting heat dissipation plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline;
the heat dissipation fin structure is positioned on at least one surface of the thermal superconducting heat dissipation plate; the heat dissipation fin structure comprises at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the thermal superconducting heat dissipation plate.
As a preferable embodiment of the finned heat sink of the superconducting plate of the present invention, the surface of the heat superconducting plate is provided with fins, and the superconducting heat sink is a composite plate structure including a first plate and a second plate.
As a preferable scheme of the heat superconducting plate fin type radiator with fins on the surface, the heat superconducting radiating plate is in a single-side expansion shape; an embossing channel is formed on one surface of the first plate or one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the impressing channel is formed is a compound surface; after the first plate and the second plate are compounded, the stamping channel forms the heat superconducting pipeline.
As a preferable scheme of the heat superconducting plate fin type radiator provided with fins on the surface, the heat superconducting radiating plate is in a double-sided flat shape; an etching channel is formed on one surface of the first plate or one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the etching channel is formed is a compound surface; after the first plate and the second plate are compounded, the etching channel forms the heat superconducting pipeline.
As a preferable scheme of the heat superconducting plate fin type radiator provided with fins on the surface, the heat superconducting radiating plate is in a double-sided flat shape; a first etching channel is formed on one surface of the first plate, and a second etching channel corresponding to the first etching channel is formed on one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface formed with the first etching channel and the surface formed with the second etching channel are compounded surfaces; after the first plate and the second plate are compounded, the first etching channel and the second etching channel jointly form the heat superconducting pipeline.
As a preferable scheme of the heat superconducting plate fin type radiator with fins on the surface, the heat superconducting radiating plate is in a double-faced expansion shape; a first stamping channel is formed on one surface of the first plate, and a second stamping channel corresponding to the first stamping channel is formed on one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the first stamping channel is formed and the surface on which the second stamping channel is formed are compound surfaces; after the first plate and the second plate are compounded, the first stamping channel and the second stamping channel jointly form the heat superconducting pipeline.
As a preferable aspect of the finned heat sink of the heat superconducting plate provided with fins on the surface of the heat superconducting plate of the present invention, the heat superconducting heat sink further includes a first composite solder layer, the first composite solder layer is located between the first plate and the second plate, and the first plate and the second plate are welded and compounded together via the first composite solder layer.
As a preferable embodiment of the finned heat sink of the heat superconducting plate of the present invention, the heat dissipating fin structure includes a first heat dissipating fin, the first heat dissipating fin is formed by one heat dissipating fin, and the first heat dissipating fin is located between two adjacent heat superconducting heat dissipating plates and is fixed to the surfaces of the two adjacent heat superconducting heat dissipating plates.
As a preferable embodiment of the heat superconducting plate finned radiator provided with fins on the surface of the present invention, the heat dissipation fin structure includes a first heat dissipation fin, the first heat dissipation fin is formed by one heat dissipation fin, and the first heat dissipation fin is located on one surface of the heat superconducting heat dissipation plate.
As a preferable scheme of the heat superconducting plate fin type heat sink provided with fins on the surface, the heat dissipation fin structure further comprises a second heat dissipation fin, and the second heat dissipation fin comprises a plurality of heat dissipation fins and connecting parts located at two ends of the heat dissipation fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins and the first heat dissipation fins are respectively positioned on two opposite surfaces of the thermal superconducting heat dissipation plate.
As a preferable embodiment of the heat superconducting plate finned radiator provided with fins on the surface of the present invention, the heat dissipation fin structure includes two first heat dissipation fins, each of the first heat dissipation fins is formed by one heat dissipation fin, and the two first heat dissipation fins are respectively located on two opposite surfaces of the heat superconducting heat dissipation plate.
As a preferable embodiment of the heat superconducting plate fin type heat sink of the present invention, the heat dissipating fin structure includes a second heat dissipating fin, and the second heat dissipating fin includes a plurality of heat dissipating fins and connecting portions located at two ends of the heat dissipating fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins are located on one surface of the thermal superconducting heat dissipation plate.
As a preferable embodiment of the heat superconducting plate fin type heat sink of the present invention, the heat dissipating fin structure includes a second heat dissipating fin, and the second heat dissipating fin includes a plurality of heat dissipating fins and connecting portions located at two ends of the heat dissipating fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins are located between two adjacent heat superconducting heat dissipation plates and are fixed on the surfaces of the two adjacent heat superconducting heat dissipation plates at the same time.
As a preferable scheme of the heat superconducting plate fin type heat sink provided with fins on the surface, the heat dissipation fin structure comprises two second heat dissipation fins, and each second heat dissipation fin comprises a plurality of heat dissipation fins and connecting parts located at two ends of each heat dissipation fin; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the two second radiating fins are respectively positioned on two opposite surfaces of the thermal superconducting radiating plate.
