TWI720802B - Liquid cooling device with pump structure - Google Patents

Abstract

A liquid cooling device with pump structure includes a heat dissipator, a cold plate and a pump structure. The heat dissipator includes a housing and a plurality of heat dissipation fins. The housing has a water-cooled connection hole and a pump hole, and one side of the housing is provided with first coupling holes. The cold plate is thermally conducted to a heating element, and the cold plate has a water-cooled outlet and a water-cooled inlet. The pump structure includes a pump and a frame. The pump has a water inlet and a water outlet, and the pump is disposed in the frame. Furthermore, a hollow portion is left between the pump and the frame. The frame is provided with second coupling holes corresponding to the heat dissipation fins. The frame is attached to one side of the heat dissipator by locking elements inserting the first coupling holes and the second coupling holes to make the hollow portion located on an outer side of the heat dissipation fins correspondingly. Thereby, the assembly of the liquid cooling device is simplified and s heat dissipation efficiency will be improved.

Description

Liquid cooling device with pump structure

The present invention relates to a liquid cooling device, especially a liquid cooling device with a pump structure.

With the development of technology, electronic components nowadays operate faster and have stronger functions. Therefore, the use of heat sinks to reduce the temperature of electronic components is a necessary design choice; in addition, because the heat generated by electronic components is also increasing, As a result, the traditional forced air cooling is no longer sufficient, and it is replaced by a liquid cooling device with better heat dissipation efficiency.

Furthermore, a general liquid cooling system includes a cold plate, a pump, a heat dissipator, and a pipe connected to each other, and the circulating pipeline is filled with a working fluid (generally water); According to this, the water-cooled head is in contact with the heat source, and the heat is taken away from the heat source by heat conduction. At the same time, the working fluid in the circulating pipeline is driven by the water pump to circulate, so that the working fluid flows through the water-cooled head and performs heat exchange. Conduct the entrained heat energy to the radiator, so as to escape to the outside air.

However, in order to comply with the current product appearances becoming thinner, thinner and smaller, the heat dissipation structure of electronic devices is gradually moving towards a streamlined design. In this regard, how to provide a liquid cooling device with good heat dissipation efficiency and a simplified external structure is the research motivation of the inventor.

An object of the present invention is to provide a liquid cooling device with a pump structure, so as to simplify the assembly of the liquid cooling device and improve the heat dissipation efficiency.

In order to achieve the above objective, the present invention is a liquid cooling device with a pump structure, which includes a heat sink, a water cooling head and a pump structure. The heat sink includes a shell base and a plurality of radiating fins arranged on one side of the shell base. The shell base has a first water-cooling connection hole, a second water-cooling connection hole, a first pump hole and a second pump hole. The side is provided with a plurality of first coupling holes; the water cooling head is thermally connected to the heating element, the water cooling head has a water cooling outlet connected to the first water cooling connection hole and a water cooling inlet connected to the second water cooling connection hole; the pump structure includes a pump and a connection pump The pump has a water inlet communicating with the first pump hole and a water outlet communicating with the second pump hole, the pump is arranged in the frame, and there is a hollow part between the pump and the frame , The frame base is provided with a plurality of second coupling holes corresponding to each first coupling hole, and the frame base is attached to a side surface of the heat sink through the plurality of locking elements through the first coupling holes and the second coupling holes The hollow part is correspondingly positioned on an outer side of the heat sinks.

Compared with the prior art, the liquid cooling device with a pump structure of the present invention is provided with a water-cooling connection hole and a pump hole in the housing of the heat sink, and a plurality of first coupling holes are provided on one side of the housing, accordingly , The frame base of the pump structure can be attached to one side of the heat sink through the plurality of locking elements through the first coupling hole of the heat sink and the second coupling hole of the pump structure, and the pump setting of the pump structure In the frame seat, there is a hollow part between the pump and the frame seat, and the hollow part is correspondingly located on an outer side of the heat sink. According to this, the heat escaping from the heat sink will be discharged from the hollow part to the outside, thereby The assembly of the liquid cooling device is simplified, and the practicability of the present invention is increased.

1: Liquid cooling device

10: radiator

11: Shell seat

111: The first water-cooled connection hole

112: The second water-cooled connection hole

113: The first pump hole

114: second pump hole

115: The first combination hole

116: lug

12: heat sink

20: Water block

21: Water-cooled inlet

22: Water cooling outlet

30: Pump structure

300: hollow part

31: Pump

32: frame seat

33: Water inlet

34: water outlet

35: The second combination hole

36: locking element

37: connecting pipe

38: Support rib

40: cooling fan

50: Catheter

51: The first catheter

52: second catheter

Fig. 1 is a three-dimensional exploded schematic diagram of a liquid cooling device with a pump structure of the present invention.

