WO2017186081A1 - Radiating system and communication device with same - Google Patents

Abstract

Provided is a radiating system. The radiating system comprises a heat-absorbing substrate, a radiating substrate and a communicating pipe for connecting the heat-absorbing substrate with the radiating substrate, wherein a heat-absorbing pipeline region formed by multiple paths of pipelines in a communicating manner is arranged in the heat-absorbing substrate, a radiating pipeline region formed by multiple paths of pipelines in a communicating manner is arranged in the radiating substrate, the communicating pipe is used for communicating the heat-absorbing pipeline region with the radiating pipeline region to form a circulation loop, the circulation loop is used for filling a working medium, the working medium flows circularly in the circulation loop so as to take the heat from the heat-absorbing pipeline region to the radiating pipeline region to be radiated out, and then the working medium returns back to the heat-absorbing pipeline region. The present invention also provides a communication device.

Description

Heat dissipation system and communication device having the same

This application claims priority to the Chinese Patent Application No. 201610280271.6, filed on April 29, 2016, entitled "Heat Dissipation System and Communication Equipment with the Heat Dissipation System", the entire contents of which are incorporated by reference. In this application.

Technical field

The present invention relates to the field of communications technologies, and in particular, to a heat dissipation system and a communication device.

Background technique

In the prior art, the indoor server or the outdoor communication base station generates a large amount of heat energy as the number of users increases and the power increases. It is necessary to set a heat dissipation system for heat dissipation to ensure work efficiency. Taking the mobile communication module as an example, as the communication bandwidth increases and the number of users expands, the heat dissipation requirements of the mobile communication module continue to increase, and a heat sink is usually disposed outside the module for heat dissipation. As the heat consumption of the mobile communication module increases, the height of the heat dissipating teeth of the heat sink increases continuously to meet the heat dissipation requirement, but the heat exchange efficiency of the heat dissipating teeth gradually decreases with the increase of the height, thus affecting the heat dissipation effect of the heat sink.

Summary of the invention

The invention provides a heat dissipation system, which can improve the heat exchange efficiency of the heat sink and improve the heat dissipation effect.

The invention also provides a communication device.

In a first aspect, the heat dissipation system of the present application includes a heat absorbing substrate, a heat dissipation substrate, and a communication tube for connecting the heat absorbing substrate and the heat dissipation substrate; and the heat absorbing substrate is internally provided with a plurality of pipelines a heat-dissipating pipe region, wherein the heat-dissipating substrate is provided with a heat-dissipating pipe region formed by connecting a plurality of pipelines, wherein the communicating pipe communicates with the heat-absorbing pipe region and the heat-dissipating pipe region to form a circulation loop, and the circulation circuit is used for filling The working fluid, the working fluid circulates in the circulation loop, so as to bring the heat of the heat absorbing pipeline area to the heat dissipation pipeline area and then flow back to the heat absorption pipeline area.

In a first possible implementation, the working fluid is used to change from a liquid phase to a gaseous state in the region of the heat absorption conduit, and from a gaseous phase to a liquid state in the region of the heat dissipation conduit. The heat dissipation system is provided with a heat absorbing substrate and a heat dissipation substrate communicating with the heat absorbing substrate, so that the heat of the heat absorbing pipe area is radiated through the heat dissipation pipe area and alternately circulated and radiated, thereby improving the heat exchange efficiency of the heat dissipation system.

In a second possible implementation manner, in a second possible implementation manner, the heat dissipation system further includes a driving device, the driving device is serially connected to the circulation circuit, and the working medium is in a liquid state The position flowing through to drive the flow of the working medium between the heat dissipation substrate and the heat absorption substrate, and improve the circulation speed of the working medium to accelerate the heat exchange efficiency of the heat dissipation substrate.

With reference to the first aspect, or the first to the second possible implementation manners of the first aspect, in a third possible implementation manner, the heat absorbing substrate and the heat dissipation substrate are both, the one heat absorbing substrate With the one heat sink substrate The parallel arrangement is such that the one heat dissipation substrate is disposed obliquely with respect to the one heat absorbing substrate, or the one heat dissipation substrate and the one heat absorbing substrate are staggered in height. The heat absorbing substrate and the heat dissipating substrate are arranged in different manners to accommodate an irregular installation space and a non-planar heat source. When the one heat absorbing substrate and the one heat dissipation substrate are parallel and opposite each other, heat dissipation can be saved. The space occupied by the system.

In combination with the first aspect or the first to third possible implementations of the first aspect, in a fourth possible implementation manner, the heat absorbing duct region and the heat dissipating duct region are formed in a vertical direction The height is poor, and at least a portion of the area of the heat absorbing duct is lower than the area of the heat dissipating duct. In the absence of a driving device, it is possible to realize the heat dissipation of the working medium, save the components of the heat dissipation system, and thereby save heat dissipation space.

With reference to the first aspect, or the first to the second possible implementation manners of the first aspect, in a fifth possible implementation manner, the heat absorbing substrate is one, and the heat dissipation substrate is a plurality of The heat dissipation duct regions of the heat dissipation substrate communicate with each other, and the heat absorption pipeline region communicates with at least one of the heat dissipation conduit regions. The plurality of heat dissipation substrates can improve the heat dissipation efficiency of the heat absorption substrate, and are suitable for a heat source with a large heat. It should be noted that the arrangement manner of the plurality of heat dissipation substrates is not limited, and may be arranged in parallel or vertically, or may be arranged in a relatively inclined manner or horizontally, as long as the circulation of the working medium in the heat dissipation circuit can be realized.

In a sixth possible implementation manner, in a sixth possible implementation manner, the heat absorption pipe area of the one heat absorbing substrate is connected to the heat dissipation pipe area of any one of the heat dissipation substrates, or the plurality of The heat dissipation pipe region of the heat dissipation substrate is in series communication with the heat absorption pipe region of the one heat absorption substrate.

In combination with the fifth or the sixth possible implementation manner, in a seventh possible implementation manner, the plurality of heat dissipation substrates and the one heat absorption substrate are stacked or arranged side by side; or the plurality of heat dissipation substrates are stacked Arranged or arranged side by side, and perpendicular to the one heat absorbing substrate; or the plurality of heat dissipation substrates are stacked or arranged side by side and disposed obliquely with respect to the one heat absorbing substrate; or the plurality of heat dissipation substrates are in a height direction And stacked on the side of the heat absorbing substrate; or the plurality of heat dissipation substrates are disposed offset in the height direction and located on one side of the heat absorbing substrate; or the plurality of heat dissipation substrates are in the height direction The heat absorbing substrate is misaligned.

With reference to the first aspect or the first to the second possible implementation manners of the first aspect, in an eighth possible implementation manner, the heat absorbing substrate is a plurality, the heat dissipation substrate is one, and the plurality of suctions The heat absorbing duct regions of the heat substrate communicate with each other, and the heat radiating duct region of the heat radiating substrate communicates with at least one heat absorbing duct region. A plurality of heat absorbing substrates can increase the heat absorbing area, thereby improving heat dissipation efficiency, and are suitable for a case where the heat dissipation area is large but the heat is low.

In combination with the eighth possible implementation manner, in a ninth possible implementation manner, the plurality of heat absorbing substrates are stacked or arranged side by side with the one heat dissipation substrate; or the plurality of heat absorbing substrates are stacked or side by side Providing and perpendicular to the one heat dissipation substrate; or the plurality of heat absorption substrates are stacked or arranged side by side and disposed obliquely with respect to the one of the scattered substrates; or the plurality of heat absorption substrates are stacked and positioned in the height direction One side of the heat dissipation substrate; or the plurality of heat absorption substrates are disposed offset in the height direction and located on one side of the heat dissipation substrate; or the plurality of heat absorption substrates are dislocated from the heat dissipation substrate in the height direction Settings.

In combination with the eighth or the ninth possible implementation manner, in a tenth possible implementation manner, the heat dissipation conduit region of the one heat dissipation substrate and the heat absorption pipeline region of the plurality of heat absorption substrates are connected in series Or the heat dissipation pipe region of the one heat dissipation substrate is in communication with the heat absorption pipe region of any one of the heat absorption substrates; or the suction of each heat absorption substrate in the heat absorption pipe region of the plurality of heat absorption substrates The heat pipe area is respectively connected to the heat dissipation pipe area of the one heat dissipation substrate.

With reference to the first aspect or the second possible implementation manner of the first aspect, in an eleventh possible implementation manner, the heat absorbing substrate is multiple, and the heat dissipation substrate is also multiple, the plurality of The heat absorbing pipeline area of the heat absorbing substrate is connected to communicate with the heat dissipation pipeline area of the plurality of heat dissipation substrates; and the plurality of heat absorbing pipeline areas that are connected to communicate with the connected heat dissipation pipeline area. It can be understood that the heat absorbing substrate has the same number as the heat dissipation substrate. The plurality of heat absorbing substrates and the plurality of heat dissipating substrates have a large enough area to absorb heat and dissipate heat. When the heat is large, the plurality of heat absorbing substrates can satisfy the heat absorption in time and dissipate heat through the plurality of heat dissipating substrates in time.

In a twelfth possible implementation manner, in a twelfth possible implementation manner, the plurality of heat absorbing substrates are stacked or arranged side by side with the plurality of heat dissipation substrates; or the plurality of heat absorbing substrates are stacked Arranging or arranging side by side, the plurality of heat dissipating substrates are stacked or arranged side by side, and the plurality of heat absorbing substrates arranged in a stacked or side by side are located on one side of the plurality of heat dissipating substrates arranged in a stacked or side by side manner; or The plurality of heat absorbing substrates are disposed offset from the plurality of heat dissipation substrates in the height direction.