As a preferable embodiment of the heat superconducting plate finned radiator provided with fins on the surface of the present invention, in the second heat dissipation fins, adjacent heat dissipation fins are distributed in a one-to-one correspondence manner or in a staggered manner.
As a preferable embodiment of the heat superconducting plate fin radiator with fins on the surface, the heat superconducting plate fin radiator further includes a second composite solder layer, the second composite solder layer is located between the heat dissipating fin structure and the heat superconducting heat dissipating plate, and the heat dissipating fin structure is soldered to the surface of the heat superconducting heat dissipating plate via the second composite solder layer.
As a preferable scheme of the finned heat sink of the heat superconducting plate provided with fins on the surface, the heat dissipating fin comprises a plurality of first protruding structures and a plurality of second protruding structures, wherein the protruding direction of the second protruding structures is opposite to the protruding direction of the first protruding structures, and the first protruding structures and the second protruding structures are alternately connected and arranged along the length direction of the heat dissipating fin; the heat dissipation fins are provided with a plurality of heat dissipation through holes, and the heat dissipation through holes are located at the tops of the first protruding structures and/or the second protruding structures.
As described above, the finned heat radiator of the heat superconducting plate provided with fins on the surface of the invention has the following beneficial effects:
the fin efficiency of the heat superconducting heat dissipation plate is more than 95% (the maximum temperature difference on the fins is less than 2 ℃), and the heat superconducting heat dissipation plate does not change along with the changes of the height, the length, the thickness and other dimensions of the heat superconducting heat dissipation plate; therefore, the structure is flexible and various, the heat dissipation capability is strong, the heat dissipation requirements of devices with high heat flow density and large heat power can be met, and the limit of the heat dissipation capability limit of the air cooling radiator is broken through;
the heat dissipation fin structure comprising at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the heat superconducting heat dissipation plate is formed on the surface of the heat superconducting heat dissipation plate, so that the heat dissipation area can be greatly increased, the heat dissipation capacity can be increased in multiples, the size is reduced, the weight is reduced, and the bearing strength and the deformation resistance of the heat superconducting plate fin type heat radiator with fins on the surface can be increased;
the heat superconducting radiating plate is not limited by low temperature and can normally work at minus 40 ℃, so that the defects that water-cooling radiating needs to heat circulating liquid at low temperature in alpine regions in winter and the problem of failure of a heat pipe radiator at low temperature in winter are solved, and the heat superconducting radiating plate has better working adaptability;
the heat superconducting plate finned radiator with the fins on the surface has the advantages of high fin efficiency (more than 95 percent), large heat exchange area per unit volume, strong heat dissipation capacity, small size, light weight, flexible and various appearance structures, low cost and small radiator substrate, can compactly arrange high-power devices together without considering the problems of heat flux density and heat diffusion, is suitable for being used in cold regions in winter at low temperature, and solves the anti-freezing problem of a heat pipe and a water-cooled radiator. The method has very good applicability and wide application market;
the heat superconducting pipeline in the heat superconducting heat dissipation plate is formed by extrusion or etching, the first plate and the second plate are compounded together through a welding process, compared with the existing composite blown heat superconducting plate, materials such as graphite are not used, sealing welding is easy, and the yield is high; the first plate and the second plate can be made of different materials, and the heat superconducting radiating plate is high in strength and wide in application range; the heat superconducting pipelines with different structural shapes and complex structures combined by the structural shapes are conveniently formed, and the reinforced heat transfer structures are conveniently arranged in the pipelines; meanwhile, compared with the existing composite blown heat superconducting plate, the heat superconducting radiating plate has the advantages of accurate size, low batch production cost, suitability for large-scale production and the like.
Drawings
Fig. 1 is a schematic perspective view illustrating a heat superconducting plate finned heat sink provided with fins on a surface thereof according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view of a heat superconducting radiator plate having a honeycomb grid-shaped heat superconducting pipeline in a fin-type heat spreader of a heat superconducting plate provided with fins according to an embodiment of the present invention.
Fig. 3 is a schematic perspective view illustrating a heat superconducting radiator plate having rectangular grid-shaped heat superconducting pipelines in a finned heat spreader of a heat superconducting plate provided with fins on a surface thereof according to an embodiment of the present invention.
Fig. 4 is an exploded schematic view of a heat superconducting radiator plate in a single-side expansion form in the fin-type heat spreader of a heat superconducting plate provided with fins on the surface according to the first embodiment of the present invention.
Fig. 5 is a schematic partial cross-sectional view of a heat superconducting heat dissipating plate in a single-side expansion form in the fin-type heat spreader of a heat superconducting plate provided with fins on the surface according to the first embodiment of the present invention.
