TWM586876U - Composite water-cooled drain structure - Google Patents

Abstract

A composite water cooling row structure includes at least a cooling plate, a uniform cold wafer unit, and a temperature equalizing plate. The cooling plate has a first upper surface, a first lower surface, and a liquid flowing portion for a working liquid to flow. The liquid flowing portion communicates with an outlet and an inlet. The refrigerated wafer unit is disposed below the cooling plate and has a cold end and a hot end. The cold end is in contact with the first lower surface of the cooling plate. The temperature equalizing plate is disposed below the cooling chip and has a second upper surface and a second lower surface. The second upper surface is in contact with the hot end of the cooling chip, and the heat dissipation is assisted by the composite layer arrangement.

Description

Compound water cooling structure

This creation is about the field of heat dissipation, especially about a composite water cooling structure.

When a computer is operating, many internal components generate a large amount of thermal energy. Therefore, a good cooling system is a key factor that determines the performance and reliability of the computer. Among all the heat-generating components, the heat dissipation problem of the central processing unit (CPU) and graphics chip processor (GPU) with the highest workload is generally the most difficult. In particular, the screens of various types of computer games are becoming more and more delicate, and the functions of computer-aided graphics software are becoming more and more powerful. Such software often puts the central processing unit and graphics chip processor in a high-load state during operation, and it will also cause a large number of If the heat energy is not effectively dissipated, it will cause the performance of the central processing unit or graphics chip processor to decline. In severe cases, the central processing unit or graphics chip processor may be damaged or its service life may be greatly reduced.

As shown in Figures 1A and 1B, in order to reduce the operating temperature of heat-generating electronic components, a water-cooled device on the market is generally connected to a water pump 1a (Pump) and a water-cooled head 1b by a water-cooled drain through a two-water conduit ( (Such as a central processing unit), through the water pump 1a (Pump) to drive the water-cooled liquid (or working liquid) to the water-cooled row 1 to dissipate heat and continuously circulate cooling to quickly dissipate heat. The aforementioned water pump 1a is disposed outside the water cooling head 1b (as shown in FIG. 1A), or the water pump 1a may be disposed inside the water cooling head 1b (as shown in FIG. 1B). The water-cooled row 1 is composed of a plurality of heat-dissipating fins 11, a plurality of straight strip-shaped flat tubes 12, and two-side water tanks 13. The heat-dissipating fins 11 are disposed between the straight strip-shaped flat tubes 12 and each of the two sides. The two sides of the water tank 13 and the radiating fins 11 and the straight strip-shaped flat tubes 12 are welded by soldering, so that the two-sided water tank 13 and the radiating fins 11 and the straight strip-shaped flat tubes 12 are welded by solder. The water cooling row 1 is connected to form a water tank 13 on one side. There is a water inlet 131 and a water outlet 132, and the water inlet 131 and the water outlet 132 are respectively used to connect opposite two water pipes (not shown in the figure).

Because the working fluid flowing from the water inlet 13 is in the water tank 13 on one side, it flows straight through from the straight flat tubes 12 to the water tank 13 on the other side, and then passes through the straight flat tubes. The pipe 12 flows quickly through the water tank 13 on the side of the road, and then is discharged from the water outlet 132. Because the overall structure of the conventional water cooling row is relatively large, it will occupy a large installation space. If the volume of the water cooling row is reduced, The heat dissipation efficiency is reduced, resulting in poor antipyretic effect. Therefore, how to provide a heat dissipation structure with a small size and high heat dissipation efficiency is the direction that the creators of this case and related manufacturers engaged in this industry are eager to study and improve.

One of the purposes of this creation is to provide a water-cooled drain structure with a composite layer arrangement.

One of the purposes of this creation is to provide a composite water-cooled drain structure that is compact and reduces thermal resistance to improve heat dissipation efficiency.

One of the purposes of this creation is to provide a composite water-cooled drain structure with a cooling plate that uses a uniform cold wafer unit to transfer heat to a temperature equalizing plate.

