CN206657307U - Board-like water cooling graphic card radiator - Google Patents
Board-like water cooling graphic card radiator Download PDFInfo
- Publication number
- CN206657307U CN206657307U CN201621401392.3U CN201621401392U CN206657307U CN 206657307 U CN206657307 U CN 206657307U CN 201621401392 U CN201621401392 U CN 201621401392U CN 206657307 U CN206657307 U CN 206657307U
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- water
- cooled plate
- video card
- master chip
- sebific duct
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Abstract
The utility model discloses a kind of board-like water cooling graphic card radiator, including cooled plate, water circulating pump, cold water sebific duct, hot water sebific duct and heat exchanger, the cooled plate is jointly mounted on video card by the way that stud is fixedly mounted, the cooled plate corresponds to video card master chip and is provided with master chip heat dissipation cavity, the master chip heat dissipation cavity is respectively communicated with by the circulating water channel in the cooled plate with the water inlet connection and water outlet joint for being arranged on the cooled plate side, cold water sebific duct and hot water sebific duct are connected by a water circulating pump respectively between the water inlet connection and the water outlet joint, the cold water sebific duct and the hot water sebific duct other end are connected with the heat exchanger respectively, heat exchanger and the external heat radiation fan is arranged on cabinet.The board-like water cooling graphic card radiator it is in light weight, combined small so as to take up space, while can efficiently be radiated with video card close structure.
Description
Technical field
Video card radiating device technical field is the utility model is related to, more particularly to a kind of board-like water cooling graphic card radiator.
Background technology
With the development of chip technology, chip integration more and more higher, nanoscale also increasingly improves, and power is increasingly
Greatly, powerful chip emerges in an endless stream, correspondingly the thermal power more and more higher of chip, and people bring life in enjoyment chip progress
While convenient, the puzzlement that must solve high-power chip radiating is also faced, so how to solve asking for high-power chip radiating
What topic and chip circle were extremely paid close attention to.
Especially prominent as the video card heat dissipation problem in desktop computer, desktop computer needs to face big data emulation, efficiently
Calculate, multitask works and as the large-scale 3D gaming platforms of overfrequency, can display card chip processing speed be more and more faster, quick
It is efficient to solve video card to radiate to be urgent problem, and existing graphic card radiator is by the combination of aluminium radiator fin and DC fans
Can not solve powerful video card heat dissipation problem, or cause to oppress video card deformation because heatsink weight is excessive, cause to contact
It is bad or video card ftractures after working long hours；Or DC number of fans is excessive, cause noise excessive, form video card periphery high-temperature region,
After long-play, high-revolving fan laying dust causes fan life to reduce, and can not meet the needs of video card capabilities；Or radiator
Conducting path it is long, these are all to influence impression of the people to high-power video card capabilities.Thus people need a kind of in light weight,
Conduction is fast, the graphic card radiator of energy high efficiency and heat radiation.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of board-like water cooling graphic card radiator, in light weight, with video card
Close structure combines small so as to take up space, while can efficiently radiate.
In order to solve the above-mentioned technical problem, specifically, the utility model provides following technical scheme：
A kind of board-like water cooling graphic card radiator, including cooled plate, water circulating pump, cold water sebific duct, hot water sebific duct and heat exchange
Device, the cooled plate are jointly mounted on video card by the way that stud is fixedly mounted, and the cooled plate corresponds to video card master chip and is provided with
Master chip heat dissipation cavity, the master chip heat dissipation cavity is by the circulating water channel in the cooled plate and is arranged on the cooled plate one
The water inlet connection and water outlet joint of side are respectively communicated with, and are followed between the water inlet connection and the water outlet joint by one
Ring water pump connects cold water sebific duct and hot water sebific duct respectively, and the cold water sebific duct and the hot water sebific duct other end change with described respectively
Hot device connection, heat exchanger and the external heat radiation fan are arranged on cabinet.In use, drive of the water cooling medium through water circulating pump
It is dynamic to flow into the cold water after cooling through heat exchanger from cooled plate water inlet, the circulating water channel of cooled plate is flowed through, wherein circulating
Master chip heat dissipation cavity corresponding to meeting flow path video card main core in aquaporin, the heat of master chip is absorbed, so as to reduce video card master control core
The temperature of piece, flow back to heat exchanger and form closed circuit Water-cooling circulating.