FIG. 2 is a schematic diagram of the three-dimensional appearance of the liquid cooling device with a pump structure of the present invention.

Fig. 3 is a front view of the liquid cooling device with a pump structure of the present invention.

Fig. 4 is another embodiment of the liquid cooling device with a pump structure of the present invention.

Fig. 5 is another embodiment of the liquid cooling device with a pump structure of the present invention.

The detailed description and technical content of the present invention are described below in conjunction with the drawings. However, the drawings are only provided for reference and explanation, and are not used to limit the present invention.

Please refer to FIGS. 1 to 3, which are a three-dimensional exploded schematic diagram, a three-dimensional appearance schematic diagram and a front view of the liquid cooling device with a pump structure of the present invention. The present invention is a liquid cooling device 1 with a pump structure for cooling a heating element (not shown), including a heat sink 10, a water cooling head 20, and a pump structure 30. In this embodiment, the liquid cooling device 1 further includes a heat dissipation fan 40. The water cooling head 20 is connected to the heat sink 10 for attaching heating elements. In addition, the pump structure 30 and the heat dissipation fan 40 are combined on two opposite sides of the heat sink 10 to form the liquid cooling device 1 accordingly.

The heat sink 10 includes a shell base 11 and a plurality of radiating fins 12 arranged on one side of the shell base 11. The housing 11 has a first water-cooled connection hole 111, a second water-cooled connection hole 112, a first pump hole 113, and a second pump hole 114, and one side of the housing 11 is provided with a plurality of first Combination of holes 115 In this embodiment, the housing 11 extends with a plurality of lugs 116, and the first coupling holes 115 are correspondingly provided on the lugs 116. It should be noted that the internal structure of the heat sink 10 is conventional and will not be repeated here.

The water cooling head 20 is thermally connected to the heating element, so as to take away the heat generated by the heating element. The water cooling head 20 has a water cooling inlet 21 communicating with the first water cooling connection hole 111 and a water cooling outlet 22 communicating with the second water cooling connection hole 112. In this embodiment, the water block 20 is a rectangular parallelepiped, but it is not limited to this system. In addition, a side surface of the water block 20 is flat against an outer surface of the housing 11. Accordingly, the water cooling inlet 21 is connected to the first water cooling hole 111, and the water cooling outlet 22 is connected to the second water cooling hole 112.

The pump structure 30 includes a pump 31 and a frame 32 connected to the pump 31. The pump 31 has a water inlet 33 communicating with the first pump hole 113 and a water outlet 34 communicating with the second pump hole 114. The pump 31 is disposed in the frame seat 32, and a hollow part 300 is tied between the pump 31 and the frame seat 32. In addition, the frame 32 is provided with a plurality of second coupling holes 35 corresponding to the first coupling holes 115 of the housing 11; in addition, the frame 32 penetrates the first coupling holes of the housing 11 through a plurality of locking elements 36 A coupling hole 115 and the second coupling holes 35 are attached to a side surface of the heat sink 10 and the hollow portion 300 is correspondingly located on an outer side of the heat sink 12. Accordingly, the heat escaping from the radiating fins 12 will be discharged from the hollow portion 300 to the outside.

It is worth noting that in this embodiment, the pump structure 30 further includes a plurality of connecting pipes 37, and the pump 31 is connected to the frame base 32 through the connecting pipes 37. Preferably, the pump structure 30 further includes a plurality of supporting ribs 38, and the supporting ribs 38 are connected to the pump 31 and the frame base 32 to support the pump 31 to be arranged in the frame base 32.

Furthermore, the heat dissipation fan 40 is coupled to the other side of the heat sink 10 relative to the pump structure 30. The heat dissipation fan 40 can generate a forced air flow to take away the heat of the heat dissipation exhaust 10.

It should be noted that, in this embodiment, the water block 20 of the liquid cooling device 1 with a pump structure of the present invention is directly attached to an outer side of the heat sink 10, but it is not implemented in this manner in actual implementation. This is a limitation.

