CN211607189U - Liquid cooling device with pumping structure - Google Patents

Liquid cooling device with pumping structure Download PDF

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Publication number
CN211607189U
CN211607189U CN202020154307.8U CN202020154307U CN211607189U CN 211607189 U CN211607189 U CN 211607189U CN 202020154307 U CN202020154307 U CN 202020154307U CN 211607189 U CN211607189 U CN 211607189U
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CN
China
Prior art keywords
heat dissipation
water
pump
hole
pumping
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Expired - Fee Related
Application number
CN202020154307.8U
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Chinese (zh)
Inventor
许永霖
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Kugene Technology Co ltd
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Kugene Technology Co ltd
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Priority to CN202020154307.8U priority Critical patent/CN211607189U/en
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Publication of CN211607189U publication Critical patent/CN211607189U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a liquid cooling device with pumping structure contains heat dissipation row, water-cooling head and pumping structure. The heat dissipation row comprises a shell seat and a plurality of heat dissipation fins, wherein the shell seat is provided with a water cooling connecting hole and a pumping hole, and one side of the shell seat is provided with a first combining hole; the water cooling head is in heat conduction with the heating component and is provided with a water cooling outlet and a water cooling inlet; the pump structure comprises a pump and a frame seat, the pump is provided with a water inlet hole and a water outlet hole, the pump is arranged in the frame seat, a hollow part is reserved between the pump and the frame seat, the frame seat is provided with a second combination hole corresponding to the first combination hole, the frame seat is attached to one side surface of the heat dissipation bar by penetrating the first combination hole and the second combination hole through the locking component, and the hollow part is correspondingly positioned on one outer side of the heat dissipation plate; therefore, the assembly of the liquid cooling device is simplified and the heat dissipation efficiency is improved.