Further, the cooled plate includes lid and cooled plate lower cover in cooled plate, is covered and the water in the cooled plate
Cold drawing lower cover is fixed together by soldering fitting；Lid and the cooled plate lower cover are respectively arranged with stamped female in the cooled plate
Groove and contact boss, lid is corresponding with the stamped recess of the cooled plate lower cover in the cooled plate is bonded, formation circulating water channel；
The contact boss corresponds to video card master chip position and forms master chip heat dissipation cavity, and the outer wall of the master chip heat dissipation cavity has video card master
Chip is bonded.
Further, the cooled plate corresponds to multiple video memory chips of video card and is provided with multiple secondary chip cooling chambers, multiple
The outer wall of the secondary chip cooling chamber is bonded with video memory chip, and the circulating water channel connects multiple secondary chip cooling chambers.
Further, microchannel shovel piece and splitter, the microchannel shovel piece are provided with the master chip heat dissipation cavity
Contact surface be bonded with video card master chip, the fin array of the microchannel shovel piece is arranged in the master chip heat dissipation cavity, institute
Splitter is stated to be arranged between the fin array and the inwall of the master chip heat dissipation cavity.Microchannel shovel piece and splitter are effective
Ensure the fin for allowing water cooling medium to adequately flow through microchannel shovel piece, maximum effect takes away heat.
Further, each described secondary chip cooling chamber is respectively arranged with folded fin；Folded fin plays increase water cooling
The Reynolds number of medium fluid, play turbulent flow.
Further, the installation fixed bolt of the fixation supporting studs of the cooled plate and video card master chip rivet jointly into
One.
Further, the water inlet connection of the cooled plate and water outlet joint are arranged on video card and the installation of cabinet is fixed
Hold side.
Further, the water circulating pump is 90 degree of cold-hot water separating water pumps of binary channels, and the water circulating pump is arranged on aobvious
The installation fixing end side of card and cabinet, the load-carrying of video card golden finger area can be mitigated；90 degree of passages can reduce graphic card radiator
Height after installation, is selected suitable for more cabinets；90 degree of cold-hot water separating water pumps of binary channels, rotor flow through through cold water medium,
Ensure rotor, stator processing low-temperature end, and high temperature channel is away from rotor, stator region.
Using above-mentioned technical proposal, circulation cooling pipeline is formed by cooled plate, heat exchanger, its cooled plate can take into account video card
Main chip radiates, and can fast and effectively take away the heat conducted through video card main control chip；Its cooled plate is with after video card installation, showing
Card overall weight is light, and wherein heat exchanger is installed on cabinet, video card will not be caused to bear a heavy burden；Water cooling medium passes through video card main control chip
After exporting heat, driven through water circulating pump, flow through heat exchanger through fan by heat and air exchange, ensure that the work temperature of video card
Degree, improves video card heat dispersion, extends the service life of video card.
Brief description of the drawings
Fig. 1 is board-like water cooling graphic card radiator installation diagram of the present utility model；
Fig. 2 is cooled plate scheme of installation of the present utility model；
Fig. 3 is cooled plate tomograph of the present utility model；
Fig. 4 is another visual angle tomograph of cooled plate of the present utility model；
Fig. 5 is cooled plate three-dimensional exploded structure chart of the present utility model；
Fig. 6 is cooled plate sectional structure chart of the present utility model；
Fig. 7 is that water pump of the present utility model passes in and out current direction schematic diagram；
Fig. 8 is shovel piece tomograph in microchannel of the present utility model；
Fig. 9 is another visual angle tomograph of microchannel shovel piece of the present utility model；
Figure 10 is folded fin tomograph of the present utility model.