One of the objectives of the present invention is to provide a composite water-cooled row structure with at least one heat sink fin blocker selected to increase the area in contact with air and improve heat dissipation efficiency through the at least one heat sink fin group.

In order to achieve the above object, the present invention provides a composite water-cooled drain structure, which includes: a cooling plate having a first upper surface and a first lower surface and a liquid flowing portion for a working liquid to flow, the liquid flowing portion communicates One outlet and one inlet: a uniform cold wafer unit, which is arranged below the cooling plate and has a cold end and a hot end, the cold end is in contact with the first lower surface of the cooling plate; Below the cold wafer, there is a second upper surface and a second lower surface, and the second upper surface contacts the hot end of the cold wafer.

In an embodiment, the first upper surface and the second lower surface of the cooling plate are respectively located on both sides of the cooling plate, and one of the first upper surface and the second lower surface is provided with a groove, and the liquid The flow part is disposed in the groove.

In one embodiment, the flow part is a liquid guide tube, and the two ends of the liquid guide tube form the outlet and the inlet.

In an embodiment, the cooling plate has a first upper plate body butting a first lower plate body, the first upper surface is formed on the first upper plate body, and the first lower surface is formed on the first lower plate body. The liquid flowing part is a guide channel located between the first upper plate body and the first lower plate body. The two ends of the guide channel form the outlet and the inlet.

In one embodiment, the refrigerated wafer unit includes one or several refrigerated wafers, and the refrigerated wafers are arranged in parallel.

In one embodiment, the inlet and the outlet are connected to a water-cooled head module, and the water-cooled head module includes a water-cooled head and a pump.

In one embodiment, a first heat dissipation fin group is provided on a first upper surface of the cooling plate, and a second heat dissipation fin group is provided on a second lower surface of the uniform temperature plate.

In one embodiment, the temperature equalizing plate has a closed chamber for containing a second working liquid, a capillary structure layer is disposed on an inner wall of the closed chamber, and at least one support post is provided in the closed chamber.

In one embodiment, the first heat dissipation fin group and the second heat dissipation fin group are connected to a protection unit, and the protection unit is connected to at least one fan.

20‧‧‧Water cooling row structure

21, 21a‧‧‧ cooling plate

2101‧‧‧First upper plate

2102‧‧‧First lower plate

211‧‧‧First upper surface

212‧‧‧First lower surface

213‧‧‧Entrance

214‧‧‧Export

215, 215a‧‧‧Liquid flowing parts

217‧‧‧Groove

22‧‧‧Refrigerated chip unit

220‧‧‧Refrigerated Chip

221‧‧‧ Cold End

222‧‧‧Hot end

23‧‧‧ Uniform temperature plate

2031, 2302‧‧‧‧body

231‧‧‧Second upper surface

232‧‧‧Second lower surface

233‧‧‧ closed chamber

234‧‧‧Capillary structure layer

235‧‧‧Second working fluid

236‧‧‧Support Post

241‧‧‧The first cooling fin group

242‧‧‧Second cooling fin set

30‧‧‧Water Cooling Head Module

31‧‧‧protection unit

311‧‧‧Part I

312‧‧‧Part II

32‧‧‧fan

The purpose of the following drawings is to make this creation easier to understand. In the text, these drawings will be described in detail and make it part of the specific embodiment. Through the specific embodiments in this article and referring to the corresponding drawings, the specific embodiments of the creation are explained in detail, and used to explain the principle of the creation.