Fig. 6 is an exploded schematic view of a heat superconducting heat sink with fins on a surface thereof according to an embodiment of the present invention, in which an etched channel is formed on a surface of a second plate of the heat superconducting plate fin type heat sink, and the heat superconducting heat sink is in a double-sided flat shape.
Fig. 7 is a schematic partial cross-sectional view of a heat superconducting heat sink having fins on a surface thereof, in which an etched channel is formed on a surface of a second plate in the fin-type heat spreader according to the first embodiment of the present invention, and the heat superconducting heat sink is a double-sided flat heat sink.
Fig. 8 is an exploded view of a heat superconducting radiator plate in a double-side-swelling form in a finned heat spreader of a heat superconducting plate provided with fins on a surface thereof according to an embodiment of the present invention.
Fig. 9 is a schematic partial cross-sectional view of a thermal superconducting heat sink in a double-side-bulging shape in a finned heat spreader of a thermal superconducting plate provided with fins on a surface thereof according to an embodiment of the present invention.
Fig. 10 is a schematic side view of a heat superconducting plate finned heat sink in which fins are disposed on a surface of a heat superconducting plate in a single-sided expansion form according to an embodiment of the present invention.
Fig. 11 is a schematic cross-sectional view of a heat superconducting heat dissipating plate with fins on a surface thereof according to a first embodiment of the present invention, wherein first heat dissipating fins are formed on a surface of the heat superconducting plate fin type heat sink.
Fig. 12 is a schematic perspective view illustrating a first heat dissipating fin of a finned heat spreader with fins on a surface thereof according to an embodiment of the present invention.
Fig. 13 is a schematic side view of a finned heat sink of a heat superconducting plate provided with fins on a surface thereof according to a third embodiment of the present invention.
Fig. 14 is a schematic side view of a finned heat sink of a heat superconducting plate provided with fins on a surface thereof according to a fourth embodiment of the present invention.
Fig. 15 is a schematic cross-sectional view of a heat superconducting plate fin type heat sink provided with fins on a surface thereof according to a fourth embodiment of the present invention, in which a first heat dissipation fin is formed on one surface and a second heat dissipation fin is formed on the other surface of the heat superconducting plate fin type heat sink.
Fig. 16 is a schematic perspective view illustrating a second heat dissipating fin of the heat superconducting plate finned heat sink provided with fins on the surface according to the fourth embodiment of the present invention.
Description of the element reference numerals
1 Heat superconducting radiator
11 first plate
12 second plate
13 heat superconducting pipeline
131 embossing channel
132 first impression channel
133 second impression channel
134 etched channel
14 non-line section
15 convex
16 first composite solder layer
17 filling pipe
18 filling opening
2 heat dissipation fin structure
21 radiating fin
211 first bump structure
212 second bump structure
22 first radiator fin
23 second radiator fin
231 connecting part
24 heat dissipation through hole
3 second composite solder layer
4 heat sink base plate
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 16. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 1 to 12, the present invention provides a finned heat sink of a heat superconducting plate with fins on a surface thereof, the finned heat sink of the heat superconducting plate with fins on a surface thereof comprising: a heat sink substrate 4; the heat superconducting radiating plates 1 are inserted on the surface of the radiator substrate at intervals in parallel; a heat superconducting pipeline 13 is formed in the heat superconducting heat dissipation plate 1, the heat superconducting pipeline 13 is a closed pipeline, and a heat transfer working medium (not shown) is filled in the heat superconducting pipeline; the heat dissipation fin structure 2 is positioned on at least one surface of the thermal superconducting heat dissipation plate 1; the heat dissipation fin structure 2 comprises at least one heat dissipation fin 21 extending in a wavy manner along a direction parallel to the surface of the thermal superconducting heat dissipation plate 1; specifically, the heat dissipation fins 21 may extend in a wavy manner along the length direction of the thermal superconducting heat dissipation plate 1, or may extend in a wavy manner along the width direction of the thermal superconducting heat dissipation plate 1.
In an example, the upper surface of the heat sink substrate 4 may be provided with a plurality of channels (not shown) arranged in parallel at intervals, and the thermal superconducting heat sink 1 is inserted into the channels and fixed on the heat sink substrate 4 by using a heat conducting adhesive, mechanical extrusion, solder welding, or a combination of the heat conducting adhesive and the mechanical extrusion.
In another example, the heat sink substrate 4 may include a plurality of partition plates, the thermal superconducting heat dissipation plate 1 and the partition plates are alternately arranged, and the substrates are bonded together by mechanical pressing or by a combination of the mechanical pressing and a heat conductive adhesive, and the thermal superconducting heat dissipation plate 1 is interposed and fixed between the partition plates.