In combination with the eleventh or the twelfth possible implementation manner, in a thirteenth possible implementation manner, the heat dissipation duct area of the plurality of heat dissipation substrates and the heat absorption pipeline area string of the plurality of heat absorption substrates Connected to each other; or, the number of the heat absorbing substrate is equal to the number of the heat dissipating substrates, and the heat absorbing duct area of the plurality of heat absorbing substrates is in one-to-one communication with the heat dissipating duct area of the plurality of heat dissipating boards; or Each of the plurality of heat absorbing substrates communicates with at least one of the heat dissipating duct regions; or each of the plurality of heat dissipating substrates communicates with at least one of the heat absorbing duct regions.

In combination with the first aspect or the first to thirteen possible implementations of the first aspect, in a fourteenth possible implementation manner, the heat absorbing duct region includes at least one sub-heat absorbing portion composed of multiple pipelines connected a pipe area, in the case of a plurality of sub-heat absorbing pipe areas, the plurality of sub-heat absorbing pipe areas are spaced apart from each other, and the heat-dissipating pipe area includes at least one sub-heat pipe area composed of a plurality of pipe connections, having In the case of a plurality of sub-heat dissipating duct regions, the plurality of sub-heat dissipating duct regions are spaced apart from each other, and the at least one sub-heat-absorbing duct region communicates with the at least one sub-heat dissipating duct region to form the circulation loop.

In a fifteenth possible implementation manner, in a fifteenth possible implementation manner, the sub-heat absorption pipeline area is one, the sub heat dissipation pipeline area is multiple, and the sub-heat absorption pipeline area and the The plurality of sub-heat-dissipating duct regions are connected in series, or each of the plurality of sub-heat-dissipating duct regions is in communication with the sub-heat-absorbing duct region. A plurality of sub-heat dissipation duct areas can increase the heat dissipation area, thereby improving the heat dissipation efficiency, and is suitable for a case where the heat absorption area is small but the heat is high.

When the sub-heat absorption duct area is connected to the heat dissipating duct area formed by the plurality of sub-heat-dissipating duct areas, the duct volume of the sub-heat-dissipating duct area directly communicating with the sub-heat-absorbing duct area is larger than other sub-portions The volume of the pipe in the heat pipe area can provide sufficient working fluid to the sub-heat pipe area to accelerate the heat dissipation efficiency.

In a sixteenth possible implementation manner, in a sixteenth possible implementation manner, the sub heat absorption duct area is multiple, the sub heat dissipation duct area is one, the sub heat dissipation duct area and the A plurality of sub-heat absorbing duct regions are connected in series, or each of the plurality of sub-heat absorbing duct regions is in communication with the sub-heat dissipating duct region. A plurality of sub-heat absorbing duct areas can increase the heat absorbing area, thereby improving the heat absorbing efficiency, and is suitable for a case where the heat absorbing area is large but the heat is low.

In a seventeenth possible implementation manner, in a seventeenth possible implementation manner, the number of the sub heat dissipation duct area and the sub heat absorption duct area are multiple, and the plurality of sub heat absorption pipeline areas are The plurality of sub-heating duct areas The domains are connected in series, and a sub-heat absorption pipe region is connected between each of the two sub-heat pipe regions; or each of the plurality of sub-heat pipe regions communicates with at least one sub-heat pipe Or the plurality of sub-heat pipe regions are connected in series, and the plurality of sub-heat pipe regions are connected in series and communicate with one of the sub-heat pipe regions.

In a manner that may be implemented in the second to thirteenth, in the eighteenth possible implementation manner, the heat absorbing substrate and the heat dissipation substrate are both, and the heat absorbing substrate and the heat dissipation substrate are vertical. Straight and opposite to each other, the heat absorbing duct area is at the same height as the heat dissipating duct area, the driving device communicates with the heat absorbing duct area and the heat dissipating duct area, and the driving device is located at the suction The heat pipe area and the bottom end position of the heat dissipation pipe area, the top end of the heat absorption pipe area and the top end of the heat dissipation pipe area are communicated through the communication pipe.

In a manner that may be implemented in the second to thirteenth, in a nineteenth possible implementation manner, the heat absorbing substrate and the heat dissipation substrate are both placed one on top of the other; the heat absorbing pipe region includes Two sub-heat absorbing pipeline areas composed of multiple pipelines are respectively a first sub-heat absorbing pipeline area and a second sub-heat absorbing pipeline area in a vertical direction from the bottom, and the first sub-heat absorbing pipeline area And the second sub-heat-absorbing pipe area is spaced apart from each other; the heat-dissipating pipe area comprises three sub-heat-dissipating pipe areas which are connected by multiple pipelines, respectively being the first sub-heat-dissipating pipes in the vertical direction from bottom to top a region, a second sub-heat pipe area, and a third sub-heat pipe area, wherein the first sub-heat pipe area, the second sub-heat pipe area, and the third sub-heat pipe area are spaced apart; the driving device and the The first sub-heat absorption pipe area is spaced apart, the driving device, the first sub-heat pipe area, the first sub-heat pipe area, the second sub-heat pipe area, the second sub-heat pipe area, and the third sub-heat pipe Area sequentially connected through the communicating pipe and the drive means in communication with the communication area of the third sub-radiating pipes, thereby forming the circulation circuit.

In a ninth possible implementation manner, the heat absorbing substrate is disposed opposite to the heat dissipation substrate, and the first sub heat dissipation pipe region is disposed opposite to the driving device, The first sub-heat-absorbing pipe area is opposite to the second sub-heat pipe area, and the third sub-heat pipe area is opposite to the third sub-heat pipe area.

In a twenty-first possible implementation manner, in a twenty-first possible implementation manner, the heat absorbing substrate is disposed side by side with the heat dissipation substrate, and the first sub heat absorbing pipeline region is The second sub-heat-absorbing pipe areas are arranged side by side in the horizontal direction, and the first sub-heat pipe area, the second sub-heat pipe area and the third sub-heat pipe area are arranged side by side in the horizontal direction. The working medium enters the first heat absorbing pipeline region in a gaseous state by the driving device, and the working fluid flowing out of the first sub heat absorbing pipeline region and the second sub heat absorbing pipeline region is in a gaseous state, the first The working fluid discharged from a sub-heat pipe area, the second sub-heat pipe area and the third sub-heat pipe area is liquid.

In combination with the second to the thirteenth possible implementation manners, in the twenty-second possible implementation manner, the heat absorbing substrate and the heat dissipation substrate are both placed one on top of the other, and the heat absorbing substrate and the heat absorbing substrate are The heat dissipating substrate is disposed opposite to each other; the heat dissipating pipe region comprises two sub-heat pipe regions connected by a plurality of pipelines, respectively being a first sub-heat pipe region and a second sub-heat pipe in a vertical direction from bottom to top a region, the first sub-heat pipe area and the second sub-heat pipe area are spaced apart from each other; the driving device is spaced apart from the first sub-heat pipe area, the driving device, and the first sub-heat pipe area The heat absorbing pipe area and the second sub heat pipe area are connected in series through the communication pipe, and the driving device is in communication with the second sub heat pipe area to constitute the circulation loop.

In combination with the twenty-second possible implementation manner, in a twenty-third possible implementation manner, the working medium in the heat absorbing pipeline region enters the second sub heat dissipation pipeline region in a gaseous state, and the The area of the second sub-heat pipe area Greater than the area of the heat absorbing duct area.

In combination with the first aspect, in combination with the first to thirteen possible implementation manners, in a twenty-fourth possible implementation manner, the heat absorbing pipeline region includes a plurality of sub-heat absorbing pipelines formed by connecting multiple pipelines a region, the plurality of sub-heat-absorbing duct regions are spaced apart from each other, the heat-dissipating duct region includes a plurality of sub-heat-dissipating duct regions formed by a plurality of pipelines, and the plurality of sub-heat-dissipating duct regions are spaced apart from each other, and The sub heat dissipation duct area is equal to the number of the sub heat absorption duct areas, and each of the plurality of sub heat absorption duct areas and each of the plurality of sub heat dissipation duct areas passes through the communication tube. A plurality of said loops are formed for one communication.

In a twenty-fifth possible implementation manner, in the twenty-fifth possible implementation manner, the sub-heat absorption duct area is two, which are respectively arranged in the vertical direction from top to bottom. a sub-heat absorption pipe area and a second sub-heat absorption pipe area, the sub-heat dissipation pipe area is two, respectively being a first sub-heat pipe area and a second sub-heat pipe arranged in a vertical direction from top to bottom a region; the first sub-heat-absorbing pipe region and the first sub-heat pipe region are connected by two first communication pipes, and at least a portion of the first sub-heat pipe region has a height lower than the first sub-portion a heat dissipation duct region; the second sub heat sink duct region and the second sub heat sink duct region are connected by two second communication tubes, and at least a portion of the second sub heat sink duct region has a height lower than the first The second sub-heat pipe area.