In figure, 20- video cards, 11- cooled plates, 12- water circulating pumps, 13- cold water sebific ducts, 14- hot water sebific ducts, 15- heat exchangers,
Covered in 111- cooled plates, 112- cooled plate lower covers, 113- water outlet joints, 114- water inlet connections, 115- installation fixed bolts,
116- microchannels shovel piece, 117- master chip heat dissipation cavities, 118- pair chip cooling chambers, 119- folded fins, 1110- splitters.
Embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Herein it should be noted that
It is used to help understand the utility model for the explanation of these embodiments, but does not form to restriction of the present utility model.This
Outside, as long as technical characteristic involved in each embodiment of the utility model disclosed below does not form conflict each other
Can is mutually combined.
As shown in figures 1 to 6, a kind of board-like water cooling graphic card radiator, including cooled plate 11, water circulating pump 12, cold water sebific duct
13rd, hot water sebific duct 14 and heat exchanger 15, the cooled plate 11 are jointly mounted on video card 20 by the way that stud 115 is fixedly mounted,
The corresponding video card master chip of cooled plate 11 is provided with master chip heat dissipation cavity 117, and the master chip heat dissipation cavity 117 passes through the water
Circulating water channel in cold drawing 11 divides with the water inlet connection 114 and water outlet joint 113 for being arranged on the side of cooled plate 11
Do not connect, cold-water glue is connected by a water circulating pump 12 respectively between the water inlet connection 114 and the water outlet joint 113
Pipe 13 and hot water sebific duct 14, the cold water sebific duct 13 and the other end of hot water sebific duct 14 are connected with the heat exchanger 15 respectively,
The heat exchanger 15 and external heat radiation fan are arranged on cabinet.In use, driving of the water cooling medium through water circulating pump 12 will
Cold water after cooling through heat exchanger 15 flows into from the water inlet of cooled plate 11, the circulating water channel of cooled plate 11 is flowed through, wherein following
Master chip heat dissipation cavity 117 corresponding to meeting flow path video card main core in ring aquaporin, the heat of master chip is absorbed, so as to reduce video card master
The temperature of chip is controlled, heat exchanger 15 is flowed back to and forms closed circuit Water-cooling circulating.
Wherein, the cooled plate 11 includes lid 111 and cooled plate lower cover 112 in cooled plate, the He of lid 111 in the cooled plate
The cooled plate lower cover 112 is fixed together by soldering fitting；Lid 111 and the cooled plate lower cover 112 in the cooled plate
It is respectively arranged with stamped recess and contacts boss, the stamped recess pair of lid 111 and the cooled plate lower cover 112 in the cooled plate
It should be bonded, form circulating water channel；The contact boss corresponds to video card master chip position and forms master chip heat dissipation cavity 117, described
The outer wall of master chip heat dissipation cavity 117 has the fitting of video card master chip.
Wherein, multiple video memory chips of the corresponding video card 20 of the cooled plate 11 are provided with multiple secondary chip cooling chambers 118, more
The outer wall of the individual secondary chip cooling chamber 118 is bonded with video memory chip, and the circulating water channel connects multiple secondary chips and dissipated
Hot chamber 118.
Wherein, cooled plate 11 ensures water cooling after video card master chip fixed spring screw, the locking of cooled plate fixed screw
Each boss of plate lower cover 112 is in contact with each chip of video card, ensures the conducting path of heat.
Preferably, cold water sebific duct 13 and hot water sebific duct 14 have certain hardness, flexible, low water evaporation rate, interior
The smooth feature of wall；Can it is cold insertion water circulating pump 12 and heat exchanger 15 barb structure, come off after insertion with difficulty, low leakage rate
Feature.