Please also refer to FIG. 4, which is another embodiment of the liquid cooling device with a pump structure of the present invention. In an embodiment of the present invention, the liquid cooling device 1 further includes a plurality of conduits 50, and the water cooling head 10 The pumping structure 30 is connected through the pipes 50. Specifically, the catheters 50 include a first catheter 51 and a second catheter 52. Two ends of the first pipe 51 are respectively connected to the first water-cooling connection hole 111 and the water-cooling inlet 21; and, two ends of the second pipe 52 are respectively connected to the second water-cooling connection hole 112 and the water-cooling outlet 22.

Please refer to FIG. 5 again, which is another embodiment of the liquid cooling device with a pump structure of the present invention. In another embodiment of the present invention, the liquid cooling device 1 further includes a plurality of heat sinks 10 and a plurality of pumping structures 30, and the heat sinks 10 and the pumping structures 30 are arranged side by side in a pairwise correspondence. . In addition, the liquid cooling device 1 further includes a plurality of heat dissipation fans 40, and the heat dissipation fans 40 are respectively coupled to the other side of each heat dissipation row 10 with respect to each of the pump structures 30, so as to pass through the plurality of heat dissipation rows 10 and the plurality of pumps. The pu structure 30 and the plurality of heat dissipation fans 40 are arranged side by side to increase the heat dissipation efficiency of the liquid cooling device 1.

The above descriptions are only preferred embodiments of the present invention, and are not intended to determine the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.

1: Liquid cooling device

10: radiator

11: Shell seat

111: The first water-cooled connection hole

112: The second water-cooled connection hole

12: heat sink

20: Water block

21: Water-cooled inlet

22: Water cooling outlet

30: Pump structure

300: hollow part

31: Pump

32: frame seat

35: The second combination hole

37: connecting pipe

38: Support rib

40: cooling fan

Claims (10)

A liquid cooling device with a pump structure for cooling a heating element, comprising: a heat sink, including a housing base and a plurality of heat sinks arranged on one side of the housing base, the housing base having a first water-cooling connection Hole, a second water-cooling connection hole, a first pump hole and a second pump hole, and one side of the housing is provided with a plurality of first coupling holes; a water-cooling head, thermally connected to the heating element, The water-cooling head has a water-cooling inlet communicating with the first water-cooling connection hole and a water-cooling outlet communicating with the second water-cooling connection hole; and a pump structure including a pump and a frame connected to the pump, the pump The pump has a water inlet hole communicating with the first pump hole and a water outlet hole communicating with the second pump hole, the pump is arranged in the frame seat, and a hollow part is tied between the pump and the frame seat , The frame is provided with a plurality of second coupling holes corresponding to the first coupling holes, and the frame is attached to the heat sink through the plurality of locking elements through the first coupling holes and the second coupling holes And make the hollow part correspondingly located on an outer side of the radiating fins. The liquid cooling device with a pump structure according to claim 1, wherein the housing base extends with a plurality of lugs, and the first coupling holes are correspondingly provided on the lugs. The liquid cooling device having a pump structure according to claim 1, wherein a side surface of the water cooling head is flat against an outer surface of the housing, the water cooling inlet is butted on the first water cooling connection, and the water cooling outlet The hole is butted on the second water-cooled connecting hole. The liquid cooling device with a pump structure as described in claim 1, wherein the water cooling head is a rectangular parallelepiped. The liquid cooling device with a pump structure according to claim 1, wherein the pump structure further includes a plurality of connecting pipes, and the pump is connected to the frame through the connecting pipes. According to claim 1, the liquid cooling device with a pump structure further includes a heat dissipation fan, and the heat dissipation fan is coupled to the other side of the heat sink relative to the pump structure. The liquid cooling device with a pump structure as described in claim 1, which further includes a plurality of pipes, and the water cooling head is connected to the pump structure through the pipes. The liquid cooling device with a pump structure according to claim 7, wherein the pipes include a first pipe and a second pipe, and two ends of the first pipe are respectively connected to the first water-cooling connection hole and the water-cooling inlet , The two ends of the second conduit are respectively connected with the second water-cooling connection hole and the water-cooling outlet. The liquid cooling device with a pump structure as described in claim 7, which further includes a plurality of heat sinks and a plurality of pump structures, and the heat sinks and the pump structures are arranged side by side in a two-to-two correspondence manner. According to claim 9, the liquid cooling device with a pump structure further includes a plurality of heat dissipation fans, and the heat dissipation fans are respectively coupled to the other side of each heat dissipation row with respect to each pump structure.

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