In combination with the first aspect, or in combination with the first to the thirteenth possible implementation manners, in the twenty-sixth possible implementation manner, the heat absorption duct region includes n sub-suctions composed of multiple pipelines connected In the case of a plurality of sub-endothermic pipe areas, the sub-heat-absorbing pipe areas are spaced apart from each other, and the heat-dissipating pipe area includes n-1 sub-heats composed of multiple pipe connections. In the case of a plurality of sub-heat-dissipating duct areas, the sub-heat-dissipating duct areas are spaced apart from each other, n is an integer greater than or equal to 2, and the heat dissipating system further includes a driving device, where the driving device is located The heat absorbing substrate communicates with one of the sub heat dissipation duct regions and constitutes a circuit having a working medium, and the other sub heat dissipation duct regions and the n sub heat absorbing duct regions are connected one-to-one through the communication tube to form a plurality of The circulation loop. The communication pipe connected to the sub-heat absorption pipe area and the sub heat dissipation pipe area is inclined with respect to a horizontal plane to realize the flow of the working medium in the circulation circuit. Alternatively, a height difference is formed between the heat absorbing duct region and the heat dissipating duct region in a vertical direction, and at least a portion of the heat absorbing duct region is located above the heat dissipating duct region.

In a twenty-seventh possible implementation manner, in the twenty-seventh possible implementation manner, the sub-heat absorption duct area is two, which are respectively the first sub-tops arranged in the vertical direction. The heat absorption pipeline area and the second sub heat absorption pipeline area are three, which are respectively a first sub heat dissipation pipeline area and a second sub heat dissipation pipeline area arranged in a vertical direction from bottom to top and a third sub-heat pipe area; the first sub-heat pipe area and the second sub-heat pipe area are connected by two first communication pipes, and at least part of the first sub-heat pipe area is lower in height The second sub-heat-dissipating duct area; the second sub-heat-absorbing duct area and the third sub-heat-dissipating duct area are connected by two second communicating tubes, and at least part of the height of the second sub-heat-absorbing duct area Lower than the third sub-heating duct area; the driving device is located on the heat absorbing substrate and spaced apart from the second sub-heat absorbing duct area; the driving device is connected by two third communicating tubes and First heat dissipation Communication channel region.

In a twenty-eighth possible or twenty-seventh possible manner, in the twenty-eighth possible implementation manner, the first sub-heat-absorbing duct area is connected to the first connecting tube at a lower position than the a position of the first sub-heat pipe area connecting the first communication pipe; a position of the second sub-heat pipe area connecting the second communication pipe is lower than a second sub-heat pipe area connecting the second connection a position of the tube; or the first connecting tube and the second connecting tube are connected Drive unit.

In combination with any of the foregoing possible implementations, in a twenty-ninth possible implementation manner, the driving device may be an active driving, which may be a mechanical pump or a magnetic pump; specifically, the driving device is installed in The communication tube, wherein the communication tube is located at a position where the working fluid flows in a liquid state on the circulation loop; or the driving device is passively driven, and is located on the heat absorbing substrate relative to an external heat source position. The drive device can be a capillary pump or an evaporator. The driving device provides a driving force for the working fluid to flow in the circulation loop.

In combination with any of the foregoing possible implementations, in a third possible implementation manner, a surface of the heat absorbing substrate is provided with a first heat sink, and at least one surface of the heat dissipation substrate is provided with a second heat sink. The first heat sink is disposed opposite to the second heat sink and forms a gap; or the first heat sink is located between the heat absorbing substrate and the heat dissipation substrate, and the first heat sink is A gap is formed between the heat dissipation substrates; or the second heat sink is located between the heat absorption substrate and the heat dissipation substrate, and a gap is formed between the second heat sink and the heat absorption substrate.

In conjunction with the thirtieth possible implementation, in a thirty-first possible implementation manner, the heat absorbing substrate includes a first outer wall and the first outer wall and the first outer wall constitutes the heat absorbing pipe a second outer wall of the region, the first outer wall comprising a plurality of flat zones and a plurality of conduit zones, the conduit zones being used to form a region of the pipe wall of the pipe, and each of the two pipe zones A flat area is disposed between the first heat sink and the flat area of the heat sink substrate, and the second heat sink is connected to the flat area of the heat dissipation substrate.

In conjunction with the thirtieth possible implementation manner, in the thirty-second possible implementation manner, the first heat sink and the second heat sink have a rectangular tooth shape. The heat absorbing substrate and the heat dissipation substrate are both formed into a composite plate by a hot rolling and pressing process, and the multiplex pipe is formed by injecting a high pressure gas.

In combination with any one of the foregoing possible implementation manners, in the thirty-third possible implementation manner, the heat absorbing substrate and the heat dissipation substrate are connected and fixed by the first and second communication tubes; or the heat absorbing substrate and The heat dissipation substrate is fixed by a screwing method or a snap structure.

In combination with the thirtieth possible implementation manner, in the thirty-fourth possible implementation manner, the bonding manner between the first and second heat sinks and the corresponding first heat dissipation substrate is brazing and laser welding. , friction stir welding or gluing and other processes.

In a second aspect, the present embodiment provides a communication device, the communication device including a housing, a circuit board disposed in the housing, a heating element disposed on the circuit board, and a heat dissipation system according to any of the above modes. The heat absorbing substrate is attached to a surface of the casing for absorbing heat of the heat generating component.

In conjunction with the second aspect, in a first possible implementation, the heat generating component is in contact with the inner surface.

In conjunction with the second aspect, in a second possible implementation, the heat absorbing duct area of the heat absorbing substrate is attached to the outer surface of the housing. The heat of the heat-generating component can be absorbed most quickly and the heat can be dissipated to ensure the efficiency of the heat-generating component.

The heat dissipation system of the present invention is provided with a heat dissipation substrate and a heat absorption substrate which are connected to each other, and forms a circulation loop. The heat absorbed by the heat absorption substrate is brought to the heat dissipation substrate through the working medium in the circulation circuit to be cooled, and then returned to the heat absorption substrate. Heat, realize alternating circulation heat dissipation, effectively improve the heat exchange efficiency of the radiator, and thus achieve the purpose of rapid heat dissipation.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description of the embodiments will be briefly described. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

FIG. 1 is a schematic perspective structural view of a heat dissipation system according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of the heat dissipation system shown in FIG. 1.

3 is a side view of the heat dissipation system shown in FIG. 1.

4 is a schematic view showing another assembly manner of the heat dissipation system shown in FIG. 1.

5 is a schematic cross-sectional view showing a first embodiment of a heat absorption pipe region and a heat dissipation pipe region of the heat dissipation system illustrated in FIG. 1 .

6 is a schematic cross-sectional view showing a second embodiment of the heat absorption duct area and the heat dissipation duct area of the heat dissipation system shown in FIG. 1.

FIG. 7 is a schematic view showing the working direction of the heat dissipation system shown in FIG. 6.

8 is a schematic plan view showing a fourth arrangement of the heat absorbing substrate and the heat dissipation substrate of the heat dissipation system of FIG.

9 is a schematic cross-sectional view showing a fifth embodiment of the heat absorption duct area and the heat dissipation duct area of the heat dissipation system shown in FIG. 1.

10 is a schematic cross-sectional view showing a sixth embodiment of a heat absorption duct region and a heat dissipation duct region of the heat dissipation system shown in FIG. 1.

11 is a schematic structural view of a heat absorbing substrate provided with a first heat sink of the heat dissipation system illustrated in FIG. 1 .

Fig. 12 is a partial cross-sectional view showing the heat absorbing substrate shown in Fig. 11;

Figure 13 is a schematic view of a heat dissipation system of a second embodiment of the present invention.

detailed description

In order to make the object, the features and the advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. The described embodiments are only a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The present invention provides a heat dissipation system and a communication device using the heat dissipation system, the communication device including a circuit board having a housing disposed in the housing, and a heat generating component disposed on the circuit board, the heat dissipation system being attached to the heat dissipation system The surface of the housing is for absorbing heat of the heat generating component. The communication device can be, but is not limited to, a base station, a server, and a router. In the embodiment of the present invention, an antenna base station is taken as an example, wherein the heat generating component includes a processor, a chip, a power amplifier device, and the like. The heat dissipation system includes a heat absorption substrate, a heat dissipation substrate, and a communication tube for connecting the heat absorption substrate and the heat dissipation substrate; the heat absorption substrate is internally provided with a heat absorption pipe region formed by connecting a plurality of pipelines, a heat dissipation pipe region is formed in the heat dissipation substrate, and the communication pipe is connected to the heat absorption pipe region and the heat dissipation pipe region to form a circulation loop, and the circulation circuit is used for filling a working medium. The circulation is circulated in the circulation loop to bring the heat of the heat absorption pipe region to the heat dissipation pipe region to be dissipated, and then flow back to the heat absorption pipe region. The working fluid is used to change from a liquid phase to a gaseous state in the region of the heat absorption conduit, and changes from a gaseous phase to a liquid state in the region of the heat dissipation conduit.

Referring to FIG. 1 and FIG. 2, in the first embodiment of the present invention, the heat dissipation system includes a heat absorbing substrate 10, a heat dissipation substrate 15, a communication tube 22, and a driving device 20. The heat absorbing substrate 10 is internally provided with a heat absorbing duct region 13 formed by connecting a plurality of pipelines, and the heat radiating substrate 15 is internally provided with a heat radiating duct region 17 formed by connecting a plurality of pipelines. The heat absorbing substrate 10 and the heat dissipation substrate 15 are connected to the heat absorbing pipe region 13 and the top end of the heat dissipation pipe region 17 and the heat dissipation pipe region 17 and the bottom end of the heat absorbing pipe region 13 through the communication pipe 22, and the communication pipe 22 communicating the heat absorbing duct area 13 with the heat dissipating duct area 17 constitutes a circulation loop. The working fluid in the circulation loop may circulate in the circulation loop to bring the heat of the heat absorption conduit region 13 to the heat dissipation conduit region 17 and then flow back to the heat absorption conduit. Area 13. Further, the working medium changes from a liquid phase to a gaseous state in the heat absorption duct region 13, and changes from a gaseous phase to a liquid state in the heat dissipation duct region 17. The driving device 20 is connected in series with the circulating circuit and located at a position where the working fluid flows in a liquid state to drive the working medium between the heat dissipation substrate 15 and the heat absorbing substrate 10 The flow.