Preferably, has barbed intake-outlet on heat exchanger 15, it connects with cold water sebific duct 13, the cold insertion of hot water sebific duct 14
Connect；There is fan peace screwed hole on the installing plate of both sides, one or two fan can be installed through cabinet, the power of heat exchanger can be by video card
Heat radiation power changes, and can increased or decrease the quantity of flat tube number and wave band to adapt to different video card heat radiation powers, be arranged on
Fan adjustable speed on heat exchanger 15 adapts to the transient change of video card thermal power.
As shown in Figure 8,9, microchannel shovel piece 116 and splitter 1110, institute are provided with the master chip heat dissipation cavity 117
The contact surface for stating microchannel shovel piece 116 is bonded with video card master chip, and the fin array of the microchannel shovel piece 116 is arranged on described
In master chip heat dissipation cavity 117, the splitter 1110 is arranged on the inwall of the fin array and the master chip heat dissipation cavity 117
Between.The fin for allowing water cooling medium to adequately flow through microchannel shovel piece is effectively ensured with splitter 1119 in microchannel shovel piece 116, maximum
Effect takes away heat.
Wherein, microchannel shovel piece 116 has the big feature of shovel piece density, is easy to water cooling medium and adequately flows through shovel piece surface,
Complete heat transfer process；There is a prismatic boss at its back side, and prismatic boss coordinates with cooled plate lower cover gap, in order to ensure that microchannel is shoveled
The positioning precision of piece 116, this gap are can be controlled in less than 0.1mm；Prismatic boss directly contacts with video card main control chip, contact surface
Between can apply thermal grease conduction, to reduce thermal contact resistance, prismatic boss height is more than cooled plate lower cover thickness, its can prevent cooled plate with
Microchannel shovel piece and video card main control chip are hanging after video card installation, cause air thermal resistance；A upper big plane below prismatic boss, its
Plane and cooled plate lower cover lumen contact, after lamination in splitter, cooled plate, it is adapted to plane soldering；Shovel piece both sides have
Chamfering, after splitter lid pressure, Diverging area is formed at chamfering, can effectively allow water cooling medium to flow through each shovel piece surface.
As shown in Figure 10, each described secondary chip cooling chamber 118 is respectively arranged with folded fin 119；Folded fin 119
The Reynolds number of increase water cooling medium fluid is played, plays turbulent flow.
Preferably, lid 111 and cooled plate lower cover 112 are formed by alloy sheet punching press system in cooled plate, are connect with water inlet
Head notch, delivery port notch, square circulating water channel, video memory contact boss, video card main control chip contact boss and riveting spiral shell
Post through hole；Its rivet joint screw through hole is that punching press system forms with stud, forms interference fit；In cooled plate under lid 111 and cooled plate
The contact plane of lid 112 is brazing surface, square circulating water channel, video memory contact boss, video card main control chip contact boss after soldering
Play cooled plate reinforcement；Lid 111, cooled plate lower cover 112, water inlet connection 114, the pricker of water outlet joint 113 in cooled plate
Between postwelding adjacency channel can not liquid leakage, adjacent joint can not liquid leakage and leakage；Video card main control chip contacts boss and shunting
Piece is in contact, the plane-welding of lid 111 in splitter and cooled plate after lamination, prevent water cooling medium be directed across microchannel shovel piece and
Reduce radiating efficiency.
Preferably, water inlet connection 114 and water outlet joint 113 are process by machining apparatus, it is ensured that welding chi
It is very little, sealed on water cooled plate after lid 111, the press forming soldering of cooled plate lower cover 112, there is the sealing with water pump joint in inner nosepiece wall
Face, there is the spring pin hole for crossing joint, this hole can prevent water pump joint from coming off on outer wall；In assembling water inlet connection in water cooling
Assembled during plate upper and lower covers with point pressure type, prevent from ensureing that cooled plate upper and lower covers do not loosen before slice weldering is entered.
Wherein, the fixation supporting studs of the cooled plate 11 and the installation fixed bolt of video card master chip rivet into one jointly
Body.