As an example, the surface of the thermal superconducting heat sink 1 may be perpendicular to the surface of the heat sink substrate 4, as shown in fig. 1, and in this case, the heat dissipation fins 21 may extend in a wave shape in a direction perpendicular to the surface of the heat sink substrate 4 (as shown in fig. 1), or may extend in a wave shape in a direction parallel to the surface of the heat sink substrate 4. Of course, in other examples, the surface of the thermal superconducting heat sink 1 may be oblique to the surface of the heat sink substrate 4.
The heat superconducting heat transfer technology comprises a heat pipe technology of filling working media in a closed mutually communicated micro-channel system and realizing heat superconducting heat transfer through evaporation and condensation phase change of the working media; and the phase change suppression (PCI) heat transfer technology for realizing high-efficiency heat transfer by controlling the microstructure state of the working medium in a closed system, namely, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and the consistency of the microstructure of the working medium is achieved on the basis. In this embodiment, the thermal superconducting heat dissipation plate 1 may be a phase change suppression heat dissipation plate, at this time, the boiling or condensation of the heat transfer working medium in the thermal superconducting heat dissipation plate 1 is suppressed in the process of heat transfer, and on this basis, the consistency of the microstructure of the working medium is achieved to realize heat transfer. In this embodiment, the thermal superconducting heat dissipation plate 1 may also be a heat pipe heat transfer plate, and at this time, the heat transfer working medium in the thermal superconducting heat dissipation plate 1 continuously performs a phase change cycle of evaporation heat absorption and condensation heat release in a heat transfer process to realize rapid heat transfer.
As an example, the heat transfer working medium is a fluid, preferably, the heat transfer working medium may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in this embodiment, the heat transfer working medium is a mixture of a liquid and a gas.
As an example, the shape of the heat superconducting pipes 13 in the heat superconducting radiating plate 1 is hexagonal honeycomb (as shown in fig. 2), circular honeycomb, quadrangular honeycomb (as shown in fig. 3), a plurality of U-shapes connected end to end in series, diamond, triangle, circular ring, criss-cross mesh, or any combination of any one or more of these.
As shown in fig. 4 to 9, the superconducting heat sink 1 is a composite plate structure including a first plate 11 and a second plate 12.
In one example, as shown in fig. 4 and 5, the thermal superconducting heat sink 1 has a single-side expansion shape; a stamping channel 131 is formed on one surface of the first plate 11; the first plate 11 and the second plate 12 are combined together through a welding process, and the surface on which the stamping channel 131 is formed is a composite surface; after the first plate 11 and the second plate 12 are combined, the embossed channel 131 forms the heat superconducting pipe 13. Of course, in other examples, the embossed channel 131 may be formed on only one surface of the second plate 12. The imprinting channel 131 is a channel formed by imprinting a flat plate using an imprinting mold formed by cold pressing Duan, and the other surface of the first plate material 11 is formed with protrusions 15 corresponding to the imprinting channel 131 while the imprinting channel 131 is formed on one surface of the first plate material 11.
In another example, as shown in fig. 6 and 7, the superconducting heat sink 1 has a double-sided flat shape; an etching channel 134 is formed on one surface of the first plate 11; the first plate 11 and the second plate 12 are combined together by a welding process, and the surface on which the etching channel 134 is formed is a combined surface; after the first plate 11 and the second plate 12 are combined, the etched channel 134 forms the heat superconducting pipe 13. Of course, in other examples, the etching channel 134 may be formed on only one surface of the second plate 12. The etched channel 134 may be a channel formed by an engraving process or an etching process.
In yet another example, the thermal superconducting heat sink 11 has a double-sided flat shape; a first etched channel (not shown) is formed on one surface of the first plate 11, and a second etched channel (not shown) corresponding to the first etched channel is formed on one surface of the second plate 12; the first plate 11 and the second plate 12 are compounded together through a welding process, and the surface formed with the first etching channel and the surface formed with the second etching channel are compounded surfaces; after the first plate 11 and the second plate 12 are combined, the first etched channel and the second etched channel together form the heat superconducting pipe 13. The shape of the first etched channel and the second etched channel may be the same as the shape of the etched channel 134; the first etching channel and the second etching channel can be channels formed by adopting fine engraving processing or etching processing.
In another example, as shown in fig. 8 and 9, the thermal superconducting heat sink 1 has a double-sided expansion shape; a first stamping channel 132 is formed on one surface of the first plate 11, and a second stamping channel 133 corresponding to the first stamping channel 132 is formed on one surface of the second plate 12; the first plate 11 and the second plate 12 are combined together by a welding process, and the surface on which the first stamping channel 132 is formed and the surface on which the second stamping channel 132 is formed are composite surfaces; after the first plate 11 and the second plate 12 are combined, the first embossed channel 132 and the second embossed channel 133 jointly form the heat superconducting pipeline 13. The first and second imprinting channels 132 and 133 are each formed by imprinting a plate using an imprinting mold formed by cold pressing Duan, wherein the first imprinting channel 132 is formed on one surface of the first plate 11, the protrusions 15 corresponding to the first imprinting channel 132 are formed on the other surface of the first plate 11, and the second imprinting channel 133 is formed on one surface of the second plate 12, and the protrusions 15 corresponding to the second imprinting channel 133 are formed on the other surface of the second plate 12.