The driving device 20 is in communication with the circulation circuit to drive the working fluid to adjust the capacity difference between the sub-heat absorption pipe region 13 and the heat dissipation pipe region 17, that is, the heat absorption pipe region and the heat dissipation pipe region. The working fluid has a poor capacity. And driving a cyclic phase transition of the working fluid flow from the heat absorbing pipe region 13 to the heat pipe region 17. The drive device 20 is actively driven, such as a mechanical pump or a magnetic pump.

Referring to FIG. 2 again, in the first embodiment of the present embodiment, the heat absorption pipe area 13 is one, the heat dissipation pipe area 17 is one, and the heat absorption substrate 10 and the heat dissipation substrate 15 are mutually Parallelly disposed, or the heat absorbing substrate 10 is disposed opposite to the heat dissipation substrate 15; or the heat absorbing substrate 10 and the heat dissipation substrate 15 are offset in height. The different arrangement of the heat absorbing substrate and the heat dissipation substrate can accommodate irregular installation space and non-planar heat source. When the heat dissipation substrate 15 and the heat absorbing substrate 10 are oppositely disposed (not shown), the surface of the heat dissipation substrate 15 and the heat absorbing substrate 10 provided with the heat sink are inclined and formed at a certain angle (0-180 degrees). It is preferred to set the angle between 0 and 90 degrees. When the heat dissipating system is used for a space with an angled setting, the heat absorbing surface of the heat absorbing substrate 10 can be close to the surface with the heat sink, and the heat dissipating substrate 15 can be adapted to the space and the angle. The presence of the heat sink into the other space increases the ease of installation of the heat sink system.

In this embodiment, the heat dissipation system is located in a vertical direction, and the heat dissipation substrate 10 and the heat dissipation substrate 15 are vertically placed and opposed to each other, without increasing the height of the heat dissipation substrate 15 or the heat sink on the heat absorption substrate 10 It can reduce the heat transfer efficiency of the heat dissipation system. The heat absorbing duct area 13 is at the same height as the heat dissipating duct area 17, the heat absorbing duct area 13 is orthographically projected with the heat dissipating duct area 17, or the heat absorbing duct area 13 is projected onto the On the heat pipe area 17 . The driving device 20 is located at the bottom end position of the heat absorption duct area 13 and the heat dissipating duct area 17, that is, the position of the heat dissipating system closest to the ground, which is more convenient for the working medium to have sufficient space in the circulation loop. Make full use of it. It can be understood that, in one case, a height difference is formed between the heat absorption pipe region 13 and the heat dissipation pipe region 17 and is located above the heat dissipation pipe region 17, and the working fluid in the circulation circuit passes through the driving device 20 The drive flows from the heat pipe area 17 to the heat pipe area. Still further in other embodiments, a height difference is formed between the heat absorbing duct region 13 and the heat dissipating duct region 17 in a vertical direction, and at least a portion of the heat absorbing duct region 13 has a height lower than the The heat dissipation pipe area 17 can eliminate the need for the driving device 20 to realize heat dissipation of the working medium, save heat dissipation system components, and save the heat dissipation system volume.

Specifically, as shown in FIG. 1 and FIG. 3 , the first heat sink 11 on one surface of the heat absorbing substrate 10 and the second heat sink 16 disposed on a surface of the heat dissipation substrate 15 . The first heat sink 11 is opposite to the second heat sink 16 or The spacers are separated by the heat dissipation substrate 15. The first heat sink 11 and the second heat sink 16 are disposed opposite to each other in this embodiment. The surface of the heat absorbing substrate 10 facing away from the first heat sink 11 is a heat absorbing surface. The communication tubes 22 are located at the upper and lower positions of the heat absorbing substrate 10 and the heat dissipation substrate 15 , and the driving device 20 is in communication with the communication tube 22 . The heat absorbing substrate 10 and the heat dissipation substrate 15 are plate-shaped, and each of them forms a composite plate by a hot rolling and pressing process, and forms the multi-channel pipe and the pipe by injecting a high-pressure gas. The heat absorbing substrate 10 and the heat dissipation substrate 15 formed by such a process are greatly reduced in weight compared to the die-cast plate body, and are relatively easy to process. In this embodiment, the multi-channel pipeline and the pipeline are arranged in a regular grid.

The first heat sink 11 is composed of a plurality of thin film connections and is disposed on a surface of the heat absorbing substrate 10 facing away from the heat absorbing surface. The second heat sink 16 is composed of a plurality of sheets connected to each other and disposed on one surface of the heat dissipation substrate 15. The heat absorbing substrate 10 and the heat dissipation substrate 15 are directly fixed by a connection of a communication tube. Alternatively, the heat absorbing substrate 10 and the heat dissipation substrate 15 are fixed by a screwing method or a snap structure. In this embodiment, the heat absorbing substrate 10 and the heat dissipation substrate 15 are fixed by a snap structure. For example, a hook is disposed on the edge of the heat absorbing substrate, and a snap ring is disposed on the edge of the heat dissipation substrate to be engaged with the hook. In this embodiment, the first heat sink 11 and the second heat sink 16 are disposed opposite to each other and form a gap, that is, the heat absorbing substrate 10 and the heat dissipation substrate 15 are assembled to form a heat dissipation system main body. Referring to FIG. 4 , in other embodiments, the first heat sink 11 is located between the heat absorbing substrate 10 and the heat dissipation substrate 15 , that is, the first heat sink 11 and the second heat sink 16 face the same direction. And a gap is formed between the first heat sink 11 and the heat dissipation substrate 12. The gap can make the first heat sink 11 have more space for better heat dissipation.

Referring to FIG. 2 , the heat absorbing surface of the heat absorbing substrate 10 is bonded to the casing 100 to absorb heat, and the heat dissipation substrate 15 realizes the heat absorbing substrate 10 to transfer heat and cool. The heat absorbing substrate 10 and the heat dissipation substrate 15 are vertically placed on the sidewall of the housing during use, and the liquid working medium is located in the lower portion of the heat absorbing pipeline region 13 and the heat dissipation conduit region 15, and the driving device 20 controls The liquid level difference (capacity difference) of the working fluid in the heat absorbing pipe area 13 and the heat pipe area 17 increases the work quality of the pipe area on the heat source side, so that the working medium can be ensured in the heat absorbing pipe area. 13 and the heat pipe area 17 are cycled with optimum effect. When the heat dissipation system performs heat dissipation, the driving device 20 is activated, so that the liquid working medium of the heat dissipation pipe region 17 flows into the heat absorption pipe region 13 through the communication pipe 22 connected to the driving device 20, and the working medium is The pipe in the heat absorbing pipe area 13 is diffused, the working fluid level in the heat absorbing pipe area 13 is raised, and the heat of the working medium passing through the position of the heat absorbing substrate 10 is absorbed by the working medium, and the first heat dissipation The heat dissipation occurs after the working medium is heated, and the phase change from the liquid state to the gaseous state is driven by the driving device from the heat absorbing pipe region 13 to the heat radiating pipe region 17 through the other connecting pipe 22, and the heat radiating substrate 15 is away from the heat radiating substrate 15 The temperature of the heat source is low, and the second heat sink 16 performs heat dissipation. At this time, the working medium is again subjected to a cold phase change. The working medium which is converted from a gaseous state to a liquid state remains in the lower portion of the heat dissipating duct region 17 and the heat absorbing duct region 13 The lower portion and the bottom end of the connecting tube 22 are further driven by the driving device 20 to the endothermic tube region 13 to continue the preheating phase change, so that the heat dissipation of the housing corresponding to the heat absorbing substrate is realized, and the circulation circuit is realized. Liquid two-phase cycle. The heat of the heat absorbing pipe area of the heat dissipation system is radiated through the heat dissipation pipe area and alternately circulates heat to improve the heat exchange efficiency of the heat dissipation system. If the heat source portion of the heat absorbing substrate is relatively large in heat, the working fluid capacity in the heat absorbing pipe region 13 can be increased to achieve high efficiency heat dissipation.

Further, the heat absorbing duct area includes at least one sub heat absorbing duct area formed by multiple pipelines, and in the case of having a plurality of sub heat absorbing duct areas, the plurality of sub heat absorbing duct areas are spaced apart. The heat dissipating duct area 17 includes at least one sub-heat dissipating duct area formed by multiple pipelines. In the case of having a plurality of sub-heat dissipating duct areas, the plurality of sub-heat dissipating duct areas are spaced apart, and the at least one sub-suction Hot pipe area and The at least one sub-heat pipe area is connected to form the circulation loop.