Preferably, the installation fixed bolt of cooled plate 11 has the dentation for being easy to riveting, with lid in cooled plate 111, water cooling
Plate lower cover 112 is interference fitted, and ensures that cooled plate upper and lower covers do not loosen before slice weldering is entered, can post-processing guarantee stud height after soldering
Degree and the depth of parallelism between end face and video card pcb board；With reinforcement cooled plate intensity, the effect of support reinforcing cooled plate.
Preferably, the installation fixed bolt of video card main control chip has the dentation for being easy to riveting, with being covered in card cooled plate
111st, cooled plate lower cover 112 is interference fitted, and ensures that cooled plate upper and lower covers do not loosen before slice weldering is entered, can post-processing guarantor after soldering
Demonstrate,prove stud height and the depth of parallelism between end face and video card pcb board；With reinforcement cooled plate intensity, the work of support reinforcing cooled plate
With.
Wherein, the water inlet connection 114 of the cooled plate 11 and water outlet joint 113 are arranged on the installation of video card and cabinet
Fixing end side.
As shown in fig. 7, the water circulating pump 12 is 90 degree of cold-hot water separating water pumps of binary channels, the water circulating pump 12 is installed
In the installation fixing end side of video card and cabinet, the load-carrying of video card golden finger area can be mitigated；90 degree of passages can reduce video card and dissipate
Height after hot device installation, is selected suitable for more cabinets；90 degree of cold-hot water separating water pumps of binary channels, rotor is through cold water media flow
Cross, ensure rotor, stator processing low-temperature end, and high temperature channel is away from rotor, stator region.
Wherein, 90 degree of cold-hot water separating water pumps of binary channels have the feature of the delivery port of two water inlet two；Flow in one group water route
Be cold water water route through vane rotor, another group of water route does not intersect with cold water water route independently of hot water water route, and with cold water water route
Between be mutually separated with the air gap after stator pack dress, it is anti-effectively have prevent the heat transfer in hot water water route to rotor and the electricity of stator
Magnetic area, extend the water pump life-span；Cold water water route one end has the seal groove for placing sealing ring, with cooled plate water inlet connection phase
Even；The top that the seal groove of sealing ring is placed in cold water water route has the mounting groove for placing spring catch, with cooled plate water inlet connection
It is connected；The other end in cold water water route has hangnail feature, and it is interference fitted with cold water sebific duct, cold insertion assembling mode, has and lets out
The low feature of dew rate；Hot water water route one end has the seal groove for placing sealing ring, is connected with the water outlet joint of cooled plate；Hot water
The top that the seal groove of sealing ring is placed in water route has the mounting groove for placing spring catch, is connected with the water outlet joint of cooled plate；
The other end in hot water water route has hangnail feature, and it is interference fitted with cold water sebific duct, cold insertion assembling mode, has leakage rate low
Feature.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall within the scope of protection of the utility model.
Claims (8)
- A kind of 1. board-like water cooling graphic card radiator, it is characterised in that：Including cooled plate, water circulating pump, cold water sebific duct, hot water sebific duct And heat exchanger, the cooled plate are jointly mounted on video card by the way that stud is fixedly mounted, the cooled plate corresponds to video card main core Piece is provided with master chip heat dissipation cavity, and the master chip heat dissipation cavity is by the circulating water channel in the cooled plate and is arranged on described The water inlet connection and water outlet joint of cooled plate side are respectively communicated with, between the water inlet connection and the water outlet joint Cold water sebific duct and hot water sebific duct, the cold water sebific duct and hot water sebific duct other end difference are connected by a water circulating pump respectively It is connected with the heat exchanger, heat exchanger and the external heat radiation fan is arranged on cabinet.
- A kind of 2. board-like water cooling graphic card radiator according to claim 1, it is characterised in that：The cooled plate includes water cooling Lid and cooled plate lower cover on plate, lid and the cooled plate lower cover are fixed together by soldering fitting in the cooled plate；It is described Lid and the cooled plate lower cover are respectively arranged with stamped recess and contact boss in cooled plate, lid and the water in the cooled plate The stamped recess of cold drawing lower cover is corresponding to be bonded, and forms circulating water channel；The contact boss corresponds to video card master chip position and formed Master chip heat dissipation cavity, the outer wall of the master chip heat dissipation cavity have the fitting of video card master chip.