Of course, in other examples, when the thermal superconducting heat sink 1 is in a single-sided expansion form or a double-sided expansion form, the thermal superconducting pipeline 13 may be formed by an inflation process.
As an example, with continued reference to fig. 4 to 9, the thermal superconducting heat dissipation plate 1 further includes a first composite solder layer 16, the first composite solder layer 16 is located between the first plate 11 and the second plate 12, and the first plate 11 and the second plate 12 are welded and combined together through the first composite solder layer 16. The first composite solder layer 16 may be located on the surface of the first board 11 or on the surface of the second board 12, taking fig. 5 and 9 as an example that the first composite solder layer 16 is located on a surface of the second board 12, the first composite solder layer 16 may be located only in a non-pipe portion region, that is, the first composite solder layer 16 may be located only in a region where the second board 12 is combined with the first board 11, and the first composite solder layer 16 may also completely cover the second board 12, that is, the first composite solder layer 16 may be located in both a non-pipe portion region and a region where the heat superconducting pipe 13 is located, as shown in fig. 5 and 9.
It should be noted that the heat transfer working medium in the heat superconducting pipeline 13 is filled from a filling pipe 17 through a filling port 18, after the heat transfer working medium is filled into the heat superconducting pipeline 13, the filling pipe 17 is pressed and cut by a jig, and the filling port 18 is welded and sealed by an argon arc welding machine, so as to ensure that the heat superconducting pipeline 13 is a sealed pipeline.
As an example, the length of the radiator fin structure 2 may be the same as the length of the thermal superconducting heat sink 1, and the width of the radiator fin structure 2 is the same as the width of the thermal superconducting heat sink 1. Of course, in other examples, the length of the heat sink fin structure 2 may also be smaller than the length of the thermal superconducting heat sink 1, and the width of the heat sink fin structure 2 may also be smaller than the width of the thermal superconducting heat sink 1; in yet another example, the length of the radiator fin structure 2 may be greater than the length of the thermal superconducting radiator plate 1, and the width of the radiator fin structure 2 may be greater than the width of the thermal superconducting radiator plate 1.
As an example, as shown in fig. 10 to 12, the radiator fin structure 2 includes a first radiator fin 22, the first radiator fin 22 is formed by one radiator fin 21, and the first radiator fin 22 is located on one surface of the superconducting heat sink 1. It should be noted that fig. 11 illustrates that the thermal superconducting heat sink 1 is in a single-side expansion shape, and the first heat dissipation fins 22 are located on a plane of the thermal superconducting heat sink 1 without the protrusions 15, in other examples, the first heat dissipation fins 22 may also be located on a protrusion surface with the protrusions 15, that is, the first heat dissipation fins 22 may also be located on a surface of the first plate 11 away from the second plate 12 in fig. 11.
It should be noted that, the first heat dissipation fins 22 are formed by one heat dissipation fin 21, which means that the whole first heat dissipation fin 22 is a heat dissipation fin 21 extending in a wave shape along a direction parallel to the surface of the superconducting heat dissipation plate 1.
As an example, the finned heat sink of the heat superconducting plate with fins on the surface further includes a second composite solder layer 3, the second composite solder layer 3 is located between the heat sink fin structure 2 and the heat superconducting heat sink plate 1, and the heat sink fin structure 2 is soldered to the surface of the heat superconducting heat sink plate 1 via the second composite solder layer 3; in this embodiment, as shown in fig. 11, the second composite solder layer 3 is located between the first heat dissipation fins 22 and the thermal superconducting heat dissipation plate 1, and the first heat dissipation fins 22 are soldered to the surface of the thermal superconducting heat dissipation plate 1 through the second composite solder layer 3.
As an example, as shown in fig. 11 and 12, the first cooling fin 22 includes a plurality of first protrusion structures 211 and a plurality of second protrusion structures 212, a protrusion direction of the second protrusion structures 212 is opposite to a protrusion direction of the first protrusion structures 211, and the first protrusion structures 211 and the second protrusion structures 212 are alternately connected and arranged along a length direction of the first cooling fin 22; the first heat dissipation fins 22 are provided with a plurality of heat dissipation through holes 24, and the heat dissipation through holes 24 may be located only on the top of the first protrusion structures 211, may also be located on the top of the second protrusion structures 212, and may also be located on the top of the first protrusion structures 211 and the top of the second protrusion structures 212 at the same time.