In the first embodiment of the present embodiment, the sub-heat absorption pipe area is one, that is, the heat absorption pipe area, the sub heat dissipation pipe area is plural, the sub heat absorption pipe area and the A plurality of sub-heat-dissipating duct regions are connected in series, or each of the plurality of sub-heat-dissipating duct regions is in communication with the sub-heat-absorbing duct region. Specifically, referring to FIG. 5, the sub-heat-absorbing pipe area 131 of the heat-absorbing substrate 10 is one, which can be understood as the heat-absorbing pipe area, and the sub-heat pipe area of the heat-dissipating substrate 15 is two. The first sub-heat pipe area 151 and the second sub-heat pipe area 152 are arranged in a vertical direction from bottom to top. The driving device 20 is a capillary pump fixed to the heat absorbing substrate 10 and spaced apart from the sub heat absorbing pipe region 131. The heat absorbing substrate 10 and the heat dissipation substrate 15 are vertically disposed and disposed opposite to each other, and the driving device 20, the first sub heat dissipation pipe region 151, the sub heat absorbing pipe region 131, and the second sub heat dissipation pipe region 152 are connected. The tubes 19 are connected in series in series and the drive unit 30 communicates with the second sub-heating duct region 152 to form the circulation loop filled with the working medium. The driving device 20 is connected in series between the first sub heat dissipation duct region 151 and the second sub heat dissipation duct region 152 of the circulation loop. The driving device 20 stores and drives the working fluid flow to realize the exchange of the phase change from the heat absorbing substrate 10 to the heat dissipation substrate 15 . Specifically, the driving device 20 stores and drives the working fluid to flow through the first The sub-heat pipe area 151 enters the sub-heat-absorbing pipe area 131, and is returned from the sub-heat-absorbing pipe area 131 into the second sub-heat pipe area 152 to the driving device 20 to realize the working medium in the sub-suction The phase change transition between the heat pipe region 131, the first sub heat pipe region 151, and the second sub heat pipe region 152; that is, the state of the working fluid in the heat absorbing substrate is different from the state of the working fluid in the heat sink substrate 40.

In this embodiment, the working fluid flows into the heat absorbing substrate 10 and the driving device 20 to be converted into a gaseous state, and is located in the liquid state on the heat dissipation substrate 15. In this embodiment, the area of the second sub-heat dissipation duct area 152 is larger than the area of the heat absorption duct area 131, and is suitable for an environment with small heat generation area but high heat, and the second self-heat dissipation duct area 152 Larger area for faster heat dissipation. Further, in other embodiments, the first sub-heat pipe area 151 is connected in parallel with the second sub-heat pipe area 152 (not shown) on the sub-heat pipe area 131. In this case, each cycle A drive can be provided on the circuit.

In the second embodiment of the present embodiment (not shown), different from the first embodiment, the sub-heat absorption pipe area is plural, and the sub heat dissipation pipe area is one, and the sub heat dissipation. The pipe area and the plurality of sub-heat absorbing pipe areas are connected in series, or each of the plurality of sub-heat absorbing pipe areas is respectively connected to the sub-heat pipe area. The heat dissipation system is suitable for a case where the heat dissipation area is large but the heat is low, and the heat absorption of the plurality of sub-heat absorption pipeline regions can increase the heat absorption efficiency of the heat absorption substrate, thereby improving the heat dissipation efficiency.

In the third embodiment of the present embodiment, different from the first embodiment, the number of the sub heat dissipation duct area and the sub heat absorption duct area are multiple, and the number may be equal or unequal. A plurality of sub-heat absorbing duct regions are in series communication with the plurality of sub-heat dissipating duct regions, and a sub-heat absorbing duct region is connected between each of the two sub-heat dissipating duct regions. Alternatively, each of the plurality of sub-heat-absorbing duct regions communicates with the at least one sub-heat-dissipating duct region. Alternatively, the plurality of sub-heat-dissipating duct regions are connected in series, and the plurality of sub-heat-absorbing duct regions are connected in series and communicate with one of the sub-heat-dissipating duct regions. Specifically, referring to FIG. 6 and FIG. 7 , the heat absorbing duct area on the heat absorbing substrate 10 includes two spaced-apart sub-heat absorbing duct areas, respectively being the first sub-top in the vertical direction. The heat absorption pipe area 33 and the second sub heat absorption pipe area 35. The heat dissipation pipe area includes three sub heat dissipation pipe areas, which are a first sub heat dissipation pipe area 43, a second sub heat dissipation pipe area 45, and a third sub heat dissipation pipe area 47. The drive unit 20 is a passive drive such as a capillary pump. The driving device 20, the first sub-heat pipe region 43, the first sub-heat pipe region 33, the second sub-heat pipe region 45, the second sub-heat pipe region 35, and the third sub-heat pipe region 47 are sequentially connected through the connecting pipe 46. The series is connected in series, and the driving device 20 connects the first sub-heating duct area 43 and the third sub-heat dissipating duct area 47 to constitute the loop. The first sub-heat absorbing duct area 33, the second sub-heat absorbing duct area 35, and the driving device 20 absorb heat as a heat absorbing source, and the working medium is in a liquid state in this portion. When the heat dissipation system is used for heat dissipation, the driving device 20 is activated. Since the driving device 20 is directly in a position corresponding to the heat source, the driving device 20 outputs a gaseous working medium to the first sub-heating pipe region 43. The gaseous working medium enters the first sub-heat-dissipating duct area 43 through the connecting pipe, and then cools through the first sub-heat-dissipating duct area 43 and the second heat sink, and the working medium becomes liquid after being cooled; the liquid working medium The heat is absorbed into the first sub-heat absorbing pipe region 33 through the connecting pipe, and the heat of the portion of the first sub-heat absorbing pipe region 33 is cooled to cool the heat absorbing substrate 10, and the first heat sink is also effectively cooled. At this time, the heated working medium again changes into a gaseous state and flows through the communication pipe to the second sub-heat pipe area 45, and after the cooling and cooling by the second sub-heat pipe area 45, the phase changes back to the liquid working medium. The second sub-heat absorption pipe region 35, the working medium absorbs the heat of the heat-absorbing substrate to cool and cool the heat-absorbing substrate 10, and the first heat-dissipating film is also effectively dissipated again; and then the heated working medium The secondary phase changes to a gaseous state and flows through the communication pipe 46 to the third sub heat dissipation pipe region 47, and is cooled and cooled by the third sub heat dissipation pipe region 47 and the second heat sink to return to the liquid state and enter the driving device 20 The endothermic phase change is performed again, thereby achieving a lower phase transition between the pipe region of the heat absorbing substrate and the pipe region of the driving device and the heat dissipating substrate, thereby achieving heat dissipation from the heat source.

The driving device 20 is located on the heat absorbing substrate 10 at a position relative to an external heat source, such as a position of a chip of the communication device. The drive unit 20 is a capillary pump to which a liquid storage chamber is connected or is an evaporator. In this embodiment, the driving device 20 includes a liquid storage chamber that houses the working fluid and a capillary pump that communicates with the liquid storage chamber. Among them, the capillary pump is divided into a gas pipeline and a liquid pipeline. The liquid line is connected to the reservoir. In this embodiment, the heat absorbing substrate 10 includes a first region and a second region where the first sub-heat absorbing duct region 33 is disposed, the heat of the first region is greater than the heat of the second region, and the driving The device 20 is located in a first region of the heat absorbing substrate. Specifically, the heat dissipation system is used for heat dissipation of the antenna base station, and the heat absorbing substrate 10 is attached to the base station housing or the substrate on which the heat source is mounted, and the heat of the driving device 20 on the heat absorbing substrate 10 relative to the heat source is large or The largest position, so that the heat source of the large heat source can be directly cooled more efficiently. It can be understood that the area of the second sub-heat dissipation duct region 45 connected to the first sub-heat-absorbing duct region 33 can be increased or decreased according to the heat-receiving area of the first sub-heat-absorbing duct region 33.

Further, in the embodiment, the heat absorbing substrate 10 is disposed opposite to the heat dissipation substrate 15, and the first sub heat dissipation duct region 43 is disposed opposite to the driving device 20, and the first sub heat absorbing pipeline region is further disposed. 33 is opposite to the second sub-heat pipe area 45, and the third sub-heat pipe area 35 is opposite to the third sub-heat pipe area 47. It can be seen that the first sub-heat dissipation duct area 43 is opposite to the driving device 20, and the first sub-heat-absorbing duct area 33 is opposite to the second sub-heat-dissipating duct area 45. The third sub-heat pipe region 47 is oppositely disposed to reduce the distance between the heat-absorbing substrate 10 and the heat-dissipating substrate 15, save the length of the connecting pipe, and reduce the heat dissipation system. volume of.

Further, referring to FIG. 8 , in the fourth embodiment of the present embodiment, the third method is different from the third manner in that the heat absorption base 10 is disposed side by side with the heat dissipation substrate 15 , and the first The sub heat absorbing duct area 33 and the second sub heat absorbing duct area 35 are arranged side by side in the horizontal direction, and the first sub heat dissipating duct area 43, the second sub heat dissipating duct area 45 and the third sub heat dissipating duct area 47 are horizontally arranged. Set them side by side. Specifically, the second sub-suction The heat pipe area 35 is located on the left side of the first sub-heat-absorbing pipe area 33. The circulation circuit of the heat-dissipating system of this mode is the same as the above-mentioned third cycle circuit and the working principle is the same, and the flow direction of the working medium is as shown by the arrow. It is not described here that the heat absorbing substrate 10 and the heat dissipating substrate 15 are arranged side by side to dissipate heat from a large-area heat source.