- A kind of 3. board-like water cooling graphic card radiator according to claim 2, it is characterised in that：The cooled plate corresponds to video card Multiple video memory chips be provided with multiple secondary chip cooling chambers, outer wall and the video memory chip of multiple secondary chip cooling chambers paste Close, the circulating water channel connects multiple secondary chip cooling chambers.
- A kind of 4. board-like water cooling graphic card radiator according to claim 2, it is characterised in that：In the master chip heat dissipation cavity Microchannel shovel piece and splitter are provided with, the contact surface of the microchannel shovel piece is bonded with video card master chip, the microchannel The fin array of shovel piece is arranged in the master chip heat dissipation cavity, and the splitter is arranged on the fin array and the main core Between the inwall of piece heat dissipation cavity.
- A kind of 5. board-like water cooling graphic card radiator according to claim 3, it is characterised in that：Each described secondary chip dissipates Hot chamber is respectively arranged with folded fin.
- A kind of 6. board-like water cooling graphic card radiator according to claim 1, it is characterised in that：The fixed branch of the cooled plate The installation fixed bolt of support stud and video card master chip is riveted into one jointly.
- A kind of 7. board-like water cooling graphic card radiator according to claim 2, it is characterised in that：The water inlet of the cooled plate Joint and water outlet joint are arranged on the installation fixing end side of video card and cabinet.
- A kind of 8. board-like water cooling graphic card radiator according to claim 7, it is characterised in that：The water circulating pump is bilateral 90 degree of road cold-hot water separating water pump, the water circulating pump are arranged on the installation fixing end side of video card and cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621401392.3U CN206657307U (en) | 2016-12-20 | 2016-12-20 | Board-like water cooling graphic card radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621401392.3U CN206657307U (en) | 2016-12-20 | 2016-12-20 | Board-like water cooling graphic card radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206657307U true CN206657307U (en) | 2017-11-21 |
Family
ID=60314853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621401392.3U Active CN206657307U (en) | 2016-12-20 | 2016-12-20 | Board-like water cooling graphic card radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206657307U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109634394A (en) * | 2019-01-23 | 2019-04-16 | 东莞市建鑫电子科技有限公司 | A kind of integrated radiator of integrated PCB and water pump |
| DE102021123697A1 (en) | 2021-06-09 | 2022-12-15 | Kuan Ding Industrial Co., Ltd. | water cooling system |
| WO2024046439A1 (en) * | 2022-08-31 | 2024-03-07 | 锐捷网络股份有限公司 | Heat dissipation architecture of photoelectric module and electronic device |
-
2016
- 2016-12-20 CN CN201621401392.3U patent/CN206657307U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109634394A (en) * | 2019-01-23 | 2019-04-16 | 东莞市建鑫电子科技有限公司 | A kind of integrated radiator of integrated PCB and water pump |
| CN109634394B (en) * | 2019-01-23 | 2024-03-19 | 东莞市建鑫电子科技有限公司 | Integrated PCB and water pump integrated radiator |
| DE102021123697A1 (en) | 2021-06-09 | 2022-12-15 | Kuan Ding Industrial Co., Ltd. | water cooling system |
| WO2024046439A1 (en) * | 2022-08-31 | 2024-03-07 | 锐捷网络股份有限公司 | Heat dissipation architecture of photoelectric module and electronic device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 Chengtou business center, Qinglin Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen City, Guangdong Province 501 Patentee after: Shenzhen Xun Ling Technology Co., Ltd. Address before: 518000, Shenzhen, Guangming District, Guangdong, Gongming street community B Industrial Zone, 27 C, third floor, Liantang Patentee before: Shenzhen Xun Ling Technology Co., Ltd. |