Description

Liquid cooling device with pumping structure
Technical Field
The present invention relates to liquid cooling devices, and more particularly to a liquid cooling device with a pumping structure.
Background
With the development of technology, the faster and more powerful the electronic device is, the more necessary the heat dissipation device is to reduce the temperature of the electronic device; as the heat generated by electronic components is also increasing, conventional forced air cooling is not used, and liquid cooling devices with better heat dissipation efficiency are used instead.
Furthermore, the liquid cooling system includes a water cooling head (cold plate), a water pump (pump), a heat sink (heat radiator) and a conduit for connecting the two, and a working fluid (generally water) is filled in the circulation pipeline; therefore, the water cooling head is contacted with the heating source, heat is taken away from the heating source in a heat conduction mode, meanwhile, the water pump is used for driving working fluid in the circulating pipeline to circularly flow, the working fluid flows through the water cooling head to carry out heat exchange, and the carried heat energy is conducted to the heat dissipation exhaust so as to be dissipated to outside air.
However, in order to meet the trend of light, thin, short and small appearance of the current products, the heat dissipation structure of the electronic device is gradually moving toward a simplified design direction. Therefore, how to provide a liquid cooling device with good heat dissipation efficiency and simplified shape structure is the research motivation of the present inventor.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a liquid cooling device with a pumping structure, so as to simplify the assembly of the liquid cooling device and improve the heat dissipation efficiency.
In order to achieve the above object, the present invention provides a liquid cooling device with a pumping structure, which comprises a heat dissipation plate, a water cooling head and a pumping structure. The heat dissipation bar comprises a shell seat and a plurality of heat dissipation fins arranged on one side of the shell seat, wherein the shell seat is provided with a first water cooling connecting hole, a second water cooling connecting hole, a first pumping hole and a second pumping hole, and one side of the shell seat is provided with a plurality of first combination holes; the water cooling head is thermally connected with the heating component and is provided with a water cooling inlet communicated with the first water cooling connecting hole and a water cooling outlet communicated with the second water cooling connecting hole; the pumping structure comprises a pump and a frame seat connected with the pump, the pump is provided with a water inlet communicated with a first pumping hole and a water outlet communicated with a second pumping hole, the pump is arranged in the frame seat, a hollow part is reserved between the pump and the frame seat, the frame seat is provided with a plurality of second combination holes corresponding to the plurality of first combination holes, and the frame seat penetrates through the first combination holes and the second combination holes through a plurality of locking components and is attached to one side surface of the radiating bar, so that the hollow part is correspondingly positioned at one outer side of the radiating fins.
Compared with the prior art, the utility model discloses a liquid cooling device with pumping structure sets up water-cooling and connects hole and pumping hole at the shell seat that the heat dissipation was arranged, be provided with the first combination hole of several in one side of shell seat in addition, in view of the above, frame seat accessible several lock solid subassembly of pumping structure wears to establish the first combination hole that the heat dissipation was arranged and the second combination hole of pumping structure and pastes and connect in a side that the heat dissipation was arranged, the pumping of pumping structure sets up in the frame seat, and there is fretwork portion between pumping and the frame seat, and make fretwork portion correspond and be located an outside of fin, the heat of following the fin loss in view of the above can be discharged to the outside from fretwork portion, borrow this and simplify the group of liquid cooling device and establish, increase the utility model discloses a practicality.
Drawings
Fig. 1 is a schematic exploded view of a liquid cooling device with a pumping structure according to the present invention.
Fig. 2 is a schematic perspective view of the liquid cooling device with a pumping structure according to the present invention.
Fig. 3 is a front view of the liquid cooling device with a pumping structure according to the present invention.
Fig. 4 is another embodiment of a liquid cooling device with a pumping structure according to the present invention.
Fig. 5 is a diagram illustrating another embodiment of a liquid cooling apparatus with a pumping structure according to the present invention.
Symbolic illustration in the drawings:
a liquid cooling device; 10, a heat dissipation bar; 11, a shell seat; 111: a first water cooling socket; 112, a second water-cooling connecting hole; 113 a first pumping hole; 114: a second pumping port; 115 a first coupling hole; 116, a lug; 12, a radiating fin; 20, a water cooling head; 21, a water-cooling inlet; 22, a water cooling outlet; 30, a pumping structure; 300, a hollow part; 31, pumping; 32, a frame seat; 33, water inlet holes; 34, water outlet holes; 35 a second combining hole; 36, a locking component; 37, a connecting pipe; 38, support ribs; 40, a heat radiation fan; 50, a conduit; 51: a first conduit; 52: a second conduit.
Detailed Description
The following detailed description and technical contents of the present invention are described with reference to the drawings, but the drawings are only for reference and illustration and are not intended to limit the present invention.
Fig. 1 to fig. 3 are a schematic exploded view, a schematic external view and a front view of a liquid cooling device with a pumping structure according to the present invention. The utility model relates to a liquid cooling device 1 with pumping structure for cool off a heating element (not shown), contain a heat dissipation row 10, a water-cooling head 20 and a pumping structure 30. In this embodiment, the liquid cooling apparatus 1 further includes a heat dissipation fan 40. The water cooling head 20 is connected to the heat dissipation bar 10 for attaching a heating element. The pump structure 30 and the heat dissipation fan 40 are combined on two opposite sides of the heat dissipation bar 10 to form the liquid cooling device 1.
The heat dissipation row 10 includes a housing 11 and a plurality of heat dissipation fins 12 disposed on one side of the housing 11. The housing 11 has a first water-cooling connection hole 111, a second water-cooling connection hole 112, a first pumping hole 113 and a second pumping hole 114, and a plurality of first coupling holes 115 are formed at one side of the housing 11. In this embodiment, the housing 11 extends with a plurality of lugs 116, and the first combining holes 115 are correspondingly disposed on the lugs 116. It should be noted that the internal structure of the heat dissipation bar 10 is known in the art, and will not be described herein.
The water cooling head 20 conducts heat to the heat generating component, thereby carrying away heat generated by the heat generating component. The water cooling head 20 has a water cooling inlet 21 connected to the first water cooling connection hole 111 and a water cooling outlet 22 connected to the second water cooling connection hole 112. In the present embodiment, the water cooling head 20 is a rectangular parallelepiped, but not limited thereto. In addition, one side of the water cooling head 20 is flush against an outer surface of the housing 11. Accordingly, the water cooling inlet 21 is connected to the first water cooling connection hole 111, and the water cooling outlet 22 is connected to the second water cooling connection hole 112.
The pump structure 30 includes a pump 31 and a frame 32 connected to the pump 31. The pump 31 has an inlet hole 33 connected to the first pumping hole 113 and an outlet hole 34 connected to the second pumping hole 114. The pump 31 is disposed in the frame 32, and a hollow portion 300 is left between the pump 31 and the frame 32. In addition, the frame seat 32 is provided with a plurality of second combining holes 35 corresponding to the first combining holes 115 of the housing seat 11; the frame 32 is attached to a side of the heat dissipation bar 10 through a plurality of locking components 36 passing through the first combining holes 115 and the second combining holes 35 of the housing 11, and the hollow portion 300 is located at an outer side of the heat dissipation fins 12. Accordingly, the heat dissipated from the heat dissipation fins 12 is discharged to the outside through the hollow portion 300.
It should be noted that, in the present embodiment, the pump structure 30 further includes a plurality of connecting pipes 37, and the pump 31 is connected to the frame 32 through the connecting pipes 37. Preferably, the pump structure 30 further includes a plurality of support ribs 38, and the support ribs 38 connect the pump 31 and the frame 32 for supporting the pump 31 in the frame 32.
Furthermore, the heat dissipation fan 40 is coupled to another side of the heat dissipation bar 10 opposite to the pumping structure 30. The heat dissipation fan 40 can generate a forced airflow to remove the heat of the heat dissipation bar 10.
It should be noted that, in the present embodiment, the water cooling head 20 of the liquid cooling device 1 with a pumping structure of the present invention is directly attached to an outer side surface of the heat dissipation bar 10, but the present invention is not limited to this embodiment in practical implementation.
Please refer to fig. 4, which is another embodiment of the liquid cooling apparatus with a pump structure according to the present invention. In an embodiment of the present invention, the liquid cooling device 1 further includes a plurality of pipes 50, and the water cooling head 20 is connected to the heat dissipation bar 10 through the pipes 50. Specifically, the conduits 50 include a first conduit 51 and a second conduit 52. The two ends of the first conduit 51 are connected to the first water-cooling connection hole 111 and the water-cooling inlet 21 respectively; the second conduit 52 has two ends respectively connected to the second water-cooling connection hole 112 and the water-cooling outlet 22.
Referring to fig. 5, another embodiment of the liquid cooling device with a pumping structure according to the present invention is shown. In another embodiment of the present invention, the liquid cooling device 1 further includes a plurality of heat dissipation bars 10 and a plurality of pumping structures 30, and the heat dissipation bars 10 and the pumping structures 30 are disposed side by side in a pairwise corresponding manner. The liquid cooling device 1 further comprises a plurality of cooling fans 40, wherein the cooling fans 40 are respectively combined with the pumping structures 30 on the other side surface of the heat dissipation rows 10, so that the cooling efficiency of the liquid cooling device 1 is improved by arranging the plurality of heat dissipation rows 10, the plurality of pumping structures 30 and the plurality of cooling fans 40 side by side.
The above only preferred embodiments of the present invention are described, not to limit the scope of the present invention, other applications the equivalent changes of the patent spirit of the present invention should be all included in the scope of the present invention.