In a fifth embodiment of the present embodiment, the heat absorbing duct area includes a plurality of sub-heat absorbing duct areas which are arranged by a plurality of pipelines, and the heat dissipating duct area includes a plurality of pipelines connected by multiple pipelines. The sub-heat pipe area is equal to the number of the sub-heat-absorbing pipe areas, and the sub-heat-absorbing pipe area and the plurality of sub-heat pipe areas are different from the third embodiment. A plurality of the circulation loops are formed by one-to-one communication of the communication tubes, and a driving device is not required. It should be noted that a driving device can be placed on each circulation circuit to ensure the driving force of the working fluid. Specifically, as shown in FIG. 9, the heat absorbing pipe area on the heat absorbing substrate 10 includes two spaced-apart sub-heat absorbing pipe areas, which are bottom-up first sub-heat absorbing pipe areas in the vertical direction. 62 and the second sub-heat absorption duct area 63. The heat dissipation duct area includes two sub heat dissipation duct areas, which are a first sub heat dissipation duct area 73 and a second sub heat dissipation duct area 75 in a vertical direction from bottom to top. The first sub-heat absorbing duct region 62 and the first sub-heat dissipating duct region 73 are communicated by the two first communication tubes 71, and at least a portion of the first sub-heat absorbing duct region 62 has a lower height than the first sub-heat dissipating duct Area 73. The second sub-heat absorbing duct region 63 and the second sub-heat dissipating duct region 75 are communicated by the two second communicating tubes 72, and at least a portion of the second sub-heat absorbing duct region 63 has a lower height than the second sub-heat dissipating duct The region 75, which in turn constitutes two parallel circulating circuits filled with a working medium, realizes the exchange of phase change from the heat absorbing substrate 60 to the heat dissipating substrate 70, and connects the first sub-heat absorbing duct region 62 with the first sub-heat dissipation The two first communication tubes 71 of the duct area 73 are for conveying the gaseous working medium discharged in the first sub-heat-absorbing duct area 62, and one for transporting the first sub-heat-dissipating duct area 73 to the first sub-heat-absorbing duct area 62. Liquid working fluid.

Further, a position at which the first sub-heat-absorbing pipe region 62 is connected to the first communication pipe 71 is lower than a position at which the first sub-heat pipe region 73 is connected to the first communication pipe 71; The position of the heat absorption duct area 63 connecting the second communication tube 72 is lower than the position where the second sub heat dissipation duct area 75 connects the two second communication tubes 72; or the first communication tube 71 and the second A driving device is connected to each of the communication tubes 72. In this embodiment, the first sub-heat-absorbing pipe region 62 is located obliquely below the first sub-heat pipe region 73, and the first communication pipe 71 is directed to the first sub-heat pipe region 73 to the first sub-pipe. The heat absorbing duct area 62 is inclined in the direction. The second sub-heat-absorbing duct region 63 is located obliquely below the second sub-heat-dissipating duct region 75, and the second communicating tube 72 is inclined by the second sub-heat-dissipating duct region 75 toward the second sub-heat-absorbing duct region 63. The first communication tube 71 and the second communication tube 72 are disposed obliquely and generate a height difference so that the working medium in the heat dissipation duct region can flow into the sub-heat absorption pipeline region by its own gravity when it is in a liquid state.

In a sixth embodiment of the present embodiment, the heat absorbing duct area includes n sub-heat absorbing duct areas formed by multiple pipelines, and in the case where the sub-heat absorbing duct area is plural, The heat-absorbing duct area includes n-1 sub-heat-dissipating duct areas formed by connecting multiple pipelines, and in the case where the sub-heat-dissipating duct area is plural, the sub-sub-zone The heat dissipation duct regions are spaced apart from each other, and n is an integer greater than or equal to 2. The heat dissipation system further includes a driving device, the driving device is located on the heat absorbing substrate and communicates with one of the sub heat dissipation pipeline regions and constitutes a working medium. The loop, the other sub-heat-dissipating duct area and the n sub-heat-absorbing duct areas are connected one-to-one through the connecting tube to form a plurality of the loops. Specifically, referring to FIG. 10, the sub-heat absorption duct area is two, which are respectively a first sub-heat-absorbing duct area 63 and a second sub-heat-absorbing duct area 65 arranged in the vertical direction from top to bottom. The heat dissipation duct area includes three sub heat dissipation duct areas, which are respectively a first sub heat dissipation duct area 73, a second sub heat dissipation duct area 75 and a third sub heat dissipation duct area 77 arranged in the vertical direction from top to bottom. First child The heat absorption duct region 63 communicates with the first sub heat dissipation duct region 73 through the first communication tube 71. The second sub-heat-absorbing duct area 65 and the second sub-heat-dissipating duct area 75 are connected to each other through the second communication tube 72. In the embodiment, the driving device 20 is fixed as a heat-absorbing source. The heat absorbing substrate 10 is spaced apart from the first sub heat absorbing duct region 63. The driving device 20 and the third sub-heat dissipation duct region 77 are connected one-to-one through the third communication tube 74. The connection mode of the sub-heat-absorbing pipe area and the heat-dissipating pipe area is the same as that of the fifth mode, and is not described herein. The driving device 20 absorbs heat together as a heat absorbing source and a sub-heat absorbing pipe region to enhance the heat dissipation speed.

In the second embodiment of the present application, referring to FIG. 13 , different from the first embodiment shown in FIG. 3 of the present application, the heat absorbing substrate 10 is one, and the heat dissipation substrate 15 is plural. The heat dissipation duct regions of the heat dissipation substrate 15 communicate with each other, and the heat absorption conduit region communicates with at least one of the heat dissipation conduit regions. The plurality of heat dissipation substrates 15 are stacked or arranged side by side with the one heat absorbing substrate 12; or the plurality of heat dissipation substrates are stacked or arranged side by side, and perpendicular to the one heat absorbing substrate; or the plurality of heat dissipation The substrates are stacked or arranged side by side, and are disposed obliquely with respect to the one heat absorbing substrate; or the plurality of heat dissipation substrates are stacked and disposed on one side of the heat absorbing substrate in a height direction; or the plurality of heat dissipation substrates Disposed in the height direction and located on one side of the heat absorbing substrate; or the plurality of heat dissipation substrates are disposed offset from the heat absorbing substrate in the height direction.

Further, the heat absorbing duct area of the one heat absorbing substrate 10 is connected to the heat radiating duct area of any one of the heat dissipating boards 15 or the heat dissipating duct area of the plurality of heat dissipating boards and the one heat absorbing board The area of the heat absorption pipe is connected in series. In this embodiment, the heat dissipation duct regions of the plurality of heat dissipation substrates 15 are in series communication with the heat absorption conduit regions of the one heat absorption substrate to constitute the circulation loop.

In this embodiment, the one heat absorbing substrate 10 is disposed in parallel with and communicates with one of the heat dissipation substrates 15 . A plurality of the heat dissipation substrates 15 are stacked one on another. The plurality of heat dissipation substrates can improve the heat dissipation efficiency of the heat absorption substrate, and are suitable for a heat source with a large heat. That is to say, the arrangement manner of the plurality of heat dissipation substrates is not limited, and may be parallel vertical alignment, or may be relatively obliquely arranged or horizontally arranged, as long as the circulation of the working medium in the heat dissipation loop can be realized. Preferably, the plurality of heat dissipating substrates are placed in parallel relative to each other and placed in parallel with the heat absorbing substrate, and the driving device can ensure smooth circulation of the working medium in the circuit. It can be understood that the sub heat dissipation duct regions can communicate with the heat absorption pipeline substrate. This structure is suitable for use in scenes where the heat source has a large heat.

In other embodiments, a height difference is formed between the heat absorbing conduit region of the heat absorbing substrate 10 and the heat dissipation conduit region of the heat dissipation substrate 15 in a vertical direction, and at least a portion of the heat absorbing conduit region is located at the Below the area of the heat-dissipating pipe, the driving device can be omitted, and the gravity of the liquid working medium in the heat-dissipating pipe area automatically flows into the lower heat-absorbing pipe area.

In the third embodiment of the present application (not shown), different from the second embodiment, the heat absorbing substrate is plural, and the heat dissipation substrate is one, and the heat absorbing pipeline region of the plurality of heat absorbing substrates The communication between the heat dissipation pipe regions of the heat dissipation substrate 15 is at least connected to one heat absorption pipe region. The heat dissipation pipe region of the one heat dissipation substrate and the heat absorption pipe region of the plurality of heat absorption substrates are connected in series; or the heat dissipation pipe region of the heat dissipation substrate and the heat absorption of any one of the heat absorption substrates The pipeline area is connected to each other; or, the heat absorption pipeline area of each of the heat absorbing substrates in the heat absorbing pipeline area of the plurality of heat absorbing substrates is respectively communicated with the heat dissipation pipeline area of the one heat dissipation substrate. Further, the plurality of heat absorbing substrates are stacked or arranged side by side with the one heat dissipation substrate; or the plurality of heat absorbing substrates are stacked or arranged side by side and perpendicular to the one heat dissipation substrate; or the plurality of suctions Thermal substrates are stacked or arranged side by side and phase Or disposed on the one of the plurality of heat-absorbing substrates; or the plurality of heat-absorbing substrates are stacked in a height direction and located on one side of the heat-dissipating substrate; or the plurality of heat-absorbing substrates are disposed in a height direction and are located at the One side of the heat dissipation substrate; or the plurality of heat absorption substrates are disposed offset from the heat dissipation substrate in the height direction.

In this embodiment, preferably, the heat dissipation duct area of the one heat dissipation substrate and the heat absorption pipeline area of the plurality of heat absorption boards are in series communication. Preferably, the heat absorbing surfaces of the plurality of heat absorbing substrates are located on the same surface (not shown), wherein the plurality of heat absorbing substrates may be located on the same plane or the same curved surface so as to be attached to the surface of the heat source.