Figures 1A and 1B are schematic diagrams of conventional techniques; Figure 2A is a schematic diagram of three-dimensional decomposition of the creation; Figure 2B is a schematic diagram of the three-dimensional composition of the creation; Figure 2C is a schematic diagram of the three-dimensional decomposition of the alternative implementation of the creation; and Figure 2D is A partial cross-sectional schematic diagram of the isothermal plate of this creation; Fig. 3A is a three-dimensional schematic diagram of the first type of cooling plate of the creation; Fig. 3B is a three-dimensional schematic diagram of the first type of cooling plate of the creation from another perspective; and Fig. 3C is An exploded perspective view of the second type of cooling plate in this creation; Figures 4A and 4B are schematic views of a water cooling head module connected to the creation; Figure 4C is a partial cross-sectional schematic view of Figure 4A; Figure 4D is Figure 4B Figure 5 is a schematic diagram of a partial cross-section; Figure 5 is a schematic diagram of the first and second cooling fin groups connected to the protection unit and the fan of the creative water cooling row group.

The above-mentioned purpose of this creation and its structural and functional characteristics will be explained according to the preferred embodiments of the drawings.

Please refer to Figure 2A for a three-dimensional exploded view of the creation; Figure 2B for a three-dimensional exploded view of the creation; and Figure 2C for a three-dimensional exploded view of the alternative implementation of the creation; schematic diagram. As shown in the figure, a water-cooled row structure 20 includes a cooling plate 21 and uniform cold crystals. The sheet unit 22 and a temperature equalizing plate 23. The cooling plate 21 has a first upper surface 211 and a first lower surface 212 located on both sides of the cooling plate 21, respectively. A liquid flowing portion 215 is provided between the first upper surface 211 and the first lower surface 212. The liquid flowing portion 215 communicates with an inlet 213 and an outlet 214 to guide a first working liquid (for example, pure water) to flow.

The refrigerated wafer unit 22 is disposed below the cooling plate 21 and has a cold end (heat-absorbing surface) 221 and a hot end (heat-radiating surface) 222 on the two sides of the refrigerating wafer unit 22 respectively after power-on. The end 221 contacts the first lower surface 212 of the cooling plate 21. The cooling wafer unit 22 includes one or more cooling wafers 220, and the cooling wafers 220 are arranged in parallel. In this embodiment, the six cooling chips 220 are arranged in parallel, but it is not limited to this. The user can set the number of the cooling chips 220 according to the requirements, such as the area of the cooling plate 21 and the temperature equalizing plate 23.

The temperature-equalizing plate 23 is disposed below the refrigerated wafer unit 22, and includes two plate bodies 2301 and 2302 butted into one body (as shown in FIG. 2D), and has a second upper surface 231 and a second lower surface 232, respectively. The second upper surface 231 is located outside the two plates 2301 and 2302 and contacts the hot end 222 of the refrigerated wafer unit 22. As shown in FIG. 2D, the temperature equalizing plate 23 has a closed chamber 233 between the two plate bodies 2301 and 2302 and contains a second working liquid 235 (such as pure water, methanol, acetone, cold coal or ammonia, etc.) One is not limited by any liquid) and a capillary structure layer 234, which is disposed on an inner wall of the closed chamber 233. In the closed cavity 233, at least one supporting post 236 is selected to be erected vertically between the two plates 2031 and 2302 to support the closed cavity 233. The temperature equalizing plate 23 is a two-dimensional heat transfer element. The second working liquid 235 circulates vapor and liquid phase heat transfer in the closed chamber 233, and rapidly amplifies the heat source transmitted from the cooling wafer unit 22 into a surface heat source. In order to reduce the heat transfer per unit area to remove the problem of hot spots (heat concentration), the uniform temperature effect is good and there is a large bonding contact area, which directly reduces the overall thermal resistance of the water-cooled row structure 20.

In an alternative implementation, as shown in FIG. 2C, the first upper surface 211 of the cooling plate 21 is provided with a first heat dissipation fin group 241, and the second lower surface 232 of the temperature equalization plate 23 is provided with a second heat dissipation fin. The group 242 uses the first heat dissipation fin group 241 and the second heat dissipation fin group 242 to increase the contact area of the first upper surface 211 and the second lower surface 232 with the air to help heat dissipation.