Example two
The present embodiment further provides a finned heat sink of a superconducting plate with fins on a surface thereof, where the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting plate with fins on a surface thereof in the first embodiment, and the difference between the structures is that: in the first embodiment, the radiator fin structure 2 includes a first radiator fin 22, and the first radiator fin 22 is located on a surface of the thermal superconducting radiator plate 1; in this embodiment, the heat dissipation fin structure 2 includes two first heat dissipation fins 22, and the two first heat dissipation fins 22 are respectively located on two opposite surfaces of the thermal superconducting heat dissipation plate 1.
EXAMPLE III
Referring to fig. 13, the present embodiment further provides a finned heat sink of a superconducting board with fins on a surface thereof, where the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting board with fins on a surface thereof in the first embodiment, and the difference between the structures is that: in the first embodiment, the radiator fin structure 2 includes a first radiator fin 22, and the first radiator fin 22 is located on a surface of the thermal superconducting radiator plate 1; in this embodiment, the heat dissipation fin structure 2 includes one first heat dissipation fin 22, the first heat dissipation fin 22 is located between two adjacent heat superconducting heat dissipation plates 1 and is fixed on the surfaces of two adjacent heat superconducting heat dissipation plates 1 at the same time, that is, the first protrusion structure 211 of the first heat dissipation fin 22 is fixed on the surface of one heat superconducting heat dissipation plate 1, and the second protrusion structure 212 of the first heat dissipation fin 22 is fixed on the surface of the adjacent heat superconducting heat dissipation plate 1.
Example four
Referring to fig. 14 to 16, the present embodiment further provides a finned heat sink of a superconducting plate with fins on a surface thereof, and the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting plate with fins on a surface thereof in the first embodiment, except that: in the first embodiment, the radiator fin structure 2 includes a first radiator fin 22, and the first radiator fin 22 is located on a surface of the thermal superconducting radiator plate 1; in this embodiment, the heat sink fin structure 2 is additionally provided with a second heat sink fin 23 on the basis of the heat sink fin structure 2 in the first embodiment, and the second heat sink fin 23 includes a plurality of heat sink fins 21 and connecting portions 231 located at two ends of the heat sink fins 21; the plurality of heat dissipation fins 21 are arranged in parallel at intervals, and the connecting part 231 is connected with the plurality of heat dissipation fins 21 uniformly; the first radiator fins 22 and the second radiator fins 23 are respectively located on two opposite surfaces of the thermal superconducting heat sink 1.
As an example, in the second cooling fin 23, the cooling fin 21 includes a plurality of first protruding structures 211 and a plurality of second protruding structures 212, the protruding direction of the second protruding structures 212 is opposite to the protruding direction of the first protruding structures 211, and the first protruding structures 211 and the second protruding structures 212 are alternately connected and arranged along the length direction of the cooling fin 21; the heat dissipation fins 21 are provided with a plurality of heat dissipation through holes 24, and the heat dissipation through holes 24 may be located only at the top of the first protrusion structures 211, may also be located at the top of the second protrusion structures 212, and may also be located at the top of the first protrusion structures 211 and the top of the second protrusion structures 212 at the same time.
For example, in the second heat dissipation fins 23, the adjacent heat dissipation fins 21 may be distributed in a one-to-one correspondence, or may be distributed in a staggered manner, as shown in fig. 15 and 16. It should be noted that, the one-to-one corresponding distribution of the adjacent heat dissipation fins 21 means: the first protruding structures 211 of the adjacent heat dissipation fins 21 correspond to one another, and the second protruding structures 212 of the adjacent heat dissipation fins 21 correspond to one another; the adjacent radiating fins 21 are distributed in a staggered manner, that is: the first protruding structure 211 of one heat dissipating fin 21 corresponds to the second protruding structure 212 of the adjacent heat dissipating fin 21, and the second protruding structure 212 of the heat dissipating fin 21 corresponds to the first protruding structure 211 of the adjacent heat dissipating fin 21.
EXAMPLE five
The present embodiment further provides a finned heat sink of a superconducting plate with fins on a surface thereof, where the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting plate with fins on a surface thereof in the first embodiment, and the difference between the structures is that: in the first embodiment, the radiator fin structure 2 includes a first radiator fin 22, and the first radiator fin 22 is located on a surface of the thermal superconducting radiator plate 1; in this embodiment, the heat dissipation fin structure 2 includes one second heat dissipation fin 23, and the second heat dissipation fin 23 is located on one surface of the thermal superconducting heat dissipation plate 1. The specific structure of the second heat dissipation fins 23 in this embodiment is completely the same as the specific structure of the second heat dissipation fins 23 in the fourth embodiment, and please refer to the fourth embodiment specifically, which will not be described again here.