In the fourth embodiment (not shown) of the present application, different from the first embodiment, the heat absorbing substrate is plural, and the heat dissipation substrate is also a plurality of heat absorbing substrates. The duct area is connected to communicate with the heat dissipating duct area of the plurality of heat dissipating substrates; the connected plurality of heat absorbing duct areas are in communication with the connected heat dissipating duct area. The plurality of heat absorbing substrates are stacked or arranged side by side with the plurality of heat dissipation substrates; or the plurality of heat absorbing substrates are stacked or arranged side by side, and the plurality of heat dissipation substrates are stacked or arranged side by side, and the plurality of The heat absorbing substrate disposed in a stacked manner or arranged side by side is located on one side of the plurality of heat dissipating substrates disposed one above another or arranged side by side; or the plurality of heat absorbing substrates are disposed offset from the plurality of heat dissipating substrates in a height direction. In this embodiment, it is preferable that a plurality of heat dissipation substrates are placed in parallel with each other and placed in parallel with the heat absorption substrate.

Further, the heat dissipation duct area of the plurality of heat dissipation substrates and the heat absorption pipeline area of the plurality of heat absorption boards are connected in series; or the number of the heat absorption substrate and the heat dissipation substrate are equal, the plurality of The heat absorbing duct area of the heat absorbing substrate is in one-to-one communication with the heat dissipating duct area of the plurality of heat dissipating substrates; or each of the plurality of heat absorbing boards is connected to at least one of the heat dissipating duct areas; Or each of the plurality of heat dissipation substrates communicates with at least one of the heat absorption pipe regions.

Referring to FIG. 11 and FIG. 12, further, the first heat sink 11 and the second heat sink 15 have a rectangular tooth shape in cross section, and may also be called a Great Wall shape as viewed from the entire side portion, and are formed by stamping a metal thin plate. The structure can reduce the thickness of the heat sink, which is advantageous for the size of the phase change heat dissipation system, because the heat sink does not need to be formed on the bottom plate and then mounted on the substrate, but directly connects the outer surface of the substrate to reduce the heat dissipation system. weight. The first heat sink 11 and the second heat sink 15 can expand the heat dissipation area, enhance convection and radiation heat exchange, strengthen the overall heat dissipation performance, and improve heat dissipation efficiency.

Further, the heat absorbing substrate 11 includes a first outer wall 113 and a second outer wall 114 opposite to the first outer wall 113. The first outer wall 113 includes a plurality of flat regions 115 and a plurality of conduit regions 116, and the plurality of conduit regions 116 are interspersed with the plurality of flat regions 115; the first heat sink 11 is coupled to the In the flat area 115 of the heat absorbing substrate 10, in the embodiment, the plurality of pipeline areas of the first outer wall are the tube wall protruding areas of the pipes of the heat absorbing substrate 10. The bonding manner of the first heat sink 11 and the heat absorbing substrate 10 is brazing, laser welding, friction stir welding or gluing. The first fins 11 of the rectangular tooth shape of the present invention are connected to the flat area 115 of the heat absorbing substrate 10. The interval area of the first heat sink 11 corresponds to the pipeline area 116, so as to avoid The pipe in the area of the heat absorbing pipe is damaged, and it is also unnecessary to fill the flat portion 115 of the first outer wall 113 using heat sinks of other shapes. It can be understood that the shape of the single fins of the first fins 11 and the second fins 15 can be diversified, and can be any shape such as a T shape, an L shape V shape, a W shape, a wave plate shape or a parallel plate shape. . The heat sink having the shape described above may be disposed on the second outer wall 114 having a flat shape.

The heat dissipation substrate 15 in this embodiment includes a first outer wall (not shown) identical to the heat absorption substrate 11 and a second outer wall opposite to the first outer wall, the first outer wall including a plurality of flat areas and a plurality of tubes a plurality of conduit regions interposed with the plurality of bonding regions; the first heat sink is connected to a flat area of the heat absorbing substrate, and the second heat sink Connected to the flat area of the heat dissipation substrate. I won't go into details here.

The above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and thus equivalent changes made in the claims of the present invention are still within the scope of the present invention.

Claims (32)