Furthermore, please continue to refer to FIG. 3A for a three-dimensional schematic diagram of the first type of cooling plate of the creation; FIG. 3B is a three-dimensional schematic diagram of the first type of cooling plate of another creation; and FIG. 3C is a second type of the creation An exploded perspective view of a type cooling plate. As shown in FIGS. 3A and 3B, the cooling plate 21 is a plate body with good thermal conductivity, and any one of the first upper surface 211 and the first lower surface 212 is provided with a groove 217, and the liquid flowing portion 215 It is disposed in the groove 217. In this embodiment, the groove 217 is provided on the first lower surface 212 and is meanderingly extended to cover the first lower surface 212. The liquid flowing portion 215 is a liquid guide tube buried in the groove 217 so as not to exceed the first lower surface 212. The side of the liquid flowing portion 215 opposite to the groove 217 forms a first lower surface 212. A co-plane, and the liquid deflector has two ends forming the inlet 213 and the outlet 214. The liquid flowing portion 215 is matched with the winding extension of the groove 217 to cover the first lower surface 212, thereby extending the flow time of the first working liquid in the liquid flowing portion 215 and allowing the first working liquid to carry The heat is evenly distributed on the cooling plate 21 to achieve the purpose of uniform temperature.

In an alternative implementation, as shown in FIG. 3C, the cooling plate 21a has a first upper plate body 2101 butted against a first lower plate body 2102. The first upper surface 211 is formed on the first upper plate body 2101. A lower surface 212 is formed in the first lower plate body 2102, and the liquid flowing portion 215a is a guide channel located between the first upper plate body 2101 and the first lower plate body 2102. The inlet 213 and the outlet 214 are formed at two ends. In this embodiment, it is shown that the liquid flowing portion 215a is disposed on a side of the first lower plate body 2102 that abuts the first upper plate body 2101. And the liquid flowing portion 215a is arranged in a meandering extension and covers the first Lower the plate body 2102, thereby extending the flow time of the first working liquid in the liquid flowing portion 215a and uniformly distributing the heat carried by the first working liquid on the cooling plate 21a.

Please continue to refer to Figures 4A and 4B for a schematic diagram of a creative connection of a water-cooled head module; Figure 4C is a partial cross-sectional schematic diagram of Figure 4A; Figure 4D is a partial cross-sectional schematic diagram of Figure 4B. As shown in these figures, together with the aforementioned 2A, 2B, 2C, 3A, 3B, and 3C diagrams, the inlet 213 and outlet 214 of the cooling plate 21 of the water-cooled row structure 20 communicate with a water-cooled head module 30, which is water-cooled The head module 30 is, for example, a water-cooled head and a pump described in the prior art, and the pump is provided outside or inside the water-cooled head. The first working liquid in the liquid flowing parts 215 and 215a flows into the water-cooled head module 30 through the outlet 214 to generate heat after exchanging heat with a heating element, and the warmed first working liquid flows out of the water-cooled head module 30. After that, the cooling plate 21 of the water-cooled drain structure 20 flows from the inlet 213, and the heat carried by the first working liquid flows along the liquid flowing parts 215, 215a toward the outlet 214, and conducts the heat to the cooling plates 21, 21a. And evenly distributed. When heat is transferred to the first upper surface 211 of the cooling plates 21, 21a, heat is dissipated through the first upper surface 211. The heat transferred to the first lower surface 212 of the cooling plates 21, 21a absorbs heat through the cold end 221 of the refrigerated wafer unit 22, and then radiates heat from the hot end 222 to the second upper surface 231 of the temperature equalizing plate 231, and then Heat is transferred to the second lower surface 232 via the second working liquid 235 vapor and liquid phase change heat transfer in the closed cavity 233.

In another alternative implementation, when heat is transferred to the first upper surface 211 of the cooling plates 21, 21a, heat is dissipated through the first heat dissipation fin group 241, and when heat is transferred to the second lower surface 232 of the temperature equalizing plate 231 Heat is radiated through the second heat dissipation fin group 242 at times.