EXAMPLE six
The present embodiment further provides a finned heat sink of a superconducting plate with fins on a surface thereof, where the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting plate with fins on a surface thereof in the fifth embodiment, and the difference between the structures is that: in the fifth embodiment, the radiator fin structure 2 includes a second radiator fin 23, and the second radiator fin 23 is located on a surface of the thermal superconducting heat sink 1; in this embodiment, the heat dissipation fin structure 2 includes two second heat dissipation fins 23, and the two second heat dissipation fins 23 are respectively located on two opposite surfaces of the thermal superconducting heat dissipation plate 1.
EXAMPLE seven
The present embodiment further provides a finned heat sink of a superconducting plate with fins on a surface thereof, where the structure of the superconducting component in the present embodiment is substantially the same as that of the finned heat sink of a superconducting plate with fins on a surface thereof in the fifth embodiment, and the difference between the structures is that: in the fifth embodiment, the radiator fin structure 2 includes a second radiator fin 23, and the second radiator fin 23 is located on a surface of the thermal superconducting heat sink 1; in this embodiment, the heat dissipation fin structure 2 includes one second heat dissipation fin 23, the second heat dissipation fin 23 is located between two adjacent heat superconducting heat dissipation plates 1 and is fixed on the surfaces of two adjacent heat superconducting heat dissipation plates 1 at the same time, that is, the first protrusion structure 211 of the second heat dissipation fin 23 is fixed on the surface of one heat superconducting heat dissipation plate 1, and the second protrusion structure 212 of the second heat dissipation fin 23 is fixed on the surface of the adjacent heat superconducting heat dissipation plate 1.
In summary, the present invention provides a heat superconducting plate finned radiator with fins on a surface thereof, wherein the heat superconducting plate finned radiator with fins on a surface thereof comprises: a heat sink substrate; the plurality of thermal superconducting heat dissipation plates are inserted on the surface of the heat radiator substrate in parallel at intervals; a heat superconducting pipeline is formed in the heat superconducting heat dissipation plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline; the heat dissipation fin structure is positioned on at least one surface of the thermal superconducting heat dissipation plate; the heat dissipation fin structure comprises at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the thermal superconducting heat dissipation plate. The fin efficiency of the heat superconducting heat dissipation plate is more than 95% (the maximum temperature difference on the fins is less than 2 ℃), and the heat superconducting heat dissipation plate does not change along with the changes of the height, the length, the thickness and other dimensions of the heat superconducting heat dissipation plate; therefore, the structure is flexible and various, the heat dissipation capability is strong, the heat dissipation requirements of devices with high heat flow density and large heat power can be met, and the limit of the heat dissipation capability limit of the air cooling radiator is broken through; the heat dissipation fin structure comprising at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the heat superconducting heat dissipation plate is formed on the surface of the heat superconducting heat dissipation plate, so that the heat dissipation area can be greatly increased, the heat dissipation capacity can be increased in multiples, the size is reduced, the weight is reduced, and the bearing strength and the deformation resistance of the heat superconducting plate fin type heat radiator with fins on the surface can be increased; the heat superconducting radiating plate is not limited by low temperature and can normally work at minus 40 ℃, so that the defects that water-cooling radiating needs to heat circulating liquid at low temperature in alpine regions in winter and the problem of failure of a heat pipe radiator at low temperature in winter are solved, and the heat superconducting radiating plate has better working adaptability; the heat superconducting plate finned radiator with the fins on the surface has the advantages of high fin efficiency (more than 95 percent), large heat exchange area per unit volume, strong heat dissipation capacity, small size, light weight, flexible and various appearance structures, low cost and small radiator substrate, can compactly arrange high-power devices together without considering the problems of heat flux density and heat diffusion, is suitable for being used in cold regions in winter at low temperature, and solves the anti-freezing problem of a heat pipe and a water-cooled radiator. The method has very good applicability and wide application market; the heat superconducting pipeline in the heat superconducting heat dissipation plate is formed by extrusion or etching, the first plate and the second plate are compounded together through a welding process, compared with the existing composite blown heat superconducting plate, materials such as graphite are not used, sealing welding is easy, and the yield is high; the first plate and the second plate can be made of different materials, and the heat superconducting radiating plate is high in strength and wide in application range; the heat superconducting pipelines with different structural shapes and complex structures combined by the structural shapes are conveniently formed, and the reinforced heat transfer structures are conveniently arranged in the pipelines; meanwhile, compared with the existing composite blown heat superconducting plate, the heat superconducting radiating plate has the advantages of accurate size, low batch production cost, suitability for large-scale production and the like.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. The heat superconducting plate finned radiator with the fins on the surface is characterized by comprising the following components:
a heat sink substrate;
the plurality of thermal superconducting heat dissipation plates are inserted on the surface of the heat radiator substrate in parallel at intervals; a heat superconducting pipeline is formed in the heat superconducting heat dissipation plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline; the heat superconducting radiating plate is of a composite plate type structure comprising a first plate and a second plate;