1. A heat dissipation system includes: a heat absorbing substrate, a heat dissipation substrate, and a communication tube for connecting the heat absorbing substrate and the heat dissipation substrate; and the plurality of pipelines are internally connected to the heat absorbing substrate a heat-dissipating pipe area, wherein the heat-dissipating substrate is provided with a heat-dissipating pipe area formed by connecting a plurality of pipes, and the connecting pipe is connected to the heat-absorbing pipe area and the heat-dissipating pipe area to form a circulation loop, and the circulation circuit is used for the circulation circuit In the filling medium, the working fluid circulates in the circulation loop to bring the heat of the heat absorption pipe region to the heat dissipation pipe region and then flow back to the heat absorption pipe region.
2. The heat dissipation system according to claim 1, wherein the working fluid is used to change from a liquid phase to a gaseous state in the region of the heat absorption conduit, and from a gaseous phase to a liquid state in the region of the heat dissipation conduit.
3. The heat dissipation system according to claim 2, wherein the heat dissipation system further comprises a driving device, wherein the driving device is connected in series with the circulation circuit and located at a position where the working medium flows in a liquid state. And driving the flow of the working medium between the heat dissipation substrate and the heat absorption substrate.
4. The heat dissipation system according to claim 1 or 3, wherein the heat absorbing substrate and the heat dissipation substrate are both, and the one heat absorbing substrate and the one heat dissipation substrate are arranged in parallel or arranged side by side, or The one heat dissipating substrate is disposed obliquely with respect to the one heat absorbing substrate, or the one heat dissipating substrate and the one heat absorbing substrate are staggered in height.
5. The heat dissipation system according to claim 4, wherein a height difference is formed between the heat absorbing duct region and the heat dissipating duct region in a vertical direction, and at least a portion of the heat absorbing duct region has a low height In the heat dissipation pipe area.
6. The heat dissipation system according to claim 1 or 3, wherein the heat absorbing substrate is one, the plurality of heat dissipation substrates are plural, the heat dissipation pipe regions of the plurality of heat dissipation substrates are connected, and the suction The hot pipe area communicates with at least one of the heat pipe areas.
7. The heat dissipation system according to claim 6, wherein the heat absorbing pipe area of the one heat absorbing substrate communicates with the heat dissipation pipe area of any one of the heat dissipation substrates, or the heat dissipation pipes of the plurality of heat dissipation substrates The region is in series communication with the heat absorbing conduit region of the one heat absorbing substrate.
8. The heat dissipation system according to claim 6, wherein the plurality of heat dissipation substrates are stacked or arranged side by side with the one heat absorbing substrate; or the plurality of heat dissipation substrates are stacked or arranged side by side, and perpendicular to the a heat absorbing substrate; or the plurality of heat dissipation substrates are stacked or arranged side by side and disposed obliquely with respect to the one heat absorbing substrate; or the plurality of heat dissipation substrates are stacked in a height direction and located at the heat absorbing One side of the substrate; or the plurality of heat dissipation substrates are disposed offset in the height direction and located on one side of the heat absorbing substrate; or the plurality of heat dissipation substrates are disposed offset from the heat absorbing substrate in the height direction.
9. The heat dissipation system according to claim 1 or 3, wherein the heat absorbing substrate is a plurality, and the heat dissipation substrate is one, and the heat absorbing pipes of the plurality of heat absorbing substrates are connected to each other. The heat dissipation duct area of the heat dissipation substrate is connected to at least one heat absorption pipeline area.
10. The heat dissipation system according to claim 9, wherein the plurality of heat absorbing substrates are stacked or arranged side by side with the one heat dissipation substrate; or the plurality of heat absorbing substrates are stacked or arranged side by side and perpendicular to the a heat dissipating substrate; or the plurality of heat absorbing substrates are stacked or arranged side by side and tilted relative to the one of the scattered substrates Or obliquely disposed; or the plurality of heat absorbing substrates are stacked in a height direction and located on one side of the heat dissipation substrate; or the plurality of heat absorbing substrates are disposed offset in a height direction and are located at one side of the heat dissipation substrate Or the plurality of heat absorbing substrates are disposed offset from the heat dissipation substrate in a height direction.
11. The heat dissipation system according to claim 9, wherein: a heat dissipation pipe region of the heat dissipation substrate and a heat absorption pipe region of the plurality of heat absorption substrates are connected in series; or a heat dissipation of the heat dissipation substrate The pipe area is in communication with the heat absorbing pipe area of any one of the heat absorbing substrates; or the heat absorbing pipe area of each of the heat absorbing substrates of the plurality of heat absorbing substrates is respectively separated from the heat absorbing pipe area The heat dissipation pipe area of the substrate is connected.
12. The heat dissipation system according to claim 1 or 3, wherein the plurality of heat absorbing substrates are plural, and the plurality of heat dissipation substrates are also connected, wherein the heat absorbing pipeline regions of the plurality of heat absorbing substrates are connected, The heat dissipation duct regions of the plurality of heat dissipation substrates are in communication; the plurality of heat absorption pipeline regions that are in communication communicate with the connected heat dissipation pipeline regions.
13. The heat dissipation system according to claim 12, wherein the plurality of heat absorbing substrates are stacked or arranged side by side with the plurality of heat dissipation substrates; or the plurality of heat absorbing substrates are stacked or arranged side by side, a plurality of heat dissipating substrates are stacked or arranged side by side, and a plurality of the heat absorbing substrates arranged in a stacked or side by side are located on one side of the plurality of heat dissipating substrates arranged in a stacked or side by side manner; or the plurality of heat absorbing substrates are at a height Disposed in the direction with the plurality of heat dissipation substrates.
14. The heat dissipation system according to claim 12, wherein the heat dissipation duct region of the plurality of heat dissipation substrates and the heat absorption conduit region of the plurality of heat absorption substrates are connected in series; or the heat absorption substrate and the heat sink substrate The number of the heat dissipation substrates is equal, and the heat absorption pipe regions of the plurality of heat absorption substrates are in one-to-one communication with the heat dissipation pipe regions of the plurality of heat dissipation substrates; or each of the plurality of heat absorption substrates absorbs heat The duct area communicates with at least one of the heat dissipating duct areas; or each of the plurality of heat dissipating boards communicates with at least one of the heat absorbing duct areas.
15. The heat dissipation system according to any one of claims 1-3, wherein the heat absorbing duct area comprises at least one sub-heat absorbing duct area formed by a plurality of pipelines, in the case of a plurality of sub-heat absorbing duct areas, The plurality of sub-heat-absorbing duct areas are spaced apart from each other, and the heat-dissipating duct area includes at least one sub-heat-dissipating duct area formed by multiple pipelines, and in the case of having a plurality of sub-heat-dissipating duct areas, the plurality of sub-heat dissipating ducts The regions are spaced apart from each other, and the at least one sub-heat-absorbing duct region communicates with the at least one sub-heat-dissipating duct region to form the circulation loop.
16. The heat dissipation system according to claim 15, wherein the sub-heat absorption pipe area is one, the sub heat dissipation pipe area is a plurality, the sub heat absorption pipe area and the plurality of sub heat dissipation pipe areas are Connected in series, or each of the plurality of sub-heat-dissipating duct regions is in communication with the sub-heat-absorbing duct region.
17. The heat dissipation system according to claim 15, wherein the sub-heat absorption pipe area is a plurality, the sub heat dissipation pipe area is one, the sub heat dissipation pipe area and the plurality of sub heat absorption pipe areas are Each of the plurality of sub-heat absorbing duct regions is in communication with the sub-heat-dissipating duct region.
18. The heat dissipation system according to claim 15, wherein the number of the sub heat dissipation duct area and the sub heat absorption duct area are plural, and the plurality of sub heat absorption duct areas and the plurality of sub heat dissipation duct areas Connected in series, and each of the two sub-heat-dissipating duct regions is connected with a sub-heat-absorbing duct region; or each of the plurality of sub-heat-absorbing duct regions is connected to at least one sub-heat-dissipating duct region Or, the plurality of sub-scatters The heat pipe area is connected in series, and the plurality of sub heat absorbing pipe areas are connected in series and communicate with one of the sub heat pipe areas.
19. The heat dissipation system according to claim 3, wherein the heat absorbing substrate and the heat dissipation substrate are both, and the heat absorbing substrate and the heat dissipation substrate are vertically placed and opposed to each other, and the heat absorbing pipe is The area is at the same height as the heat dissipation duct area, the driving device communicates with the heat absorption pipe area and the heat dissipation pipe area, and the driving device is located at the bottom of the heat absorption pipe area and the heat dissipation pipe area In an end position, a top end of the heat absorption duct area and a top end of the heat dissipation duct area communicate with each other through a communication tube.
20. The heat dissipation system according to claim 3, wherein the heat absorbing substrate and the heat dissipation substrate are both placed one on top of the other; the heat absorbing pipe region comprises two sub-suctions connected by a plurality of pipes. The heat pipe area is a first sub-heat absorbing pipe area and a second sub heat absorbing pipe area in a vertical direction from the bottom, respectively, and a space between the first sub-heat absorbing pipe area and the second sub-heat absorbing pipe area The heat dissipation pipe area comprises three sub-heat pipe areas connected by multiple pipelines, which are a first sub-heat pipe area, a second sub-heat pipe area and a third from the bottom in the vertical direction. a sub-heat pipe area, the first sub-heat pipe area, the second sub-heat pipe area, and the third sub-heat pipe area are spaced apart; the driving device is spaced apart from the first sub-heat pipe area, The driving device, the first sub-heat pipe area, the first sub-heat pipe area, the second sub-heat pipe area, the second sub-heat pipe area, and the third sub-heat pipe area are connected in series through the connecting pipe The driving device is in communication with the third sub-heating duct region to constitute the circulation loop.
21. The heat dissipation system according to claim 20, wherein the heat absorbing substrate is disposed opposite to the heat dissipation substrate, and the first sub heat dissipation pipe region is disposed opposite to the driving device, and the first sub heat absorption The pipe area is opposite to the second sub heat pipe area, and the third sub heat pipe area is opposite to the third sub heat pipe area.
22. The heat dissipation system according to claim 20, wherein the heat absorbing substrate is disposed side by side with the heat dissipation substrate, and the first sub heat absorbing pipe area and the second sub heat absorbing pipe area are arranged side by side in the horizontal direction. The first sub-heat pipe area, the second sub-heat pipe area, and the third sub-heat pipe area are arranged side by side in the horizontal direction.
23. The heat dissipation system according to claim 3, wherein the heat absorbing substrate and the heat dissipation substrate are both disposed vertically, and the heat absorbing substrate is disposed opposite to the heat dissipation substrate; The sub-heat-dissipating duct area consisting of two multi-channel pipelines is respectively connected to a first sub-heat-dissipating duct area and a second sub-heat-dissipating duct area in a vertical direction from the bottom, the first sub-heat dissipating duct area, The second sub-heat pipe area is spaced apart from each other; the driving device is spaced apart from the first sub-heat pipe area, the driving device, the first sub-heat pipe area, the heat absorption pipe area, and the second sub-heat pipe The region is connected in series by a communication pipe and the driving device communicates with the second sub-heat pipe region to constitute the circulation loop.
24. The heat dissipation system according to claim 23, wherein the working medium in the region of the heat absorption pipe enters the second sub heat dissipation pipe region in a gaseous state, and the area of the second sub heat dissipation pipe region is larger than The area of the heat absorbing pipe area.
25. The heat dissipation system according to claim 1, wherein the heat absorbing duct area comprises a plurality of sub-heat absorbing duct areas formed by connecting a plurality of ducts, and the plurality of sub-heat absorbing duct areas are spaced apart from each other. The heat pipe area includes a plurality of sub heat pipe areas connected by a plurality of pipes, and between the plurality of sub heat pipe areas Separatingly disposed, and the sub-heat-dissipating duct area is equal to the number of the sub-heat-absorbing duct areas, and each sub-heat-absorbing duct area of the plurality of sub-heat-absorbing duct areas and each of the plurality of sub-heat-dissipating duct areas are dissipated The pipe area is connected one-to-one through the communication pipe to form a plurality of the circulation circuits.
26. The heat dissipation system according to claim 25, wherein the sub-heat absorbing duct area is two, which are respectively a first sub-heat absorbing duct area and a second sub-suction arranged in a vertical direction from top to bottom. In the hot pipe area, the sub-heat pipe area is two, which are respectively a first sub-heat pipe area and a second sub-heat pipe area arranged in the vertical direction from top to bottom; the first sub-heat pipe area And communicating with the first sub-heat pipe area through two first communication pipes, and at least a portion of the first sub-heat pipe area is lower than the first sub-heat pipe area; the second sub-heat absorption The pipe area and the second sub-heat pipe area are connected by two second communication pipes, and at least part of the second sub-heat pipe area is lower in height than the second sub-heat pipe area.
27. The heat dissipation system according to claim 1, wherein the heat absorbing duct area comprises n sub-heat absorbing duct areas formed by connecting a plurality of ducts, and in the case where the sub-heat absorbing duct area is plural The sub heat absorbing duct areas are spaced apart from each other, and the heat dissipating duct area includes n-1 sub heat dissipating duct areas formed by connecting a plurality of ducts, and in a case where the sub heat dissipating duct area is plural, An interval between the regions of the heat dissipation ducts, n is an integer greater than or equal to 2, the heat dissipation system further includes a driving device, the driving device is located at the heat absorbing substrate and communicates with one of the sub heat dissipation duct regions and constitutes one The circuit of the working medium, the other sub-heat-dissipating duct area and the n sub-heat-absorbing duct areas are connected one-to-one through the connecting tube to form a plurality of the circulating loops.
28. The heat dissipation system according to claim 27, wherein the sub-heat absorption duct area is two, which are respectively a first sub-heat-absorbing duct area and a second sub-suction arranged in a vertical direction from top to bottom. In the hot pipe area, the sub-heat pipe area is three, which are respectively a first sub-heat pipe area, a second sub-heat pipe area and a third sub-heat pipe area arranged from top to bottom in a vertical direction; The first sub-heat-absorbing pipe area and the second sub-heat pipe area are connected by two first communication pipes, and at least a portion of the first sub-heat pipe area is lower than the second sub-heat pipe area; The second sub-heat-absorbing pipe area and the third sub-heat pipe area are connected by two second communication pipes, and at least part of the second sub-heat pipe area is lower in height than the third sub-heat pipe The driving device is located on the heat absorbing substrate and spaced apart from the second sub heat absorbing pipe region; the driving device is connected by two third communication pipes and the first sub heat dissipation pipe region is in communication.
29. The heat dissipation system according to claim 26 or 28, wherein the first sub-heat absorption pipe region is connected to the first communication pipe at a lower position than the first sub-heat pipe region to connect the first communication a position of the tube; a position at which the second sub-heat absorption duct region is connected to the second communication tube is lower than a position at which the second sub-heat dissipation duct region is connected to the second communication tube; or the first communication tube and A driving device is connected to each of the second communication tubes.
30. A communication device, comprising: a housing, a circuit board disposed in the housing, a heating element disposed on the circuit board, and the heat dissipation system according to any one of claims 1-28; The heat absorbing substrate is attached to an outer surface of the casing for absorbing heat of the heat generating component.
31. The communication device according to claim 30, wherein said heat generating component is in contact with said inner surface.
32. The communication device according to claim 30, wherein the heat absorbing duct region of the heat absorbing substrate is attached to an outer surface of the casing.

Images