In addition, the aforementioned cooling plates 21, 21a, the liquid flow portions 215, 215a, the temperature equalizing plate 231, the first heat radiation fin group 241, and the second heat radiation fin group 242 are, for example, gold or silver or copper or iron or Titanium or aluminum or stainless steel or alloys of these metals. Among them titanium metal has high strength and light weight Characteristics and good heat conduction efficiency to effectively improve the heat conduction efficiency and reduce the overall weight.

Furthermore, as shown in FIG. 5, the first heat radiation fin group 241 and the second heat radiation fin group 242 are connected to a protection unit 31, and the protection unit 31 has a first portion 311 and a second portion 312 from the water-cooled row. The first and second heat dissipation fin groups 241 and 242 are covered above and below the structure 20 to protect the first and second heat dissipation fin groups 241 and 242 from damage. In addition, the protection unit 31 can also be optionally connected to the at least one fan 32, and the first and second heat dissipation fin groups 241 and 242 can be cooled by the at least one fan 32.

With the above implementation, the uniform cold wafer unit 22 is used to transfer the heat of the cooling plates 21 and 21a to a temperature equalizing plate 23 for heat dissipation. In addition, the first and second heat dissipation fin groups 241 and 242 are selected to pass through the first And the second heat dissipation fin groups 241 and 242 increase the area of the cooling plate 21 and the temperature equalizing plate 23 in contact with the air, so that the water cooling row structure 20 is provided in a composite layer to provide a composite water cooling that is compact and reduces thermal resistance and improves heat dissipation efficiency排 结构。 Row structure.

The creation has been described in detail above, but the above is only a preferred embodiment of the creation, and the scope of implementation of the creation cannot be limited. That is to say, all equal changes and modifications made in accordance with the scope of this creative application shall still be covered by the patent of this creative.

Claims (10)

A composite water-cooled drain structure includes: a cooling plate having a first upper surface and a first lower surface and a liquid flow portion for a first working liquid to flow, the liquid flow portion is connected to an outlet and an inlet: consistent A cold wafer unit is disposed below the cooling plate and has a cold end and a hot end, the cold end is in contact with the first lower surface of the cooling plate; a temperature equalizing plate is disposed below the cooling wafer unit, There is a second upper surface and a second lower surface, and the second upper surface is in contact with the hot end of the refrigerated wafer unit. The composite water cooling drain structure according to claim 1, wherein the first upper surface and the second lower surface of the cooling plate are located on both sides of the cooling plate, respectively, and any one of the first upper surface and the first lower surface is One is provided with a groove, and the liquid flowing part is disposed in the groove. The composite water cooling drain structure according to claim 2, wherein the liquid flowing part is a liquid deflector, and the two ends form the outlet and the inlet. The composite water cooling drain structure according to claim 1, wherein the cooling plate has a first upper plate body butted with a first lower plate body, and the first upper surface is formed on the first upper plate body and the first lower surface It is formed on the first lower plate body, and the liquid flowing part is a guide channel located between the first upper plate body and the first lower plate body. The two ends of the guide groove form the outlet and the Entrance. The composite water cooling row structure according to claim 1, wherein the cooling chip unit comprises one or several cooling chips, and the cooling chips are arranged in parallel. The composite water-cooled drain structure according to claim 1, wherein the inlet and the outlet are connected to a water-cooled head module, and the water-cooled head module includes a water-cooled head and a pump. The composite water-cooled drain structure according to claim 1, wherein the temperature equalizing plate has a closed chamber to receive a second working liquid, and a capillary structure layer is disposed on an inner wall of the closed chamber. The composite water cooling row structure according to claim 7, wherein at least one supporting column is provided in the closed chamber. The composite water cooling structure according to any one of claims 1 to 8, wherein a first upper surface of the cooling plate is provided with a first heat dissipation fin group, and a second lower surface of the temperature equalizing plate is provided with a second heat radiation Fin set. The composite water cooling row structure according to claim 9, wherein the first heat dissipation fin group and the second heat dissipation fin group are connected to a protection unit, and the protection unit is connected to at least one fan.