the heat dissipation fin structure is positioned on at least one surface of the thermal superconducting heat dissipation plate; the heat dissipation fin structure comprises at least one heat dissipation fin extending in a wavy manner along a direction parallel to the surface of the thermal superconducting heat dissipation plate; the radiating fins comprise a plurality of first protruding structures and a plurality of second protruding structures, the protruding direction of the second protruding structures is opposite to that of the first protruding structures, and the first protruding structures and the second protruding structures are alternately connected and arranged along the length direction of the radiating fins; the heat dissipation fins are provided with a plurality of heat dissipation through holes, and the heat dissipation through holes are positioned at the tops of the first protruding structures or/and the second protruding structures;
a first composite solder layer located between the first plate and the second plate, the first plate and the second plate being welded and compounded together via the first composite solder layer;
a second composite solder layer, the second composite solder layer being located between the heat sink fin structure and the thermal superconducting heat sink plate, the heat sink fin structure being soldered to the surface of the thermal superconducting heat sink plate via the second composite solder layer;
the heat superconducting radiating plate is in a single-side expansion shape; an embossing channel is formed on one surface of the first plate or one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the impressing channel is formed is a compound surface; after the first plate and the second plate are compounded, the coining channel forms the heat superconducting pipeline;
or the heat superconducting radiating plate is in a double-sided flat shape; an etching channel is formed on one surface of the first plate or one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the etching channel is formed is a compound surface; after the first plate and the second plate are compounded, the etching channel forms the heat superconducting pipeline;
or the heat superconducting radiating plate is in a double-sided flat shape; a first etching channel is formed on one surface of the first plate, and a second etching channel corresponding to the first etching channel is formed on one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface formed with the first etching channel and the surface formed with the second etching channel are compounded surfaces; after the first plate and the second plate are compounded, the first etching channel and the second etching channel jointly form the heat superconducting pipeline;
or the heat superconducting radiating plate is in a double-faced expansion shape; a first stamping channel is formed on one surface of the first plate, and a second stamping channel corresponding to the first stamping channel is formed on one surface of the second plate; the first plate and the second plate are compounded together through a welding process, and the surface on which the first stamping channel is formed and the surface on which the second stamping channel is formed are compound surfaces; after the first plate and the second plate are compounded, the first stamping channel and the second stamping channel jointly form the heat superconducting pipeline.
2. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the heat dissipation fin structure comprises a first heat dissipation fin, the first heat dissipation fin is composed of one heat dissipation fin, and the first heat dissipation fin is located between two adjacent heat superconducting heat dissipation plates and is simultaneously fixed on the surfaces of the two adjacent heat superconducting heat dissipation plates.
3. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the heat dissipation fin structure comprises a first heat dissipation fin, the first heat dissipation fin is composed of one heat dissipation fin, and the first heat dissipation fin is located on one surface of the thermal superconducting heat dissipation plate.
4. The finned heat spreader of claim 3, wherein the finned heat spreader comprises: the radiating fin structure further comprises a second radiating fin, and the second radiating fin comprises a plurality of radiating fins and connecting parts positioned at two ends of the radiating fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins and the first heat dissipation fins are respectively positioned on two opposite surfaces of the thermal superconducting heat dissipation plate.
5. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the heat dissipation fin structure comprises two first heat dissipation fins, each first heat dissipation fin is composed of one heat dissipation fin, and the two first heat dissipation fins are respectively located on two opposite surfaces of the thermal superconducting heat dissipation plate.
6. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the radiating fin structure comprises a second radiating fin, and the second radiating fin comprises a plurality of radiating fins and connecting parts positioned at two ends of the radiating fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins are located on one surface of the thermal superconducting heat dissipation plate.
7. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the radiating fin structure comprises a second radiating fin, and the second radiating fin comprises a plurality of radiating fins and connecting parts positioned at two ends of the radiating fins; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the second heat dissipation fins are located between two adjacent heat superconducting heat dissipation plates and are fixed on the surfaces of the two adjacent heat superconducting heat dissipation plates at the same time.
8. The finned heat spreader of claim 1, wherein the heat superconducting plate comprises fins on a surface thereof, and wherein: the radiating fin structure comprises two second radiating fins, and each second radiating fin comprises a plurality of radiating fins and connecting parts positioned at two ends of each radiating fin; the plurality of radiating fins are arranged in parallel at intervals, and the connecting part is integrally connected with the plurality of radiating fins; the two second radiating fins are respectively positioned on two opposite surfaces of the thermal superconducting radiating plate.
9. The finned heat spreader of claim 4, 6, 7 or 8, wherein the fins are formed on the surface of the superconducting plate, and wherein: in the second radiating fins, the adjacent radiating fins are distributed in a one-to-one correspondence manner or in a staggered manner.
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