Claims (10)

1. A liquid cooling device with a pumping structure for cooling a heat generating component, comprising:
the heat dissipation bar comprises a shell seat and a plurality of heat dissipation fins arranged on one side of the shell seat, wherein the shell seat is provided with a first water cooling connecting hole, a second water cooling connecting hole, a first pumping hole and a second pumping hole, and a plurality of first combination holes are formed in one side of the shell seat;
the water cooling head is in heat conduction connection with the heating component and is provided with a water cooling inlet communicated with the first water cooling connecting hole and a water cooling outlet communicated with the second water cooling connecting hole; and
the pump structure comprises a pump and a frame seat connected with the pump, the pump is provided with a water inlet communicated with the first pump hole and a water outlet communicated with the second pump hole, the pump is arranged in the frame seat, a hollow part is reserved between the pump and the frame seat, the frame seat is provided with a plurality of second combination holes corresponding to the plurality of first combination holes, the frame seat is attached to one side surface of the heat dissipation bar by penetrating the plurality of first combination holes and the plurality of second combination holes through a plurality of locking components, and the hollow part is correspondingly positioned at one outer side of the plurality of radiating fins.
2. The liquid cooling device with a pumping structure as claimed in claim 1, wherein the housing extends with a plurality of protruding lugs, and the plurality of first combining holes are correspondingly disposed on the plurality of protruding lugs.
3. The liquid cooling apparatus with pump structure as claimed in claim 1, wherein a side of the water cooling head is flush against an outer surface of the housing, the water cooling inlet is butted to the first water cooling connection hole, and the water cooling outlet is butted to the second water cooling connection hole.
4. The liquid cooling device with a pumping structure as set forth in claim 1, wherein the water cooling head is a rectangular parallelepiped.
5. The liquid cooling device with a pumping structure as claimed in claim 1, wherein the pumping structure further comprises a plurality of connecting pipes, and the pump is connected to the frame through the plurality of connecting pipes.
6. The liquid cooling device with a pumping structure as claimed in claim 1, further comprising a heat dissipation fan coupled to another side of the heat dissipation plate opposite to the pumping structure.
7. The liquid cooling device with a pumping structure as set forth in claim 1, further comprising a plurality of conduits, wherein the water cooling head is connected to the heat dissipation bank through the plurality of conduits.
8. The liquid cooling device with a pump structure as claimed in claim 7, wherein the plurality of pipes includes a first pipe and a second pipe, the first pipe has two ends respectively connected to the first water-cooling connection hole and the water-cooling inlet, and the second pipe has two ends respectively connected to the second water-cooling connection hole and the water-cooling outlet.
9. The liquid cooling device with pumping structure as claimed in claim 7, further comprising a plurality of heat dissipation rows and a plurality of pumping structures, wherein the heat dissipation rows and the pumping structures are disposed side by side in a corresponding manner.
10. The liquid cooling device with pumping structure as claimed in claim 9, further comprising a plurality of heat dissipation fans respectively coupled to the other side of each heat dissipation row opposite to the pumping structure.
CN202020154307.8U 2020-02-06 2020-02-06 Liquid cooling device with pumping structure Expired - Fee Related CN211607189U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020154307.8U CN211607189U (en) 2020-02-06 2020-02-06 Liquid cooling device with pumping structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020154307.8U CN211607189U (en) 2020-02-06 2020-02-06 Liquid cooling device with pumping structure

Publications (1)

Publication Number Publication Date
CN211607189U true CN211607189U (en) 2020-09-29

Family

ID=72580361

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020154307.8U Expired - Fee Related CN211607189U (en) 2020-02-06 2020-02-06 Liquid cooling device with pumping structure

Country Status (1)

Country Link
CN (1) CN211607189U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200929

Termination date: 20210206